TWI870883B - 樹脂密封裝置及樹脂密封方法 - Google Patents

樹脂密封裝置及樹脂密封方法 Download PDF

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Publication number
TWI870883B
TWI870883B TW112120569A TW112120569A TWI870883B TW I870883 B TWI870883 B TW I870883B TW 112120569 A TW112120569 A TW 112120569A TW 112120569 A TW112120569 A TW 112120569A TW I870883 B TWI870883 B TW I870883B
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TW
Taiwan
Prior art keywords
resin
mold
molded product
workpiece
guillotine
Prior art date
Application number
TW112120569A
Other languages
English (en)
Chinese (zh)
Other versions
TW202410218A (zh
Inventor
金井雅弥
寺澤広子
金井英二
Original Assignee
日商山田尖端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商山田尖端科技股份有限公司 filed Critical 日商山田尖端科技股份有限公司
Publication of TW202410218A publication Critical patent/TW202410218A/zh
Application granted granted Critical
Publication of TWI870883B publication Critical patent/TWI870883B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H10W74/01—

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW112120569A 2022-08-30 2023-06-01 樹脂密封裝置及樹脂密封方法 TWI870883B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-136435 2022-08-30
JP2022136435A JP2024033057A (ja) 2022-08-30 2022-08-30 樹脂封止装置及び樹脂封止方法

Publications (2)

Publication Number Publication Date
TW202410218A TW202410218A (zh) 2024-03-01
TWI870883B true TWI870883B (zh) 2025-01-21

Family

ID=90099110

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112120569A TWI870883B (zh) 2022-08-30 2023-06-01 樹脂密封裝置及樹脂密封方法

Country Status (3)

Country Link
JP (1) JP2024033057A (ja)
TW (1) TWI870883B (ja)
WO (1) WO2024047916A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7625624B2 (ja) 2023-01-27 2025-02-03 エムテックスマツムラ株式会社 ゲートブレーク装置、樹脂成形システム及び不要樹脂除去方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306934A (ja) * 1999-04-19 2000-11-02 Apic Yamada Corp マトリクス状基板のディゲート方法及びモールド金型
JP2007129113A (ja) * 2005-11-05 2007-05-24 Towa Corp 成形済マトリクス型リードフレームのゲート切断方法
US20080309015A1 (en) * 2005-11-25 2008-12-18 Dai-Chi Seiko Co., Ltd Resin Sealing Apparatus and Resin Sealing Method
JP2021034479A (ja) * 2019-08-21 2021-03-01 Ｉ−Ｐｅｘ株式会社 ゲートブレイク方法及びゲートブレイク装置
JP7121835B1 (ja) * 2021-06-25 2022-08-18 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740573B2 (ja) * 1987-01-26 1995-05-01 株式会社東芝 半導体製造装置
JP2000003921A (ja) * 1998-06-13 2000-01-07 Shibaura Mechatronics Corp 半導体製造装置
JP5732669B2 (ja) * 2010-08-12 2015-06-10 アピックヤマダ株式会社 ディゲート装置及びそれを備えた樹脂モールド装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306934A (ja) * 1999-04-19 2000-11-02 Apic Yamada Corp マトリクス状基板のディゲート方法及びモールド金型
JP2007129113A (ja) * 2005-11-05 2007-05-24 Towa Corp 成形済マトリクス型リードフレームのゲート切断方法
US20080309015A1 (en) * 2005-11-25 2008-12-18 Dai-Chi Seiko Co., Ltd Resin Sealing Apparatus and Resin Sealing Method
JP2021034479A (ja) * 2019-08-21 2021-03-01 Ｉ−Ｐｅｘ株式会社 ゲートブレイク方法及びゲートブレイク装置
JP7121835B1 (ja) * 2021-06-25 2022-08-18 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

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Publication number Publication date
TW202410218A (zh) 2024-03-01
WO2024047916A1 (ja) 2024-03-07
JP2024033057A (ja) 2024-03-13

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