M255961 創作說明（1) 【新型所屬之技術領域】 本新型係有關一種筆記型電腦之散熱座，藉由將散埶座 設計為一可收合的，使得散熱座所佔空間減少，以利於攜帶 且可配合不同尺寸之筆記型電腦使用。 同 【先前技術】M255961 Creation Instructions (1) [Technical Field to which the New Type belongs] This new type is related to a notebook computer's heat sink. By designing the fan mount to be retractable, the space occupied by the heat sink is reduced to facilitate carrying. And can be used with different size notebook computers. The same as [prior art]
筆記型電腦（Note Book，NB) —向標榜方便、可攜帶， 但也為了要符合攜帶方便的要求，筆記型電腦（NB )必得輕薄 短小，以使其達到重量輕、體積小的境界，也就是因為^/ 樣，所以筆記曰型電腦（NB)的内部空間總是極其有限，而使得 CPU產生的熱1 ’在狹小的空間内便無法順利排出，於是， CPU每每運轉一陣子後，即得「休息」一下，以等待cpu内部 線路冷卻，這也就是所謂的「當機」。 /所以散熱問題，一直是筆記型電腦最大的技術瓶頸，它 y係到筆記型電腦的穩定度，許多不明原因的當機都是因為 f熱問題無法解決所造成，而散熱的方法更關係到筆記型電 月向電池的壽命，不良的散熱方法，將導致大部分電池的電力 使=於散熱，而縮短了電池的使用時間，但筆記型電腦内部 的空間實在有限，所以利用一外接於筆記型電腦外部的散埶 座來幫助其散熱。 …、Note Book (NB) — advertised as convenient and portable, but in order to meet the requirements of portability, the notebook computer (NB) must be thin and short to make it reach the realm of light weight and small size. Because ^ / is the same, the internal space of a notebook computer (NB) is always extremely limited, so that the heat generated by the CPU cannot be discharged smoothly in a small space. Therefore, after the CPU has been running for a while, Have to "rest" to wait for the internal circuit of the CPU to cool down, which is also called "downtime". / So the heat dissipation problem has always been the biggest technical bottleneck of the notebook computer. It is related to the stability of the notebook computer. Many unexplained crashes are caused by the thermal problem that cannot be solved, and the method of heat dissipation is more related. The life of the notebook electric moon battery and poor heat dissipation methods will cause most of the battery's power to be used to dissipate heat and shorten the battery life, but the space inside the notebook computer is really limited, so using an external connection to the notebook A computer's external diffuser to help dissipate heat. ...,
一般的散熱座其表面開設有複數個洞孔，用以裝設複數 個並使風扇露出，當風扇運轉時可將空氣吹拂以帶動 周4氣流流動，並在散熱座表面設有複數個橡皮墊以將置放 2散熱座上的筆記型電腦撐起，使散熱座與筆記型電腦具有 一間距，以利於散熱座之風扇將筆記型電腦底部之熱量吹The surface of a general heat sink is provided with a plurality of holes for installing a plurality of holes and exposing the fan. When the fan is running, the air can be blown to drive the flow of air around the periphery, and a plurality of rubber pads are provided on the surface of the heat sink. To support the notebook computer placed on the 2 cooling base, so that the cooling base and the notebook have a gap, so that the fan of the cooling base can blow the heat of the bottom of the notebook computer.
M255961 四、創作說明（2) 散，並經由脐„ σ 但常見 f 將此熱量帶出。 處，了 i著i f熱座因體積較大，使得擴帶外出有不便之 法配合各式揭電腦製作的體積愈來愈小，此種散熱座無 金為材料製作，退型電腦，且因為此種散熱座通常以鋁合 法跟進筆記型I=f—定之=量’顯示出現有之散熱座無 【新型内容】*i作趨於輕薄短小，且重量輕的境界。 本新型. 使散熱座成為—可決上述問題，係利用-收合機構， 本新型包括Z 減小散熱座之體積。 板；一支撐板用以對筆記型電腦進行散熱之散熱 以使支樓板與以；樞！二糧板及支撐板之間，用 成熱板有一靠近或遠離之關係。 配合不ΐ尺：口mi構，可改變散熱座之體積大小，以 加工容易等多項優點。 又具有製造及 【實施方式】 有關本新型之詳纟田# BB ^+ 如下：七，、…月及技術内容’現就配合圖式說明 請參閱「第i、2_2、3圖」，如 筆記型電腦之散熱座，包括有：一散熱板】，在其表本新型之 禝數個風扇10，及複數個配合風扇丨〇散熱之散熱孔11，，用以 第6頁 M255961 四、創作說明（3) '" " 對筆π己型電腦之底部進行散熱，並在其四個端點設置數個軟 墊12(可為一橡膠墊片），使筆記型電腦底部撐起，以具有一 通風之空間； ^ 一支撐板2，於支撐板2二端設置數個軟墊15(可為一橡 膠墊片）’並於軟墊15底部設有一滑槽151，使軟墊15可於滑 槽151中來回移動，藉由軟墊15可移動其位置，以供不同大 小之筆記型電腦置放於其上，並藉由上述之軟墊12、15以增 加摩擦力，使筆記型電腦不易滑落； 9 一收合機構3，樞設於散熱板1及支撐板2間，包括有： 一滑杯3 0 1、3 0 2 ’其分別設有一滑動齒條3 〇 4，並於滑動齒 條304二側分別設置滑槽執道303、305 ; 分別將滑桿301、302之一端與支撐板2固接，滑桿3〇1、 302之另一端以可滑動之方式樞設於相對應於散熱板1之開槽 131中，使滑桿301、302可於開槽131之空間内滑動，且開^ 1 31之空間設有二配合滑桿3 0 1、3 0 2之滑槽執道3 〇 3、3 0 5的 凸執1 3 2、1 3 3，使滑桿3 0 1、3 0 2於滑動時，其滑槽執道 3 0 3、3 0 5將沿凸軌1 3 2、1 3 3之軌道滑移，使滑桿3 〇 1、3 〇 2滑 動時不易產生晃動，又開槽1 3 1之空間亦設有一對應滑桿 301、302之滑動齒條304的凸塊134，使滑桿3〇1、302移動 時，其滑動齒條304的齒狀凸起部份將卡觸此凸塊丨34。 將支撐板2向散熱板1之方向推進，當滑桿3〇1、3〇2滑人 開槽131之空間時，滑桿301、302之滑槽執道303、3〇5將沿 凸執1 3 2、1 3 3之執道滑移，此時便可帶動支撐板2與散熱板j 貼齊靠攏，藉以縮小散熱座的體積，使其便於攜帶或可配合M255961 Fourth, the creation instructions (2), and the heat through the umbilical „σ but common f to take out this heat. Because of the large volume of the thermal base, if there is an inconvenient way to expand the band to cooperate with various types of computer The production volume is getting smaller and smaller. This kind of heat sink is made of gold without material. It is a type of computer, and because this kind of heat sink is usually followed by aluminum, I = f— 定 之 = 量 'shows the existence of the heat sink. No [new content] * I tend to be light, thin, short, and light. This new type. Makes the heat sink-can solve the above problems, is the use-collapse mechanism, this model includes Z to reduce the size of the heat sink. Plate A support board is used to dissipate the heat of the notebook computer so that the support floor and the support board are connected to each other; between the two grain boards and the support board, the heating board is used to have a close or far relationship. Structure, can change the volume size of the heat sink, easy processing, and many other advantages. It also has manufacturing and [implementation] details of this new model. Putian # BB ^ + is as follows: July, ... and technical content Refer to "i "2_2, 3", such as the cooling base of a notebook computer, including: a heat sink], a number of fans 10 in its model, and a plurality of cooling holes 11 for cooling. Page 6 M255961 Fourth, the creation instructions (3) '" " The bottom of the pen π type computer heat dissipation, and several soft pads 12 (can be a rubber gasket) at its four end points, so that The bottom of the notebook computer is supported so as to have a ventilated space; ^ a support plate 2 is provided with a plurality of cushions 15 (which can be a rubber gasket) at the two ends of the support plate 2 and a slide is provided at the bottom of the cushion 15 The groove 151 allows the soft pad 15 to move back and forth in the sliding groove 151, and the position can be moved by the soft pad 15 so that notebook computers of different sizes can be placed thereon. In order to increase the friction force, the notebook computer is not easy to fall; 9 A collapsible mechanism 3 is pivoted between the heat dissipation plate 1 and the support plate 2 and includes: a sliding cup 3 0 1 and 3 0 2 'which are respectively provided with a slide Rack 3 04, and slide rails 303 and 305 are set on the two sides of the sliding rack 304, respectively. The end is fixedly connected to the support plate 2 and the other end of the sliding rod 3101 and 302 is pivotably arranged in a slot 131 corresponding to the heat sink 1 so that the sliding rods 301 and 302 can be in the slot 131. Slide in the space, and the space of ^ 1 31 is provided with two slide grooves 3 0 1 and 3 0 2 which cooperate with the slide bars 3 0 3 and 3 0 5 to make the slide bars When 3 0 1, 3 0 2 slides, its chute guides 3 0 3, 3 0 5 will slide along the track of the convex track 1 3 2, 1 3 3, making the slide bar 3 〇1, 3 〇2 slide It is not easy to produce shaking, and a slot 131 is also provided with a projection 134 corresponding to the sliding rack 304 of the sliding bars 301 and 302. When the sliding bar 301 and 302 move, the teeth of the sliding rack 304 The convex portion will be caught on this convex block 34. Push the support plate 2 in the direction of the heat dissipation plate 1. When the slide bars 301, 302 slide into the space of the slot 131, the slide channel 303, 305 of the slide bars 301, 302 will follow the convex 1 3 2, 1 3 3 slips, and at this time, the support plate 2 and the heat sink j can be brought close together, thereby reducing the volume of the heat sink, making it convenient to carry or cooperate with
第7頁 M255961 3、創作說明（4) " 較小的筆記型電腦使用；而將支撐板2向遠離散熱板丨之方向 拉離時’滑桿301、302滑出開槽131之空間，滑桿3〇1、3〇2 之滑槽執道303、305將沿凸軌132、133之執道滑移，此 可f動支撐板2與散熱板1遠離，使散熱座面積加大， 較大的筆記型電腦使用；又因開槽131之凸塊134會輕微卡σ 滑動齒條304上之齒狀凸起，所以當移動支撐板2時，< 卞於 134及滑動齒條304會產生一摩擦，並產生階#段性:移=塊 得支撐板2與散熱板1可相對固定於任一位 ’使 的滑動。 置，不易產生突然 請參閱「第4圖」，係為另一實施例之示意圖，包 散熱板1 ; 一收合機構6，包括有：兩相同結構之連桿6〜 602，將兩連桿601、602之一端樞接於散熱板1上，另〜、 支撐板2樞接，其中兩連桿6〇ι、6〇2之交錯部份，具有^輿 接點6 11，藉由此樞接點6 11，使兩連桿6 〇 j6 〇 2可收合柩 疊；將支撐板2向散熱板1之方向推近，將帶動兩連桿&曰 602相疊合，使支撐板2靠攏散熱板i，以縮小散熱座的體、 積；將支撐板2向遠離散熱板1之方向拉離時，將帶動 面 601、60 2撐開，使支撐板2與散熱板1遠離，加大散熱，棹 積。 之 綜上所述僅為本新型的較佳實施例而已，並非用來 本新型之貫施範圍。即凡依本新型申請專利範圍之内容又 定 的等效變化與修飾，皆應為本新型之技術範疇。 所為Page 7 M255961 3. Creation instructions (4) " For smaller notebook computers; when the support plate 2 is pulled away from the heat sink 丨, the slide bars 301, 302 slide out of the space of the slot 131, The sliding groove guideways 303 and 305 of the slide bars 3101 and 302 will slide along the guideways of the convex rails 132 and 133. This can move the support plate 2 away from the heat sink plate 1 to increase the area of the heat sink seat. Larger notebook computers are used; and because the projections 134 of the slot 131 will slightly catch σ, the toothed projections on the sliding rack 304, so when moving the support plate 2, < 卞 134 and sliding rack 304 There will be a friction and step #segmentation: shift = the support plate 2 and the heat dissipation plate 1 can be relatively fixed at any position to cause sliding. Please refer to "Figure 4", which is a schematic diagram of another embodiment, including a heat sink 1; a folding mechanism 6, including: two connecting rods 6 to 602 of the same structure, and two connecting rods One end of 601 and 602 is pivotally connected to the heat dissipation plate 1 and the other is a pivotal connection to the support plate 2. The interlaced part of the two links 60 and 60 has a contact point 6 11 through which Contact 6 11 so that the two links 6 〇j6 〇2 can be folded and stacked; pushing the support plate 2 toward the heat dissipation plate 1 will drive the two links & 602 to overlap to make the support plate 2 Close the heat sink i to reduce the size and volume of the heat sink; when pulling the support board 2 away from the heat sink 1, the driving surfaces 601 and 60 2 are spread apart to keep the support board 2 and the heat sink 1 away. Great heat dissipation and accumulation. In summary, the above are only preferred embodiments of the present invention, and are not intended to be used in the scope of the present invention. In other words, all equivalent changes and modifications based on the scope of the patent application for the new model shall be the technical scope of the new model. Do
M255961 圖式簡單說明 【圖式簡單說明】 第1圖，係為本新型之外觀收合示意圖。 第2-1圖，係為本新型之收合機構示意圖。 第2-2圖，係為本新型之侷部放大示意圖。 第3圖，係為本新型之外觀展開示意圖。 第4圖，係為本新型之另一實施例之示意圖。 【圖式符號說明】 I .....•散熱板 10......風扇 II ......散熱孔 12、15......軟塾 151 ......滑槽 3、6......收合機構 301、302……滑桿 131 ......開槽 132、133......凸軌 303、305……滑槽執道 2……支撐板 3 0 4 ......滑動齒條 13 4......凸塊 6 01、602 ......連桿 611 ......極接點M255961 Schematic illustration [Schematic description] Figure 1 is a schematic diagram of the appearance of the new model. Figure 2-1 is a schematic diagram of the new type of folding mechanism. Figure 2-2 is a partially enlarged schematic diagram of the new model. Figure 3 is a schematic diagram showing the appearance of the new model. FIG. 4 is a schematic diagram of another embodiment of the present invention. [Illustration of Symbols] I ..... • Radiating plate 10 ...... Fan II ...... Cooling holes 12, 15 ... Soft 塾 151 ...... Slots 3, 6 ... Collapse mechanisms 301, 302 ... Slide bars 131 ... Slots 132, 133 ... Raised rails 303, 305 ... Slot channels 2 ... support plate 3 0 4 ... sliding rack 13 4 ... bump 6 01,602 ... link 611 ... pole contact
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