M341942 八、新型說明： 【新型所屬之技術領域】 • 本創作係有關一種模組化發光二極體，尤指一種更 具適用性及實用性的多功發光二極體封裝模組。 【先前技術】 在全球_能議題日愈發酵及各國政府未來將陸續禁 φ用白幟燈泡的政策下，發光二極體（LED)挾其高效率、節 能與可調光性之優勢在照明市場已逐漸形成風潮，其在 路燈、車燈、戶外照明、情境照明等應用已是全球矚目 的焦點。 過去發光二極體只普遍做為狀態指示燈的時代，其封 裝架構大多係以單一發光二極體為主，其所運用的設備則 必須個別完成發光二極體之電性連接，近年來由於發光二 極體的亮度、功率皆積極提升，並開始用於高亮度電子照 明應用之後，整體照明設備之發光二極體數量相對增加 (例如發光二極體路燈所採用的發光二極體數量從18顆 ’到126顆不等）。 ' 換言之，隨著發光二極體照明設備所使用的發光二 極體數量增加，藉由發光二極體封裝架構之改良，將有 助於高亮度發光二極體照明設備之產能。 【新型内容】 有鑑於此’本創作之主要目的即在提供一種更具適用 5 M341942 為達:2多功發光二極體封裴模組。 在一金屬基本創作之多功發光二極體封裝模組係 極體總成係包括:構有㈣個發光二極體總成’各發光二 的光杯;另外！至〉、一晶片及—相對包圍在晶片外侧 路，以及供I和=基板係設有供各晶片電性連接的線 接運用於手電筒==路;點，構成-種:以直 照明設備的模組化發光:極體;構。子看板4發先二極體 每、一個多功發光二極體封裝模組於實際使用 日、、而凡成金屬基板之電路接點與所應用設備之間的 電ϋ連接即可構成所有發光二極體總成之電性連接，故 可大幅提升發光二極體照明設備之產能；尤其，可針對使 用對象之實際需求，採用單—多功發光二極體封裝模組或 複數個多功發光二極體封|模組供使用對象組裝配置，大 幅升多功發光一極體封裴模組之適用性及實用性。 # 【實施方式】 • 本創作之特點，可參閱本案圖式及實施例之詳細說明 .而獲得清楚地瞭解。 如第一圖所示’本創作之多功發光二極體封裝模組 10係包括有·一金屬基板U及複數個發光二極體總成 12 ;其中： 金屬基板11係設有供各晶片121電性連接的線路（圖 略），以及供與外部電源連接的電路接點m;至於，複 6 M341942 數個發光二極體總成12即建構在該金屬基板11上，各發 、光二極體總成12係具有至少一晶片121及一相對包圍在 -晶片121外侧的光杯丨22,由光杯122控制各發光二極體 總成12的出光方向。 於實施時，各發光二極體總成12的光杯122係可以 由金屬、玻璃或塑膠等材料所製成，以有更好的光線反射 效果，增加出光效率，以及同時參照第二圖所示，得以依 ^照各光杯122的彎弧程度，進而調整發光二極體總成12 • 的出光方向；當然，亦可以如第三圖所示，於光杯122 内侧設有為高反射鍍膜的反射層123,使各晶片121產生 之光線得以進一步經由反射層123完全反射出光；甚至 於，各發光二極體總成12可以如第四圖所示，由一個光 杯122包圍複數個晶片121所構成，並進一步以一控制電 子元件124控制各發光二極體總成12之該些晶片121產 生不同的光色或者調整預期的光源亮度，更可透過該些晶 片121之混色作用，產生預期的光色（如白光）。 • 由於，本創作之多功發光二極體封裝模組10係在一 •金屬基板11上建構有複數個各具光源表現能力的發光二 -極體總成12,而得以採用單一多功發光二極體封裝模組 10使用於手電或是如第五圖所不’採用複數個多功 發光二極體封裝模組1〇使用於吸頂燈1，或是其他如路 燈、電子看板等發光二極體照明設備，大幅提升多功發光 二極體封裝模組之適用性及實用性。 尤其，每一個多功發光二極體封裝模組於實際使用 7 M341942 時’僅需要完成金屬基板之t路接點與所應贱備之間的 電性連接，即可構成所有發光二極體總成之電性連接，有 效㈣發k極體㈣設備之產能。 電 碘述，本創作提供一較佳可行之模組化發光二極 =裝㈣’爰依法提呈新型專狀申請；本創作之技術 可ΪΖΐί點已揭示如上，然而熟悉本項技術之人士仍 ill:絲作之揭示而作各種不背離本案創作精神之 "。因此’本創作之保護範圍應不限於實施例所 以^夕由而it包括各種不_本創作之替換及修飾’並為 下之申㉚專利範圍所涵蓋。 【圖式簡單說明】 f二，係為本創作第一實施例之多功發光二極體封裝模 組外觀立體圖。 係為本創作第一實施例之多功發光二極體封裝模 組結構剖視圖。 ff圖係為本創作第二實施例之多功發光二極體封裝模 組結構剖視圖。 ^ =圖係為本創作第三實施例之多功發光二極體封裝模 Ί、、、吉構平面圖。 ^圖係為本創作之多功發光二極體封裝模組之使用狀 悲參考圖。 【主要元件代表符號說明 8 M341942 1吸頂燈 、10多功發光二極體封裝模組 .11金屬基板 111電路接點 12發光二極體總成 121晶片 122光杯 ’ 123反射層 • 124控制電子元件M341942 VIII. New Description: [New Technology Field] • This creation is about a modular LED, especially a more suitable and practical multi-function LED package. [Prior Art] Under the policy of global _ energy issues and the government will continue to ban the use of white light bulbs in the future, the advantages of high efficiency, energy saving and dimming of light-emitting diodes (LED) in lighting The market has gradually formed a trend, and its application in street lamps, car lights, outdoor lighting, and situational lighting has become the focus of attention worldwide. In the past, the light-emitting diodes were only used as the status indicator. Most of the package architectures were based on single-emitting diodes. The devices used must be individually connected to the LEDs. The brightness and power of the light-emitting diodes are actively increased, and after the high-intensity electronic lighting application is started, the number of light-emitting diodes of the overall lighting device is relatively increased (for example, the number of light-emitting diodes used in the light-emitting diode street light is from 18 'to 126'). In other words, as the number of light-emitting diodes used in light-emitting diode lighting equipment increases, the improvement in the LED package structure will contribute to the production capacity of high-brightness light-emitting diode lighting equipment. [New content] In view of this, the main purpose of this creation is to provide a more suitable 5 M341942 for: 2 multi-function LED package. In the basic creation of a metal, the multi-function LED package module body assembly includes: a light cup with (four) light-emitting diode assemblies 'each light-emitting two; To >, a wafer and - relatively enclosed on the outside of the wafer, and for the I and = substrate are provided with wires for electrical connection of the wafers for use in the flashlight == road; point, composition - kind: with direct lighting Modular illumination: polar body; structure. Sub-board 4 first-pole diodes, one multi-function LED package module on the actual use day, and the electrical connection between the circuit contacts of the metal substrate and the applied device can constitute all the light The electrical connection of the diode assembly can greatly increase the production capacity of the light-emitting diode lighting device; in particular, the single-multi-function light-emitting diode package module or a plurality of multi-functions can be used for the actual needs of the object to be used. The light-emitting diode package|module is used for assembly and configuration of the object, and the applicability and practicability of the multi-function light-emitting one-pole sealing module are greatly increased. # [Implementation] • The characteristics of this creation can be clearly understood by referring to the detailed description of the drawings and the examples. As shown in the first figure, the multi-function LED package module 10 of the present invention comprises a metal substrate U and a plurality of LED assemblies 12; wherein: the metal substrate 11 is provided for each wafer 121 electrically connected circuit (not shown), and a circuit contact m for connection with an external power source; as for the complex 6 M341942, a plurality of light emitting diode assemblies 12 are constructed on the metal substrate 11, each hair, light two The polar body assembly 12 has at least one wafer 121 and a light cup 22 opposite to the outside of the wafer 121, and the light-emitting direction of each of the light-emitting diode assemblies 12 is controlled by the light cup 122. In implementation, the light cup 122 of each of the LED assemblies 12 can be made of metal, glass or plastic to provide better light reflection, increase light extraction efficiency, and simultaneously refer to the second figure. According to the degree of curvature of each of the light cups 122, the light-emitting diode assembly 12 can be adjusted to have a light-emitting direction. Of course, as shown in the third figure, the inner surface of the light cup 122 is provided with a high reflection. The coated reflective layer 123 allows the light generated by each of the wafers 121 to be completely reflected by the reflective layer 123; even, each of the LED assemblies 12 can be surrounded by a plurality of light cups 122 as shown in the fourth figure. The chip 121 is configured to further control the chips 121 of the LED assemblies 12 to generate different light colors or adjust the brightness of the desired light source, and the color mixing effect of the wafers 121 is further controlled by a control electronic component 124. Produces the desired color of light (such as white light). • Since the multiplexed LED package module 10 of the present invention is constructed with a plurality of light-emitting diode assemblies 12 each having a light source performance capability on a metal substrate 11, a single multi-function can be used. The LED package module 10 is used in a flashlight or as in the fifth figure, a plurality of multi-function LED package modules are used for the ceiling lamp 1 or other illumination such as street lamps and electronic boards. The diode lighting device greatly enhances the applicability and practicability of the multi-function LED package module. In particular, each plexi-electric diode package module can be used to form all the LEDs when the actual use of the 7 M341942 is required to complete the electrical connection between the t-contact of the metal substrate and the device. The electrical connection of the assembly is effective (4) the capacity of the device of the k pole body (4). Electric iodine, this creation provides a better and feasible modular illuminating dipole = loading (four) ' 爰 to submit a new type of application for the law; the technology of this creation can be disclosed above, but those who are familiar with the technology still Ill: The revelation of silk works is done in a variety of ways that do not deviate from the spirit of the creation of this case. Therefore, the scope of protection of this work should not be limited to the scope of the examples, and it includes various alternatives and modifications of the present invention and is covered by the scope of the patent application. [Simple description of the drawing] f II is a perspective view of the appearance of the multi-function LED package of the first embodiment of the present invention. A cross-sectional view of the structure of a multi-function LED package of the first embodiment of the present invention. The ff diagram is a cross-sectional view showing the structure of the multiplexed-diode package module of the second embodiment. ^ = The figure is a plan view of the multiplexed light-emitting diode package module of the third embodiment of the present invention. The figure is a reference diagram of the use of the multiplexed LED package module. [Main component representative symbol description 8 M341942 1 ceiling lamp, 10 multi-function LED package module. 11 metal substrate 111 circuit contact 12 light-emitting diode assembly 121 wafer 122 light cup ' 123 reflective layer • 124 control electronics element