TWI890174B - Electrical connector colloid structure - Google Patents
Electrical connector colloid structureInfo
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- TWI890174B TWI890174B TW112141339A TW112141339A TWI890174B TW I890174 B TWI890174 B TW I890174B TW 112141339 A TW112141339 A TW 112141339A TW 112141339 A TW112141339 A TW 112141339A TW I890174 B TWI890174 B TW I890174B
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Abstract
本發明為涉及一種電連接器之膠體結構,主要包括一傳輸導體組、一傳輸導體組接觸部、一傳輸導體組基部、一傳輸導體組彎折導引部、一傳輸導體組焊接部、一前排傳輸導體組接觸部、一後排傳輸導體組接觸部、及絕緣膠體,而所述絕緣膠體包括有舌片部、及基座部,而舌片部包括第一舌片部、後排接觸穿孔、舌片定位孔、舌片鏤空部、第二舌片部、及前排接觸槽,當傳輸導體組的訊號在經過傳輸導體組接觸部、傳輸導體組基部、及傳輸導體組彎折導引部後,最終抵達傳輸導體組焊接部的時間大多不會一致,而本案即利用舌片鏤空部將傳輸導體組基部形成裸露,有效加速訊號傳輸的介質,讓訊號抵達的時間可以一致,使高頻訊號品質更好。 The present invention relates to a colloid structure of an electrical connector, which mainly includes a transmission conductor group, a transmission conductor group contact portion, a transmission conductor group base portion, a transmission conductor group bending guide portion, a transmission conductor group welding portion, a front transmission conductor group contact portion, a rear transmission conductor group contact portion, and an insulating colloid, wherein the insulating colloid includes a tongue portion and a base portion, and the tongue portion includes a first tongue portion, a rear contact through hole, and a tongue positioning hole. The tongue cutout, the second tongue, and the front row of contact slots. When the signal from the transmission conductor assembly passes through the transmission conductor assembly contact portion, the transmission conductor assembly base, and the transmission conductor assembly bend guide, the time it finally reaches the transmission conductor assembly solder joint is often inconsistent. This design utilizes the tongue cutout to expose the transmission conductor assembly base, effectively accelerating the signal transmission medium and ensuring consistent signal arrival time, thus improving high-frequency signal quality.
Description
本發明係涉及一種可提升高頻訊號傳輸之品質的電連接器之膠體結構。 The present invention relates to a colloid structure for an electrical connector that can improve the quality of high-frequency signal transmission.
按,傳統應用於多媒體訊號傳導的連接器結構,有如中華民國專利公告第M509461號「USB連接器之結構」主要包括外屏蔽殼體、內屏蔽殼體、絕緣膠體及設於絕緣膠體上之傳輸導體組,其主要特徵在於藉由外屏蔽殼體完整包覆內屏蔽殼體,使可有效抑制收容於內屏蔽殼體內的傳輸導體組所產生的EMI及RFI干擾問題,另外,外屏蔽殼體包含一具開口之基部,且基部背離開口之側處乃延伸形成一遮罩部,該遮罩部上具有一呈傾斜態樣之第一傾斜部及一與第一傾斜部呈相異方向傾斜的第二傾斜部,藉此除了上述優勢外,更可透過第一傾斜部及第二傾斜部得以有效節省安裝空間。 According to the traditional connector structure used for multimedia signal transmission, such as the structure of the USB connector in the Republic of China Patent Publication No. M509461, it mainly includes an outer shielding shell, an inner shielding shell, an insulating gel and a transmission conductor set on the insulating gel. Its main feature is that the outer shielding shell completely covers the inner shielding shell, which can effectively suppress the transmission conductor set contained in the inner shielding shell. To address the EMI and RFI interference issues caused by the shielding, the outer shielding case includes a base with an opening. A shielding portion extends from the base away from the opening. The shielding portion has a first inclined portion and a second inclined portion inclined in an opposite direction to the first inclined portion. In addition to the aforementioned advantages, the first and second inclined portions can effectively save installation space.
然上述USB連接器之結構於使用時,為確實存在下列問題與缺失尚待改進: However, the above-mentioned USB connector structure does have the following problems and deficiencies when in use and needs to be improved:
因屬於側立式的連接器,必然使傳輸導體組的各個端子長度不同,而當長度不同時即會發生傳輸訊號的速度不同,所謂速度不同即為訊號經過端子後抵達電路基板的時間不一致,如此將會導致高頻訊號傳輸的品質不穩定。 Because it's a side-mounted connector, the terminals of the transmission conductor assembly inevitably have different lengths. These varying lengths result in different signal transmission speeds. This speed difference means the signal takes different amounts of time to reach the circuit board after passing through the terminals. This leads to unstable high-frequency signal transmission quality.
是以,要如何解決上述習用之問題與缺失,即為本發明之申請人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above-mentioned problems and shortcomings in usage is the direction that the applicant of this invention and related manufacturers in this industry are eager to research and improve.
本發明之課題主要目的在於提供一種得以讓側立式電連接器之訊號抵達傳輸導體組焊接部的時間相同,而使高頻訊號品質更佳。 The main purpose of this invention is to provide a method that allows the signal from a side-mounted electrical connector to reach the soldered portion of the transmission conductor assembly at the same time, thereby improving the quality of high-frequency signals.
本發明能夠達成上述目的之主要結構包括一傳輸導體組、一傳輸導 體組接觸部、一傳輸導體組基部、一傳輸導體組彎折導引部、一傳輸導體組焊接部、一前排傳輸導體組接觸部、一後排傳輸導體組接觸部、及絕緣膠體,而所述絕緣膠體包括有舌片部、及基座部,而舌片部包括第一舌片部、後排接觸穿孔、舌片定位孔、舌片鏤空部、第二舌片部、及前排接觸槽,其中,傳輸導體組接觸部乃由一方依序延伸形成傳輸導體組基部、傳輸導體組彎折導引部、及傳輸導體組焊接部,且傳輸導體組接觸部包括有所述之前排傳輸導體組接觸部及後排傳輸導體組接觸部,而絕緣膠體係包覆傳輸導體組,並所述舌片部乃包覆傳輸導體組接觸部、與傳輸導體組基部,基座部乃包覆傳輸導體組彎折導引部;另第一舌片部係包覆傳輸導體組基部,而後排接觸穿孔係供後排傳輸導體組接觸部裸露,所述舌片定位孔則位置對應於傳輸導體組基部,並用於防止傳輸導體組於製造過程中走位;又第二舌片部係由第一舌片部所延伸形成,且第二舌片部包括有數個供裸露前排傳輸導體組接觸部之所述前排接觸槽,值得一提的是,第一舌片部包括有至少一所述舌片鏤空部,所述舌片鏤空部乃位置對應於傳輸導體組基部,使傳輸導體組基部形成裸露,以提升傳輸速度。 The main structure of the present invention capable of achieving the above-mentioned objectives includes a transmission conductor assembly, a transmission conductor assembly contact portion, a transmission conductor assembly base portion, a transmission conductor assembly bending guide portion, a transmission conductor assembly welding portion, a front transmission conductor assembly contact portion, a rear transmission conductor assembly contact portion, and an insulating colloid. The insulating colloid includes a tongue portion and a base portion. The tongue portion includes a first tongue portion. The transmission conductor group contact portion is sequentially extended from one side to form a transmission conductor group base, a transmission conductor group bending guide portion, and a transmission conductor group welding portion, and the transmission conductor group contact portion includes the front row transmission conductor group contact portion and the rear row transmission conductor group contact portion, and the insulating gel The tongue portion covers the transmission conductor assembly, with the tongue portion covering the transmission conductor assembly contact portion and the transmission conductor assembly base, and the base portion covering the transmission conductor assembly bend guide portion. The first tongue portion covers the transmission conductor assembly base, while the rear contact perforations expose the rear transmission conductor assembly contact portion. The tongue positioning holes correspond to the transmission conductor assembly base and prevent the transmission conductor assembly from shifting during the manufacturing process. The second tongue portion extends from the first tongue portion and includes a plurality of front contact slots for exposing the front transmission conductor assembly contact portion. Notably, the first tongue portion includes at least one tongue cutout portion, which corresponds to the transmission conductor assembly base, exposing the transmission conductor assembly base to increase transmission speed.
當傳輸導體組的訊號在經過傳輸導體組接觸部、傳輸導體組基部、及傳輸導體組彎折導引部後,最終抵達傳輸導體組焊接部的時間大多不會一致,然舌片鏤空部乃將原本通過傳輸導體組基部的訊號速度進行提升,讓訊號抵達傳輸導體組焊接部之時間相同,如此即可提高高頻訊號傳輸之品質。 When the signal from the transmission conductor assembly passes through the transmission conductor assembly contact portion, the transmission conductor assembly base, and the transmission conductor assembly bend guide portion, the time it takes to finally reach the transmission conductor assembly soldering portion is often inconsistent. However, the tongue cutout increases the speed of the signal originally passing through the transmission conductor assembly base, ensuring that the signal reaches the transmission conductor assembly soldering portion at the same time, thereby improving the quality of high-frequency signal transmission.
藉由上述技術,可針對習用USB連接器之結構所存在之因屬於側立式的連接器,必然使傳輸導體組的各個端子長度不同,而當長度不同時即會發生傳輸訊號的速度不同,所謂速度不同即為訊號經過端子後抵達電路基板的時間不一致,如此將會導致高頻訊號傳輸的品質不穩定的問題點加以突破,達到本發明如上述優點之實用進步性。 The above-mentioned technology overcomes the problem of conventional USB connectors, which, due to their side-mounted design, inevitably result in different lengths for the terminals of the transmission conductor assembly. These different lengths lead to different transmission speeds for the signal. These speed differences mean that the signal takes different times to reach the circuit board after passing through the terminals, leading to unstable high-frequency signal transmission quality. This solves the practical and advanced advantages of the present invention.
1:傳輸導體組 1: Transmission conductor set
11a:傳輸導體組接觸部 11a: Transmission conductor contact part
111a:前排傳輸導體組接觸部 111a: Front row transmission conductor contact area
112a:後排傳輸導體組接觸部 112a: Rear transmission conductor contact area
11b:傳輸導體組基部 11b: Base of the transmission conductor assembly
11c:傳輸導體組彎折導引部 11c: Transmission conductor assembly bending guide
11d:傳輸導體組焊接部 11d: Transmission conductor assembly welding part
20:第一差分訊號傳輸導體基部 20: Base of the first differential signal transmission conductor
20a:第一差分訊號傳輸導體導引部 20a: First differential signal transmission conductor guide portion
21:第二差分訊號傳輸導體基部 21: Second differential signal transmission conductor base
21a:第二差分訊號傳輸導體導引部 21a: Second differential signal transmission conductor guide section
22:電源傳輸導體基部 22: Power transmission conductor base
22a:電源傳輸導體導引部 22a: Power transmission conductor guide part
23:第一接地傳輸導體基部 23: First ground transmission conductor base
23a:第一接地傳輸導體導引部 23a: First ground transmission conductor guide
24:第一訊號傳輸導體基部 24: Base of the first signal transmission conductor
24a:第一訊號傳輸導體導引部 24a: First signal transmission conductor guide section
25:第二訊號傳輸導體基部 25: Second signal transmission conductor base
25a:第二訊號傳輸導體導引部 25a: Second signal transmission conductor guide section
26:第二接地傳輸導體基部 26: Second ground transmission conductor base
27:第三接地傳輸導體基部 27: Third ground transmission conductor base
27a:第三接地傳輸導體導引部 27a: Third ground transmission conductor guide
28:第三差分訊號傳輸導體基部 28: Third differential signal transmission conductor base
28a:第三差分訊號傳輸導體導引部 28a: Third differential signal transmission conductor guide section
29:第四差分訊號傳輸導體基部 29: Fourth differential signal transmission conductor base
29a:第四差分訊號傳輸導體導引部 29a: Fourth differential signal transmission conductor guide section
3:絕緣膠體 3: Insulation colloid
31:舌片部 31: Tongue
311:第一舌片部 311: First tongue portion
3111:後排接觸穿孔 3111: Rear contact perforation
3112:舌片定位孔 3112: Tongue positioning hole
3113:舌片鏤空部 3113: Tongue hollowing area
312:第二舌片部 312: Second tongue portion
3121:前排接觸槽 3121: Front contact slot
32:基座部 32: Base
321:基座定位孔 321: Base positioning hole
322:基座鏤空部 322: Base hollowing
323:強化鏤空部 323: Strengthen the hollow area
3231:橫向鏤空部 3231: Horizontal hollowing
3232:縱向鏤空部 3232: Vertical hollowing
4:屏蔽外殼 4: Shielding housing
41:屏蔽外殼鏤空部 41: Shielding the outer shell hollow area
第一圖 為本發明第一較佳實施例之立體圖。 Figure 1 is a perspective view of the first preferred embodiment of the present invention.
第二圖 為本發明第一較佳實施例之平面圖。 Figure 2 is a plan view of the first preferred embodiment of the present invention.
第三圖 為本發明第一較佳實施例之傳輸導體組平面圖。 Figure 3 is a plan view of the transmission conductor assembly of the first preferred embodiment of the present invention.
第四圖 為本發明第二較佳實施例之平面圖。 Figure 4 is a plan view of the second preferred embodiment of the present invention.
第五圖 為本發明第三較佳實施例之平面圖。 Figure 5 is a plan view of the third preferred embodiment of the present invention.
第六圖 為本發明第四較佳實施例之立體圖。 Figure 6 is a perspective view of the fourth preferred embodiment of the present invention.
第七圖 為本發明第五較佳實施例之平面圖。 Figure 7 is a plan view of the fifth preferred embodiment of the present invention.
第八圖 為本發明第六較佳實施例之平面分解圖。 Figure 8 is an exploded plan view of the sixth preferred embodiment of the present invention.
請參閱第一圖至第三圖所示,為本發明第一較佳實施例之立體圖至傳輸導體組平面圖,由圖中可清楚看出本發明係包括: Please refer to Figures 1 to 3, which show the perspective view and the plan view of the transmission conductor assembly of the first preferred embodiment of the present invention. It can be clearly seen from the figures that the present invention includes:
一傳輸導體組1,乃包括有: A transmission conductor set 1 includes:
一傳輸導體組接觸部11a,傳輸導體組接觸部11a包括有一前排傳輸導體組接觸部111a及一位於該前排傳輸導體組接觸部111a後側處之後排傳輸導體組接觸部112a; A transmission conductor contact portion 11a, comprising a front transmission conductor contact portion 111a and a rear transmission conductor contact portion 112a located behind the front transmission conductor contact portion 111a;
一由該傳輸導體組接觸部11a一端處延伸形成之傳輸導體組基部11b,該傳輸導體組基部11b乃依序排列有一第一差分訊號傳輸導體基部20、一設於該第一差分訊號傳輸導體基部20一側之第二差分訊號傳輸導體基部21、一設於該第二差分訊號傳輸導體基部21一側之電源傳輸導體基部22、一設於該電源傳輸導體基部22一側之第一接地傳輸導體基部23、一設於該第一接地傳輸導體基部23一側之第一訊號傳輸導體基部24、一設於該第一訊號傳輸導體基部24一側之第二訊號傳輸導體基部25、一設於該第二訊號傳輸導體基部25一側並與該第一接地傳輸導體基部23連結之第二接地傳輸導體基部26、一設於該第二接地傳輸導體基部26一側並與該第二接地傳輸導體基部26連結之第三接地傳輸導體基部27、一設於該第三接地傳輸導體基部27一側之第三差分訊號傳輸導體基部28、及一設於該第三差分訊號傳輸導體基部28一側之第四差分訊號傳輸導體基部29,又下述傳輸導體組彎折導引部11c依序排列有一第一差分訊號傳輸導體導引部20a、一設於該第一差分訊號傳輸導體導引部20a一側之第二差分訊號傳輸導體導引部21a、一設於該第二差分訊號傳輸導體導引部21a一側之電源傳輸導體導引部22a、一設於該電源傳輸導體導引部22a一側之第一接地傳輸導體導引部23a、一設於該第一接地傳輸導體導引部23a一側之第一訊號傳輸導體導引部24a、一設於該第一訊號傳輸導體導引部24a一側之第二訊號 傳輸導體導引部25a、一設於該第二訊號傳輸導體導引部25a一側並與該第二接地傳輸導體基部26及該第三接地傳輸導體基部27連結之第三接地傳輸導體導引部27a、一設於該第三接地傳輸導體導引部27a一側之第三差分訊號傳輸導體導引部28a、及一設於該第三差分訊號傳輸導體導引部28a一側之第四差分訊號傳輸導體導引部29a; A transmission conductor assembly base 11b is formed by extending from one end of the transmission conductor assembly contact portion 11a. The transmission conductor assembly base 11b is sequentially arranged with a first differential signal transmission conductor base 20, a second differential signal transmission conductor base 21 provided on one side of the first differential signal transmission conductor base 20, a power transmission conductor base 22 provided on one side of the second differential signal transmission conductor base 21, a first ground transmission conductor base 23 provided on one side of the power transmission conductor base 22, and a first signal transmission conductor provided on one side of the first ground transmission conductor base 23. base 24, a second signal transmission conductor base 25 provided on one side of the first signal transmission conductor base 24, a second ground transmission conductor base 26 provided on one side of the second signal transmission conductor base 25 and connected to the first ground transmission conductor base 23, a third ground transmission conductor base 27 provided on one side of the second ground transmission conductor base 26 and connected to the second ground transmission conductor base 26, a third differential signal transmission conductor base 28 provided on one side of the third ground transmission conductor base 27, and a third differential signal transmission conductor base 28 provided on one side of the third differential signal transmission conductor base 28. The four differential signal transmission conductor bases 29 and the following transmission conductor group bending guide portion 11c are arranged in sequence: a first differential signal transmission conductor guide portion 20a, a second differential signal transmission conductor guide portion 21a provided on one side of the first differential signal transmission conductor guide portion 20a, a power transmission conductor guide portion 22a provided on one side of the second differential signal transmission conductor guide portion 21a, a first ground transmission conductor guide portion 23a provided on one side of the power transmission conductor guide portion 22a, a first signal transmission conductor guide portion 23a provided on one side of the first ground transmission conductor guide portion 23a, and a second differential signal transmission conductor guide portion 21a. The first signal transmission conductor guide 24a comprises a first signal transmission conductor guide 25a disposed on one side of the first signal transmission conductor guide 24a; a third ground transmission conductor guide 27a disposed on one side of the second signal transmission conductor guide 25a and connected to the second ground transmission conductor base 26 and the third ground transmission conductor base 27; a third differential signal transmission conductor guide 28a disposed on one side of the third ground transmission conductor guide 27a; and a fourth differential signal transmission conductor guide 29a disposed on one side of the third differential signal transmission conductor guide 28a.
一由該傳輸導體組基部11b背離該傳輸導體組接觸部11a側處延伸形成之傳輸導體組彎折導引部11c; A transmission conductor assembly bending guide portion 11c extending from the transmission conductor assembly base portion 11b away from the transmission conductor assembly contact portion 11a;
一由該傳輸導體組彎折導引部11c背離該傳輸導體組基部11b延伸形成之傳輸導體組焊接部11d; A transmission conductor assembly welding portion 11d formed by extending the transmission conductor assembly bending guide portion 11c away from the transmission conductor assembly base portion 11b;
一包覆該傳輸導體組1之絕緣膠體3,乃包括有: An insulating colloid 3 covering the transmission conductor assembly 1 includes:
一包覆該傳輸導體組接觸部11a、與該傳輸導體組基部11b之舌片部31,該舌片部31包括有一包覆該傳輸導體組基部11b之第一舌片部311、及一由該第一舌片部311背離下述基座部32側處所延伸形成,並供設置該前排傳輸導體組接觸部111a之第二舌片部312,該第一舌片部311包括有數個供該後排傳輸導體組接觸部112a裸露之後排接觸穿孔3111、數個位置對應於該傳輸導體組基部11b,並用於防止該傳輸導體組1於製造過程中走位之舌片定位孔3112、及至少一位置對應於該傳輸導體組基部11b,使該傳輸導體組基部11b形成裸露,以提升傳輸速度之舌片鏤空部3113,又該第二舌片部312包括有數個供裸露該前排傳輸導體組接觸部111a之前排接觸槽3121;及 A tongue portion 31 covering the transmission conductor group contact portion 11a and the transmission conductor group base portion 11b, the tongue portion 31 including a first tongue portion 311 covering the transmission conductor group base portion 11b, and a second tongue portion 312 extending from the first tongue portion 311 away from the base portion 32 described below and for arranging the front row transmission conductor group contact portion 111a. The first tongue portion 311 includes a plurality of rear rows for exposing the rear row transmission conductor group contact portion 112a. The second tongue portion 312 includes a plurality of contact holes 3111, several tongue positioning holes 3112 corresponding to the base portion 11b of the transmission conductor assembly to prevent the transmission conductor assembly 1 from shifting during the manufacturing process, and a tongue cutout portion 3113, at least one of which corresponds to the base portion 11b of the transmission conductor assembly to expose the base portion 11b of the transmission conductor assembly to increase transmission speed. The second tongue portion 312 includes a plurality of front contact slots 3121 for exposing the front row transmission conductor assembly contact portion 111a.
一與該舌片部31連結並包覆該傳輸導體組彎折導引部11c之基座部32。 A base portion 32 connected to the tongue portion 31 and covering the transmission conductor assembly bending guide portion 11c.
其中,以本實施例而言,該舌片鏤空部3113乃位於該第二差分訊號傳輸導體基部21上方處。 In this embodiment, the tongue cutout portion 3113 is located above the second differential signal transmission conductor base 21.
以製造過程而論,當欲將傳輸導體組1鑲埋於絕緣膠體3內時,得以透過舌片定位孔3112,利用頂針將傳輸導體組1進行定位固定,使得於澆模時,傳輸導體組1不會發生跑位情形,且使前排傳輸導體組接觸部111a位於前排接觸槽3121內,後排傳輸導體組接觸部112a位於後排接觸穿孔3111內,傳輸導體組焊接部11d裸露於絕緣膠體3一側處,並藉由傳輸導體組彎折導引部11c形成一個側立式的電連接器。 During the manufacturing process, when embedding the transmission conductor assembly 1 within the insulating gel 3, the assembly is positioned and fixed using a pin through the tongue positioning hole 3112. This prevents the assembly from shifting during molding. The front transmission conductor assembly contact portion 111a is positioned within the front contact groove 3121, and the rear transmission conductor assembly contact portion 112a is positioned within the rear contact through-hole 3111. The transmission conductor assembly welding portion 11d is exposed on one side of the insulating gel 3, and the transmission conductor assembly bending guide portion 11c forms a side-standing electrical connector.
俾當本案電連接器與對手連接器相互插置時,傳輸導體組接觸部11a的前排傳輸導體組接觸部111a與後排傳輸導體組接觸部112a接收到訊號後,則依序經由傳輸導體組基部11b、及傳輸導體組彎折導引部11c,並傳送至傳輸導體組焊接部11d,更進一步而言,訊號會依序通過第一差分訊號傳輸導體基部20、及第一差分訊號傳輸導體導引部20a;依序通過第二差分訊號傳輸導體基部21、及第二差分訊號傳輸導體導引部21a;依序通過第三差分訊號傳輸導體基部28、及第三差分訊號傳輸導體導引部28a;依序通過第四差分訊號傳輸導體基部29、及第四差分訊號傳輸導體導引部29a;依序通過第一訊號傳輸導體基部24、及第一訊號傳輸導體導引部24a;依序通過第二訊號傳輸導體基部25、及第二訊號傳輸導體導引部25a;並前述訊號最終會抵達傳輸導體組焊接部11d。 When the electrical connector of this embodiment is inserted into the counterpart connector, the front transmission conductor group contact portion 111a and the rear transmission conductor group contact portion 112a of the transmission conductor group contact portion 11a receive the signal, which is then sequentially transmitted through the transmission conductor group base portion 11b and the transmission conductor group bending guide portion 11c to the transmission conductor group welding portion 11d. Furthermore, the signal sequentially passes through the first differential signal transmission conductor base portion 20 and the first differential signal transmission conductor guide portion 20a; and sequentially passes through the second differential signal transmission conductor base portion 21 , and the second differential signal transmission conductor guide portion 21a; sequentially passing through the third differential signal transmission conductor base 28 and the third differential signal transmission conductor guide portion 28a; sequentially passing through the fourth differential signal transmission conductor base 29 and the fourth differential signal transmission conductor guide portion 29a; sequentially passing through the first signal transmission conductor base 24 and the first signal transmission conductor guide portion 24a; sequentially passing through the second signal transmission conductor base 25 and the second signal transmission conductor guide portion 25a; and the aforementioned signals will eventually reach the transmission conductor assembly welding portion 11d.
值得一提的是,本案在傳輸導體組基部11b上形成有舌片鏤空部3113,並以形成在第二差分訊號傳輸導體基部21上方處為例,因第二差分訊號傳輸導體基部21及第二差分訊號傳輸導體導引部21a之共同長度乃大於第一差分訊號傳輸導體基部20及第一差分訊號傳輸導體導引部20a之共同長度,使得在訊號傳輸的路徑上,第二差分訊號傳輸導體基部21及第二差分訊號傳輸導體導引部21a之長度遠大於第一差分訊號傳輸導體基部20及第一差分訊號傳輸導體導引部20a之長度,又因絕緣膠體3之介電常數與散逸係數(Dissipation Factor)會直接影響傳輸訊號的速度與品質,使得通過第二差分訊號傳輸導體基部21及第二差分訊號傳輸導體導引部21a的訊號,在抵達傳輸導體組焊接部11d的時間會慢於通過第一差分訊號傳輸導體基部20及第一差分訊號傳輸導體導引部20a的訊號,進而產生訊號不平衡,導致高頻訊號傳輸品質降低,藉此,本案藉由舌片鏤空部3113將第二差分訊號傳輸導體基部21裸露於外,此做法依據空氣的介電常數(Dielectric Constant)εr=1.00053,為僅高於真空介電常數的存在,使通過第二差分訊號傳輸導體基部21的訊號不會受到絕緣膠體3的介質影響,有效改善訊號延遲,讓傳輸速度得以增快,如此即可讓通過第二差分訊號傳輸導體基部21及第二差分訊號傳輸導體導引部21a的訊號,抵達傳輸導體組焊接部11d的時間,可與通過第一差分訊號傳輸導體基部20及第一差分訊號傳輸導體導引部20a的訊號相同,而達到訊號平衡,有效增加高頻傳輸訊號的穩定性及品質。 It is worth mentioning that in this case, a tongue hollow portion 3113 is formed on the base portion 11b of the transmission conductor assembly, and is formed above the second differential signal transmission conductor base 21 as an example. Since the common length of the second differential signal transmission conductor base 21 and the second differential signal transmission conductor guide portion 21a is greater than the common length of the first differential signal transmission conductor base 20 and the first differential signal transmission conductor guide portion 20a, the length of the second differential signal transmission conductor base 21 and the second differential signal transmission conductor guide portion 21a is much greater than the length of the first differential signal transmission conductor base 20 and the first differential signal transmission conductor guide portion 20a in the signal transmission path. In addition, due to the dielectric constant and dissipation coefficient of the insulating gel 3, the length of the second differential signal transmission conductor base 21 and the second differential signal transmission conductor guide portion 21a is much greater than the length of the first differential signal transmission conductor base 20 and the first differential signal transmission conductor guide portion 20a. Factor) will directly affect the speed and quality of the transmission signal, making the signal passing through the second differential signal transmission conductor base 21 and the second differential signal transmission conductor guide portion 21a reach the transmission conductor assembly welding portion 11d slower than the signal passing through the first differential signal transmission conductor base 20 and the first differential signal transmission conductor guide portion 20a, thereby generating signal imbalance and causing a decrease in the high-frequency signal transmission quality. In this case, the second differential signal transmission conductor base 21 is exposed to the outside by the tongue hollow portion 3113. This approach is based on the dielectric constant of air. The dielectric constant (εr) = 1.00053, which is just above the dielectric constant of a vacuum, prevents signals passing through the second differential signal transmission conductor base 21 from being affected by the dielectric of the insulating gel 3, effectively improving signal delay and increasing transmission speed. This allows the signal passing through the second differential signal transmission conductor base 21 and the second differential signal transmission conductor guide portion 21a to reach the transmission conductor assembly solder portion 11d at the same time as the signal passing through the first differential signal transmission conductor base 20 and the first differential signal transmission conductor guide portion 20a, achieving signal balance and effectively improving the stability and quality of high-frequency transmission signals.
請參閱第四圖所示,為本發明第二較佳實施例之平面圖,由圖中可清楚看出,本實施例與前述實施例不同處在於,本實施例基座部32上乃具有數個基座定位孔321、及數個位於該基座定位孔321側處之基座鏤空部322,換言之,各基座定位孔321主要係於製程中的頂針對傳輸導體組進行抵壓動作,搭配舌片定位孔3112更可增加其定位的穩定性,而基座鏤空部322除了可以當製程中的頂針定位外,更可減少傳輸導體組彎折導引部受傳輸介質之影響,而增加傳輸速度,且抵達傳輸導體組焊接部11d之時間仍相同,本實施例之基座鏤空部322係以設於第三差分訊號傳輸導體導引部28a及第四差分訊號傳輸導體導引部29a上方為例,而有效加速通過第三差分訊號傳輸導體基部、第三差分訊號傳輸導體導引部28a、第四差分訊號傳輸導體基部、及第四差分訊號傳輸導體導引部29a的訊號。 Please refer to the fourth figure, which is a plan view of the second preferred embodiment of the present invention. It can be clearly seen from the figure that the present embodiment is different from the above embodiments in that the base portion 32 of the present embodiment has a plurality of base positioning holes 321 and a plurality of base hollow portions 322 located on the sides of the base positioning holes 321. In other words, each base positioning hole 321 is mainly used for the top pin to press the transmission conductor assembly during the manufacturing process, and the tongue positioning hole 3112 can further increase the stability of its positioning. In addition, the base hollow portion 322 can be used as the top pin positioning hole 321 during the manufacturing process. In addition, the influence of the transmission medium on the bending guide portion of the transmission conductor assembly can be reduced, thereby increasing the transmission speed, while maintaining the same time required to reach the welding portion 11d of the transmission conductor assembly. The base cutout 322 of this embodiment is provided above the third differential signal transmission conductor guide portion 28a and the fourth differential signal transmission conductor guide portion 29a, for example, to effectively accelerate the signal passing through the third differential signal transmission conductor base, the third differential signal transmission conductor guide portion 28a, the fourth differential signal transmission conductor base, and the fourth differential signal transmission conductor guide portion 29a.
請參閱第五圖所示,為本發明第三較佳實施例之平面圖,由圖中可清楚看出,本實施例與前述實施例不同處在於,本實施例基座部32上乃具有一強化鏤空部323,乃包括有一橫向鏤空部3231及一與該橫向鏤空部3231相通之縱向鏤空部3232,並且橫向鏤空部3231乃位置對應該傳輸導體組彎折導引部11c鄰近該傳輸導體組焊接部11d一側處,再者,該縱向鏤空部3232乃位置對應該第二差分訊號傳輸導體導引部21a;藉此,透過強化鏤空部323的橫向鏤空部3231設計,讓傳輸導體組彎折導引部11c的訊號速度可以再次提升,加快傳輸速度,並透過縱向鏤空部3232設計,讓通過第二差分訊號傳輸導體導引部21a的訊號可再次加速,使通過第二差分訊號傳輸導體基部21、及第二差分訊號傳輸導體導引部21a的訊號,在抵達傳輸導體組焊接部11d之時間,可與通過第一差分訊號傳輸導體基部、及第一差分訊號傳輸導體導引部20a的訊號相同,更強化高頻輸出訊號之穩定性與品質。 Please refer to FIG5, which is a plan view of the third preferred embodiment of the present invention. It can be clearly seen from the figure that the present embodiment is different from the aforementioned embodiment in that the base portion 32 of the present embodiment has a reinforced hollow portion 323, which includes a transverse hollow portion 3231 and a longitudinal hollow portion 3232 communicating with the transverse hollow portion 3231, and the transverse hollow portion 3231 is located at a position corresponding to the side of the transmission conductor group bending guide portion 11c adjacent to the transmission conductor group welding portion 11d, and the longitudinal hollow portion 3232 is located at a position corresponding to the second differential signal transmission conductor guide portion 21a; thereby, by strengthening the hollow portion The transverse cutout 3231 in section 323 further increases the signal speed of the transmission conductor assembly's bent guide section 11c, accelerating transmission speed. The longitudinal cutout 3232 further accelerates the signal passing through the second differential signal transmission conductor guide section 21a. This allows the signal passing through the second differential signal transmission conductor base 21 and the second differential signal transmission conductor guide section 21a to reach the transmission conductor assembly soldering portion 11d at the same time as the signal passing through the first differential signal transmission conductor base and the first differential signal transmission conductor guide section 20a, further enhancing the stability and quality of the high-frequency output signal.
請參閱第六圖所示,為本發明第四較佳實施例之立體圖,由圖中可清楚看出,本實施例與前述實施例不同處在於,本實施例絕緣膠體3外包覆有一屏蔽外殼4,透過屏蔽外殼4可有較屏蔽雜訊,避免影響其他電子元件。 Please refer to Figure 6, which is a perspective view of the fourth preferred embodiment of the present invention. As can be clearly seen from the figure, this embodiment differs from the previous embodiments in that the insulating colloid 3 is covered with a shielding shell 4. The shielding shell 4 can effectively shield noise and prevent it from affecting other electronic components.
請參閱第七圖所示,為本發明第五較佳實施例之平面圖,由圖中可清楚看出,本實施例與前述實施例不同處在於,本實施例屏蔽外殼4上乃具有一位置對應該強化鏤空部323之屏蔽外殼鏤空部41,藉由屏蔽外殼鏤空部 41之設計,讓通過橫向鏤空部3231及縱向鏤空部3232的訊號更無阻礙,傳輸速度可更快、更平衡,讓高頻傳輸品質更佳。 Please refer to Figure 7, which is a plan view of the fifth preferred embodiment of the present invention. As can be clearly seen from the figure, this embodiment differs from the previous embodiments in that the shielding housing 4 of this embodiment includes a shielding housing cutout 41 corresponding to the reinforced cutout 323. This design of the shielding housing cutout 41 allows signals to pass through the transverse cutout 3231 and the longitudinal cutout 3232 without obstruction, resulting in faster and more balanced transmission speeds and improved high-frequency transmission quality.
請參閱第八圖所示,為本發明第六較佳實施例之平面分解圖,由圖中可清楚看出,本實施例與前述實施例不同處在於,本實施除了包括第一較佳實施例所有技術特徵外,更同時包括了基座部32上之數個基座定位孔321、數個基座鏤空部322、及一強化鏤空部323,其中基座鏤空部322位置乃分別對應該傳輸導體組彎折導引部11c,而強化鏤空部323包括有一橫向鏤空部3231及一與該橫向鏤空部3231相通之縱向鏤空部3232,所述橫向鏤空部3231乃位置對應該傳輸導體組彎折導引部11c鄰近該傳輸導體組焊接部11d一側處,又該縱向鏤空部3232乃位置對應該第二差分訊號傳輸導體導引部21a,此外,絕緣膠體3外包覆有一屏蔽外殼4,屏蔽外殼4上乃具有一位置對應該強化鏤空部323之屏蔽外殼鏤空部41;藉此,本實施例乃綜合前述實施例之所有技術特徵,意謂,本實施例藉由舌片鏤空部3113將第二差分訊號傳輸導體基部21裸露於外,使通過第二差分訊號傳輸導體基部21的訊號不會受到絕緣膠體3的介質影響,讓傳輸速度得以增快,如此即可讓通過第二差分訊號傳輸導體基部21及第二差分訊號傳輸導體導引部21a的訊號,抵達傳輸導體組焊接部11d的時間,可與通過第一差分訊號傳輸導體基部20及第一差分訊號傳輸導體導引部20a的訊號相同,而達到訊號平衡,有效增加高頻傳輸訊號的穩定性及品質。不僅如此,透過基座鏤空部322之設計,可讓通過第四差分訊號傳輸導體基部29、及第四差分訊號傳輸導體導引部29a的訊號,在抵達傳輸導體組焊接部11d之時間,可與通過第三差分訊號傳輸導體基部28、及第三差分訊號傳輸導體導引部28a的訊號相同。另外,透過強化鏤空部323的橫向鏤空部3231設計,讓傳輸導體組彎折導引部11c的速度可以再次提升,加快傳輸速度,而透過強化鏤空部323的縱向鏤空部3232設計,可更強化高頻輸出訊號之穩定性與品質,且屏蔽外殼鏤空部41可讓通過橫向鏤空部3231及縱向鏤空部3232的訊號更無阻礙,傳輸速度可更快、更平衡,讓高頻傳輸品質更佳。 Please refer to FIG8, which is a planar exploded view of the sixth preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment is different from the above embodiments in that, in addition to including all the technical features of the first preferred embodiment, this embodiment also includes a plurality of base positioning holes 321, a plurality of base hollow portions 322, and a reinforced hollow portion 323 on the base portion 32, wherein the base hollow portion 322 is located corresponding to the transmission guide. The reinforcing hollow portion 323 includes a transverse hollow portion 3231 and a longitudinal hollow portion 3232 communicating with the transverse hollow portion 3231. The transverse hollow portion 3231 is located at a position corresponding to the side of the transmission conductor assembly bending guide portion 11c adjacent to the transmission conductor assembly welding portion 11d. The longitudinal hollow portion 3232 is located at a position corresponding to the second differential signal transmission conductor guide portion 21a. The insulating colloid 3 is covered with a shielding shell 4, and the shielding shell 4 has a shielding shell hollow portion 41 corresponding to the position of the reinforced hollow portion 323. Thus, this embodiment integrates all the technical features of the aforementioned embodiments, that is, this embodiment exposes the second differential signal transmission conductor base 21 to the outside through the tongue hollow portion 3113, so that the signal passing through the second differential signal transmission conductor base 21 will not be affected by the insulating colloid 3. The medium influence can increase the transmission speed. In this way, the time it takes for the signal passing through the second differential signal transmission conductor base 21 and the second differential signal transmission conductor guide portion 21a to reach the transmission conductor assembly welding portion 11d can be the same as the time it takes for the signal passing through the first differential signal transmission conductor base 20 and the first differential signal transmission conductor guide portion 20a, thereby achieving signal balance and effectively improving the stability and quality of the high-frequency transmission signal. Furthermore, the design of the base hollow portion 322 allows the signal passing through the fourth differential signal transmission conductor base 29 and the fourth differential signal transmission conductor guide portion 29a to reach the transmission conductor assembly welding portion 11d at the same time as the signal passing through the third differential signal transmission conductor base 28 and the third differential signal transmission conductor guide portion 28a. Furthermore, the design of the transverse cutout 3231 within the reinforced cutout 323 further increases the speed at which the transmission conductor assembly bends the guide portion 11c, further accelerating transmission speed. The design of the longitudinal cutout 3232 within the reinforced cutout 323 further enhances the stability and quality of the high-frequency output signal. Furthermore, the shielded housing cutout 41 allows signals to pass through the transverse and longitudinal cutouts 3231 and 3232 without obstruction, resulting in faster and more balanced transmission speeds and improved high-frequency transmission quality.
惟,雖然本文中已顯示並敘明本發明之各種實施例,但僅以舉例方式提供此等實施例,本文中所提供之任何操作理論或益處既定僅作為敘明本發 明之一輔助;此等理論及解釋不束縛或限制關於藉由實踐本發明而達成之組織重塑之申請專利範圍。熟習此項技術者現在可不背離本發明之情形下構想出諸多變化、改變或替代。應瞭解,可在實踐本發明時採用本文中所敘明之發明之實施例的各種替代方案。本發明之範疇、本發明之範疇內的方法及結構既定包括等效形式。 However, although various embodiments of the present invention have been shown and described herein, such embodiments are provided by way of example only, and any theories of operation or benefits provided herein are intended solely as an aid in describing the present invention; such theories and explanations do not restrict or limit the scope of the patent claims relating to the organizational remodeling achieved by practicing the present invention. Those skilled in the art will now be able to devise numerous variations, modifications, and substitutions without departing from the present invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the present invention. The scope of the present invention, methods, and structures within the scope of the present invention are intended to include equivalents.
綜上所述,本發明之電連接器之膠體結構於使用時,為確實能達到其功效及目的,故本發明誠為一實用性優異之發明,為符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本發明,以保障申請人之辛苦發明,倘若 鈞局審委有任何稽疑,請不吝來函指示,申請人定當竭力配合,實感公便。 In summary, the colloid structure of the electrical connector of this invention is able to achieve its efficacy and purpose during use. Therefore, this invention is truly an invention of excellent practicality. To meet the application requirements for a patent, we have filed an application in accordance with the law. We hope that the Examination Committee will approve this invention as soon as possible to protect the applicant's hard work. If the Examination Committee has any questions, please feel free to contact us. The applicant will fully cooperate and feel that this is a public convenience.
3:絕緣膠體 3: Insulation colloid
31:舌片部 31: Tongue
3111:後排接觸穿孔 3111: Rear contact perforation
3113:舌片鏤空部 3113: Tongue hollowing area
3121:前排接觸槽 3121: Front contact slot
32:基座部 32: Base
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112141339A TWI890174B (en) | 2023-10-27 | 2023-10-27 | Electrical connector colloid structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112141339A TWI890174B (en) | 2023-10-27 | 2023-10-27 | Electrical connector colloid structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202518781A TW202518781A (en) | 2025-05-01 |
| TWI890174B true TWI890174B (en) | 2025-07-11 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112141339A TWI890174B (en) | 2023-10-27 | 2023-10-27 | Electrical connector colloid structure |
Country Status (1)
| Country | Link |
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| TW (1) | TWI890174B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM420064U (en) * | 2011-07-14 | 2012-01-01 | Amphenol East Asia Ltd | Vertical connector |
| US8821195B2 (en) * | 2012-01-06 | 2014-09-02 | Hosiden Corporation | Connector |
| TWI710169B (en) * | 2019-04-12 | 2020-11-11 | 維將科技股份有限公司 | Electric connector (1) |
| CN109390764B (en) * | 2017-08-04 | 2021-09-21 | 富士康(昆山)电脑接插件有限公司 | Terminal module, electric connector with terminal module and manufacturing method of electric connector |
| TWM660658U (en) * | 2023-10-27 | 2024-09-21 | 維將科技股份有限公司 | Electrical connector colloid structure |
-
2023
- 2023-10-27 TW TW112141339A patent/TWI890174B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM420064U (en) * | 2011-07-14 | 2012-01-01 | Amphenol East Asia Ltd | Vertical connector |
| US8821195B2 (en) * | 2012-01-06 | 2014-09-02 | Hosiden Corporation | Connector |
| CN109390764B (en) * | 2017-08-04 | 2021-09-21 | 富士康(昆山)电脑接插件有限公司 | Terminal module, electric connector with terminal module and manufacturing method of electric connector |
| TWI710169B (en) * | 2019-04-12 | 2020-11-11 | 維將科技股份有限公司 | Electric connector (1) |
| TWM660658U (en) * | 2023-10-27 | 2024-09-21 | 維將科技股份有限公司 | Electrical connector colloid structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202518781A (en) | 2025-05-01 |
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