TWI870838B - Sensing module - Google Patents
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Abstract
Description
本發明是有關於一種電子裝置,且特別是有關於一種感測模組。The present invention relates to an electronic device, and in particular to a sensing module.
在目前立體深度感測技術的應用中,從距離較遠的遙感地貌探測,至中距離的工廠自動化之無人搬運車、智慧機械、車輛輔助駕駛或無人車、無人機等,而至短距離的應用包括掃地機器人,手勢辨識裝置以及手機之人臉辨識系統等,極其廣泛,無所不在。近年來突飛猛進的發展,主要是受到該技術在民生消費品以及車用電子應用的驅動所導致。In the current application of stereo depth sensing technology, from long-distance remote sensing terrain detection to medium-distance factory automation unmanned transport vehicles, smart machinery, vehicle-assisted driving or unmanned vehicles, drones, etc., and short-distance applications include sweeping robots, gesture recognition devices and mobile phone face recognition systems, etc., which are extremely wide and ubiquitous. The rapid development in recent years is mainly driven by the application of this technology in consumer goods and automotive electronics.
在一般立體深度感測技術的應用中使用飛時測距(Time of Flight)裝置。由一般飛時測距裝置的基本構造可知,其平面空間解析度主要受飛時測距感測器的解析度所限制。在目前的市場上,以320×240解析度的QVGA(Quarter VGA)規格為主。目前雖然已有開發至640×480解析度的飛時測距裝置,但此類裝置因雪崩二極體(avalanche photodiode, APD)或單光子雪崩二極體(single photon avalanche diode, SPAD)在畫素微縮上仍待改進,且整個裝置在高解析度情形下體積較大。同時,在高解析度數據量龐大的情形下,會逐漸失去與其他技術比較上反應速度極高的優點。因此,如何提升飛時測距裝置品質是本領域所需致力的目標。In the application of general stereo depth sensing technology, a Time of Flight (TOF) device is used. From the basic structure of a general TOF device, it can be seen that its planar spatial resolution is mainly limited by the resolution of the TOF sensor. In the current market, the QVGA (Quarter VGA) specification with a resolution of 320×240 is the main specification. Although TOF devices with a resolution of 640×480 have been developed, such devices still need to be improved in pixel miniaturization due to avalanche photodiodes (APD) or single photon avalanche diodes (SPAD), and the entire device is relatively large in high-resolution situations. At the same time, in the case of a large amount of high-resolution data, it will gradually lose the advantage of extremely high response speed compared with other technologies. Therefore, how to improve the quality of time-of-flight ranging devices is a goal that needs to be worked on in this field.
本發明提供一種感測模組,可進一步提升感測解析度,且具有較小的體積。The present invention provides a sensing module which can further improve the sensing resolution and has a smaller volume.
本發明提供一種感測模組,包括發光裝置以及感測裝置。發光裝置包括發光元件以及光學元件。發光元件用以提供照明光束。光學元件配置於照明光束的傳遞路徑上,用以傳遞照明光束至感測區域的多個子區域以產生多個反射光束。感測裝置包括感測元件以及陣列透鏡。感測元件配置於多個反射光束的傳遞路徑上,用以接收多個反射光束以產生多個子感測信號。陣列透鏡配置於感測元件。陣列透鏡包括多個子透鏡,分別配置於多個反射光束的傳遞路徑上。The present invention provides a sensing module, including a light-emitting device and a sensing device. The light-emitting device includes a light-emitting element and an optical element. The light-emitting element is used to provide an illumination beam. The optical element is arranged on the transmission path of the illumination beam, and is used to transmit the illumination beam to multiple sub-areas of a sensing area to generate multiple reflected beams. The sensing device includes a sensing element and an array lens. The sensing element is arranged on the transmission path of the multiple reflected beams, and is used to receive the multiple reflected beams to generate multiple sub-sensing signals. The array lens is arranged on the sensing element. The array lens includes multiple sub-lenses, which are respectively arranged on the transmission path of the multiple reflected beams.
在本發明的一實施例中,上述的光學元件包括輪盤、轉軸、多個繞射元件以及驅動元件。轉軸配置於輪盤的旋轉中心。多個繞射元件配置於輪盤,且圍繞轉軸。驅動元件連接轉軸,用以驅動轉軸旋轉。In one embodiment of the present invention, the optical element includes a wheel, a rotating shaft, a plurality of diffraction elements and a driving element. The rotating shaft is disposed at the rotation center of the wheel. The plurality of diffraction elements are disposed on the wheel and surround the rotating shaft. The driving element is connected to the rotating shaft to drive the rotating shaft to rotate.
在本發明的一實施例中,上述的多個繞射元件的數量相同於多個子區域的數量。In an embodiment of the present invention, the number of the plurality of diffraction elements is equal to the number of the plurality of sub-regions.
在本發明的一實施例中,上述的驅動元件依時序驅動轉軸以帶動輪盤旋轉。In one embodiment of the present invention, the driving element drives the shaft in a time sequence to drive the wheel to rotate.
在本發明的一實施例中,上述的光學元件包括光調變元件,配置於照明光束的傳遞路徑上,用以依時序傳遞照明光束至多個子區域。In an embodiment of the present invention, the optical element includes a light modulation element disposed on a transmission path of the illumination light beam for transmitting the illumination light beam to a plurality of sub-areas in a time sequence.
在本發明的一實施例中,上述的多個子區域彼此不重疊。In one embodiment of the present invention, the above-mentioned multiple sub-areas do not overlap with each other.
在本發明的一實施例中,上述的多個子區域的區域範圍輪廓為矩形。In an embodiment of the present invention, the area range outlines of the above-mentioned multiple sub-areas are rectangular.
在本發明的一實施例中,上述的感測區域由多個子區域拼接而成。In an embodiment of the present invention, the above-mentioned sensing area is composed of a plurality of sub-areas.
在本發明的一實施例中,上述的多個子區域的數量相同於多個子透鏡的數量。In an embodiment of the present invention, the number of the plurality of sub-regions is equal to the number of the plurality of sub-lenses.
在本發明的一實施例中,上述的感測模組,還包括處理裝置,電性連接於感測元件,用以依據多個子感測信號產生感測信號。In an embodiment of the present invention, the sensing module further includes a processing device electrically connected to the sensing element for generating a sensing signal according to a plurality of sub-sensing signals.
基於上述,在本發明的感測模組中,感測模組包括發光裝置以及感測裝置,其中光學元件傳遞發光元件所提供的照明光束至感測區域的多個子區域以產生多個反射光束。陣列透鏡中的多個子透鏡分別傳遞由不同子區域所提供的反射光束至感測元件,以產生多個子感測信號。進而可藉由信號數據處理獲得較大解析度的感測信號。如此一來,可進一步提升感測模組的感測解析度,且感測模組具有較小的體積。Based on the above, in the sensing module of the present invention, the sensing module includes a light-emitting device and a sensing device, wherein the optical element transmits the illumination light beam provided by the light-emitting element to multiple sub-areas of the sensing area to generate multiple reflected light beams. Multiple sub-lenses in the array lens respectively transmit the reflected light beams provided by different sub-areas to the sensing element to generate multiple sub-sensing signals. Then, a sensing signal with a higher resolution can be obtained by signal data processing. In this way, the sensing resolution of the sensing module can be further improved, and the sensing module has a smaller volume.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the present invention more clearly understood, embodiments are specifically cited below and described in detail with reference to the accompanying drawings.
圖1A至圖1D為本發明一實施例的感測模組在不同時序下傳遞照明光束的示意圖。圖2為圖1A的感測模組的感測裝置接收多個反射光束的示意圖。請先參考圖1A至圖1D。本發明提供一種感測模組100,例如是具有結構光照明的飛時測距裝置,用以提供結構光至感測目標並利用飛時測距(Time of Fight)技術進行立體深度感測,可應用於地貌探測、智慧機械、車輛輔助駕駛、無人裝置、手機辨識裝置等不同領域。感測目標可以是任意有形體的物件,本發明並不限於此。FIG. 1A to FIG. 1D are schematic diagrams of a sensing module of an embodiment of the present invention transmitting an illumination beam at different timings. FIG. 2 is a schematic diagram of a sensing device of the sensing module of FIG. 1A receiving multiple reflected beams. Please refer to FIG. 1A to FIG. 1D first. The present invention provides a
在本實施例中,感測模組100包括發光裝置110以及感測裝置120,發光裝置110用以提供照明光束L1至感測目標,而感測裝置120用以接收由感測目標所反射的反射光束L2以進行感測。詳細而言,感測模組100所感測到感測目標的表面可被定義為感測區域50,而感測區域50可由被定義的多個子區域52、54、56、58所組成。其中,在本實施例中,多個子區域52、54、56、58彼此不重疊。舉例而言,這些子區域52、54、56、58的區域範圍輪廓例如為矩形,這些子區域52、54、56、58的區域範圍輪廓可拼接形成感測區域50,如圖1A所顯示。但在不同實施例中,多個子區域52、54、56、58也可設計比此重疊,並涵蓋整個感測區域50,本發明並不限於此。以下說明將以外型可拼接形成感測區域50的四個子區域52、54、56、58為例。In this embodiment, the
詳細而言,發光裝置110包括發光元件112以及光學元件114。發光元件112提供照明光束L1。舉例而言,在本實施例中,發光元件112例如為發光二極體(light-emitting diode, LED)或是雷射二極體(laser diode, LD),照明光束L1例如為紅外光束。光學元件114配置於照明光束L1的傳遞路徑上,用以傳遞照明光束L1至感測區域50的多個子區域52、54、56、58以產生多個反射光束L2。具體而言,光學元件114包括輪盤202、轉軸204、多個繞射元件206以及驅動元件(未繪示)。轉軸204配置於輪盤202的旋轉中心。多個繞射元件206配置於輪盤202,且圍繞轉軸204。驅動元件連接轉軸204,驅動元件例如為馬達,用以驅動轉軸204旋轉以帶動輪盤202旋轉。因此,照明光束L1將隨時性地傳遞通過不同的繞射元件206。驅動元件可選擇性地配置於輪盤202上或另設置他處,本發明並不限於此。In detail, the light-
在本實施例中,多個繞射元件206的數量相同於多個子區域52、54、56、58的數量,即例如同為四個。多個繞射元件206例如是繞射式光學元件(Diffractive Optical Elements, DOE),用以讓所通過的照明光束L1形成為結構光並賦予特定指向性。舉例而言,如圖1A至圖1D分別所顯示,在本實施例中,當照明光束L1依時序傳遞通過不同的繞射元件206時,會產生照射不同的子區域52、54、56、58的結構光。其中,照明光束L1依時序傳遞通過不同的繞射元件206可通過旋轉輪盤202以替換位在光軸上的繞射元件206來實現。換句話說,本實施例透過不同的繞射元件206將照明光束L1朝不同方向照射以形成對應子區域52、54、56、58的結構光,而這些光將由各子區域52、54、56、58朝不同方向反射回感測模組100,即成為感測裝置120所接收的反射光束L2。In the present embodiment, the number of the plurality of
請參考圖2。為方便說明,圖2僅顯示一部份的感測區域50,以子區域52、54顯示為例。另一方面,感測裝置120包括感測元件122以及陣列透鏡124。感測元件122配置於多個反射光束L2的傳遞路徑上,用以接收多個反射光束L2以產生多個子感測信號。感測元件122例如為紅外感測器。舉例而言,本實施例選用解析度為320 x 240的飛時測距感測器(ToF sensor)。陣列透鏡124配置於感測元件122。陣列透鏡124包括多個子透鏡M,分別配置於多個反射光束L2的傳遞路徑上。換句話說,多個子區域52、54、56、58的數量相同於多個子透鏡M的數量。在本實施例中,子透鏡M的數量為四個,即為2 x 2的透鏡陣列形式,且四個子透鏡M分別對應配置在四個不同反射光束L2的傳遞路徑上。這些子透鏡M可分別接收由不同子區域52、54、56、58所反射的反射光束L2以傳遞至單一個感測元件122。換句話說,由於感測元件122可接收解析度可達320 x 240的反射光束L2,故隨著發光裝置110隨時性地提供照明光束L1至不同子區域52、54、56、58,感測元件122將隨時性地接收不同子區域52、54、56、58所反射的反射光束L2,且這些反射光束L2分別可產生解析度320 x 240的子感測信號,並藉由將對應於不同子區域52、54、56、58的子感測信號進行信號數據處理,以獲得解析度可達到640 x 480的感測信號。如此一來,可進一步提升感測模組100的感測解析度,且感測模組100具有較小的體積。在一些實施例中,感測模組100可包括處理裝置,電性連接於感測元件122,用以依據多個子感測信號產生感測信號。處理裝置例如為中央處理單元(Central Processing Unit,CPU)或是其他種類處理器,本發明並不限於此。Please refer to FIG. 2. For the convenience of explanation, FIG. 2 only shows a portion of the
圖3為本發明另一實施例的感測模組進行感測的示意圖。請參考圖3。本實施例的感測模組100A類似於圖1A所顯示的感測模組100。兩者不同之處在於,在本實施例中,發光裝置110A中的光學元件114A包括光調變元件208,配置於照明光束L1的傳遞路徑上,用以依時序傳遞照明光束L1至不同的多個子區域52、54、56、58。光調變元件208例如為空間光調製器(Spatial Light Modulator, SLM)。光調變元件208藉由電性控制隨時性地改變狀態,以將所通過的照明光束L1隨時性地改變傳遞方向,進而傳遞至不同的多個子區域52、54、56、58。如此一來,可進一步提升感測模組100A的感測解析度,且感測模組100A具有較小的體積。FIG3 is a schematic diagram of another embodiment of the present invention in which the sensing module performs sensing. Please refer to FIG3. The
在圖1A至圖1D或圖3的實施例中,還可選擇性地將感測區域50定義成九個子區域,並藉由配置可提供至九個不同子區域的照明光束L1的發光裝置110與3 x 3透鏡陣列形式的陣列透鏡124的搭配,從而獲得更高解析度的影像深度資訊。換句話說,本發明並不限制照明光束L1投射至不同子區域的數量。In the embodiment of FIG. 1A to FIG. 1D or FIG. 3 , the
綜上所述,在本發明的感測模組中,感測模組包括發光裝置以及感測裝置,其中光學元件傳遞發光元件所提供的照明光束至感測區域的多個子區域以產生多個反射光束。陣列透鏡中的多個子透鏡分別傳遞由不同子區域所提供的反射光束至感測元件,以產生多個子感測信號。進而可藉由信號數據處理獲得較大解析度的感測信號。如此一來,可進一步提升感測模組的感測解析度,且感測模組具有較小的體積。In summary, in the sensing module of the present invention, the sensing module includes a light-emitting device and a sensing device, wherein the optical element transmits the illumination light beam provided by the light-emitting element to multiple sub-areas of the sensing area to generate multiple reflected light beams. Multiple sub-lenses in the array lens respectively transmit the reflected light beams provided by different sub-areas to the sensing element to generate multiple sub-sensing signals. Then, a sensing signal with a higher resolution can be obtained by signal data processing. In this way, the sensing resolution of the sensing module can be further improved, and the sensing module has a smaller volume.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above by the embodiments, they are not intended to limit the present invention. Any person with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be defined by the scope of the attached patent application.
50:感測區域
52,54,56,58:子區域
100,100A:感測模組
110,110A:發光裝置
112:發光元件
114,114A:光學元件
120:感測裝置
122:感測元件
124:陣列透鏡
202:輪盤
204:轉軸
206:繞射元件
208:光調變元件
L1:照明光束
L2:反射光束
M:子透鏡
50: Sensing
圖1A至圖1D為本發明一實施例的感測模組在不同時序下傳遞照明光束的示意圖。 圖2為圖1A的感測模組的感測裝置接收多個反射光束的示意圖。 圖3為本發明另一實施例的感測模組進行感測的示意圖。 Figures 1A to 1D are schematic diagrams of a sensing module of an embodiment of the present invention transmitting an illumination beam at different timings. Figure 2 is a schematic diagram of a sensing device of the sensing module of Figure 1A receiving multiple reflected beams. Figure 3 is a schematic diagram of a sensing module of another embodiment of the present invention performing sensing.
50:感測區域 50: Sensing area
52,54,56,58:子區域 52,54,56,58: Sub-area
100:感測模組 100:Sensor module
110:發光裝置 110: Light-emitting device
112:發光元件 112: Light-emitting element
114:光學元件 114: Optical components
120:感測裝置 120:Sensor device
122:感測元件 122: Sensing element
124:陣列透鏡 124: Array lens
202:輪盤 202: Roulette
204:轉軸 204: Rotating axis
206:繞射元件 206:Diffraction element
L1:照明光束 L1: lighting beam
M:子透鏡 M: Sub-lens
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TW112115749A TWI870838B (en) | 2022-06-01 | 2022-06-01 | Sensing module |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2014059301A (en) * | 2012-09-18 | 2014-04-03 | Sick Ag | Photoelectric sensor and depth map detection method |
WO2019078074A1 (en) * | 2017-10-20 | 2019-04-25 | Sony Semiconductor Solutions Corporation | Depth image acquiring apparatus, control method, and depth image acquiring system |
TW202024563A (en) * | 2018-12-26 | 2020-07-01 | 日商迪思科股份有限公司 | Thickness measuring apparatus |
CN113296265A (en) * | 2017-08-31 | 2021-08-24 | 脸谱科技有限责任公司 | Depth camera assembly, head mounted display and method for depth sensing |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2014059301A (en) * | 2012-09-18 | 2014-04-03 | Sick Ag | Photoelectric sensor and depth map detection method |
CN113296265A (en) * | 2017-08-31 | 2021-08-24 | 脸谱科技有限责任公司 | Depth camera assembly, head mounted display and method for depth sensing |
WO2019078074A1 (en) * | 2017-10-20 | 2019-04-25 | Sony Semiconductor Solutions Corporation | Depth image acquiring apparatus, control method, and depth image acquiring system |
TW202024563A (en) * | 2018-12-26 | 2020-07-01 | 日商迪思科股份有限公司 | Thickness measuring apparatus |
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