TWI889249B - 積層壓電體及其製造方法 - Google Patents
積層壓電體及其製造方法 Download PDFInfo
- Publication number
- TWI889249B TWI889249B TW113110540A TW113110540A TWI889249B TW I889249 B TWI889249 B TW I889249B TW 113110540 A TW113110540 A TW 113110540A TW 113110540 A TW113110540 A TW 113110540A TW I889249 B TWI889249 B TW I889249B
- Authority
- TW
- Taiwan
- Prior art keywords
- piezoelectric
- hard coating
- less
- multilayer
- film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/098—Forming organic materials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023048031 | 2023-03-24 | ||
| JP2023-048031 | 2023-03-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202506427A TW202506427A (zh) | 2025-02-16 |
| TWI889249B true TWI889249B (zh) | 2025-07-01 |
Family
ID=92905015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113110540A TWI889249B (zh) | 2023-03-24 | 2024-03-21 | 積層壓電體及其製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP4691758A1 (https=) |
| JP (1) | JPWO2024203685A1 (https=) |
| CN (1) | CN120813472A (https=) |
| TW (1) | TWI889249B (https=) |
| WO (1) | WO2024203685A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202138191A (zh) * | 2020-04-02 | 2021-10-16 | 日商吳羽股份有限公司 | 積層膜、其製造方法及用途 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010026938A (ja) | 2008-07-23 | 2010-02-04 | Daikin Ind Ltd | タッチパネル |
| EP3216596A1 (en) | 2014-12-17 | 2017-09-13 | Mitsui Chemicals, Inc. | Laminated body |
| JP7050469B2 (ja) * | 2017-11-21 | 2022-04-08 | 日東電工株式会社 | 圧電フィルムおよび圧電センサ |
| EP4238763A4 (en) * | 2020-10-30 | 2024-04-10 | Kureha Corporation | Piezoelectric film, touch panel, and piezoelectric film manufacturing method |
| JP2023048031A (ja) | 2021-09-27 | 2023-04-06 | Toto株式会社 | 衛生陶器 |
| KR102814226B1 (ko) * | 2021-10-22 | 2025-05-28 | 가부시끼가이샤 구레하 | 투명 도전 압전 필름, 디바이스 및 투명 도전 압전 필름의 제조방법 |
-
2024
- 2024-03-21 JP JP2025510621A patent/JPWO2024203685A1/ja active Pending
- 2024-03-21 CN CN202480015424.7A patent/CN120813472A/zh active Pending
- 2024-03-21 TW TW113110540A patent/TWI889249B/zh active
- 2024-03-21 WO PCT/JP2024/010932 patent/WO2024203685A1/ja not_active Ceased
- 2024-03-21 EP EP24779808.5A patent/EP4691758A1/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202138191A (zh) * | 2020-04-02 | 2021-10-16 | 日商吳羽股份有限公司 | 積層膜、其製造方法及用途 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2024203685A1 (https=) | 2024-10-03 |
| CN120813472A (zh) | 2025-10-17 |
| TW202506427A (zh) | 2025-02-16 |
| EP4691758A1 (en) | 2026-02-11 |
| WO2024203685A1 (ja) | 2024-10-03 |
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