TWM377704U - Edge type light emitting component package structure and package housing - Google Patents

Edge type light emitting component package structure and package housing Download PDF

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Publication number
TWM377704U
TWM377704U TW98221811U TW98221811U TWM377704U TW M377704 U TWM377704 U TW M377704U TW 98221811 U TW98221811 U TW 98221811U TW 98221811 U TW98221811 U TW 98221811U TW M377704 U TWM377704 U TW M377704U
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Taiwan
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light
cup
base
emitting
area
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TW98221811U
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Chinese (zh)
Inventor
Chih-Ming Chen
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Advanced Optoelectronic Tech
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Priority to TW98221811U priority Critical patent/TWM377704U/en
Publication of TWM377704U publication Critical patent/TWM377704U/en

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Abstract

An edge type light emitting component package structure is disclosed, which includes a housing and a light emitting component. An inner sidewall of the housing inclines outward from a base of the housing to form an included angle ranges from 140 to 150 degrees. The depth of the housing, which is measured vertically from top of the housing to the base thereof, is about 0.25 mm to 0.3 mm. Furthermore, an opening of the housing is a light emitting surface having an area being 1.5 to 2 times of the area of the base.

Description

M377704 五、新型說明: 【新型所屬之技術領域】 本創作有關一種發光元件(light emitting component)封裝殼體及 封裝結構,特別是有關一種側光式發光元件封裝殼體及封裝結構。 【先前技術】 發光二極體(light emitting diode,LED)已用於照明裝置,例如應 用於手電筒、汽車頭燈、燈泡、燈管,另外,也可做為裴置的背光, 例如應用於電視、監視器、手機的液晶顯示器的背光模組 module)中。背光模組的分類,依基底上LED晶片的出光方向的不 同T區为有直下式(direct type)與側光式(edge type)的設計,不同類 型產品各有其需求。 習知的侧光式LED背光模組一般具有一杯形基底,LED晶片 置於該基底上,LED發光後,有的光線由杯口直接射出至外界,有 的光2射至杯壁再反射至外界。如第丨圖所示的杯形基底結構的截 面不忍圖,習知的杯深D1 一般為06mm,杯殼10傾斜角度心—般 為90度至11〇度。然而,這樣的設置,使得由晶片12射出的 部分光線14需要經過_ u反射及繞射後才由^光面帥出至故 光器18,由於光的路徑較長,容易損失而影響出光效率。 M377704 美國專利申請案公叫勘亀柳㈤號揭示_種發光裝 置,其封裝結構具有一凹槽,發光元件置於此凹槽内,凹槽為狹長 形’在狹長方向的二相對側壁呈現斜面狀,此二斜面的夫角為卯 度或大於90度。在-實施例中,此二斜面的夫角可為135至165 度,在另-實施财,狹長方向_口長度可為凹槽底部長度的2 至4倍,及在又另-實施例中,凹槽深度可為凹槽底部長度的 至0.4倍,使得發光元件發出的光線在凹槽的狹長方向充分分散., 以製造帶狀光束(band-shapedbeam)。在有多個發光元件置於此凹槽 内的情形時,這樣的封裝結構可抑制不均勻照光。 然而,對於一種新穎的侧光式發光元件封裝結構仍持續有需 求’以期能具有充分的出光效率。 【新型内容】 經由 本創作的一目的是要提供一種側光式發光元件封裴結構 杯殼形狀的獨特設計’能夠使大部分的光線直接出光,因此真有^ 好的出光效率。 依據本創作的一具體實施例,提供一種側光式發光元件封穿妗 構’其包括下列:一底座;至少一發光元件,位於底座上;及一杯 殼’與底座結合而味繞此發光元件,杯殼面向發光元件的—側壁-目 有反射性。杯殼向外傾斜而使側壁與底座形成-140度至150度的 夹角’杯㊅具有—垂直於底座的深度,也就是杯深,此深度為0.25 mm至〇·3 mm’及杯殼的杯口為―出光面,出光面的面積為底座的 面積的1.5至2倍。 依據本創作的另-具體實施例’提供—種側^式表面黏著型 (surfacemGunt deviee ’ SMD)LED 結構,包括下列:—杯形基 底包括杯设及一底座而形成一容置空間,杯殼面向容置空間的 一側壁具有反雜;—引線_eadframe)位於底座上;至少一咖 晶片位於引線架上而於容置空間内;及一封勝層,覆蓋此咖晶 片:杯殼向外傾斜而使侧壁與底座形成一 140度至150度的夾角, ,殼具有一垂直於底座的深度,此深度為0.25 mm至0.3 mm,及杯 π又的杯口為―出光面’出光關©積為底座的面積的1.5至2倍。 ★依據本創作的又另-具體實關,提供—麵減發光元件封 裝成體’包括下列:—底座及—杯殼。杯殼與底座結合而形成—杯 狀的今置空間’杯殼面向杯内的—侧壁具有反射性,杯殼向外傾斜 而使側壁與底座形成—14〇度至15Q度的夾角,杯殼的杯口為—出 光面,出光面的面積為底座的面積的1.5至2倍。 , ,本創作中,因為減械於習知技躺該淺,使得發光元 件距離封裝結制岐面較近,並且增加減傾斜肖度,使得出光 面的面積與發光元件所在的魏區面積形成—比例,出光角度大, M377704 可儘置讓光線-次於出光面出光,或是歷經—次全反射即於出光面 出光’如此也可減少折射、繞射、散射的產生,因此能表現應有的 出光性能’提高出光率,可良好的使用於背光模組或是照明裝置中。 【實施方式】 本創作的側光式發光元件封裝結構的發光元件位於一杯形基底 t,其t,杯形基底的杯殼向外傾斜而使側壁與底座形成一 14〇度 至150度的夾角,杯殼具有一垂直於底座的深度,此深度為〇 麵 至0.3 mm,及杯殼的杯口為一出光面,出光面的面積為底座的面積 的1.5至2倍。 如第2圖所不的-具體實施例的截面示意圖,侧光式發光元件 封裝殼體20包括下列:-底座22。底座22上可承載發光元件。發 光元件可為例如發光二極體、有機發光二極體、舰腔發光二極體 或雷射半導體的晶片。-杯殼26,與底座22結合而形成—杯形容 置空間。杯殼26 _杯内的側壁27具有反射性。杯殼%向外傾斜 而使侧壁27與底座22形成-14()度至15()度的夾^2。杯殼26 具有一垂直於底座22的深度D2 ’ D2為α25 _至G 3随。杯殼的 的面積A2的L5至2倍,也就是說,Al(出光面面積):A2(底座面積) =1.5 : i至2 :卜杯π及底座可分別為例如1長的橢圓形狀,但 也可為長形或不規則形。 //04 底座與杯殼可以是随㈣(例如:Ai2o3、A1NM_材料互 相接合或是-體成形。亦可使㈣雌取代,⑽架的材質可以是 鋁、銅、铭表面鑛銀或鋼表面鑛銀、鮮合金、銘鎂合金、減石夕 合金、_合金等。杯殼面向發絲件的嫩具有反紐,此可利 用在杯殼側絲面上附著反射率較高的㈣,或细自色陶究材料 作為反射物而達成。 第3圖進一步顯示本創作的發光元件封裝殼體承載著發光元件 的出光__意圖’可與第〗_f知的發統件封裝結構比 較。可見本翁的城的深度d2較淺,發光元件24的丨光距離L 車乂短或疋與出光面28較近,並因增加杯殼傾斜角度,出 面積為底座22面積的1-5至2倍,使得較習知的結構為多的光線5〇 直接於出光面28出光’較少的光線52才經由杯壁27反射出光,以 及減少光折射錢射的損失,因敝光^ 54接收到的光 知的封裝結構大。 又如第4圖的截面示意圖所示,依據本創作的側光式發光元件 封裝結構30 ’其底座32與杯殼34形成一杯形基底,底座&與杯 殼34可-體成形或是互相結合以環繞一發光元件,而為一容置空 間,杯殼面向容置空間(也就是面向發光元件)的一側壁35具有反^射 性;底座32具有一引線架36,其包括二部件361及362 •至少一發 光元件例如LED晶片38位於引線架36的部件362上而於容置空間 M377704 内。LED晶片可包含有-正電極與—負電極,並經由導線%電氣 性連接至引線架%的部件%卜引線架%由杯形基底内延伸至杯 形基底的外部,肋做為後續背光或照明製程的触。可進_ 步包括-封膠層40,覆蓋此LED日日日片38。側壁%向外傾斜而盘底 座32形成- 140度至150度的夾角&,杯殼%具有一垂直於底座 32的深度巧,此深度為α25麵至α3 _,及杯殼%的杯口為一 出光面42,出光面42的面積為底座32的面積的i 5至2倍。 封膠層覆蓋發光元件。封膠層可包括環氧樹脂或_,用縣 護及固紐光元件例如LED “與金屬料。並可另於封膠層中包 括一螢光材料,以進行混光或改變出光顏色。 第5圖顯不第4圖的侧光式發光元件封農結構3〇的頂視示意 圖。其中出光面42的面積A3為底座32的面積5至2倍。 圖中顯示杯口及底座分別具有—扁長__狀,但不限於此: 第6圖顯示分別使用習知❺LED封裝結構(杯殼與底座形成9〇 度)及本創作的侧光式SMD 封裝結構(其杯殼側壁與底座形成 140度)’以測得的光通量(lumiri〇usflux)(單位為流明伽膽杯殼深 度(單位為mm)作圖的結果。由圖中可知,在一樣的杯殼深度下比 較’本創作顺裝結構的紐量較習知的封裝結構的光通量為大, 再者,當本創作的杯殼深度由〇.6mm減為〇 3_時,光通量可高 出將近11m,也就是大約高出2〇%。可見增進出光率的功效。 M377704 帛7關示本創作SMD LED封裝結翻—具體實施 例與習知的封裝結構兩者的光通量對發光強度的作圖比較。本 創作的封裝結構朗減的側雜絲形成⑽度的失肖,及杯殼 深度為0.3 mm。習知的封裝結構使用杯殼與底座形成%度的失角, 及杯殼深度為0.6 _。橫坐標為發光強度(Iv),單位為燭光㈣,縱 坐標為光通量,單位為流明㈣。由圖中可知,在大於約146燭光 修-2,相_發絲度下’本創作的封裝結構具有較習知的封裝結構 高的光通量,而具有較佳的出光率。 以上所述僅為本創作之較佳實施例,凡依本創作申請專利範圍 所做之均等變化與修飾,皆闕本創作之涵蓋範圍。 【圖式簡單說明】 瓤 =圖顯示-習知的封裝結構及出柄截面示意圖。 2顯示-依據糊作的發光元件__的具體實施例的截面 ===本解的發光元件封额體承糖發光元件的出光的截 的截依縣創作的側光輕光元件封裝結獅具體實施例 第5圖顯示^ 4 _域輪物結細視示意圖。 M377704 第6圖顯示分別使用習知的封裝結構及本創作的封裝結構,以測得 的光強度對杯殼深度作圖的結果。 第7圖顯示本創作的封裝結構與習知的封裝結構兩者的光通量對發 光強度的作圖比較。 【主要元件符號說明】 10 杯殼 11 側壁 12 LED晶片 14 光線 16 出光面 18 收光器 20 側光式發光元件封裝殼體 22 底座 24 發光元件 26 杯殼 27 侧壁 28 出光面 30 側光式發光元件封裝結構 32 底座 34 杯殼 35 側壁 36 引線架 361 引線架部件 362 引線架部件 38 LED晶片 39 導線 40 封膠層 42 出光面 50 光線 52 光線 54 收光器M377704 V. New description: [New technical field] The present invention relates to a light emitting component package housing and a package structure, and more particularly to a side light type light emitting device package housing and package structure. [Prior Art] Light emitting diodes (LEDs) have been used in lighting devices, such as flashlights, automotive headlights, light bulbs, and lamps, and can also be used as backlights for installation, for example, for televisions. In the backlight module of the liquid crystal display of the monitor and the mobile phone. The classification of the backlight module is based on the different T-zones of the LED chip in the light-emitting direction of the substrate. There are direct type and edge type designs, and different types of products have their own needs. The conventional edge-lit LED backlight module generally has a cup-shaped substrate on which the LED chip is placed. After the LED emits light, some of the light is directly emitted from the cup to the outside, and some light is emitted to the wall and then reflected. external. The cross-section of the cup-shaped base structure as shown in the figure is not tolerated. The conventional cup depth D1 is generally 06 mm, and the cup 10 is inclined at an angle of 90 to 11 degrees. However, such an arrangement is such that part of the light 14 emitted by the wafer 12 needs to be reflected and diffracted by the _u to be lighted out to the photodetector 18. Since the path of the light is long, it is easy to lose and affect the light-emitting efficiency. . M377704 U.S. Patent Application Publication No. 5, discloses a illuminating device having a package structure having a recess in which a light-emitting element is placed, and the recess is elongated and has a bevel on two opposite side walls in the longitudinal direction. Shape, the angle of the two bevels is twist or greater than 90 degrees. In an embodiment, the angle of the two bevels may be 135 to 165 degrees, and in the other embodiment, the length of the slit may be 2 to 4 times the length of the bottom of the groove, and in still another embodiment. The groove depth may be up to 0.4 times the length of the bottom of the groove, so that the light emitted from the light-emitting element is sufficiently dispersed in the narrow direction of the groove to produce a band-shaped beam. Such a package structure can suppress uneven illumination when a plurality of light-emitting elements are placed in the recess. However, there is a continuing need for a novel edge-lit light-emitting device package structure to have sufficient light-emitting efficiency. [New content] One of the purposes of this creation is to provide a side-light type light-emitting element sealing structure. The unique design of the shape of the cup shell enables most of the light to be directly emitted, so that there is a good light-emitting efficiency. According to a specific embodiment of the present invention, an edge-lit light-emitting element encapsulating structure is provided, which includes the following: a base; at least one light-emitting element on the base; and a cup-shell combined with the base to taste the light-emitting element The side of the cup facing the light-emitting element is reflective. The cup is inclined outwardly so that the side wall forms an angle of -140 degrees to 150 degrees with the base. The cup 6 has a depth perpendicular to the base, that is, the depth of the cup, which is 0.25 mm to 〇·3 mm' and the cup shell The mouth of the cup is the illuminating surface, and the area of the illuminating surface is 1.5 to 2 times the area of the pedestal. According to another embodiment of the present invention, a surface-type surface mount type (SMD) LED structure is provided, including the following: - a cup-shaped base includes a cup and a base to form an accommodation space, and a cup shell a side wall facing the accommodating space has a reverse impurity; a lead _eadframe is located on the base; at least one café wafer is located on the lead frame in the accommodating space; and a triumph layer covers the coffee chip: the cup shell is outward Tilting so that the side wall and the base form an angle of 140 to 150 degrees, the shell has a depth perpendicular to the base, the depth is 0.25 mm to 0.3 mm, and the cup π is the "lighting surface" © is 1.5 to 2 times the area of the base. ★ According to the creation of this creation, another specific implementation, the surface-reducing light-emitting component is packaged into the body' including the following: - base and cup. The cup shell is combined with the base to form a cup-shaped space. The cup shell faces the inside of the cup. The side wall is reflective, and the cup shell is inclined outward to form an angle between the side wall and the base - 14 degrees to 15Q degrees, the cup The cup mouth of the shell is the light-emitting surface, and the area of the light-emitting surface is 1.5 to 2 times the area of the base. In this creation, because the reduction of the weapon is shallow in the conventional technique, the light-emitting element is closer to the packaged surface, and the slope is increased, so that the area of the light-emitting surface and the area of the Wei region where the light-emitting element is formed are formed. - Proportion, large angle of light, M377704 can be used to make light - second to the light surface, or to pass through the total light to emit light on the light surface. This can also reduce the occurrence of refraction, diffraction, and scattering. Some light-emitting performance 'increased light extraction rate, can be well used in backlight modules or lighting devices. [Embodiment] The light-emitting element of the edge-light type light-emitting element package structure of the present invention is located on a cup-shaped base t, wherein the cup of the cup-shaped base is inclined outward so that the side wall forms an angle of 14 to 150 degrees with the base. The cup shell has a depth perpendicular to the base, the depth is from the rake face to 0.3 mm, and the cup mouth of the cup shell is a light exit surface, and the area of the light exit surface is 1.5 to 2 times the area of the base. As shown in Fig. 2, a schematic cross-sectional view of a specific embodiment, the edge-lit light-emitting device package housing 20 includes the following: - a base 22. A light emitting element can be carried on the base 22. The light-emitting element can be a wafer such as a light-emitting diode, an organic light-emitting diode, a marine light-emitting diode or a laser semiconductor. The cup case 26 is combined with the base 22 to form a cup-shaped accommodation space. The side wall 27 in the cup 26 _ cup is reflective. The cup case % is inclined outwardly so that the side wall 27 forms a clip of -14 (degrees to 15 degrees) to the base 22. The cup shell 26 has a depth D2' D2 perpendicular to the base 22 which is α25_ to G3. The area of the cup shell A5 is L5 to 2 times, that is, Al (light-emitting surface area): A2 (base area) = 1.5: i to 2: the cup π and the base may each be, for example, a long elliptical shape, But it can also be long or irregular. //04 The base and the cup can be made with (4) (for example: Ai2o3, A1NM_ materials are joined to each other or formed by body. It can also be replaced by (4) females. The material of the (10) frame can be aluminum, copper, ore surface ore or steel. Surface mineral silver, fresh alloy, Ming magnesium alloy, reduced stone alloy, _ alloy, etc. The cup shell faces the hair of the hair piece has a reverse button, which can be used on the side of the shell side of the wire surface with a high reflectivity (four), Or the fine self-color ceramic material is achieved as a reflector. The third figure further shows that the light-emitting element package housing of the present invention carries the light-emitting element light-emitting __intent can be compared with the ___ knowing the hair piece package structure. It can be seen that the depth d2 of the city of Benung is shallow, the light distance L of the light-emitting element 24 is short or the 疋 is close to the light-emitting surface 28, and the area of the exit is 1-5 to the area of the base 22 due to the increase of the tilt angle of the cup. 2 times, so that the light of the conventional structure is 5 〇 directly emitted from the light-emitting surface 28 'less light 52 is reflected by the cup wall 27, and the loss of light refracting is reduced, because the light is received The optical package has a large package structure. As shown in the cross-sectional view of Fig. 4 According to the creation of the edge-lit light-emitting device package structure 30', the base 32 and the cup 34 form a cup-shaped base, and the base & and the cup 34 can be formed or combined to surround a light-emitting element. The space 35 has a side wall 35 facing the accommodating space (that is, facing the light-emitting element) having a reflexivity; the base 32 has a lead frame 36 including two parts 361 and 362. • at least one light-emitting element such as the LED chip 38 The component 362 of the lead frame 36 is located in the accommodating space M377704. The LED chip may include a positive electrode and a negative electrode, and is electrically connected to the lead frame % via the wire %% of the lead frame % by the cup shape The substrate extends to the outside of the cup-shaped substrate, and the rib acts as a contact for subsequent backlighting or illumination process. The step-by-step sealing layer 40 can be covered to cover the LED day and day sheet 38. The side wall % is inclined outwardly and the disk base 32 Forming an angle of between -140 degrees and 150 degrees, the cup shell % has a depth perpendicular to the base 32, the depth is from α25 to α3 _, and the cup of the cup is a light exit surface 42 and the light exit surface 42 The area is 5 to 2 times the area of the base 32 The sealing layer covers the light-emitting element. The sealing layer may comprise an epoxy resin or a metal element, such as an LED, and a metal material, and may further comprise a fluorescent material in the sealing layer for mixing. The light or the color of the light is changed. Fig. 5 is a top plan view showing the sidelight type light-emitting element sealing structure 3 of Fig. 4, wherein the area A3 of the light-emitting surface 42 is 5 to 2 times the area of the base 32. The cup mouth and the base respectively have a flat length __ shape, but are not limited thereto: Figure 6 shows the use of the conventional LED package structure (the cup case and the base form 9 degrees) and the edge-light SMD package structure of the present invention ( The side wall of the cup and the base form 140 degrees) as a result of the measured luminous flux (lumiri〇usflux) (in units of lumens of the lumen of the galvanic cup (in mm). It can be seen from the figure that the luminous flux of the original packaging structure is larger than that of the conventional packaging structure at the same cup depth. Furthermore, when the cup depth of the present invention is reduced from 〇.6 mm to 〇 At 3_, the luminous flux can be as high as 11m, which is about 2% higher. Can be seen to enhance the efficacy of light output. M377704 帛7 shows the comparison of the luminous flux versus the luminous intensity of both the specific embodiment and the conventional package structure. The side-filaments of this package have been reduced in size (10), and the depth of the cup is 0.3 mm. The conventional package structure uses a cup and a base to form a % degree of corner loss, and the cup depth is 0.6 _. The abscissa is the luminous intensity (Iv), the unit is the candle light (four), and the ordinate is the luminous flux in units of lumens (four). As can be seen from the figure, the package structure of the present invention has a higher light flux than the conventional package structure and has a better light extraction rate than that of more than about 146 candelas. The above is only the preferred embodiment of the present invention, and all the changes and modifications made by the scope of the patent application of the present invention are covered by the present invention. [Simple description of the diagram] 瓤 = diagram display - a schematic diagram of the package structure and the cross section of the handle. 2 Display - Cross section of a specific embodiment of the light-emitting element __ according to the paste === The light-emitting element of the present solution is sealed by the light-emitting element of the sugar-emitting light-emitting element DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Figure 5 shows a schematic view of the ^ 4 _ domain wheel junction. M377704 Figure 6 shows the results of plotting the measured light intensity versus cup depth using a conventional package structure and the package structure of the present invention. Fig. 7 is a graph showing the comparison of the luminous flux and the luminous intensity of both the package structure of the present invention and the conventional package structure. [Main component symbol description] 10 Cup shell 11 Side wall 12 LED chip 14 Light 16 Light emitting surface 18 Light collector 20 Side light type light emitting element package housing 22 Base 24 Light emitting element 26 Cup shell 27 Side wall 28 Light emitting surface 30 Side light type Light-emitting element package structure 32 Base 34 Cup shell 35 Side wall 36 Lead frame 361 Lead frame part 362 Lead frame part 38 LED chip 39 Wire 40 Sealing layer 42 Light-emitting surface 50 Light 52 Light 54 Light collector

Claims (1)

^///U4 六、申請專利範圍: L 一種側光式發光元件封|結構,包括: 一底座; 至少一發光元件,位於該底座上;及 H與底座結合而環繞該至少—發光元件,該杯殼面向該至 少一發光7G件的一側壁具有反射性該杯殼向外傾斜而使該側壁 • 與該底座形成一 140度至150度的失角,該杯殼具有-垂直於該 底座的冰度’該深度為G.25 mm至0.3 mm,該杯殼的杯口為-出 光面該出光面的面積為該底座的面積的1.5至2倍。 構’另包括一封膠層 2.如請求項1所述的側光式發光元件封裝結 覆蓋該至少一發光元件。 線,其與該至少結構’純括至少一導 元件封裝結發歧件魏結構,射_光式發光 11 [77704 6·—種側光式表面黏著型發光二極體封裝結構’包括: —杯形基底,包括一杯殼及一底座而形成一容置空間,該杯殼面向 該容置空間的一側壁具有反射性,該杯殼向外傾斜而使該側壁與 該底座形成一 140度至15〇度的夾角,該杯殼具有一垂直於該底 座的永度,該深度為0.25 mm至0·3 mm,該杯殼的杯口為一出光 面’該出光面的面積為該底座的面積的! 5至2倍; —引線架位於該底座上; 至少一發光二極體晶片,位於該引線架上而於該容置空間内;及 一封膠層,覆蓋該至少一發光二極體晶片。 7.如請求項6所述的側光式表面黏著型發光二極體封裝結構,其中 該封膠層另包括一螢光材料。 8. —種側光式發光元件封裝殼體,包括: 一底座;及 合而形成—杯狀的容置空間,該杯殼面向杯内 該杯殼向外傾斜而使該側壁與該底座形成 該出光面 的面積為該底座的面積的杯口為一出光面 9.如請求項8所述的側光式發 垂直於該底觸深度,該深产^件封裝殼體,其巾該杯殼具有一 又為 〇.25 _ 至 0.3 mm。 12 M377704 10.如請求項8所述的側光式發光元件封裝殼體,另包括一引線架 位於該底座上。 七、圖式:^///U4 VI. Patent Application Range: L A side-light type light-emitting element package|structure, comprising: a base; at least one light-emitting element is located on the base; and H is combined with the base to surround the at least-light-emitting element, The side of the cup facing the at least one illuminating 7G member is reflective. The cup is outwardly inclined such that the side wall forms a declination of 140 to 150 degrees with the base, the cup having - perpendicular to the base The ice degree 'the depth is G.25 mm to 0.3 mm, and the cup mouth of the cup is the light-emitting surface. The area of the light-emitting surface is 1.5 to 2 times the area of the base. The structure further includes an adhesive layer. The edge-lit light-emitting device package as claimed in claim 1 covers the at least one light-emitting element. a wire, and the at least structure 'pure at least one of the conductive component packages, the hair-emitting component, the light-emitting light-emitting diode 11 [77704 6·-side-side surface-mounting light-emitting diode package structure] includes: The cup-shaped base comprises a cup and a base to form an accommodating space, the cup shell is reflective toward a side wall of the accommodating space, and the cup shell is inclined outwardly so that the side wall forms a 140 degree with the base to An angle of 15 degrees, the cup has a permanentness perpendicular to the base, the depth is 0.25 mm to 0. 3 mm, and the cup mouth of the cup is a light exit surface. The area of the light exit surface is the base Area! 5 to 2 times; the lead frame is located on the base; at least one LED chip is disposed on the lead frame in the receiving space; and a glue layer covers the at least one LED chip. 7. The edge-lit surface-emissive LED package structure of claim 6, wherein the sealant layer further comprises a phosphor material. 8. An edge-lit light-emitting device package housing comprising: a base; and a cup-shaped accommodating space, wherein the cup body faces the cup and the cup shell is outwardly inclined to form the side wall and the base The cup surface of the area of the light-emitting surface is a light-emitting surface of the area of the base. The side-light type according to claim 8 is perpendicular to the depth of the bottom contact, the deep-packed package housing, the towel cup The shell has a 〇.25 _ to 0.3 mm. 12 M377704. The edge-lit light-emitting device package housing of claim 8, further comprising a lead frame on the base. Seven, the pattern: 1313
TW98221811U 2009-11-23 2009-11-23 Edge type light emitting component package structure and package housing TWM377704U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105070812A (en) * 2011-02-18 2015-11-18 新世纪光电股份有限公司 LED device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105070812A (en) * 2011-02-18 2015-11-18 新世纪光电股份有限公司 LED device

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