TWI849084B - 黏著劑組成物、黏著帶、及電子零件之處理方法 - Google Patents

黏著劑組成物、黏著帶、及電子零件之處理方法 Download PDF

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TWI849084B
TWI849084B TW109109267A TW109109267A TWI849084B TW I849084 B TWI849084 B TW I849084B TW 109109267 A TW109109267 A TW 109109267A TW 109109267 A TW109109267 A TW 109109267A TW I849084 B TWI849084 B TW I849084B
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group
adhesive composition
general formula
reactive resin
functional group
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TW109109267A
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TW202045677A (zh
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七里徳重
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日商積水化學工業股份有限公司
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    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
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    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
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    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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    • C08G73/125—Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW109109267A 2019-03-20 2020-03-19 黏著劑組成物、黏著帶、及電子零件之處理方法 TWI849084B (zh)

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JPJP2019-053280 2019-03-20
JP2019053279 2019-03-20
JP2019053280 2019-03-20
JPJP2019-053279 2019-03-20
JPJP2019-053278 2019-03-20
JP2019053278 2019-03-20

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TW202045677A TW202045677A (zh) 2020-12-16
TWI849084B true TWI849084B (zh) 2024-07-21

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US (1) US12509612B2 (https=)
JP (2) JP7433228B2 (https=)
KR (1) KR102770542B1 (https=)
CN (2) CN120349767A (https=)
TW (1) TWI849084B (https=)
WO (1) WO2020189764A1 (https=)

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JP7433228B2 (ja) * 2019-03-20 2024-02-19 積水化学工業株式会社 粘着剤組成物、粘着テープ、及び、電子部品の処理方法
KR20230074063A (ko) * 2020-09-23 2023-05-26 세키스이가가쿠 고교가부시키가이샤 임시 고정재, 및, 전자 부품의 제조 방법
JP2023109307A (ja) * 2022-01-27 2023-08-08 積水化学工業株式会社 硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法
CN120435507A (zh) * 2023-03-23 2025-08-05 Dic株式会社 固化性化合物、固化性树脂组合物、固化物及层叠体

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KR20120057467A (ko) * 2010-11-26 2012-06-05 삼성전자주식회사 실리콘 변성 그룹을 갖는 감광성 폴리이미드, 이를 포함하는 접착 조성물 및 반도체 패키지
JP2013077521A (ja) 2011-09-30 2013-04-25 Dainippon Printing Co Ltd 電磁波剥離性フレキシブルデバイス用基板およびそれを用いた電子素子の製造方法
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