TWI872226B - 硬化性樹脂組成物、硬化物、及印刷配線板 - Google Patents

硬化性樹脂組成物、硬化物、及印刷配線板 Download PDF

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Publication number
TWI872226B
TWI872226B TW110109242A TW110109242A TWI872226B TW I872226 B TWI872226 B TW I872226B TW 110109242 A TW110109242 A TW 110109242A TW 110109242 A TW110109242 A TW 110109242A TW I872226 B TWI872226 B TW I872226B
Authority
TW
Taiwan
Prior art keywords
resin composition
curable resin
bisphenol
printed wiring
hardening
Prior art date
Application number
TW110109242A
Other languages
English (en)
Chinese (zh)
Other versions
TW202202940A (zh
Inventor
金沢康代
槇田昇平
野口智崇
Original Assignee
日商太陽控股股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商太陽控股股份有限公司 filed Critical 日商太陽控股股份有限公司
Publication of TW202202940A publication Critical patent/TW202202940A/zh
Application granted granted Critical
Publication of TWI872226B publication Critical patent/TWI872226B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
TW110109242A 2020-03-31 2021-03-16 硬化性樹脂組成物、硬化物、及印刷配線板 TWI872226B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020062179 2020-03-31
JP2020-062179 2020-03-31

Publications (2)

Publication Number Publication Date
TW202202940A TW202202940A (zh) 2022-01-16
TWI872226B true TWI872226B (zh) 2025-02-11

Family

ID=77929226

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110109242A TWI872226B (zh) 2020-03-31 2021-03-16 硬化性樹脂組成物、硬化物、及印刷配線板

Country Status (5)

Country Link
JP (1) JP7371321B2 (https=)
KR (1) KR102832902B1 (https=)
CN (1) CN115380074B (https=)
TW (1) TWI872226B (https=)
WO (1) WO2021200032A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118139929A (zh) * 2021-10-22 2024-06-04 东洋纺株式会社 导电性组合物
JP2023174097A (ja) * 2022-05-27 2023-12-07 住友ベークライト株式会社 基板材料用樹脂組成物、および半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201506539A (zh) * 2009-09-29 2015-02-16 Fujifilm Corp 著色硬化組成物、彩色光阻、彩色濾光片及其製備方法、以及含有彩色濾光片之固態影像感測器、影像顯示裝置
TW201538503A (zh) * 2013-11-25 2015-10-16 Shikoku Chem 具有官能基的乙炔脲類及其應用
TW201631023A (zh) * 2015-01-21 2016-09-01 Taiyo Ink Mfg Co Ltd 熱硬化性樹脂組成物、乾膜、硬化物以及印刷配線板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3189988B2 (ja) * 1992-07-07 2001-07-16 住友ベークライト株式会社 絶縁樹脂ペースト
BR9910933A (pt) * 1998-06-02 2001-02-28 Bayer Ag Poliuretano-uréias, fibras de poliuretano-uréia e processo para a sua preparação
JP4343367B2 (ja) * 1999-12-17 2009-10-14 旭化成せんい株式会社 耐熱性に優れたポリウレタンウレア弾性繊維
JP5027357B2 (ja) * 2001-03-30 2012-09-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物及びプリント配線板
ES2279017T3 (es) * 2002-02-23 2007-08-16 Bayer Materialscience Ag Procedimiento para la preparacion de elastomeros de poliuretano termoplasticos blandos bien desmoldeables con escasa contraccion.
JP5209888B2 (ja) * 2006-03-09 2013-06-12 昭和電工株式会社 熱硬化性樹脂組成物及びその用途
JP2008214413A (ja) * 2007-03-01 2008-09-18 Toray Ind Inc 熱硬化性樹脂組成物
TW200908839A (en) 2007-08-09 2009-02-16 Nichigo Morton Co Ltd Solder mask, photoresist pattern forming method and the light-emitting device thereof
EP2829642A4 (en) * 2011-12-16 2015-12-16 Toray Opelontex Co Ltd ELASTIC POLYURETHANE FIBER AND METHOD FOR THE PRODUCTION THEREOF
JP2015121775A (ja) * 2013-11-20 2015-07-02 四国化成工業株式会社 光硬化性・熱硬化性樹脂組成物およびプリント配線板
JP7454906B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201506539A (zh) * 2009-09-29 2015-02-16 Fujifilm Corp 著色硬化組成物、彩色光阻、彩色濾光片及其製備方法、以及含有彩色濾光片之固態影像感測器、影像顯示裝置
TW201538503A (zh) * 2013-11-25 2015-10-16 Shikoku Chem 具有官能基的乙炔脲類及其應用
TW201631023A (zh) * 2015-01-21 2016-09-01 Taiyo Ink Mfg Co Ltd 熱硬化性樹脂組成物、乾膜、硬化物以及印刷配線板

Also Published As

Publication number Publication date
WO2021200032A1 (ja) 2021-10-07
JP7371321B2 (ja) 2023-10-31
CN115380074A (zh) 2022-11-22
TW202202940A (zh) 2022-01-16
JPWO2021200032A1 (https=) 2021-10-07
KR20220140810A (ko) 2022-10-18
KR102832902B1 (ko) 2025-07-11
CN115380074B (zh) 2024-03-08

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