M316600 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種快速熱對流金屬基板，尤指利用具 有至少一散熱片之金屬散熱結構透過不導電導熱材質與電 路板結合，使電路板上所產生之廢熱經由此金屬散熱結構 快速散除者。M316600 VIII. New Description: [New technical field] This is a fast thermal convection metal substrate, especially a metal heat dissipation structure with at least one heat sink through a non-conductive heat conductive material combined with a circuit board to make a circuit board The generated waste heat is quickly dissipated via the metal heat dissipation structure.
【先前技術】 由於電子產業的發達，電路板上的電路密度越來越 高，也造成在使用時電路板所積聚的廢熱越來越不易散 除。但現今電路板除了功能上的要求外，亦有輕巧化之要 求，因此，電路板往往都裝設於狹小之密閉空間中，致使 運作過程中所產生之熱量無法散發出去，而造成溫度過高 之現象’其不僅會影響電路之運作品質，更會縮減相關元 件之使用壽命。 習知對電路板散熱的方法，多為在電路板下方另外加 裝平板式散熱裝置’其散熱效果因散絲置與空氣接觸的 面積較少而較差。 因此’如何創作出—種快速熱對流金屬基板，使電路 .積極探 板能在運作_到最佳散触果，將是賴作所欲 討之處。 【新型内容】 :上述驾知之缺憾，創作人有感其未臻於完善， 5 M316600 遂竭其心智悉心研究克服，憑其從事該項產業多年之累積 經驗’進而研發出一種快速熱對流金屬基板，利用具有至 少一散熱片之金屬散熱結構透過不導電導熱材質與電路板 結合，使電路板上所產生之廢熱經由此金屬散熱結構快速 散除。 本創作之主要目的在提供一種快速熱對流金屬基板， 其利用具有至少一散熱片之金屬散熱結構透過不導電導熱 材質與電路板結合，使電路板上所產生之廢熱經由此金屬 散熱結構達到快速散除的目的。 w 本創作之目的係提供一種快速熱對流金屬基板，包 括：一金屬散熱結構，其具有至少一散熱片；一電路板^ 其设有至少一電子晶片；以及一不導電導熱材質，其黏人 該電路板設有該電子晶片的另一面與該金屬散埶姓 ° 、藉此，利用具有至少一散熱片之金屬散熱結構透過 導電導熱材質與電路板結合，使電路板上所產生之廢熱細 由此金屬散熱結構快速散除。 …、"二 【實施方式】 為使貴審查委員充分瞭解本創作之目的、特徵及工 效，茲藉由下述具體之實施例，並配合所附之圖式，= 創作做一詳細說明，說明如後： 、 _第一圖為本創作之一較佳具體實施例之快速埶對法 屬基板之剖視圖，請參考第一圖，此快速熱對流金屬= 包括：具有至少-散熱片之一金屬散熱結構1 (例如^呂 M316600 質散熱結構或鋼質散熱結構，但不限於此），其中，可藉由 擠壓方式或沖模方式形成散熱片；一電路板2(例如，3單 層電路板或多層電路板），其形式可為一印刷電路板、一陶 瓷電路板、一軟式印刷電路板或一金屬印刷電路板， 板2設有與其電性連結之至少一電子晶片3 ;以及一不導 電導熱材質4 (例如，熱熔黏合或常溫黏著的固態接著材 料或是熱熔黏合或常溫黏著的液態接著材料，但不限於 此），其利用常溫貼合或高溫壓合的方式使金屬散熱結構ι 與電路板2 «c有電子晶片3的另一面黏合。如第一圖所示 ，為了方便本創作之快速熱對流金屬基板與外部裝置的耦 合，更可利用穿孔機加工快速熱對流金屬基板形成至少一 牙孔5，以供至少一耦合元件7穿入。而電路板2上之電 路係以銅箔或鋁箔由影像轉移、蝕刻、雕刻或雷射製作形 成’同時塗佈絕緣阻劑防止短路情況發生，並以防氧化保 護層保護防止電路因水氣而氧化。 、 第一圖為本創作之另一較佳具體實施例之快速熱對流 金屬基板之剖視圖，請參考第二圖，其中，為了加強黏合 效果，可對金屬散熱結構i _化學㈣或方式進行 表面粗化。另外，亦可以一電池或—外接電源驅動之散熱 風扇6搞合於金屬散熱結構！，藉由散熱風扇6使空氣對 流帶走更多電路板2所產生的廢熱。 如上所述’本創作係利用具有至少一散熱片之金屬散 熱結構透料導電導歸f與電叫結合，使電路板上所 產生之廢熱經減金屬賴賴物快速散除的目的；就 M316600 產業上的可性而言，彻本創作所衍生的產品，當可 充分滿足目前市場的需求。 本創作在上文中已以較佳實施例揭露，然孰 :者應理解的是’該實施例僅用麟本創作 項為限制本鑛之_。應注意的是，舉凡與該實施例等 放之’交化與置換，均應設為涵蓋於本創作之範轉内。因此 ，本創作之保護範圍當以下文之申請專利範圍所界定者為 準。 〆 【圖式簡單說明】 第一圖為本創作之一較佳具體實施例之快速熱對流金 屬基板之剖視圖。 第二圖為本創作之另一較佳具體實施例之快速熱對流 金屬基板之剖視圖。 【主要元件符號說明】 1金屬散熱結構 2電路板 3電子晶片 4不導電導熱材質 5穿孔 6散熱風扇 7轉合元件[Prior Art] Due to the development of the electronics industry, the circuit density on the circuit board is getting higher and higher, which also causes the waste heat accumulated in the circuit board to be more and more difficult to dissipate during use. However, in addition to the functional requirements, today's circuit boards also have the requirement of light weight. Therefore, the circuit boards are often installed in a narrow and confined space, so that the heat generated during operation cannot be dissipated, resulting in excessive temperature. The phenomenon 'will not only affect the operational quality of the circuit, but also reduce the service life of related components. Conventionally, the method of dissipating heat to the circuit board is mostly to add a flat-plate heat sink below the circuit board. The heat dissipation effect is poor due to the small area of the loose wire placed in contact with the air. Therefore, 'how to create a kind of fast thermal convection metal substrate, so that the circuit can be operated. _ to the best touch fruit, will be the place to be. [New content]: The lack of the above-mentioned driving knowledge, the creator feels that it is not perfect, 5 M316600 exhausted its mental research and overcome it, and based on its accumulated experience in the industry for many years, and developed a fast thermal convection metal substrate The metal heat dissipation structure having at least one heat sink is combined with the circuit board through the non-conductive heat conductive material, so that the waste heat generated on the circuit board is quickly dissipated through the metal heat dissipation structure. The main purpose of the present invention is to provide a fast thermal convection metal substrate which is combined with a circuit board through a non-conductive heat conductive material by using a metal heat dissipation structure having at least one heat sink, so that the waste heat generated on the circuit board is fast through the metal heat dissipation structure. The purpose of dispersal. The purpose of the present invention is to provide a rapid thermal convection metal substrate comprising: a metal heat dissipation structure having at least one heat sink; a circuit board having at least one electronic wafer; and a non-conductive heat conductive material, which is viscous The circuit board is provided with the other side of the electronic chip and the metal, and the metal heat dissipation structure having at least one heat sink is combined with the circuit board through the conductive heat conductive material to make the waste heat generated on the circuit board The metal heat dissipation structure is quickly dissipated. ...,"2 [Implementation] In order to fully understand the purpose, characteristics and work efficiency of the author, the following specific examples, together with the attached drawings, = a detailed description of the creation, Illustrated as follows: _ The first figure is a cross-sectional view of a preferred substrate of the preferred embodiment of the present invention, please refer to the first figure, the fast thermal convection metal = including: having at least one of the heat sink Metal heat dissipation structure 1 (for example, but not limited to) the M316600 heat dissipation structure or the steel heat dissipation structure, wherein the heat sink can be formed by extrusion or die; a circuit board 2 (for example, 3 single layer circuit) The board or the multi-layer circuit board can be in the form of a printed circuit board, a ceramic circuit board, a flexible printed circuit board or a metal printed circuit board, and the board 2 is provided with at least one electronic chip 3 electrically connected thereto; Non-conducting and heat-conducting material 4 (for example, hot-melt bonding or solid-state bonding material at room temperature or hot-melt bonding or liquid-bonding material at room temperature, but not limited to this), which utilizes normal temperature bonding or high temperature bonding Ι embodiment of the metal heat dissipation structure and the circuit board 2 «c 3 has another side of the wafer bonding electrons. As shown in the first figure, in order to facilitate the coupling of the rapid thermal convection metal substrate and the external device of the present invention, the piercing machine can be used to process the rapid thermal convection metal substrate to form at least one hole 5 for the at least one coupling element 7 to penetrate. . The circuit on the circuit board 2 is formed by image transfer, etching, engraving or laser forming with copper foil or aluminum foil. At the same time, an insulating resist is applied to prevent a short circuit from occurring, and the anti-oxidation protective layer is used to protect the circuit from moisture. Oxidation. The first figure is a cross-sectional view of a fast thermal convection metal substrate according to another preferred embodiment of the creation. Please refer to the second figure. In order to enhance the bonding effect, the surface of the metal heat dissipation structure i _ chemical (four) or mode can be surfaced. Coarse. In addition, a battery or an external power supply driven cooling fan 6 can be integrated into the metal heat dissipation structure! By the cooling fan 6, the air convection takes away more waste heat generated by the circuit board 2. As described above, the present invention utilizes a metal heat-dissipating structure having at least one heat sink, and the conductive conductive derivative f is combined with the electric call to make the waste heat generated on the circuit board quickly dissipated by the metal-reducing material; In terms of industrial viability, the products derived from this creation can fully meet the needs of the current market. This creation has been disclosed above in the preferred embodiment, and it should be understood that the embodiment only uses the lining creation to limit the mine. It should be noted that the intersection and replacement of the embodiment and the like should be included in the scope of this creation. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application below. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a cross-sectional view of a fast thermal convection metal substrate according to a preferred embodiment of the present invention. The second figure is a cross-sectional view of a fast thermal convection metal substrate in accordance with another preferred embodiment of the present invention. [Main component symbol description] 1 metal heat dissipation structure 2 circuit board 3 electronic chip 4 non-conductive heat conductive material 5 perforation 6 cooling fan 7 turning component