TWI921275B - Heat dissipation structure and electronic device - Google Patents

Abstract

The present invention relates to a heat dissipation structure and an electronic device. The heat dissipation structure comprises a cold plate and a cooling fan. The cold plate is provided with a liquid flow channel, the liquid flow channel being configured to allow a coolant to flow therethrough. A portion of the cold plate having the liquid flow channel is thermally coupled to a first hard disk array component, so that the coolant in the liquid flow channel performs liquid cooling heat dissipation for the first hard disk array component. The cooling fan is disposed at a side portion of the cold plate and is configured to drive airflow to perform air cooling heat dissipation for a second hard disk array component. By adopting a combined liquid cooling and air cooling approach for dissipating heat from a plurality of hard disks, the power consumption and operational noise of the cooling fan can be reduced, and the heat dissipation risk is lower. In addition, since the second hard disk array component adopts the air cooling mode, the flow rate of the coolant in the cold plate can be reduced, thereby reducing resistance loss and facilitating a reduction in the overall pressure drop of the cold plate.

Description

Heat dissipation structure and electronic device

This invention relates to the field of server technology, and in particular to a heat dissipation structure and electronic device.

With the continuous emergence of AI products, the global market demand for computing power has exploded. To achieve faster computing speeds, it is necessary to improve server performance. The improvement of server performance will lead to the generation of more heat. If too much heat accumulates, it will lead to a decrease in server performance and lifespan. Therefore, it is necessary to dissipate heat from the server.

Common server cooling methods include air cooling and liquid cooling. Air cooling has high energy consumption, high noise, and low heat dissipation efficiency, while liquid cooling has heat dissipation risks.

Therefore, it is necessary to provide a heat dissipation structure and electronic device that has low energy consumption, low noise, high heat dissipation efficiency, and at the same time reduces heat dissipation risks.

In a first aspect, the present invention provides a heat dissipation structure for dissipating heat between a first hard disk array unit and a second hard disk array unit, said heat dissipation structure comprising:

A cold plate, wherein the cold plate is provided with a liquid flow channel for supplying coolant, and the portion of the cold plate having the liquid flow channel is used for thermal coupling with the first hard disk array unit, so that the coolant in the liquid flow channel provides liquid cooling heat dissipation to the first hard disk array unit; and

A heat dissipation fan is located on the side of the cold plate and is used to drive airflow to perform air cooling for the second hard disk array unit.

In one embodiment, the cold plate has a first portion and a second portion, the first portion having the fluid flow channel, the first portion being used for thermal coupling with the first hard disk array unit, and the second portion being used for thermal coupling with the second hard disk array unit.

In one embodiment, the heat dissipation fan is located on the side of the first portion opposite to the second portion.

In one embodiment, at least two fluid channels are provided, and the at least two fluid channels are independent of each other and staggered.

In one embodiment, at least two fluid channels are provided, and the at least two fluid channels have the same length.

In one embodiment, the cold plate is further provided with a first liquid inlet and a first liquid outlet, both of which are connected to the liquid flow channel; the heat dissipation structure further includes a coolant distribution unit, which is provided with a second liquid inlet and a second liquid outlet, the second liquid inlet being connected to the first liquid outlet and the second liquid outlet being connected to the first liquid inlet.

In one embodiment, the heat dissipation structure further includes a plurality of heat-conducting brackets, which are arranged in an array on the cold plate and thermally coupled to the cold plate. Each of the heat-conducting brackets is provided with a receiving groove, and the hard disk is disposed in the receiving groove and thermally coupled to the heat-conducting bracket.

In one embodiment, the heat-conducting bracket includes a heat-conducting base plate, a first heat-conducting side plate, and a second heat-conducting side plate. The heat-conducting base plate is thermally coupled to the cold plate. Two first heat-conducting side plates are provided, and the two first heat-conducting side plates are arranged opposite each other in a first direction of the cold plate. The second heat-conducting side plate is disposed between the two first heat-conducting side plates. The first heat-conducting side plates, the second heat-conducting side plates, and the heat-conducting base plate surround to form the receiving groove.

In one embodiment, a first airflow channel is formed between the first heat-conducting side plates of two adjacent heat-conducting brackets in the first direction; and/or, the distance between the second heat-conducting side plates of two adjacent heat-conducting brackets in the second direction of the cold plate is greater than the thickness of a single hard disk, so that a second airflow channel is formed between the hard disk on one of the adjacent heat-conducting brackets and the second heat-conducting side plate of the other adjacent heat-conducting bracket.

In one embodiment, the heat dissipation structure further includes a thermally conductive medium layer disposed between the cold plate and the thermally conductive support.

Secondly, the present invention also provides an electronic device, comprising:

The shell has a receiving cavity, an air inlet, and an air outlet, and the receiving cavity is connected to the air inlet and the air outlet;

Multiple hard drives, the multiple hard drive arrays disposed within the receiving cavity to form a first hard drive array unit and a second hard drive array unit; and

In any of the above heat dissipation structures, the cold plate is disposed within the accommodating cavity, and the portion of the cold plate having the liquid flow channel is thermally coupled to the first hard disk array unit so that the heat generated by the first hard disk array unit is transferred to the coolant. The heat dissipation fan is disposed within the casing, and the heat dissipation fan is used to drive outside air into the accommodating cavity through the air inlet to blow towards the second hard disk array unit and exhaust it from the air outlet.

In one embodiment, the cooling fan is located on the side of the first hard disk array unit away from the second hard disk array unit, with the air intake side of the cooling fan facing the air inlet and the air outlet side of the cooling fan facing the air outlet.

In one embodiment, the electronic device further includes a motherboard, a cold plate disposed on the motherboard, and a hard drive disposed on the side of the cold plate opposite to the motherboard and electrically connected to the motherboard.

Compared to air cooling, the aforementioned heat dissipation structure and electronic device in this embodiment employ a combination of liquid cooling and air cooling to dissipate heat from multiple hard drives, thus reducing the power consumption and operating noise of the cooling fans. Compared to liquid cooling alone, this embodiment's combination of liquid cooling and air cooling for multiple hard drives results in lower heat dissipation risk. Furthermore, since the second hard drive array unit uses air cooling, the flow rate of coolant within the cold plate is reduced, minimizing resistance loss and consequently reducing the overall pressure drop of the cold plate.

To make the aforementioned objectives, features, and advantages of this invention more apparent, the specific embodiments of this invention are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of this invention. However, this invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the scope of this invention. Therefore, this invention is not limited to the specific embodiments disclosed below.

Referring to Figure 1, an electronic device is provided in one embodiment of the present invention. The electronic device is a server or other electronic product.

Referring to Figures 2, 3, and 5, the electronic device includes a casing 20, a hard drive 30, and a motherboard 40. The casing 20 has a receiving cavity 21, within which both the hard drive 30 and the motherboard 40 are located. The hard drive 30 and the motherboard 40 are electrically connected. Specifically, in this embodiment, there are multiple hard drives 30, arranged in an array on the motherboard 40. The motherboard 40 has multiple connectors 41, arranged in an array, each connector 41 being electrically connected to one of the multiple hard drives 30.

When the electronic device is running, the hard drive 30 generates heat. If too much heat accumulates on the hard drive 30, it will affect the performance and lifespan of the hard drive 30. Therefore, in this embodiment, the electronic device also includes a heat dissipation structure 10, which is used to dissipate heat from the multiple hard drives 30, so that the temperature of the multiple hard drives 30 is kept within a preset temperature range.

In one embodiment, referring to Figure 2, multiple hard drives 30 are arranged in an array, forming a first hard drive array unit 31 and a second hard drive array unit 32. The first hard drive array unit 31 and the second hard drive array unit 32 are arranged side by side in a first direction. Here, X represents the first direction.

Referring to Figure 2, there are 112 hard drives 30, which are arranged in an array of 8 rows and 14 columns. Among them, 5 rows and 14 columns of hard drives 30 constitute the first hard drive array unit 31, and 3 rows and 14 columns of hard drives 30 constitute the second hard drive array unit 32.

Of course, in other embodiments, 4 rows of 14 hard drives 30 constitute the first hard drive array unit 31, and 4 rows of 14 hard drives 30 constitute the second hard drive array unit 32. Alternatively, 6 rows of 14 hard drives 30 constitute the first hard drive array unit 31, and 2 rows of 14 hard drives 30 constitute the second hard drive array unit 32.

In one embodiment, referring to Figure 3, the housing 20 is provided with an air inlet 231, which is connected to the accommodating cavity 21.

Referring to Figures 2 and 3, the heat dissipation structure 10 includes a liquid cooling structure and an air cooling structure. The liquid cooling structure includes a cold plate 11, which is disposed within the housing cavity 21 and thermally coupled to the first hard disk array unit 31 for liquid cooling heat dissipation. The air cooling structure includes a heat dissipation fan 12, which drives outside air into the housing cavity 21 through the air inlet 231 and blows it towards the second hard disk array unit 32 for air cooling heat dissipation. Thus, compared to using air cooling alone, this embodiment uses a combination of liquid cooling and air cooling to dissipate heat from multiple hard disks 30, which reduces the power consumption and operating noise of the heat dissipation fan 12. Compared to liquid cooling, this embodiment uses a combination of liquid cooling and air cooling to dissipate heat from multiple hard drives 30, resulting in lower heat dissipation risk. In addition, since the second hard drive array unit 32 uses air cooling, the flow rate of coolant in the cold plate 11 can be reduced, reducing resistance loss and thus helping to reduce the overall pressure drop of the cold plate 11.

In one embodiment, referring to Figure 5, the cold plate 11 has a first portion 111. The first portion 111 is provided with a liquid flow channel 1111, a first liquid inlet 1112, and a first liquid outlet 1113, and the liquid flow channel 1111 is connected to the first liquid inlet 1112 and the first liquid outlet 1113. A first hard disk array unit 31 is disposed in the first portion 111 and is thermally coupled to the first portion 111. During heat dissipation, coolant flows into the liquid flow channel 1111 through the first liquid inlet 1112, carrying away the heat generated by the first hard disk array unit 31, reducing the temperature of the first hard disk array unit 31, and increasing the temperature of the coolant in the liquid flow channel 1111, which then flows out through the first liquid outlet 1113. This cycle is repeated to achieve liquid cooling heat dissipation of the first hard disk array unit 31.

Furthermore, the heat dissipation structure 10 also includes a coolant distribution unit (CDU). The coolant distribution unit is provided with a second inlet and a second outlet. The second inlet is connected to the first outlet 1113 of the cold plate 11, and the second outlet is connected to the first inlet 1112 of the cold plate 11. It should be noted that the coolant distribution unit has a built-in heat exchange unit, etc. The coolant distribution unit exchanges heat with the cold source equipment on the primary side, and the coolant after heat exchange flows into the liquid flow channel 1111 from the first inlet 1112.

In one embodiment, at least two liquid flow channels 1111 are provided. The at least two liquid flow channels 1111 are arranged in parallel. It is understood that the at least two liquid flow channels 1111 are not interconnected. At least two first liquid inlets 1112 and at least two first liquid outlets 1113 are provided. The at least two first liquid inlets 1112 are connected to the inlet ends of the at least two liquid flow channels 1111 one by one, and the at least two first liquid outlets 1113 are connected to the outlet ends of the at least two liquid flow channels 1111 one by one.

Furthermore, at least two liquid flow channels 1111 are staggered. It is understood that at least two liquid flow channels 1111 do not overlap. This arrangement increases the heat exchange area between the coolant and the first hard drive array unit 31, thereby improving the heat dissipation effect of the first hard drive array unit 31. In addition, while keeping the heat exchange area between the first hard drive array unit 31 and the coolant constant, the length of each liquid flow channel 1111 can be shortened, which is beneficial for increasing the circulation speed of the coolant, thereby improving the heat dissipation effect of the first hard drive array unit 31.

In one embodiment, at least two flow channels 1111 are of equal length. It is understood that the coolant has the same path in all flow channels 1111. This reduces the overall pressure drop of the cold plate 11.

In one embodiment, referring to Figure 5, the cold plate 11 further has a second portion 112, with the first portion 111 and the second portion 112 arranged side-by-side in a first direction. A second hard disk array unit 32 is disposed in the second portion 112. It is understood that the second portion 112 of the cold plate 11 does not have a liquid flow channel 1111. When the electronic device is operating, the heat generated by the second hard disk array unit 32 can be transferred to the second portion 112 and exchanged with the coolant. The coolant carries away the heat generated by the second hard disk array unit 32, thereby reducing the temperature of the second hard disk array unit 32.

Understandably, the coolant can only remove a small portion of the heat generated by the second hard drive array unit 32.

The second hard disk array unit 32 mainly uses air cooling for heat dissipation, that is, the cooling airflow formed by the heat dissipation fan 12 can carry away most of the heat of the second hard disk array unit 32.

In one embodiment, the cooling fan 12 is located on the side of the first hard disk array unit 31 away from the second hard disk array unit 32, and the air inlet 231 is arranged opposite to the suction side of the cooling fan 12. When dissipating heat, the cooling fan 12 is turned on, and the cooling fan 12 drives the outside air into the housing 21 through the air inlet 231 and blows it towards the second hard disk array unit 32 to remove the heat generated by the second hard disk array unit 32, thereby reducing the temperature of the second hard disk array unit 32 and realizing air-cooled heat dissipation of the second hard disk array unit 32. Because the second hard disk array unit 32 is located close to the air inlet 231, outside air enters the housing 21 through the air inlet 231 and exchanges heat with the second hard disk array unit 32 before being heated by other components. This ensures the heat dissipation effect of the second hard disk array unit 32. In addition, under the action of the cooling fan 12, outside air enters and exits directly, avoiding local resistance caused by complex air ducts. At the same speed, this reduces pressure drop and power consumption of the cooling fan 12.

Referring to Figure 3, the casing 20 has a first sidewall 22 and a second sidewall 23 facing each other. The first sidewall 22 and the second sidewall 23 are arranged opposite each other in a first direction, with the first sidewall 22 located near the first hard disk array unit 31 and the second sidewall 23 located near the second hard disk array unit 32. The first sidewall 22 is provided with an air outlet 221, which communicates with the receiving cavity 21. The air outlet side of the cooling fan 12 is arranged opposite to the air outlet 221. An air inlet 231 is located on the second sidewall 23. When dissipating heat, the cooling fan 12 is activated, which drives outside air into the housing 21 through the air inlet 231. The outside air passes through the second hard disk array unit 32 and the first hard disk array unit 31 in sequence, and flows out from the air outlet 221. In this way, the outside air can carry away the heat generated by the first hard disk array unit 31 and the second hard disk array unit 32, thereby reducing the temperature of the first hard disk array unit 31 and the second hard disk array unit 32.

Understandably, since the outside air first comes into contact with the second hard disk array unit 32 and then with the first hard disk array unit 31, the outside air can only carry away a small portion of the heat on the first hard disk array unit 31, while most of the heat on the first hard disk array unit 31 is dissipated through the coolant in the cold plate 11.

In one embodiment, multiple cooling fans 12 are provided, and the multiple cooling fans 12 are arranged side by side along the second direction. In this way, the air cooling effect can be improved.

It should be noted that the number of heat dissipation fans 12 can be set according to actual needs, and no specific limitation is made here. In this embodiment, there are four heat dissipation fans 12, which are arranged side by side in the second direction.

In one embodiment, referring to Figures 3 and 4, the heat dissipation structure 10 further includes multiple heat-conducting brackets 13, which are arrayed on and thermally coupled to the cold plate 11. Each heat-conducting bracket 13 is provided with a receiving slot 131, and the hard drive 30 is disposed in the receiving slot 131 and thermally coupled to the heat-conducting bracket 13. Specifically, in this embodiment, the multiple hard drives 30 are correspondingly disposed in the multiple receiving slots 131.

By incorporating the heat-conducting bracket 13, the heat generated by the hard drive 30 can be quickly transferred to the coolant in the cold plate 11, reducing the temperature of the hard drive 30 and improving its reliability and lifespan. Simultaneously, the heat-conducting bracket 13 can diffuse the heat generated by the hard drive 30 before transferring it to the cold plate 11, thus reducing peak temperatures. Furthermore, the heat-conducting bracket 13 provides support for the hard drive 30, contributing to improved installation stability.

It should be noted that both the first part 111 and the second part 112 of the cold plate 11 are provided with heat-conducting brackets 13.

In one embodiment, referring to Figures 4 and 6, the heat-conducting bracket 13 includes a heat-conducting base plate 132, a first heat-conducting side plate 133, and a second heat-conducting side plate 134. The heat-conducting base plate 132 is in contact with the cold plate 11. There are two first heat-conducting side plates 133, which are arranged opposite to each other in a first direction. The second heat-conducting side plate 134 is disposed between the two first heat-conducting side plates 133. The first heat-conducting side plates 133, the second heat-conducting side plate 134, and the heat-conducting base plate 132 surround each other to form a receiving groove 131. During installation, the hard drive 30 is attached to the heat-conducting base plate 132, the first heat-conducting side plate 133 and the second heat-conducting side plate 134, which increases the contact area between the hard drive 30 and the heat-conducting bracket 13, thereby improving the heat dissipation effect of the hard drive 30.

Furthermore, a first heat-conducting side plate 133 of two adjacent heat-conducting brackets 13 in the first direction is spaced apart to form a first airflow channel. And/or, the distance between the second heat-conducting side plates 134 of two adjacent heat-conducting brackets 13 in the second direction is greater than the thickness of the hard disk 30, so that the hard disk 30 on one of the adjacent heat-conducting brackets 13 and the second heat-conducting side plate 134 of the other adjacent heat-conducting bracket are spaced apart to form a second airflow channel. In this way, cooling air can flow in the first airflow channel and the second airflow channel, increasing the contact area between the cooling air and the hard disk 30 and improving the heat dissipation effect of the hard disk 30.

In one embodiment, referring to Figures 2 and 6, the height of the first heat-conducting side plate 133 is less than the height of the hard drive 30, and the height of the second heat-conducting side plate 134 is adapted to the height of the hard drive 30. It can be understood that the height of the second heat-conducting side plate 134 is equal to or approximately equal to the height of the hard drive 30. Because the height of the first heat-conducting side plate 133 is less than the height of the hard drive 30, the obstruction of the hard drive 30 by the first heat-conducting side plate 133 can be reduced, ensuring that the hard drive 30 can fully contact the cooling airflow and improving the air-cooling heat dissipation effect of the hard drive 30. Since the height of the second heat-conducting side plate 134 is adapted to the height of the hard drive 30, this not only increases the contact area between the hard drive 30 and the heat-conducting bracket 13 and improves the heat conduction efficiency, but also better supports the hard drive 30 and improves the stability of the hard drive 30 installation.

In one embodiment, the heat dissipation structure 10 further includes a thermally conductive medium layer. The thermally conductive medium layer is disposed between the cold plate 11 and the thermally conductive bracket 13. Specifically, the thermally conductive medium 14 is disposed between the cold plate 11 and the thermally conductive base plate 132. In this way, the heat generated by the hard drive 30 can be quickly transferred to the cold plate 11 through the thermally conductive bracket 13 and the thermally conductive medium layer in sequence, thereby improving the heat dissipation effect of the hard drive 30.

Optionally, the thickness of the thermally conductive layer is 1 mm, and the thermal conductivity is 3.5 W (m·K).

In one embodiment, the thermally conductive layer is flexible, so that it can fill the tiny gap between the thermally conductive support 13 and the cold plate 11, allowing the thermally conductive support 13 to better fit with the cold plate 11 through the thermally conductive layer, thus ensuring efficient heat transfer.

Optionally, the thermally conductive medium layer is a thermally conductive silicone pad. The thermally conductive silicone pad is an ultra-soft material with high thermal conductivity, exhibiting low thermal resistance and high deformation under low pressure. It has gap-filling properties, capable of filling the tiny gaps between the thermally conductive support 13 and the cold plate 11. While filling these tiny gaps, it also generates a weak rebound force, reducing the impact of external impacts on the hard drive 30. Furthermore, the thermally conductive silicone pad is self-adhesive, facilitating its assembly between the thermally conductive support 13 and the cold plate 11.

Of course, in other embodiments, the thermally conductive layer may also be silicone grease, phase change material, graphene sheet, etc., and is not limited thereto.

In one embodiment, the cold plate 11 has a first clearance hole, and the heat-conducting medium layer has a second clearance hole, with the first clearance hole and the second clearance hole communicating with each other. The connector 41 passes through the first clearance hole and the second clearance hole and is electrically connected to the hard drive 30. This arrangement prevents the cold plate 11 and the heat-conducting medium from blocking the connector 41, ensuring that the motherboard 40 can be electrically connected to the hard drive 30 through the connector 41.

In addition, since the cold plate 11 is located between the motherboard 40 and the hard drive 30, the cold plate 11 can not only provide liquid cooling for the hard drive 30, but also provide liquid cooling for the motherboard 40.

In this embodiment, the 3 rows of 14 hard drives 30 located away from the cooling fan are cooled by air, while the 5 rows of 14 hard drives 30 located close to the cooling fan are cooled by a cold plate 11. Using the simulation software Flotherm, with the cooling fan running at 20% power, the coolant temperature at 40°C, and a flow rate of 6 L/M, the temperature of the hard drive 30 can be reduced to 49.5°C or below. Specific simulation data are shown in Table 1.

Table 1. Simulation data of cold plate Heat dissipation fan side 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1 47.9 49.1 49.3 49.1 48.4 48.1 48.1 47.3 46.9 47.3 46.7 46.5 46.3 45.8 2 47.5 48.7 48.5 48.4 48.3 47.9 47.5 47.2 47.2 47.2 46.8 46.6 46.6 46.1 3 47 48.6 48.6 48.5 48.4 48.2 48 47.8 47.7 47.5 47 46.8 46.7 46.1 4 46.6 48.5 48.7 48.6 48.6 48.3 48.2 48 47.9 47.7 47.4 46.9 46.7 46.1 5 46.6 48.8 48.9 48.8 48.7 48.5 48.4 48.2 48 47.9 47.6 47.2 47.1 46.6 6 46.5 49.1 49.4 49.4 49.5 49.3 49.2 49 48.7 48.6 48.5 48.3 48.2 47.6 7 44.1 46.1 46.5 46.6 46.7 46.6 46.6 46.5 46.3 46.3 46.2 46.1 45.8 45.1 8 38.2 39.1 39.3 39.7 39.6 39.7 39.6 39.6 39.5 39.6 39.4 39.4 39.2 38.8 Keep away from the heat dissipation fan side

In the description of this invention, it should be understood that if terms such as "center", "longitudinal", "horizontal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the diagram. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature marked "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, the term "multiple" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.

In this invention, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixation," etc., should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal connections between two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meanings of the above terms in this invention according to the specific circumstances.

In this invention, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" a second feature indicates that the first and second features are in direct contact, or that they are indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" a second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" a second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

It should be noted that if a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. If a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. If so, the terms "vertical," "horizontal," "up," "down," "left," "right," and similar expressions used in this invention are for illustrative purposes only and do not represent the only embodiments.

The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

The embodiments described above merely illustrate several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the inventive concept, and these all fall within the scope of protection of the present invention. Therefore, the scope of protection of this invention patent shall be determined by the appended patent application.

10: Heat dissipation structure 11: Cold plate 111: First part 1111: Liquid flow channel 1112: First liquid inlet 1113: First liquid outlet 112: Second part 12: Heat dissipation fan 13: Heat-conducting bracket 131: Receiving groove 132: Heat-conducting base plate 133: First heat-conducting side plate 134: Second heat-conducting side plate 20: Shell 21: Receiving cavity 22: First side wall 221: Air outlet 23: Second side wall 231: Air inlet 30: Hard disk 31: First hard disk array unit 32: Second hard disk array unit 40: Motherboard 41: Connector X: First direction Y: Second direction

Figure 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention. Figure 2 is a schematic internal structural diagram of the electronic device shown in Figure 1. Figure 3 is a schematic structural diagram of the electronic device shown in Figure 2 without a hard drive installed. Figure 4 is a schematic structural diagram of a heat dissipation structure in an embodiment of the present invention with a heat-conducting bracket mounted on a cold plate. Figure 5 is a top view of the cold plate of the heat dissipation structure shown in Figure 4 with the heat-conducting bracket mounted on it. Figure 6 is a schematic structural diagram of a heat dissipation structure in an embodiment of the present invention with a heat-conducting bracket.

10: Heat dissipation structure

12: Cooling Fan

13: Thermal Conductive Support

20: Shell

30: Hard Drive

31: First hard drive array unit

32: Second hard drive array unit

X: First direction

Y: Second direction

Claims (13)

A heat dissipation structure (10) for dissipating heat between a first hard disk array unit (31) and a second hard disk array unit (32), the heat dissipation structure (10) comprising: A cold plate (11) is provided with a liquid flow channel (1111) for supplying coolant flow. The portion of the cold plate (11) with the liquid flow channel (1111) is used for thermal coupling with the first hard disk array unit (31) so that the coolant in the liquid flow channel (1111) can perform liquid cooling heat dissipation on the first hard disk array unit (31). A heat dissipation fan (12) is provided on the side of the cold plate (11) and is used to drive air flow to perform air cooling heat dissipation on the second hard disk array unit (32). The heat dissipation structure (10) as described in claim 1, wherein the cold plate (11) has a first portion (111) and a second portion (112), the first portion (111) being provided with the fluid flow channel (1111), the first portion (111) being used for thermal coupling with the first hard disk array unit (31), and the second portion (112) being used for thermal coupling with the second hard disk array unit (32). The heat dissipation structure (10) as described in claim 2, wherein the heat dissipation fan (12) is located on the side of the first part (111) away from the second part (112). The heat dissipation structure (10) as described in claim 1, wherein the liquid flow channel (1111) is provided with at least two channels, and the at least two channels (1111) are independent of each other and staggered. The heat dissipation structure (10) as described in claim 1, wherein the liquid flow channel (1111) is provided with at least two channels, and the at least two channels (1111) are of equal length. The heat dissipation structure (10) as described in claim 2, wherein the cold plate (11) is further provided with a first liquid inlet (1112) and a first liquid outlet (1113), both of which are connected to the liquid flow channel (1111); the heat dissipation structure (10) further includes a coolant distribution unit, wherein the coolant distribution unit is provided with a second liquid inlet and a second liquid outlet, wherein the second liquid inlet is connected to the first liquid outlet (1113) and the second liquid outlet is connected to the first liquid inlet (1112). The heat dissipation structure (10) as described in claim 1 further includes a plurality of heat-conducting brackets (13), the plurality of heat-conducting brackets (13) being arrayed on the cold plate (11) and thermally coupled to the cold plate (11), the plurality of heat-conducting brackets (13) being provided with receiving slots (131), the receiving slots (131) being used to house a plurality of hard disks (30), and the heat-conducting brackets (13) being used to thermally couple with the hard disks (30). As described in claim 7, the heat dissipation structure (10) includes a heat-conducting base plate (132), a first heat-conducting side plate (133), and a second heat-conducting side plate (134). The heat-conducting base plate (132) is thermally coupled to the cold plate (11). There are two first heat-conducting side plates (133), which are arranged opposite to each other in a first direction of the cold plate (11). The second heat-conducting side plate (134) is disposed between the two first heat-conducting side plates (133). The first heat-conducting side plate (133), the second heat-conducting side plate (134), and the heat-conducting base plate (132) surround and form the receiving groove (131). The heat dissipation structure (10) as described in claim 8, wherein a first airflow channel is formed between the first heat-conducting side plates (133) of two adjacent heat-conducting brackets (13) in the first direction; and/or, the spacing between the second heat-conducting side plates (134) of two adjacent heat-conducting brackets (13) in the second direction of the cold plate (11) is greater than the thickness of a single hard disk (30), such that a second airflow channel is formed between the hard disk (30) on one of the adjacent heat-conducting brackets (13) and the second heat-conducting side plate (134) of the other adjacent heat-conducting bracket (13). The heat dissipation structure (10) as described in claim 7 further includes a thermally conductive medium layer disposed between the cold plate (11) and the thermally conductive support (13). An electronic device includes: a housing (20) having a receiving cavity (21), an air inlet (231), and an air outlet (221), the receiving cavity (21) communicating with the air inlet (231) and the air outlet (221); a plurality of hard drives (30) arrayed within the receiving cavity (21) to form a first hard drive array unit (31) and a second hard drive array unit (32); and a heat dissipation structure as described in any one of claims 1 to 10. (10) The cold plate (11) is disposed in the accommodating cavity (21). The portion of the cold plate (11) having the liquid flow channel (1111) is thermally coupled to the first hard disk array unit (31). The heat dissipation fan (12) is disposed in the casing (20). The heat dissipation fan (12) is used to drive outside air into the accommodating cavity (21) through the air inlet (231) to blow towards the second hard disk array unit (32) and discharge from the air outlet (221). The electronic device as claimed in claim 11, wherein the heat dissipation fan (12) is disposed on the side of the first hard disk array unit (31) away from the second hard disk array unit (32), the air intake side of the heat dissipation fan (12) is disposed opposite to the air inlet (231), and the air outlet side of the heat dissipation fan (12) is disposed opposite to the air outlet (221). The electronic device as claimed in claim 11 further includes a motherboard (40), the cold plate (11) being disposed on the motherboard (40), and the hard disk (30) being disposed on the side of the cold plate (11) away from the motherboard (40) and electrically connected to the motherboard (40).