TWI861746B - 嵌段共聚物、樹脂組合物、硬化物、樹脂膜、預浸體、積層體、及電子電路基板用之材料 - Google Patents

嵌段共聚物、樹脂組合物、硬化物、樹脂膜、預浸體、積層體、及電子電路基板用之材料 Download PDF

Info

Publication number
TWI861746B
TWI861746B TW112107789A TW112107789A TWI861746B TW I861746 B TWI861746 B TW I861746B TW 112107789 A TW112107789 A TW 112107789A TW 112107789 A TW112107789 A TW 112107789A TW I861746 B TWI861746 B TW I861746B
Authority
TW
Taiwan
Prior art keywords
mass
block copolymer
polymer block
parts
component
Prior art date
Application number
TW112107789A
Other languages
English (en)
Chinese (zh)
Other versions
TW202346463A (zh
Inventor
松岡裕太
服部剛樹
助川敬
近藤知宏
荒木祥文
Original Assignee
日商旭化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商旭化成股份有限公司 filed Critical 日商旭化成股份有限公司
Publication of TW202346463A publication Critical patent/TW202346463A/zh
Application granted granted Critical
Publication of TWI861746B publication Critical patent/TWI861746B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
    • C08F297/04—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising vinyl aromatic monomers and conjugated dienes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
    • C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • C08F283/08—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F287/00—Macromolecular compounds obtained by polymerising monomers on to block polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F293/00—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C08F4/28—Oxygen or compounds releasing free oxygen
    • C08F4/32—Organic compounds
    • C08F4/34—Per-compounds with one peroxy-radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
TW112107789A 2022-03-04 2023-03-03 嵌段共聚物、樹脂組合物、硬化物、樹脂膜、預浸體、積層體、及電子電路基板用之材料 TWI861746B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022033349 2022-03-04
JP2022-033349 2022-03-04
WOPCT/JP2023/000860 2023-01-13
JP2023000860 2023-01-13

Publications (2)

Publication Number Publication Date
TW202346463A TW202346463A (zh) 2023-12-01
TWI861746B true TWI861746B (zh) 2024-11-11

Family

ID=87883663

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112107789A TWI861746B (zh) 2022-03-04 2023-03-03 嵌段共聚物、樹脂組合物、硬化物、樹脂膜、預浸體、積層體、及電子電路基板用之材料

Country Status (4)

Country Link
JP (1) JP7799031B2 (https=)
KR (1) KR20240116955A (https=)
TW (1) TWI861746B (https=)
WO (1) WO2023167151A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025094876A1 (https=) * 2023-10-31 2025-05-08
WO2025225221A1 (ja) * 2024-04-26 2025-10-30 デンカ株式会社 ブロック共重合体、樹脂組成物及び樹脂ペレット

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200706601A (en) * 2005-05-31 2007-02-16 3M Innovative Properties Co Sealant materials containing diblock copolymers and methods of making thereof
TW201634555A (zh) * 2015-02-09 2016-10-01 Asahi Chemical Ind 嵌段共聚物組合物、成形材料、樹脂組合物、及成形體
CN109627662A (zh) * 2018-12-19 2019-04-16 天津金发新材料有限公司 一种抗菌聚苯乙烯复合材料、制备方法及其评价方法
CN111875916A (zh) * 2019-05-03 2020-11-03 克拉通聚合物研究有限公司 嵌段共聚物组合物、预浸料和由其制备的层压体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60223813A (ja) * 1984-04-21 1985-11-08 Asahi Chem Ind Co Ltd ブロック共重合体
JP3973537B2 (ja) 2002-10-29 2007-09-12 電気化学工業株式会社 電子写真用トナーバインダー用樹脂組成物
JP3986452B2 (ja) 2003-03-17 2007-10-03 電気化学工業株式会社 電子写真用トナーバインダー用樹脂組成物
KR100753245B1 (ko) 2003-08-22 2007-08-30 아사히 가세이 케미칼즈 가부시키가이샤 캐리어 테이프용 시트
JP2005206669A (ja) 2004-01-21 2005-08-04 Mitsubishi Chemicals Corp ビニル芳香族系熱可塑性エラストマー組成物
JP2010037398A (ja) 2008-08-01 2010-02-18 Nippon Zeon Co Ltd プリプレグ及びそれを用いた積層体
JP6333140B2 (ja) 2013-09-20 2018-05-30 Ｐｓジャパン株式会社 板状押出発泡体
JP6278753B2 (ja) 2014-03-06 2018-02-14 旭化成株式会社 ブロック共重合体
ES2694881T3 (es) 2014-09-08 2018-12-27 Kuraray Co., Ltd. Película para recipientes de empaque de líquidos y recipiente de empaque de líquidos
JP2019044090A (ja) 2017-09-04 2019-03-22 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、並びに、それを用いたプリプレグ、樹脂付金属箔、樹脂フィルム、金属張積層板及び配線基板
ES2890685T3 (es) * 2017-11-22 2022-01-21 Kuraray Co Hidrogenado de copolímero de bloques, composición de resina y aplicaciones de los mismos
JP7099128B2 (ja) 2018-07-26 2022-07-12 味の素株式会社 樹脂組成物
US11760826B2 (en) 2018-12-14 2023-09-19 Kraton Corporation Block copolymers and uses thereof
WO2021024680A1 (ja) 2019-08-06 2021-02-11 日本曹達株式会社 金属張積層板用樹脂組成物、プリプレグ、及び金属張積層板
JP7508244B2 (ja) 2020-03-18 2024-07-01 旭化成株式会社 ポリフェニレンエーテル樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200706601A (en) * 2005-05-31 2007-02-16 3M Innovative Properties Co Sealant materials containing diblock copolymers and methods of making thereof
TW201634555A (zh) * 2015-02-09 2016-10-01 Asahi Chemical Ind 嵌段共聚物組合物、成形材料、樹脂組合物、及成形體
CN109627662A (zh) * 2018-12-19 2019-04-16 天津金发新材料有限公司 一种抗菌聚苯乙烯复合材料、制备方法及其评价方法
CN111875916A (zh) * 2019-05-03 2020-11-03 克拉通聚合物研究有限公司 嵌段共聚物组合物、预浸料和由其制备的层压体

Also Published As

Publication number Publication date
JP7799031B2 (ja) 2026-01-14
KR20240116955A (ko) 2024-07-30
JPWO2023167151A1 (https=) 2023-09-07
TW202346463A (zh) 2023-12-01
WO2023167151A1 (ja) 2023-09-07

Similar Documents

Publication Publication Date Title
TWI861746B (zh) 嵌段共聚物、樹脂組合物、硬化物、樹脂膜、預浸體、積層體、及電子電路基板用之材料
TWI906643B (zh) 樹脂組合物、硬化物、樹脂膜、預浸體、積層體、及電子電路基板用之材料
JP2023129399A (ja) ブロック共重合体、樹脂組成物、硬化物、樹脂フィルム、プリプレグ、積層体、及び電子回路基板用の材料
TWI852383B (zh) 嵌段共聚物、樹脂組合物、硬化物、樹脂膜、預浸體、積層體、及電子電路基板用之材料
TWI873742B (zh) 樹脂組合物、硬化物、樹脂膜、預浸體、積層體、及電子電路基板用之材料
JP2024021048A (ja) 樹脂組成物、硬化物、樹脂フィルム、プリプレグ、積層体、及び電子回路基板用の材料
JP2024074136A (ja) ブロック共重合体、硬化物、電子回路基板材料、樹脂フィルム、プリプレグ、積層体、及び半導体チップパッケージ
TWI858713B (zh) 氫化共軛二烯系共聚物、樹脂組合物、硬化物、樹脂膜、預浸體、積層體、及印刷電路板
KR102957520B1 (ko) 수지 조성물, 경화물, 수지 필름, 프리프레그, 적층체 및 전자 회로 기판용 재료
KR102858428B1 (ko) 블록 공중합체 그리고 해당 블록 공중합체를 함유하는 수지 조성물 및 경화물
KR102957505B1 (ko) 수지 조성물, 경화물, 수지 필름, 프리프레그, 적층체 및 전자 회로 기판용 재료
KR102957492B1 (ko) 수지 조성물, 경화물, 수지 필름, 프리프레그, 적층체 및 전자 회로 기판용 재료
CN116693781B (zh) 嵌段共聚物、树脂组合物、固化物、树脂膜、预浸料、层积体以及电子电路基板用的材料
KR20240053538A (ko) 공액 디엔계 공중합체, 수지 조성물, 경화물, 수지 필름, 프리프레그, 적층체 및 전자 회로 기판 재료
CN118632881A (zh) 嵌段共聚物、树脂组合物、固化物、树脂膜、预浸料、层积体以及电子电路基板用的材料
CN118613516A (zh) 嵌段共聚物、树脂组合物、固化物、树脂膜、预浸料、层积体以及电子电路基板用的材料
JP2023135652A (ja) ブロック共重合体並びに該ブロック共重合体を含有する樹脂組成物及び硬化物
TW202442723A (zh) 樹脂組合物、硬化物、樹脂膜、預浸體、積層體、及印刷配線板
JP2023147193A (ja) 変性共役ジエン系重合体、及びこれを含有する樹脂組成物、並びに、（半）硬化物、接着剤、樹脂フィルム、ボンディングフィルム、プリプレグ、積層体、及び電子回路基板材料
JP2025150362A (ja) 樹脂組成物、硬化物、樹脂フィルム、プリプレグ、積層体、及び電子回路基板用の材料