TWI880760B - 探針 - Google Patents

探針 Download PDF

Info

Publication number
TWI880760B
TWI880760B TW113119874A TW113119874A TWI880760B TW I880760 B TWI880760 B TW I880760B TW 113119874 A TW113119874 A TW 113119874A TW 113119874 A TW113119874 A TW 113119874A TW I880760 B TWI880760 B TW I880760B
Authority
TW
Taiwan
Prior art keywords
probe
protrusion
axis direction
contact portion
guide plate
Prior art date
Application number
TW113119874A
Other languages
English (en)
Chinese (zh)
Other versions
TW202503280A (zh
Inventor
竹谷敏永
岸康貴
Original Assignee
日商日本麥克隆尼股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本麥克隆尼股份有限公司 filed Critical 日商日本麥克隆尼股份有限公司
Publication of TW202503280A publication Critical patent/TW202503280A/zh
Application granted granted Critical
Publication of TWI880760B publication Critical patent/TWI880760B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
TW113119874A 2023-06-01 2024-05-29 探針 TWI880760B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-090723 2023-06-01
JP2023090723A JP2024172768A (ja) 2023-06-01 2023-06-01 プローブ

Publications (2)

Publication Number Publication Date
TW202503280A TW202503280A (zh) 2025-01-16
TWI880760B true TWI880760B (zh) 2025-04-11

Family

ID=93657947

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113119874A TWI880760B (zh) 2023-06-01 2024-05-29 探針

Country Status (6)

Country Link
US (1) US20260079179A1 (https=)
JP (1) JP2024172768A (https=)
KR (1) KR20260003757A (https=)
CN (1) CN121241261A (https=)
TW (1) TWI880760B (https=)
WO (1) WO2024247885A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200624815A (en) * 2005-01-14 2006-07-16 Nihon Micronics Kk Electrical contact testing probe
JP2010261718A (ja) * 2009-04-29 2010-11-18 Japan Electronic Materials Corp プローブ、複数のプローブが実装されたプローブカード、およびプローブカードにプローブを実装する際のプローブの位置決め方法
JP2011027538A (ja) * 2009-07-24 2011-02-10 Japan Electronic Materials Corp アライメントマークを設けたプローブ、およびアライメントマークが設けられた複数のプローブが実装されたプローブカード
TW201305567A (zh) * 2011-06-17 2013-02-01 Electro Scient Ind Inc 具有用於電子裝置測試之交錯蜿蜒測試接觸件之探針模組
TW201443441A (zh) * 2012-12-04 2014-11-16 Japan Electronic Materials 電性接觸子
TW202041864A (zh) * 2019-03-29 2020-11-16 日商日本麥克隆尼股份有限公司 探針卡
JP2023520244A (ja) * 2020-04-03 2023-05-16 ファイコム カンパニー リミテッド プローブカード製造用治具、これを含むプローブ整列システム、およびこれを用いて製造されたプローブカード

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5487049B2 (ja) * 2010-08-19 2014-05-07 株式会社日本マイクロニクス プローブカード
JP7443017B2 (ja) 2019-10-17 2024-03-05 株式会社日本マイクロニクス 検査プローブ、検査プローブの製造方法および検査装置
JP7626693B2 (ja) * 2021-11-22 2025-02-04 株式会社日本マイクロニクス プローブ格納治具、プローブ格納システムおよびプローブ格納方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200624815A (en) * 2005-01-14 2006-07-16 Nihon Micronics Kk Electrical contact testing probe
JP2010261718A (ja) * 2009-04-29 2010-11-18 Japan Electronic Materials Corp プローブ、複数のプローブが実装されたプローブカード、およびプローブカードにプローブを実装する際のプローブの位置決め方法
JP2011027538A (ja) * 2009-07-24 2011-02-10 Japan Electronic Materials Corp アライメントマークを設けたプローブ、およびアライメントマークが設けられた複数のプローブが実装されたプローブカード
TW201305567A (zh) * 2011-06-17 2013-02-01 Electro Scient Ind Inc 具有用於電子裝置測試之交錯蜿蜒測試接觸件之探針模組
TW201443441A (zh) * 2012-12-04 2014-11-16 Japan Electronic Materials 電性接觸子
TW202041864A (zh) * 2019-03-29 2020-11-16 日商日本麥克隆尼股份有限公司 探針卡
JP2023520244A (ja) * 2020-04-03 2023-05-16 ファイコム カンパニー リミテッド プローブカード製造用治具、これを含むプローブ整列システム、およびこれを用いて製造されたプローブカード

Also Published As

Publication number Publication date
CN121241261A (zh) 2025-12-30
US20260079179A1 (en) 2026-03-19
KR20260003757A (ko) 2026-01-07
WO2024247885A1 (ja) 2024-12-05
TW202503280A (zh) 2025-01-16
JP2024172768A (ja) 2024-12-12

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