TWI855689B - 積層壓電膜 - Google Patents

積層壓電膜 Download PDF

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Publication number
TWI855689B
TWI855689B TW112118309A TW112118309A TWI855689B TW I855689 B TWI855689 B TW I855689B TW 112118309 A TW112118309 A TW 112118309A TW 112118309 A TW112118309 A TW 112118309A TW I855689 B TWI855689 B TW I855689B
Authority
TW
Taiwan
Prior art keywords
piezoelectric film
film
rigidity
protective film
laminated
Prior art date
Application number
TW112118309A
Other languages
English (en)
Chinese (zh)
Other versions
TW202412343A (zh
Inventor
芹川正寛
今治誠
Original Assignee
日商吳羽股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商吳羽股份有限公司 filed Critical 日商吳羽股份有限公司
Publication of TW202412343A publication Critical patent/TW202412343A/zh
Application granted granted Critical
Publication of TWI855689B publication Critical patent/TWI855689B/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/02Forming enclosures or casings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/704Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/88Mounts; Supports; Enclosures; Casings
    • H10N30/883Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/16Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/022Mechanical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/857Macromolecular compositions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538Roughness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/732Dimensional properties
    • B32B2307/737Dimensions, e.g. volume or area
    • B32B2307/7375Linear, e.g. length, distance or width
    • B32B2307/7376Thickness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
TW112118309A 2022-05-18 2023-05-17 積層壓電膜 TWI855689B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022081449 2022-05-18
JP2022-081449 2022-05-18

Publications (2)

Publication Number Publication Date
TW202412343A TW202412343A (zh) 2024-03-16
TWI855689B true TWI855689B (zh) 2024-09-11

Family

ID=88835564

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112118309A TWI855689B (zh) 2022-05-18 2023-05-17 積層壓電膜

Country Status (7)

Country Link
US (1) US20250318434A1 (https=)
EP (1) EP4507480A4 (https=)
JP (1) JP7730420B2 (https=)
KR (1) KR102892441B1 (https=)
CN (1) CN119138126A (https=)
TW (1) TWI855689B (https=)
WO (1) WO2023224057A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI903935B (zh) * 2023-12-21 2025-11-01 日商吳羽股份有限公司 積層壓電體及其製造方法
WO2026029139A1 (ja) * 2024-07-31 2026-02-05 株式会社クレハ フッ素系樹脂圧電フィルムおよびその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060071966A1 (en) * 2004-09-30 2006-04-06 Fuji Photo Film Co., Ltd. Liquid ejection head
US20080135213A1 (en) * 2006-03-03 2008-06-12 Syh-Yuh Cheng Composite mode transducer and cooling device having the composite mode transducer
US20130241352A1 (en) * 2011-10-03 2013-09-19 Piezoelectrtic Vibration Device and Portable Terminal Using the Same Piezoelectric vibration device and portable terminal using the same
US20210031519A1 (en) * 2019-07-30 2021-02-04 Seiko Epson Corporation Liquid discharge head and liquid discharge apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05324203A (ja) 1992-05-22 1993-12-07 Fujitsu Ltd 静電容量型タッチパネル
KR101972242B1 (ko) * 2014-11-14 2019-04-24 미쯔이가가꾸가부시끼가이샤 고분자 압전 필름
JP6993555B2 (ja) 2015-05-22 2022-01-13 ダイキン工業株式会社 有機圧電フィルム
EP3418049B1 (en) * 2016-03-09 2021-02-17 Mitsui Chemicals, Inc. Laminated article
JP2019067908A (ja) 2017-09-29 2019-04-25 株式会社クレハ 圧電フィルムおよびフィルムの製造方法
KR20220140840A (ko) 2020-04-02 2022-10-18 가부시끼가이샤 구레하 적층 필름, 그의 제조 방법 및 이용
KR20230010710A (ko) 2020-06-25 2023-01-19 후지필름 가부시키가이샤 압전 소자
CN117813842A (zh) * 2021-08-18 2024-04-02 富士胶片株式会社 压电膜及层叠压电元件

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060071966A1 (en) * 2004-09-30 2006-04-06 Fuji Photo Film Co., Ltd. Liquid ejection head
US20080135213A1 (en) * 2006-03-03 2008-06-12 Syh-Yuh Cheng Composite mode transducer and cooling device having the composite mode transducer
US20130241352A1 (en) * 2011-10-03 2013-09-19 Piezoelectrtic Vibration Device and Portable Terminal Using the Same Piezoelectric vibration device and portable terminal using the same
US20210031519A1 (en) * 2019-07-30 2021-02-04 Seiko Epson Corporation Liquid discharge head and liquid discharge apparatus

Also Published As

Publication number Publication date
CN119138126A (zh) 2024-12-13
KR20250002466A (ko) 2025-01-07
JP7730420B2 (ja) 2025-08-27
US20250318434A1 (en) 2025-10-09
TW202412343A (zh) 2024-03-16
EP4507480A4 (en) 2025-07-09
JPWO2023224057A1 (https=) 2023-11-23
KR102892441B1 (ko) 2025-11-27
EP4507480A1 (en) 2025-02-12
WO2023224057A1 (ja) 2023-11-23

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