TWI858283B - 黏接劑組成物 - Google Patents

黏接劑組成物 Download PDF

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Publication number
TWI858283B
TWI858283B TW110131397A TW110131397A TWI858283B TW I858283 B TWI858283 B TW I858283B TW 110131397 A TW110131397 A TW 110131397A TW 110131397 A TW110131397 A TW 110131397A TW I858283 B TWI858283 B TW I858283B
Authority
TW
Taiwan
Prior art keywords
adhesive composition
adhesive layer
adhesive
inorganic filler
resin
Prior art date
Application number
TW110131397A
Other languages
English (en)
Chinese (zh)
Other versions
TW202214808A (zh
Inventor
門間栞
片桐航
Original Assignee
日商信越聚合物股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商信越聚合物股份有限公司 filed Critical 日商信越聚合物股份有限公司
Publication of TW202214808A publication Critical patent/TW202214808A/zh
Application granted granted Critical
Publication of TWI858283B publication Critical patent/TWI858283B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW110131397A 2020-08-27 2021-08-25 黏接劑組成物 TWI858283B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020143253 2020-08-27
JP2020-143253 2020-08-27

Publications (2)

Publication Number Publication Date
TW202214808A TW202214808A (zh) 2022-04-16
TWI858283B true TWI858283B (zh) 2024-10-11

Family

ID=80353964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110131397A TWI858283B (zh) 2020-08-27 2021-08-25 黏接劑組成物

Country Status (3)

Country Link
JP (1) JP7716415B2 (https=)
TW (1) TWI858283B (https=)
WO (1) WO2022045157A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7638661B2 (ja) * 2020-10-21 2025-03-04 Ｐｓジャパン株式会社 樹脂組成物、マスターバッチ及びシート
WO2022113963A1 (ja) * 2020-11-24 2022-06-02 富士フイルム株式会社 ポリマーフィルム、及び、積層体
JP7342917B2 (ja) * 2021-07-26 2023-09-12 東洋インキＳｃホールディングス株式会社 接着性樹脂シート、プリント配線板および、電子機器。
JP2023157050A (ja) * 2022-04-14 2023-10-26 アイカ工業株式会社 低誘電率樹脂組成物
KR20260032559A (ko) * 2023-07-06 2026-03-09 가부시끼가이샤 레조낙 경화성 수지 조성물, 경화성 필름, 및 적층 필름

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340593A (ja) * 1998-05-29 1999-12-10 Shin Etsu Polymer Co Ltd プリント配線基板用積層板およびこの製造方法
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP6284094B2 (ja) * 2013-08-23 2018-02-28 国立研究開発法人産業技術総合研究所 誘電体用樹脂組成物および高周波誘電体デバイス
JP6332458B2 (ja) * 2014-07-31 2018-05-30 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
JP6828242B2 (ja) * 2016-01-26 2021-02-10 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板及び多層プリント配線板
JP6142961B1 (ja) * 2016-03-08 2017-06-07 東洋インキＳｃホールディングス株式会社 積層体およびその製造方法、並びに接着層付樹脂フィルム
JP6561153B2 (ja) * 2017-02-20 2019-08-14 株式会社有沢製作所 樹脂組成物、接着フィルム、カバーレイフィルム、積層板、樹脂付き銅箔及び樹脂付き銅張り積層板
JP2018170492A (ja) * 2017-11-21 2018-11-01 東洋インキＳｃホールディングス株式会社 電子部品保護シート
WO2019216352A1 (ja) * 2018-05-11 2019-11-14 日立化成株式会社 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム
CN112789317B (zh) * 2018-10-02 2023-03-10 纳美仕有限公司 树脂组合物、带有基材的膜、金属/树脂层压体及半导体装置
JP7283208B2 (ja) * 2019-04-26 2023-05-30 Ａｇｃ株式会社 パウダー分散液、積層体の製造方法、積層体及びプリント基板の製造方法
JP7736567B2 (ja) * 2019-12-23 2025-09-09 信越ポリマー株式会社 接着剤組成物
JP6909342B1 (ja) * 2020-07-31 2021-07-28 アイカ工業株式会社 樹脂組成物及びそれを用いた接着シート
JPWO2022255137A1 (https=) * 2021-06-02 2022-12-08

Also Published As

Publication number Publication date
WO2022045157A1 (ja) 2022-03-03
JPWO2022045157A1 (https=) 2022-03-03
JP7716415B2 (ja) 2025-07-31
TW202214808A (zh) 2022-04-16

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