TWI843305B - Exposure method and exposure device - Google Patents

Exposure method and exposure device Download PDF

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TWI843305B
TWI843305B TW111145536A TW111145536A TWI843305B TW I843305 B TWI843305 B TW I843305B TW 111145536 A TW111145536 A TW 111145536A TW 111145536 A TW111145536 A TW 111145536A TW I843305 B TWI843305 B TW I843305B
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exposure
head
area
light
exposure head
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TW111145536A
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TW202349127A (en
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中井一
磯大介
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日商斯庫林集團股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2051Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70283Mask effects on the imaging process
    • G03F7/70291Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)

Abstract

本發明即使當存在有因異常等而不能曝光之曝光頭時,亦可不降低位置精度地進行補充曝光。 本發明之一種曝光方法,係具備有以下之步驟:將第一曝光圖案自第一曝光頭朝向第一曝光區域照射光之步驟;將第二曝光圖案自第一曝光頭朝向第二曝光區域照射光之步驟;將第三曝光圖案自第二曝光頭朝向第三曝光區域照射光之步驟;及將第四曝光圖案自第二曝光頭朝向第四曝光區域照射光之步驟。 The present invention can perform supplementary exposure without reducing position accuracy even when there is an exposure head that cannot expose due to abnormality. An exposure method of the present invention comprises the following steps: a step of irradiating a first exposure pattern from a first exposure head toward a first exposure area; a step of irradiating a second exposure pattern from the first exposure head toward a second exposure area; a step of irradiating a third exposure pattern from the second exposure head toward a third exposure area; and a step of irradiating a fourth exposure pattern from the second exposure head toward a fourth exposure area.

Description

曝光方法及曝光裝置Exposure method and exposure device

本說明書揭示之技術係關於一種基板之曝光者。作為處理對象之基板,例如,包含有半導體晶圓、液晶顯示裝置用玻璃基板、有機EL(electroluminescence)顯示裝置等平板顯示器(FPD)用基板、光碟用基板、磁碟用基板、光磁碟用基板、光罩用玻璃基板、陶瓷基板、場發射型顯示器(field emission display、即FED)用基板、或太陽能電池用基板等。The technology disclosed in this specification is related to a substrate exposure. The substrate to be processed includes, for example, semiconductor wafers, glass substrates for liquid crystal display devices, substrates for flat panel displays (FPD) such as organic EL (electroluminescence) display devices, optical disk substrates, magnetic disk substrates, optical magneto-disk substrates, glass substrates for masks, ceramic substrates, field emission display (FED) substrates, or solar cell substrates.

過往,已知一種曝光裝置(例如,參照專利文獻1),其使用複數個曝光頭,對基板上之曝光區域進行曝光。In the past, an exposure device is known (for example, refer to Patent Document 1), which uses a plurality of exposure heads to expose an exposure area on a substrate.

於此一曝光裝置中,複數個曝光頭分別對負責之曝光區域進行曝光。並且,當任一個曝光頭因異常而不能對負責之曝光區域進行曝光時,則藉由其他曝光頭另外進行追加曝光來加以補足。 [先前技術文獻] [專利文獻] In this exposure device, a plurality of exposure heads expose the exposure areas they are responsible for. Furthermore, when any exposure head cannot expose the exposure area it is responsible for due to an abnormality, other exposure heads can perform additional exposure to compensate. [Prior technical literature] [Patent literature]

專利文獻1:日本專利特開2008-116646號公報Patent document 1: Japanese Patent Publication No. 2008-116646

(發明所欲解決之問題)(Invent the problem you want to solve)

於先前技術中,當存在有不能曝光之曝光區域時,則需要另外追加曝光來加以補足,但該追加曝光係使曝光頭執行與通常之曝光動作不同之動作。因此,動作控制變得複雜,且可能造成曝光之位置精度降低。In the prior art, when there is an exposure area that cannot be exposed, additional exposure is required to compensate for it, but the additional exposure is to make the exposure head perform an action different from the normal exposure action. Therefore, the action control becomes complicated and may cause the exposure position accuracy to decrease.

本說明書所揭示之技術係鑑於以上記載之問題所完成者,該技術是即使當存在有因異常等而不能曝光之曝光頭之情形時,亦可不降低位置精度地補充曝光。 (解決問題之技術手段) The technology disclosed in this manual was developed in view of the above-described problems. Even when there is an exposure head that cannot be exposed due to abnormalities, etc., the technology can supplement exposure without reducing position accuracy. (Technical means to solve the problem)

本說明書揭示技術之第一態樣之曝光方法,係使用具備有第一曝光頭及第二曝光頭之曝光裝置的曝光方法;其中,前述曝光裝置係對設置有複數個曝光區域之基板進行曝光,前述第一曝光頭係可對複數個前述曝光區域中與第一曝光區域相對應之第一曝光圖案、及複數個前述曝光區域中與第二曝光區域相對應之第二曝光圖案照射光,前述第二曝光頭係可對複數個前述曝光區域中與第三曝光區域相對應之第三曝光圖案、及複數個前述曝光區域中與第四曝光區域相對應之第四曝光圖案照射光;且該曝光方法具備有以下之步驟:使複數個前述曝光區域對前述第一曝光頭及前述第二曝光頭相對地移動之步驟;於前述第一曝光區域位於前述第一曝光頭之曝光位置之狀態下,前述第一曝光圖案自前述第一曝光頭朝向前述第一曝光區域照射光之步驟;於前述第二曝光區域位於前述第一曝光頭之前述曝光位置之狀態下,前述第二曝光圖案自前述第一曝光頭朝向前述第二曝光區域照射光之步驟;於前述第三曝光區域位於前述第二曝光頭之前述曝光位置之狀態下,前述第三曝光圖案自前述第二曝光頭朝向前述第三曝光區域照射光之步驟;及於前述第四曝光區域位於前述第二曝光頭之前述曝光位置之狀態下,前述第四曝光圖案自前述第二曝光頭朝向前述第四曝光區域照射光之步驟。The first aspect of the exposure method disclosed in this specification is an exposure method using an exposure device having a first exposure head and a second exposure head; wherein the exposure device is used to expose a substrate provided with a plurality of exposure areas, the first exposure head can irradiate light to a first exposure pattern corresponding to the first exposure area in the plurality of exposure areas, and a second exposure pattern corresponding to the second exposure area in the plurality of exposure areas, and the second exposure head can irradiate light to a third exposure pattern corresponding to the third exposure area in the plurality of exposure areas, and a fourth exposure pattern corresponding to the fourth exposure area in the plurality of exposure areas; and the exposure method has the following steps: exposing the plurality of exposure areas to the first exposure head and the second exposure head. The step of moving the first exposure area to the ground; when the first exposure area is located at the exposure position of the first exposure head, the step of irradiating the first exposure pattern from the first exposure head toward the first exposure area; when the second exposure area is located at the aforementioned exposure position of the first exposure head, the step of irradiating the second exposure pattern from the first exposure head toward the second exposure area; when the third exposure area is located at the aforementioned exposure position of the second exposure head, the step of irradiating the third exposure pattern from the second exposure head toward the third exposure area; and when the fourth exposure area is located at the aforementioned exposure position of the second exposure head, the step of irradiating the fourth exposure pattern from the second exposure head toward the fourth exposure area.

本說明書揭示之技術的第二態樣之曝光方法,係與第一態樣之曝光方法相關聯,其中,自前述第一曝光頭照射於前述第一曝光區域之光、自前述第一曝光頭照射於前述第二曝光區域之光、自前述第二曝光頭照射於前述第三曝光區域之光、及自前述第二曝光頭照射於前述第四曝光區域之光中任一者,係在對應之前述曝光區域不進行曝光。The second aspect of the exposure method of the technology disclosed in this specification is related to the first aspect of the exposure method, wherein any one of the light irradiated from the aforementioned first exposure head to the aforementioned first exposure area, the light irradiated from the aforementioned first exposure head to the aforementioned second exposure area, the light irradiated from the aforementioned second exposure head to the aforementioned third exposure area, and the light irradiated from the aforementioned second exposure head to the aforementioned fourth exposure area, is not exposed in the corresponding aforementioned exposure area.

本說明書揭示之技術之第三態樣之曝光方法,係與第一或第二態樣之曝光方法相關聯,其中,自前述第一曝光頭照射於前述第一曝光區域之光、自前述第一曝光頭照射於前述第二曝光區域之光、自前述第二曝光頭照射於前述第三曝光區域之光、及自前述第二曝光頭照射於前述第四曝光區域之光中任一者,係被遮擋。The third aspect of the exposure method of the technology disclosed in this specification is related to the first or second aspect of the exposure method, wherein any one of the light irradiated from the first exposure head to the first exposure area, the light irradiated from the first exposure head to the second exposure area, the light irradiated from the second exposure head to the third exposure area, and the light irradiated from the second exposure head to the fourth exposure area is blocked.

本說明書揭示之技術之第四態樣之曝光方法,係與第一至第三態樣中任一態樣之曝光方法相關聯,其中,前述第一曝光頭與前述第二曝光頭係被排列於第一方向,複數個前述曝光區域被分別排列於前述第一方向,且使複數個前述曝光區域相對地移動之步驟係使複數個前述曝光區域沿前述第一方向移動之步驟。The fourth aspect of the exposure method of the technology disclosed in this specification is related to the exposure method of any one of the first to third aspects, wherein the first exposure head and the second exposure head are arranged in a first direction, a plurality of exposure areas are respectively arranged in the first direction, and the step of moving the plurality of exposure areas relative to each other is the step of moving the plurality of exposure areas along the first direction.

本說明書揭示之技術之第五態樣之曝光方法,係與第一至第四態樣中任一態樣之曝光方法相關聯,其中,前述第一曝光區域與前述第二曝光區域係被鄰接設置,前述第三曝光區域與前述第四曝光區域係被鄰接設置。The fifth aspect of the exposure method of the technology disclosed in this specification is related to the exposure method of any one of the first to fourth aspects, wherein the first exposure area and the second exposure area are adjacently arranged, and the third exposure area and the fourth exposure area are adjacently arranged.

本說明書揭示之技術之第六態樣之曝光方法,係與第一至第五態樣中任一態樣之曝光方法相關聯,其中,前述第一曝光區域與前述第三曝光區域係相同之前述曝光區域。The exposure method of the sixth aspect of the technology disclosed in this specification is related to the exposure method of any one of the first to fifth aspects, wherein the aforementioned first exposure area and the aforementioned third exposure area are the same aforementioned exposure areas.

本說明書揭示之技術之第七態樣之曝光方法,係與第四態樣之曝光方法相關聯,其中,前述第一曝光頭與前述第二曝光頭係於前述第一方向被鄰接配置,前述第二曝光區域與前述第三曝光區域係相同之區域,並且依前述第一曝光區域、前述第二曝光區域、前述第四曝光區域之順序,於前述第一方向被鄰接配置,且自前述第一曝光頭照射於前述第二曝光區域之光、及自前述第二曝光頭照射於前述第三曝光區域之光中任一者係被遮擋。The seventh aspect of the exposure method of the technology disclosed in this specification is related to the fourth aspect of the exposure method, wherein the first exposure head and the second exposure head are adjacently arranged in the first direction, the second exposure area and the third exposure area are the same area, and are adjacently arranged in the first direction in the order of the first exposure area, the second exposure area, and the fourth exposure area, and any one of the light irradiated from the first exposure head to the second exposure area and the light irradiated from the second exposure head to the third exposure area is blocked.

本說明書揭示之技術之第八態樣之曝光裝置,其具備有:第一曝光頭及第二曝光頭,其用以對基板進行曝光;於前述基板設置有複數個曝光區域,前述第一曝光頭係可對複數個前述曝光區域中之第一曝光區域相對應之第一曝光圖案、及與複數個前述曝光區域中之第二曝光區域相對應之第二曝光圖案照射光,前述第二曝光頭係可對複數個前述曝光區域中之第三曝光區域相對應之第三曝光圖案、及複數個前述曝光區域中之第四曝光區域相對應之第四曝光圖案照射光;且該曝光裝置具備有:移動部,其使複數個前述曝光區域對前述第一曝光頭及前述第二曝光頭相對地移動;及控制部,其用以控制前述第一曝光頭及前述第二曝光頭之曝光動作;前述控制部係,於前述第一曝光區域位於前述第一曝光頭之曝光位置之狀態下,使光自前述第一曝光頭朝向前述第一曝光區域照射前述第一曝光圖案,然後於前述第二曝光區域位於前述第一曝光頭之前述曝光位置之狀態下,使光自前述第一曝光頭朝向前述第二曝光區域照射前述第二曝光圖案,且前述控制部係於前述第三曝光區域位於前述第二曝光頭之前述曝光位置之狀態下,使光自前述第二曝光頭朝向前述第三曝光區域照射前述第三曝光圖案,然後於前述第四曝光區域位於前述第二曝光頭之前述曝光位置之狀態下,使光自前述第二曝光頭朝向前述第四曝光區域照射前述第四曝光圖案。The eighth aspect of the technology disclosed in this specification is an exposure device, which comprises: a first exposure head and a second exposure head, which are used to expose a substrate; a plurality of exposure areas are set on the substrate, the first exposure head can irradiate light to a first exposure pattern corresponding to a first exposure area among the plurality of exposure areas, and a second exposure pattern corresponding to a second exposure area among the plurality of exposure areas, and the second exposure head can irradiate light to a third exposure pattern corresponding to a third exposure area among the plurality of exposure areas, and a fourth exposure pattern corresponding to a fourth exposure area among the plurality of exposure areas; and the exposure device comprises: a moving part, which makes the plurality of exposure areas move relative to the first exposure head and the second exposure head; and a control part, which is used to control the first exposure head and the second exposure head. The control unit is configured to perform an exposure operation of the second exposure head; the control unit is configured to, when the first exposure area is located at the exposure position of the first exposure head, irradiate the first exposure pattern from the first exposure head toward the first exposure area, and then, when the second exposure area is located at the exposure position before the first exposure head, irradiate the second exposure pattern from the first exposure head toward the second exposure area; and the control unit is configured to, when the third exposure area is located at the exposure position before the second exposure head, irradiate the third exposure pattern from the second exposure head toward the third exposure area, and then, when the fourth exposure area is located at the exposure position before the second exposure head, irradiate the fourth exposure pattern from the second exposure head toward the fourth exposure area.

本說明書揭示之技術之第九態樣之曝光裝置,係與第八態樣之曝光裝置關聯,其更具備有:遮光部,其根據前述控制部之控制,可選擇性地遮擋前述第一曝光頭及前述第二曝光頭照射之光;及感測器,其被構成為,可檢測前述第一曝光頭及前述第二曝光頭之狀態;且前述移動部被構成為,可使前述複數個曝光區域相對於前述第一曝光頭及前述第二曝光頭於第一方向移動,前述第一曝光頭與前述第二曝光頭係於前述第一方向被鄰接配置,前述第二曝光區域與前述第三曝光區域係相同之區域,並且依前述第一曝光區域、前述第二曝光區域、前述第四曝光區域之順序,於前述第一方向被鄰接配置,前述控制部被構成為,根據來自前述感測器之資訊,檢測有無前述第一曝光頭及前述第二曝光頭之異常,前述控制部被構成為,當未檢測出前述第一曝光頭及前述第二曝光頭之異常時,藉由前述遮光部將自前述第一曝光頭照射於前述第二曝光區域之光、及自前述第二曝光頭照射於前述第三曝光區域之光的其中一者遮擋,並且,當檢測出前述第一曝光頭之異常時,至少不執行以前述遮光部遮擋自前述第二曝光頭照射於前述第三曝光區域之光,並且當檢測出前述第二曝光頭之異常時,至少不執行以前述遮光部遮擋自前述第一曝光頭照射於前述第二曝光區域之光。 (對照先前技術之功效) The ninth aspect of the exposure device disclosed in the present specification is related to the eighth aspect, and is further provided with: a light shielding portion, which can selectively shield the light irradiated by the first exposure head and the second exposure head according to the control of the control portion; and a sensor, which is configured to detect the state of the first exposure head and the second exposure head; and the moving portion is configured to move the plurality of exposure areas in a first direction relative to the first exposure head and the second exposure head, the first exposure head and the second exposure head are adjacently arranged in the first direction, the second exposure area and the third exposure area are the same area, and in the order of the first exposure area, the second exposure area and the fourth exposure area, the plurality of exposure areas are moved in the first direction. The control unit is configured to detect the presence or absence of abnormalities of the first exposure head and the second exposure head based on the information from the sensor. The control unit is configured to block one of the light irradiated from the first exposure head to the second exposure area and the light irradiated from the second exposure head to the third exposure area by the light shielding unit when the abnormality of the first exposure head and the second exposure head is not detected, and when the abnormality of the first exposure head is detected, at least the light shielding unit is not used to block the light irradiated from the second exposure head to the third exposure area, and when the abnormality of the second exposure head is detected, at least the light shielding unit is not used to block the light irradiated from the first exposure head to the second exposure area. (Compared to the effect of the prior art)

根據本說明書揭示之技術之至少第一、第八態樣,藉由使用複數個曝光頭分別進行複數次光之照射,可實現使用複數個曝光頭而完成各式各樣變化的曝光動作。藉此,即使於複數個曝光頭中任一個因異常等而不能曝光之狀態下,藉由預先設定之其他曝光頭之複數次光之照射,亦可不降低曝光之位置精度地補充曝光。According to at least the first and eighth aspects of the technology disclosed in this specification, by using a plurality of exposure heads to perform a plurality of light irradiations respectively, it is possible to use a plurality of exposure heads to complete various exposure operations. Thus, even if any one of the plurality of exposure heads cannot perform exposure due to an abnormality, the exposure can be supplemented without reducing the exposure position accuracy by irradiating with a plurality of light by other exposure heads that are set in advance.

此外,本說明書所揭示之技術相關聯之目的、特徵、態樣及優點,藉由以下所示之詳細說明及附圖,當可進一步明瞭。In addition, the objectives, features, aspects and advantages of the technology disclosed in this specification will be further understood through the detailed description and drawings shown below.

以下,參照附圖對實施形態進行說明。於以下實施形態中,雖然為了技術說明其也表示有詳細之特徵等,但其等係例示性者,未必為了使實施形態可實施而其全部均為必要之特徵。In the following embodiments, although detailed features are shown for the purpose of technical description, they are merely illustrative and not all of them are necessary features for the embodiments to be implemented.

再者,圖式係被示意性表示,為了方便說明,於圖式已適當地對構成進行了省略或簡化。此外,於不同圖式中分別表示構成等之大小及位置之相互關係,惟其未必為正確之記載,其可適當地變更。此外,為了容易理解實施形態之內容,於非剖視圖之俯視圖等圖式中,亦可能被附加陰影線。Furthermore, the drawings are schematically shown, and for the convenience of explanation, the components are appropriately omitted or simplified in the drawings. In addition, the size and position of the components are shown in different drawings, but they are not necessarily correct descriptions and can be changed appropriately. In addition, in order to facilitate the understanding of the content of the implementation form, hatching may also be added in drawings such as top views that are not cross-sectional views.

此外,於以下所示之說明中,對同樣之構成要件被賦予相同之符號作圖示,且其等之名稱及功能均相同。因此,為了避免重複說明,有時有省略關於其等內容之詳細說明之情形。In addition, in the following description, the same constituent elements are given the same symbols and their names and functions are the same. Therefore, in order to avoid duplication, the detailed description of the contents may be omitted.

此外,於本說明書記載之說明中,只要未特別說明,於將某構成要件記載為「具備」、「包含」或「具有」等之情況,並非為將其他構成要件之存在排除在外之排他表現。Furthermore, in the descriptions of this specification, unless otherwise specified, the description of a certain constituent element as “having”, “including”, or “having” does not constitute an exclusive expression that excludes the existence of other constituent elements.

此外,於本說明書記載之說明中,即使具有使用「第一」或「第二」等序數之情形,其等用語亦僅是為了容易理解實施形態之內容而為方便所使用者,本發明實施形態的內容並不受限於其等序數所可產生之順序等。In addition, in the description recorded in this specification, even if there are cases where ordinal numbers such as "first" or "second" are used, such terms are only used for the convenience of users in order to easily understand the content of the implementation form, and the content of the implementation form of the present invention is not limited to the order that can be generated by such ordinal numbers.

此外,於本說明書記載之說明中,「正某軸方向」或「負某軸方向」等之表現係將圖示之沿某軸之箭頭的方向設為正方向,將與圖示之某軸之箭頭相反側的方向設為負方向。In the descriptions described in this specification, the expressions "positive direction of a certain axis" or "negative direction of a certain axis" etc. are expressed as the direction of the arrow along the certain axis in the diagram being the positive direction and the direction opposite to the arrow of the certain axis in the diagram being the negative direction.

此外,於本說明書記載之說明中,即使有使用意指「上」、「下」、「左」、「右」、「側」、「底」、「表」或「裡」等特定位置或方向之用語之情形,但其等用語亦是為了容易理解實施形態的內容而為方便所使用,其與實施形態之實際實施時之位置或方向無關。In addition, in the descriptions recorded in this manual, even if there are cases where terms are used that refer to specific positions or directions such as "upper", "lower", "left", "right", "side", "bottom", "front" or "back", these terms are used for convenience in order to easily understand the content of the implementation form, and they have nothing to do with the position or direction of the actual implementation of the implementation form.

<實施形態> 以下,對本實施形態之曝光裝置及曝光方法進行說明。 <Implementation> The following describes the exposure device and exposure method of this implementation.

<關於曝光裝置之構成> 圖1為表示本實施形態之曝光裝置1之構成的側視圖。此外, 圖2為表示本實施形態之曝光裝置1之構成的俯視圖。曝光裝置1例如為一種於製造液晶顯示裝置之濾色片的步驟中,用以於濾色片用之玻璃基板(以下,亦簡稱為「基板」)的上表面描繪既定之圖案的裝置。 <About the structure of the exposure device> Figure 1 is a side view showing the structure of the exposure device 1 of the present embodiment. In addition, Figure 2 is a top view showing the structure of the exposure device 1 of the present embodiment. The exposure device 1 is, for example, a device for drawing a predetermined pattern on the upper surface of a glass substrate (hereinafter also referred to as a "substrate") for a color filter in the step of manufacturing a color filter of a liquid crystal display device.

如圖1及圖2所示,曝光裝置1具備有:載台10,其用以保持基板9;載台驅動部20,其連結於載台10;頭部30,其具有沿X軸方向排列之複數個曝光頭(曝光頭32a、曝光頭32b、曝光頭32c、曝光頭32d及曝光頭32e);及控制部50,其用以控制裝置之各驅動部之動作。此外,曝光裝置1更具備有照射光攝影部40,該照射光攝影部40係用以對自各個曝光頭照射之光(照射光)進行攝影。As shown in FIG. 1 and FIG. 2 , the exposure device 1 includes: a stage 10 for holding a substrate 9; a stage driving unit 20 connected to the stage 10; a head unit 30 having a plurality of exposure heads (exposure head 32a, exposure head 32b, exposure head 32c, exposure head 32d, and exposure head 32e) arranged along the X-axis direction; and a control unit 50 for controlling the operation of each driving unit of the device. In addition, the exposure device 1 is further provided with an irradiation light photographing unit 40 for photographing the light (irradiation light) irradiated from each exposure head.

載台10具有平板狀之外形,其係用以於其上表面以水平姿勢配置並保持基板9之保持部。於載台10的上表面形成有複數個吸引孔(在此,省略圖示)。因此,當載台10上配置有基板9時,藉由吸引孔之吸引力將基板9固定於載台10的上表面。再者,在保持於載台10上之基板9的表面形成有彩色光阻等感光材料之層。The stage 10 has a flat plate shape and is a holding portion for arranging and holding the substrate 9 in a horizontal position on its upper surface. A plurality of suction holes (not shown here) are formed on the upper surface of the stage 10. Therefore, when the substrate 9 is arranged on the stage 10, the substrate 9 is fixed to the upper surface of the stage 10 by the suction force of the suction holes. Furthermore, a layer of photosensitive material such as a color photoresist is formed on the surface of the substrate 9 held on the stage 10.

載台驅動部20係用以使載台10於主掃描方向(Y軸方向)、副掃描方向(X軸方向)及旋轉方向(繞Z軸之旋轉方向)移動之機構。載台驅動部20具備有:旋轉機構21,其使載台10旋轉;支撐板22,其可旋轉地支撐載台10;副掃描機構23,其使支撐板22於副掃描方向移動;基座板24,其隔著副掃描機構23對支撐板22進行支撐;及主掃描機構25,其使基座板24於主掃描方向移動。The stage drive unit 20 is a mechanism for moving the stage 10 in the main scanning direction (Y-axis direction), the sub-scanning direction (X-axis direction), and the rotation direction (rotation direction around the Z-axis). The stage drive unit 20 includes: a rotation mechanism 21 that rotates the stage 10; a support plate 22 that rotatably supports the stage 10; a sub-scanning mechanism 23 that moves the support plate 22 in the sub-scanning direction; a base plate 24 that supports the support plate 22 via the sub-scanning mechanism 23; and a main scanning mechanism 25 that moves the base plate 24 in the main scanning direction.

旋轉機構21具備有:動子,其安裝於載台10之負Y軸方向側之端部;及線性馬達21a,其由鋪設於支撐板22上表面之定子構成。此外,於載台10之中央部下表面側與支撐板22之間設置有旋轉軸21b。因此,若驅動線性馬達21a,則動子沿定子於X軸方向移動,載台10以支撐板22上之旋轉軸21b為中心於既定角度之範圍內旋轉。The rotating mechanism 21 includes: a mover mounted on the end of the negative Y-axis direction of the stage 10; and a linear motor 21a, which is composed of a stator laid on the upper surface of the support plate 22. In addition, a rotating shaft 21b is provided between the lower surface of the central part of the stage 10 and the support plate 22. Therefore, if the linear motor 21a is driven, the mover moves along the stator in the X-axis direction, and the stage 10 rotates within a predetermined angle range with the rotating shaft 21b on the support plate 22 as the center.

副掃描機構23具備有線性馬達23a,該線性馬達23a係藉由安裝於支撐板22下表面之動子及鋪設於基座板24上表面之定子所構成。此外,於支撐板22與基座板24之間設置有於副掃描方向延伸之一對導軌部23b。因此,若驅動線性馬達23a,則支撐板22沿基座板24上之導軌部23b於副掃描方向移動。The sub-scanning mechanism 23 has a linear motor 23a, which is composed of a mover mounted on the lower surface of the support plate 22 and a stator laid on the upper surface of the base plate 24. In addition, a pair of guide rails 23b extending in the sub-scanning direction are provided between the support plate 22 and the base plate 24. Therefore, if the linear motor 23a is driven, the support plate 22 moves along the guide rails 23b on the base plate 24 in the sub-scanning direction.

主掃描機構25具備有線性馬達25a,該線性馬達25a係藉由安裝於基座板24下表面之動子及鋪設於曝光裝置1之基台60上之定子所構成。此外,於基座板24與基台60之間設置有於主掃描方向延伸之一對導軌部25b。因此,若線性馬達25a被驅動,則基座板24沿基台60上之導軌部25b於主掃描方向移動。The main scanning mechanism 25 has a linear motor 25a, which is composed of a mover mounted on the lower surface of the base plate 24 and a stator mounted on the base 60 of the exposure device 1. In addition, a pair of guide rails 25b extending in the main scanning direction are provided between the base plate 24 and the base 60. Therefore, when the linear motor 25a is driven, the base plate 24 moves in the main scanning direction along the guide rails 25b on the base 60.

頭部30係用以對保持於載台10上之基板9的上表面照射既定圖案之脈衝光的機構。頭部30具有:支架31,其以橫跨載台10及載台驅動部20之方式架設於基台60上;及5個曝光頭(曝光頭32a、曝光頭32b、曝光頭32c、曝光頭32d及曝光頭32e),其等沿副掃描方向等間隔地安裝於支架31。於各個曝光頭隔著照明光學系統33連接有一個雷射振盪器34。此外,於雷射振盪器34連接有雷射驅動部35。The head 30 is a mechanism for irradiating the upper surface of the substrate 9 held on the stage 10 with pulsed light of a predetermined pattern. The head 30 comprises: a bracket 31, which is mounted on the base 60 in a manner spanning the stage 10 and the stage drive unit 20; and five exposure heads (exposure head 32a, exposure head 32b, exposure head 32c, exposure head 32d, and exposure head 32e), which are installed on the bracket 31 at equal intervals along the sub-scanning direction. A laser oscillator 34 is connected to each exposure head via an illumination optical system 33. In addition, a laser drive unit 35 is connected to the laser oscillator 34.

因此,若使雷射驅動部35動作,則自雷射振盪器34振盪產生脈衝光,振盪產生之脈衝光經由照明光學系統33而被導入至各個曝光頭內。Therefore, when the laser driver 35 is operated, the laser oscillator 34 oscillates to generate pulse light, and the oscillated pulse light is introduced into each exposure head via the illumination optical system 33.

於各個曝光頭之內部設置有出射部36、光圈單元37及投影光學系統38,該出射部36係用以將自照明光學系統33導入之脈衝光朝向下方出射,該光圈單元37係用以局部遮擋脈衝光,該投影光學系統38係用以使脈衝光成像於基板9的上表面。於光圈單元37固設形成有既定之遮光圖案的玻璃板即光圈AP。自出射部36出射之脈衝光通過設置於光圈單元37之光圈AP時被局部遮光,成為既定圖案的光束朝投影光學系統38入射。並且,藉由將通過投影光學系統38之脈衝光照射於基板9的上表面,將既定之圖案描繪於基板9上的感光材料。An output portion 36, an aperture unit 37, and a projection optical system 38 are disposed inside each exposure head. The output portion 36 is used to output the pulse light introduced from the illumination optical system 33 downward, the aperture unit 37 is used to partially shield the pulse light, and the projection optical system 38 is used to image the pulse light on the upper surface of the substrate 9. A glass plate, namely, an aperture AP, formed with a predetermined light-shielding pattern is fixedly disposed in the aperture unit 37. The pulse light emitted from the output portion 36 is partially shielded when passing through the aperture AP disposed in the aperture unit 37, and becomes a light beam of a predetermined pattern and is incident on the projection optical system 38. In addition, by irradiating the pulse light passing through the projection optical system 38 on the upper surface of the substrate 9, a predetermined pattern is drawn on the photosensitive material on the substrate 9.

此外,如圖1所示意性例示,於各個曝光頭分別設置有光圈驅動部39,該光圈驅動部39係用以調整設置於光圈單元37之光圈AP的位置。光圈驅動部39藉由調整光圈AP之水平位置(包含水平面內之傾斜度),可選擇投影於基板9上之圖案、或調整圖案之投影位置。此外,光圈驅動部39還可藉由利用光圈AP之遮光部將脈衝光之整個照射區域遮擋,而禁止脈衝光之照射。光圈驅動部39例如可將複數個線性馬達組合而構成。In addition, as shown schematically in FIG. 1 , each exposure head is provided with an aperture driver 39, which is used to adjust the position of the aperture AP provided in the aperture unit 37. The aperture driver 39 can select the pattern projected on the substrate 9 or adjust the projection position of the pattern by adjusting the horizontal position (including the inclination in the horizontal plane) of the aperture AP. In addition, the aperture driver 39 can also prohibit the irradiation of the pulse light by using the light shielding part of the aperture AP to shield the entire irradiation area of the pulse light. The aperture driver 39 can be composed of, for example, a plurality of linear motors.

圖3為表示正常動作時基板9上之曝光區域與複數個曝光頭之關係之一例的圖。如圖3所示,複數個曝光頭係沿副掃描方向(X軸方向)等間隔地(例如,200mm間隔)排列配置。當進行曝光處理(描繪處理)時,一面使載台10於主掃描方向移動一面自各個曝光頭照射脈衝光。藉此,於基板9的上表面以既定之曝光寬度W(例如,50mm寬度)於主掃描方向描繪複數條圖案。FIG. 3 is a diagram showing an example of the relationship between the exposure area on the substrate 9 and the plurality of exposure heads during normal operation. As shown in FIG. 3 , the plurality of exposure heads are arranged at equal intervals (e.g., 200 mm intervals) along the sub-scanning direction (X-axis direction). When performing exposure processing (drawing processing), the stage 10 is moved in the main scanning direction while pulse light is irradiated from each exposure head. In this way, a plurality of patterns are drawn in the main scanning direction with a predetermined exposure width W (e.g., 50 mm width) on the upper surface of the substrate 9.

若完成一次朝主掃描方向之描繪,則曝光裝置1使載台10於副掃描方向移動曝光寬度W份額,然後一面使載台10再次於主掃描方向移動,一面自各個曝光頭照射脈衝光。如此,曝光裝置1藉由一面使基板9於副掃描方向逐次偏移曝光頭之曝光寬度W,一面重複既定次數(例如,4次)朝主掃描方向之描繪,而於基板9上形成濾色片用的圖案。When one drawing in the main scanning direction is completed, the exposure device 1 moves the stage 10 in the sub-scanning direction by the exposure width W, and then moves the stage 10 in the main scanning direction again while irradiating pulse light from each exposure head. In this way, the exposure device 1 forms a pattern for a color filter on the substrate 9 by repeatedly drawing in the main scanning direction for a predetermined number of times (for example, 4 times) while shifting the substrate 9 in the sub-scanning direction by the exposure width W of the exposure head.

如此,基板9上之曝光區域被分割為與各個曝光頭(曝光頭32a、曝光頭32b、曝光頭32c、曝光頭32d及曝光頭32e)相對應之5個長條形之曝光區域Aa、曝光區域Ab、曝光區域Ac、曝光區域Ad、曝光區域Ae,且排列於X軸方向。再者,曝光頭之數量與曝光區域之數量,不必完全一致,亦可為其中一者之數量較多之情形。Thus, the exposure area on the substrate 9 is divided into five long strips of exposure area Aa, exposure area Ab, exposure area Ac, exposure area Ad, and exposure area Ae corresponding to the exposure heads (exposure head 32a, exposure head 32b, exposure head 32c, exposure head 32d, and exposure head 32e), and arranged in the X-axis direction. Furthermore, the number of exposure heads and the number of exposure areas do not have to be completely consistent, and the number of one of them may be greater.

各個曝光頭係可對複數個曝光區域進行曝光。例如,曝光頭32a係可對曝光區域Aa及曝光區域Ab進行曝光;曝光頭32b係可對曝光區域Aa、曝光區域Ab及曝光區域Ac進行曝光;曝光頭32c係可對曝光區域Ab、曝光區域Ac及曝光區域Ad進行曝光;曝光頭32d係可對曝光區域Ac、曝光區域Ad及曝光區域Ae進行曝光;曝光頭32e係可對曝光區域Ad及曝光區域Ae進行曝光。再者,可供曝光之曝光區域,並不受限於如上述,即與各個曝光頭相對應之位置的曝光區域及與其鄰接的曝光區域之情形。於圖3所示之情形下,對在前述中與各個曝光頭相對應之位置的曝光區域(亦即,相對於曝光頭32a之曝光區域Aa、相對於曝光頭32b之曝光區域Ab、相對於曝光頭32c之曝光區域Ac、相對於曝光頭32d之曝光區域Ad、相對於曝光頭32e之曝光區域Ae)進行曝光。Each exposure head can expose a plurality of exposure areas. For example, exposure head 32a can expose exposure area Aa and exposure area Ab; exposure head 32b can expose exposure area Aa, exposure area Ab, and exposure area Ac; exposure head 32c can expose exposure area Ab, exposure area Ac, and exposure area Ad; exposure head 32d can expose exposure area Ac, exposure area Ad, and exposure area Ae; exposure head 32e can expose exposure area Ad and exposure area Ae. Furthermore, the exposure areas available for exposure are not limited to the above-mentioned exposure areas corresponding to the positions of each exposure head and the exposure areas adjacent thereto. In the situation shown in Figure 3, the exposure areas at the positions corresponding to the exposure heads in the above description (i.e., exposure area Aa relative to exposure head 32a, exposure area Ab relative to exposure head 32b, exposure area Ac relative to exposure head 32c, exposure area Ad relative to exposure head 32d, and exposure area Ae relative to exposure head 32e) are exposed.

圖4為示意性表示複數個曝光頭之構成的圖。如圖4所示,曝光頭32a、曝光頭32b、曝光頭32c、曝光頭32d及曝光頭32e係藉由光圈AP、光圈驅動部39及投影光學系統38等複數個要件零組件所構成。並且,藉由使複數個要件零組件皆正常動作,而於基板9上照射正常之脈衝光。Fig. 4 is a diagram schematically showing the configuration of a plurality of exposure heads. As shown in Fig. 4, exposure head 32a, exposure head 32b, exposure head 32c, exposure head 32d, and exposure head 32e are configured by a plurality of essential components such as aperture AP, aperture drive unit 39, and projection optical system 38. Furthermore, by making the plurality of essential components operate normally, normal pulse light is irradiated on substrate 9.

返回圖1及圖2,照射光攝影部40係用以對自各個曝光頭照射之脈衝光進行攝影的機構。照射光攝影部40具備有CCD相機41、導軌42、及由線性馬達等構成之相機驅動機構43。CCD相機41係將攝影方向朝向上方配置。此外,若使相機驅動機構43動作,則CCD相機41沿安裝於基座板24之Y軸方向側之側邊的導軌42於副掃描方向移動。Returning to FIG. 1 and FIG. 2, the irradiation light photographing section 40 is a mechanism for photographing the pulse light irradiated from each exposure head. The irradiation light photographing section 40 has a CCD camera 41, a guide rail 42, and a camera driving mechanism 43 composed of a linear motor, etc. The CCD camera 41 is arranged with the photographing direction facing upward. In addition, if the camera driving mechanism 43 is operated, the CCD camera 41 moves in the sub-scanning direction along the guide rail 42 installed on the side of the Y-axis direction of the base plate 24.

當使用CCD相機41時,首先,使主掃描機構25動作,以CCD相機41位於頭部30下方之方式對基座板24進行定位(圖1及圖2之狀態)。然後,使相機驅動機構43動作,一面使CCD相機41於副掃描方向移動一面以CCD相機41對自各個曝光頭照射之脈衝光進行攝影。藉由攝影所取得之圖像資料自CCD相機41被傳送至控制部50。所傳送之圖像資料例如被使用於是否有對應之曝光頭異常之判定等。When using the CCD camera 41, first, the main scanning mechanism 25 is operated to position the base plate 24 in a manner such that the CCD camera 41 is located below the head 30 (the state of FIG. 1 and FIG. 2). Then, the camera driving mechanism 43 is operated to move the CCD camera 41 in the sub-scanning direction while the CCD camera 41 photographs the pulse light emitted from each exposure head. The image data obtained by the photography is transmitted from the CCD camera 41 to the control unit 50. The transmitted image data is used, for example, to determine whether the corresponding exposure head is abnormal.

控制部50係用以控制曝光裝置1內各個驅動部之動作的處理部。圖5為示意表示曝光裝置1之各驅動部與控制部50之間之連接構成的圖。The control unit 50 is a processing unit for controlling the operation of each driving unit in the exposure device 1. FIG5 is a diagram schematically showing the connection structure between each driving unit of the exposure device 1 and the control unit 50.

如圖5所示,控制部50係與旋轉機構21、副掃描機構23、主掃描機構25、雷射驅動部35、照明光學系統33、投影光學系統38、光圈驅動部39、CCD相機41及相機驅動部43電性連接,用以控制其等構件之動作。再者,控制部50例如由具有CPU或記憶體之電腦構成,且藉由使電腦依照安裝於電腦之程式動作而進行前述控制。As shown in FIG5 , the control unit 50 is electrically connected to the rotating mechanism 21, the auxiliary scanning mechanism 23, the main scanning mechanism 25, the laser driver 35, the illumination optical system 33, the projection optical system 38, the aperture driver 39, the CCD camera 41, and the camera driver 43 to control the operation of these components. The control unit 50 is composed of a computer having a CPU or a memory, for example, and performs the aforementioned control by causing the computer to operate according to a program installed in the computer.

<有關曝光裝置之功能> 圖6為依各個功能表示,以控制部50為中心之曝光裝置1之構成的圖。如圖6所示,於控制部50,其為藉由CPU或記憶體之動作而實現的處理部,被設置有載台位置調整部53、照射控制部(照射控制部54a、照射控制部54b、照射控制部54c、照射控制部54d及照射控制部54e)、及控制切換判定部55。 <Functions of the exposure device> FIG. 6 is a diagram showing the structure of the exposure device 1 with the control unit 50 as the center, according to each function. As shown in FIG. 6, the control unit 50 is a processing unit realized by the operation of the CPU or the memory, and is provided with a stage position adjustment unit 53, an irradiation control unit (irradiation control unit 54a, irradiation control unit 54b, irradiation control unit 54c, irradiation control unit 54d and irradiation control unit 54e), and a control switching determination unit 55.

載台位置調整部53係用以調整載台10之位置的處理部。載台位置調整部53藉由對載台驅動部20傳送控制信號,使各個曝光頭位於負責之曝光區域上方,而使載台10移動。The stage position adjustment unit 53 is a processing unit for adjusting the position of the stage 10. The stage position adjustment unit 53 moves the stage 10 by transmitting a control signal to the stage driving unit 20 so that each exposure head is located above a responsible exposure area.

照射控制部(照射控制部54a、照射控制部54b、照射控制部54c、照射控制部54d及照射控制部54e)係用以控制脈衝光對成為曝光對象之複數個曝光區域之照射動作的處理部。The irradiation control unit (irradiation control unit 54a, irradiation control unit 54b, irradiation control unit 54c, irradiation control unit 54d, and irradiation control unit 54e) is a processing unit for controlling the irradiation operation of the pulse light on a plurality of exposure areas to be exposed.

此外,控制切換判定部55係用以將分別自照射控制部54a、照射控制部54b、照射控制部54c、照射控制部54d及照射控制部54e輸出之照射控制信號Sa、照射控制信號Sb、照射控制信號Sc、照射控制信號Sd及照射控制信號Se,分別分配至曝光頭32a、曝光頭32b、曝光頭32c、曝光頭32d及曝光頭32e的處理部。控制切換判定部55係將照射控制信號Sa、照射控制信號Sb、照射控制信號Sc、照射控制信號Sd及照射控制信號Se中至少2個信號(表示曝光圖案之信號)分別分配至曝光頭。藉此,各個曝光頭可藉由複數次曝光動作對複數個曝光區域進行曝光。In addition, the control switching determination unit 55 is used to distribute the irradiation control signal Sa, the irradiation control signal Sb, the irradiation control signal Sc, the irradiation control signal Sd, and the irradiation control signal Se outputted from the irradiation control unit 54a, the irradiation control unit 54b, the irradiation control unit 54c, the irradiation control unit 54d, and the irradiation control unit 54e, respectively, to the processing units of the exposure head 32a, the exposure head 32b, the exposure head 32c, the exposure head 32d, and the exposure head 32e, respectively. The control switching determination unit 55 distributes at least two signals (signals indicating exposure patterns) among the irradiation control signal Sa, the irradiation control signal Sb, the irradiation control signal Sc, the irradiation control signal Sd, and the irradiation control signal Se to the exposure heads, respectively. In this way, each exposure head can expose a plurality of exposure areas by a plurality of exposure operations.

<有關曝光裝置之動作> 接著,對曝光裝置1之動作進行說明。圖7為表示曝光裝置1之動作流程之一例的流程圖。此外,圖8、圖9及圖10為表示曝光裝置1之動作狀況的俯視圖。再者,以下說明之一系列動作係藉由控制部50對旋轉機構21、副掃描機構23、主掃描機構25、雷射驅動部35、照明光學系統33、投影光學系統38、光圈驅動部39、CCD相機41及相機驅動部43等進行動作控制而實現。 <About the action of the exposure device> Next, the action of the exposure device 1 is described. FIG. 7 is a flowchart showing an example of the action flow of the exposure device 1. In addition, FIG. 8, FIG. 9 and FIG. 10 are top views showing the action state of the exposure device 1. Furthermore, the series of actions described below are realized by the control unit 50 controlling the action of the rotating mechanism 21, the sub-scanning mechanism 23, the main scanning mechanism 25, the laser drive unit 35, the illumination optical system 33, the projection optical system 38, the aperture drive unit 39, the CCD camera 41 and the camera drive unit 43.

當將基板9設定於載台10上之狀態時,曝光裝置1使用曝光頭32a、曝光頭32b、曝光頭32c、曝光頭32d及曝光頭32e,對各個曝光頭負責之複數個曝光區域(曝光區域Aa、曝光區域Ab、曝光區域Ac、曝光區域Ad、曝光區域Ae)進行光之照射(步驟ST1)。即,一面控制載台驅動部20使基板9於主掃描方向及副掃描方向移動,一面使負責之曝光區域的曝光開始位置位於各個曝光頭下方。然後,自複數個曝光頭(於本實施形態中,全部的曝光頭)照射相對應之曝光圖案的脈衝光。When the substrate 9 is placed on the stage 10, the exposure device 1 uses the exposure head 32a, the exposure head 32b, the exposure head 32c, the exposure head 32d, and the exposure head 32e to irradiate the plurality of exposure areas (exposure area Aa, exposure area Ab, exposure area Ac, exposure area Ad, exposure area Ae) that each exposure head is responsible for (step ST1). That is, while controlling the stage drive unit 20 to move the substrate 9 in the main scanning direction and the sub-scanning direction, the exposure start position of the responsible exposure area is located below each exposure head. Then, pulse light corresponding to the exposure pattern is irradiated from the plurality of exposure heads (in this embodiment, all the exposure heads).

具體而言,如圖8所示,由於曝光區域未位於曝光頭32a相對應之曝光位置,因此曝光頭32a以虛擬(dummy)圖案等無助於曝光之圖案照射光;曝光頭32b以根據照射控制信號Sa之曝光圖案,對位於曝光位置的曝光區域Aa進行曝光;曝光頭32c根據照射控制信號Sb之曝光圖案,對位於曝光位置的曝光區域Ab進行曝光;曝光頭32d根據照射控制信號Sc之曝光圖案,對位於曝光位置的曝光區域Ac進行曝光;曝光頭32e根據照射控制信號Sd之曝光圖案,對位於曝光位置的曝光區域Ad進行曝光。此時,由於曝光區域Ae未位於任一曝光頭之曝光位置,因此曝光區域Ae未被曝光。再者,曝光位置係指自曝光頭照射之光到達且可適當地進行曝光之位置,例如,對應於各個曝光頭正下方之位置。再者,以無助於曝光之圖案照射光係意指在未於曝光區域上形成曝光圖案之態樣照射光。未於曝光區域上形成曝光圖案之態樣係例如,以光圈AP之遮光部將脈衝光之整個照射區域遮擋之狀態亦可。此外,當照明光學系統33為具備有空間光調製器(DMD或GLV等)之構成之情形下,未於曝光區域上形成曝光圖案之態樣,亦可為將空間光調製器控制為使空間光調製器不朝曝光區域反射脈衝光之狀態。Specifically, as shown in FIG8 , since the exposure area is not located at the exposure position corresponding to the exposure head 32a, the exposure head 32a irradiates light with a dummy pattern or other pattern that does not contribute to exposure; the exposure head 32b exposes the exposure area Aa located at the exposure position with an exposure pattern according to the exposure control signal Sa; the exposure head 32c exposes the exposure area Ab located at the exposure position according to the exposure pattern of the exposure control signal Sb; the exposure head 32d exposes the exposure area Ac located at the exposure position according to the exposure pattern of the exposure control signal Sc; the exposure head 32e exposes the exposure area Ad located at the exposure position according to the exposure pattern of the exposure control signal Sd. At this time, since the exposure area Ae is not located at the exposure position of any exposure head, the exposure area Ae is not exposed. Furthermore, the exposure position refers to a position where the light irradiated from the exposure head reaches and can be properly exposed, for example, it corresponds to the position directly below each exposure head. Furthermore, irradiating light with a pattern that does not contribute to exposure means irradiating light in a state where an exposure pattern is not formed on the exposure area. The state where an exposure pattern is not formed on the exposure area is, for example, a state where the entire irradiation area of the pulse light is blocked by the light shielding portion of the aperture AP. In addition, when the illumination optical system 33 is configured to have a spatial light modulator (DMD or GLV, etc.), the state where an exposure pattern is not formed on the exposure area can also be a state where the spatial light modulator is controlled so that the spatial light modulator does not reflect the pulse light toward the exposure area.

接著,一面沿副掃描方向(負X軸方向)移動一個曝光區域之份量,一面以對應之曝光圖案對位於各個曝光頭之曝光位置的曝光區域進行第二次光之照射(步驟ST2)。此處,將複數次預定曝光動作的各次可對不同曝光區域曝光之方式,使與不同曝光區域相對應之照射控制信號(表示曝光圖案之信號)輸入至各個曝光頭。因此,於步驟ST2中分別位於各個曝光頭之曝光位置的曝光區域與步驟ST1中之曝光區域不同,自各個曝光頭可適當地照射相對應之曝光圖案的光。Next, while moving the portion of an exposure area along the sub-scanning direction (negative X-axis direction), the exposure area at the exposure position of each exposure head is irradiated with light for the second time with the corresponding exposure pattern (step ST2). Here, in a manner that each of the plurality of predetermined exposure actions can expose a different exposure area, an irradiation control signal (a signal indicating an exposure pattern) corresponding to a different exposure area is input to each exposure head. Therefore, the exposure area at the exposure position of each exposure head in step ST2 is different from the exposure area in step ST1, and the light of the corresponding exposure pattern can be appropriately irradiated from each exposure head.

具體而言,如圖9所示,曝光頭32a根據照射控制信號Sa之曝光圖案,對位於曝光位置的曝光區域Aa進行曝光;曝光頭32b根據照射控制信號Sb之曝光圖案,對位於曝光位置的曝光區域Ab進行曝光;曝光頭32c根據照射控制信號Sc之曝光圖案,對位於曝光位置的曝光區域Ac進行曝光;曝光頭32d根據照射控制信號Sd之曝光圖案,對位於曝光位置的曝光區域Ad進行曝光;曝光頭32e根據照射控制信號Se之曝光圖案,對位於曝光位置的曝光區域Ae進行曝光。Specifically, as shown in Figure 9, the exposure head 32a exposes the exposure area Aa located at the exposure position according to the exposure pattern of the illumination control signal Sa; the exposure head 32b exposes the exposure area Ab located at the exposure position according to the exposure pattern of the illumination control signal Sb; the exposure head 32c exposes the exposure area Ac located at the exposure position according to the exposure pattern of the illumination control signal Sc; the exposure head 32d exposes the exposure area Ad located at the exposure position according to the exposure pattern of the illumination control signal Sd; and the exposure head 32e exposes the exposure area Ae located at the exposure position according to the exposure pattern of the illumination control signal Se.

並且,一面沿副掃描方向(負X軸方向)移動一個曝光區域之份量,一面以對應之曝光圖案對位於各個曝光頭之曝光位置的曝光區域進行第三次光之照射(步驟ST3)。如上述,將複數次預定曝光動作的各次可對不同之曝光區域曝光之方式,使與不同之曝光區域相對應之照射控制信號(表示曝光圖案之信號)輸入至各個曝光頭,因此自各個曝光頭可適當地照射相對應之曝光圖案的光。Furthermore, while moving the portion of one exposure area in the sub-scanning direction (negative X-axis direction), the exposure area at the exposure position of each exposure head is irradiated with light for the third time with the corresponding exposure pattern (step ST3). As described above, each of the plurality of predetermined exposure operations can expose a different exposure area, and the irradiation control signal (signal indicating the exposure pattern) corresponding to the different exposure area is input to each exposure head, so that each exposure head can appropriately irradiate the light of the corresponding exposure pattern.

具體而言,如圖10所示,曝光頭32a根據照射控制信號Sb之曝光圖案,對位於曝光位置的曝光區域Ab進行曝光;曝光頭32b根據照射控制信號Sc之曝光圖案,對位於曝光位置的曝光區域Ac進行曝光;曝光頭32c根據照射控制信號Sd之曝光圖案,對位於曝光位置的曝光區域Ad進行曝光;曝光頭32d根據照射控制信號Se之曝光圖案,對位於曝光位置的曝光區域Ae進行曝光;由於曝光區域未位於曝光頭32e相對應之曝光位置,因此曝光頭32e以虛擬圖案等無助於曝光之圖案照射光。此時,由於曝光區域Aa未位於任一曝光頭之曝光位置,因此曝光區域Aa未被曝光。Specifically, as shown in FIG. 10 , the exposure head 32a exposes the exposure area Ab located at the exposure position according to the exposure pattern of the exposure control signal Sb; the exposure head 32b exposes the exposure area Ac located at the exposure position according to the exposure pattern of the exposure control signal Sc; the exposure head 32c exposes the exposure area Ad located at the exposure position according to the exposure pattern of the exposure control signal Sd; the exposure head 32d exposes the exposure area Ae located at the exposure position according to the exposure pattern of the exposure control signal Se; since the exposure area is not located at the exposure position corresponding to the exposure head 32e, the exposure head 32e irradiates light with a pattern that does not contribute to exposure, such as a virtual pattern. At this time, since the exposure area Aa is not located at the exposure position of any exposure head, the exposure area Aa is not exposed.

如此,可對曝光區域Aa及曝光區域Ae進行二次之曝光,而對曝光區域Ab、曝光區域Ac及曝光區域Ad進行三次之曝光。In this way, the exposure area Aa and the exposure area Ae can be exposed twice, and the exposure area Ab, the exposure area Ac, and the exposure area Ad can be exposed three times.

其中,由於以可曝光於複數個曝光區域之方式對各個曝光頭輸入表示曝光圖案之照射控制信號,因此只要是照射與位於曝光位置的曝光區域相對應之曝光圖案的光,亦可並非如上述之對應關係。即,不管是否對一個曝光頭輸入與相互鄰接之複數個曝光區域相對應之照射控制信號(表示曝光圖案之信號),其亦可為對一個曝光頭輸入與未鄰接之複數個曝光區域相對應之照射控制信號。惟,當對一個曝光頭輸入與相互鄰接之複數個曝光區域相對應之照射控制信號時,可將用以對複數個曝光區域進行曝光之曝光頭與相對應之曝光區域之間的相對移動最小化。因此,由於其可減少曝光頭之動作量,因此可減少用以曝光所需之時間,此外,可維持曝光之高位置精度。Since the illumination control signal representing the exposure pattern is input to each exposure head in such a manner that exposure can be applied to a plurality of exposure areas, the above-described corresponding relationship may not be required as long as the light corresponding to the exposure pattern corresponding to the exposure area at the exposure position is irradiated. That is, regardless of whether an illumination control signal (signal representing the exposure pattern) corresponding to a plurality of exposure areas adjacent to each other is input to one exposure head, an illumination control signal corresponding to a plurality of exposure areas not adjacent to each other may be input to one exposure head. However, when an illumination control signal corresponding to a plurality of exposure areas adjacent to each other is input to one exposure head, the relative movement between the exposure head used to expose the plurality of exposure areas and the corresponding exposure areas can be minimized. Therefore, since the movement amount of the exposure head can be reduced, the time required for exposure can be reduced, and in addition, high position accuracy of exposure can be maintained.

此外,曝光頭與曝光區域之間的位置關係可藉由頭部30與基板9相對移動而變更。亦即,既可為頭部30移動之情形,亦可為雙方移動之情形。In addition, the positional relationship between the exposure head and the exposure area can be changed by relatively moving the head 30 and the substrate 9. That is, it can be a situation where the head 30 moves or a situation where both sides move.

此外,來自各個曝光頭的光之照射次數不限於3次,只要為複數次即可。In addition, the number of times of irradiation with light from each exposure head is not limited to three times, and may be a plurality of times.

藉由如上述之複數次光之照射,可實現包含二重曝光及三重曝光之曝光。此外,若將至少一部分曝光頭的光之照射遮擋,則可實現與前述不同之各種曝光。也就是說,即使於複數個曝光頭中任一個因異常等而不能曝光之狀態,只要自圖8至圖16所示之通常動作將光圈AP之遮光部之動作簡單地加以變更,亦可藉由其他曝光頭之複數次照射而補充曝光。因此,其與為了補全曝光而另外進行曝光動作之情形相比,可一面維持高位置精度,一面提高曝光動作之自由度。By irradiating light multiple times as described above, exposure including double exposure and triple exposure can be realized. In addition, if the irradiation of light from at least a part of the exposure head is blocked, various exposures different from the above can be realized. In other words, even if any one of the multiple exposure heads cannot expose due to abnormality, the exposure can be supplemented by multiple irradiations from other exposure heads by simply changing the action of the light shielding part of the aperture AP from the normal action shown in Figures 8 to 16. Therefore, compared with the situation where an additional exposure action is performed to supplement the exposure, it is possible to maintain high position accuracy while increasing the degree of freedom of the exposure action.

其次,對曝光裝置1之動作的變形例進行說明。圖11、圖12及圖13為表示曝光裝置1之動作狀況的俯視圖。Next, a description will be given of a modified example of the operation of the exposure device 1. Fig. 11, Fig. 12, and Fig. 13 are plan views showing the operation of the exposure device 1.

當將基板9設定於載台10上之狀態下,曝光裝置1使用曝光頭32a、曝光頭32b、曝光頭32c、曝光頭32d及曝光頭32e對各自負責之曝光區域(曝光區域Aa、曝光區域Ab、曝光區域Ac、曝光區域Ad、曝光區域Ae)進行光之照射。When the substrate 9 is set on the stage 10, the exposure device 1 uses the exposure head 32a, the exposure head 32b, the exposure head 32c, the exposure head 32d and the exposure head 32e to irradiate the exposure areas (exposure area Aa, exposure area Ab, exposure area Ac, exposure area Ad, exposure area Ae) respectively responsible for light.

具體而言,如圖11所示,曝光頭32a以虛擬圖案等無助於曝光之圖案照射光;曝光頭32b根據照射控制信號Sa朝向曝光區域Aa照射光;曝光頭32c根據照射控制信號Sb朝向曝光區域Ab照射光;曝光頭32d根據照射控制信號Sc朝向曝光區域Ac照射光;曝光頭32e根據照射控制信號Sd朝向曝光區域Ad照射光。此時,由於曝光區域Ae未位於任一曝光頭之曝光位置,因此光未朝向曝光區域Ae照射。Specifically, as shown in FIG. 11 , the exposure head 32a irradiates light with a pattern that does not contribute to exposure, such as a virtual pattern; the exposure head 32b irradiates light toward the exposure area Aa according to the irradiation control signal Sa; the exposure head 32c irradiates light toward the exposure area Ab according to the irradiation control signal Sb; the exposure head 32d irradiates light toward the exposure area Ac according to the irradiation control signal Sc; and the exposure head 32e irradiates light toward the exposure area Ad according to the irradiation control signal Sd. At this time, since the exposure area Ae is not located at the exposure position of any exposure head, light is not irradiated toward the exposure area Ae.

其中,於各個曝光頭中,藉由光圈驅動部39之驅動,以光圈AP之遮光部將脈衝光之整個照射區域遮擋。也就是說,自各個曝光頭遮擋光之照射。其結果,於圖11所示之動作中,並未對各個曝光區域進行曝光。再者,如圖11所示,亦可藉由遮光部而不進行曝光,亦可不以遮光部遮光,而藉由以虛擬圖案等無助於曝光之圖案照射光而不進行曝光。In each exposure head, the aperture driving unit 39 is driven to block the entire irradiation area of the pulse light with the light shielding unit of the aperture AP. In other words, the irradiation of light is blocked from each exposure head. As a result, in the operation shown in FIG. 11 , each exposure area is not exposed. Furthermore, as shown in FIG. 11 , exposure may not be performed by using the light shielding unit, or exposure may not be performed by irradiating light with a pattern that does not contribute to exposure, such as a virtual pattern, without blocking light with the light shielding unit.

其次,一面於副掃描方向(負X軸方向)移動一個曝光區域之份量,一面以對應之曝光圖案對位於各個曝光頭之曝光位置的曝光區域進行第二次光之照射。Next, while moving a portion of the exposure area in the sub-scanning direction (negative X-axis direction), the exposure area at the exposure position of each exposure head is irradiated with light for the second time with a corresponding exposure pattern.

具體而言,如圖12所示,曝光頭32a根據照射控制信號Sa對曝光區域Aa進行曝光;曝光頭32b根據照射控制信號Sb對曝光區域Ab進行曝光;曝光頭32c根據照射控制信號Sc對曝光區域Ac進行曝光;曝光頭32d根據照射控制信號Sd對曝光區域Ad進行曝光;曝光頭32e根據照射控制信號Se對曝光區域Ae進行曝光。Specifically, as shown in Figure 12, the exposure head 32a exposes the exposure area Aa according to the illumination control signal Sa; the exposure head 32b exposes the exposure area Ab according to the illumination control signal Sb; the exposure head 32c exposes the exposure area Ac according to the illumination control signal Sc; the exposure head 32d exposes the exposure area Ad according to the illumination control signal Sd; and the exposure head 32e exposes the exposure area Ae according to the illumination control signal Se.

然後,一面於副掃描方向(負X軸方向)移動一個曝光區域之份量,一面以對應之曝光圖案對位於各個曝光頭之曝光位置的曝光區域進行第三次光之照射。Then, while moving a portion of the exposure area in the sub-scanning direction (negative X-axis direction), the exposure area located at the exposure position of each exposure head is irradiated with light for the third time with the corresponding exposure pattern.

具體而言,如圖13所示,曝光頭32a根據照射控制信號Sb朝向曝光區域Ab照射光;曝光頭32b根據照射控制信號Sc朝向曝光區域Ac照射光;曝光頭32c根據照射控制信號Sd朝向曝光區域Ad照射光;曝光頭32d根據照射控制信號Se朝向曝光區域Ae照射光;曝光頭32e以虛擬圖案等無助於曝光之圖案照射光。此時,由於曝光區域Aa未位於任一曝光頭之曝光位置,因此光未朝向曝光區域Aa照射。Specifically, as shown in FIG. 13 , the exposure head 32a irradiates light toward the exposure area Ab according to the irradiation control signal Sb; the exposure head 32b irradiates light toward the exposure area Ac according to the irradiation control signal Sc; the exposure head 32c irradiates light toward the exposure area Ad according to the irradiation control signal Sd; the exposure head 32d irradiates light toward the exposure area Ae according to the irradiation control signal Se; and the exposure head 32e irradiates light with a pattern that does not contribute to exposure, such as a virtual pattern. At this time, since the exposure area Aa is not located at the exposure position of any exposure head, light is not irradiated toward the exposure area Aa.

其中,於各個曝光頭中,藉由光圈驅動部39之驅動,以光圈AP之遮光部將脈衝光之整個照射區域遮擋。也就是說,自各個曝光頭遮擋光之照射。其結果,於圖13所示之動作中,未對各個曝光區域進行曝光。再者,如圖13所示,亦可藉由遮光部而不進行曝光,亦可不以遮光部遮光,而藉由以虛擬圖案等無助於曝光之圖案照射光而不進行曝光。In each exposure head, the aperture driving unit 39 is driven to block the entire irradiation area of the pulse light with the light shielding unit of the aperture AP. In other words, the irradiation of light is blocked from each exposure head. As a result, in the operation shown in FIG. 13 , each exposure area is not exposed. Furthermore, as shown in FIG. 13 , exposure may be avoided by using the light shielding unit, or exposure may be avoided by irradiating light with a pattern that does not contribute to exposure, such as a virtual pattern, without blocking light with the light shielding unit.

根據此一構成,其可對全部曝光區域進行一次之曝光。According to this structure, the entire exposure area can be exposed once.

接著,對曝光裝置1之動作的另一變形例進行說明。圖14、圖15及圖16為表示曝光裝置1之動作狀況的俯視圖。Next, another modification of the operation of the exposure device 1 will be described. FIG14, FIG15 and FIG16 are plan views showing the operation of the exposure device 1 ...

於將基板9設定於載台10上之狀態下,曝光裝置1使用曝光頭32a、曝光頭32b、曝光頭32c、曝光頭32d及曝光頭32e對各自負責之曝光區域(曝光區域Aa、曝光區域Ab、曝光區域Ac、曝光區域Ad、曝光區域Ae)進行光之照射。When the substrate 9 is set on the stage 10, the exposure device 1 uses the exposure head 32a, the exposure head 32b, the exposure head 32c, the exposure head 32d and the exposure head 32e to irradiate the exposure areas (exposure area Aa, exposure area Ab, exposure area Ac, exposure area Ad, exposure area Ae) respectively responsible for light.

具體而言,如圖14所示,曝光頭32a以虛擬圖案等無助於曝光之圖案照射光;曝光頭32b根據照射控制信號Sa朝向曝光區域Aa照射光;曝光頭32c根據照射控制信號Sb朝向曝光區域Ab照射光;曝光頭32d根據照射控制信號Sc朝向曝光區域Ac照射光;曝光頭32e根據照射控制信號Sd朝向曝光區域Ad照射光。此時,由於曝光區域Ae未位於任一曝光頭之曝光位置,因此光未朝向曝光區域Ae照射。Specifically, as shown in FIG. 14 , the exposure head 32a irradiates light with a pattern that does not contribute to exposure, such as a virtual pattern; the exposure head 32b irradiates light toward the exposure area Aa according to the irradiation control signal Sa; the exposure head 32c irradiates light toward the exposure area Ab according to the irradiation control signal Sb; the exposure head 32d irradiates light toward the exposure area Ac according to the irradiation control signal Sc; and the exposure head 32e irradiates light toward the exposure area Ad according to the irradiation control signal Sd. At this time, since the exposure area Ae is not located at the exposure position of any exposure head, light is not irradiated toward the exposure area Ae.

其中,於曝光頭32a及曝光頭32c中,藉由光圈驅動部39之驅動,以光圈AP之遮光部將脈衝光之整個照射區域遮擋。也就是說,自曝光頭32a及曝光頭32c遮擋光之照射。其結果,於圖14所示之動作中,對曝光區域Ab未進行曝光。再者,藉由遮擋來自曝光頭32a之光之照射,可抑制朝向基板9外之多餘之光。In the exposure head 32a and the exposure head 32c, the aperture driving unit 39 is driven to block the entire irradiation area of the pulse light with the light shielding unit of the aperture AP. In other words, the irradiation of light from the exposure head 32a and the exposure head 32c is blocked. As a result, in the operation shown in FIG. 14, the exposure area Ab is not exposed. Furthermore, by blocking the irradiation of light from the exposure head 32a, it is possible to suppress excess light from going outside the substrate 9.

其次,一面於副掃描方向(負X軸方向)移動一個曝光區域之份量,一面以對應之曝光圖案對位於各個曝光頭之曝光位置的曝光區域進行第二次光之照射。Next, while moving a portion of the exposure area in the sub-scanning direction (negative X-axis direction), the exposure area at the exposure position of each exposure head is irradiated with light for the second time with a corresponding exposure pattern.

具體而言,如圖15所示,曝光頭32a根據照射控制信號Sa朝向曝光區域Aa照射光;曝光頭32b根據照射控制信號Sb朝向曝光區域Ab照射光;曝光頭32c根據照射控制信號Sc朝向曝光區域Ac照射光;曝光頭32d根據照射控制信號Sd朝向曝光區域Ad照射光;曝光頭32e根據照射控制信號Se朝向曝光區域Ae照射光。Specifically, as shown in Figure 15, the exposure head 32a irradiates light toward the exposure area Aa according to the illumination control signal Sa; the exposure head 32b irradiates light toward the exposure area Ab according to the illumination control signal Sb; the exposure head 32c irradiates light toward the exposure area Ac according to the illumination control signal Sc; the exposure head 32d irradiates light toward the exposure area Ad according to the illumination control signal Sd; and the exposure head 32e irradiates light toward the exposure area Ae according to the illumination control signal Se.

其中,於曝光頭32c中,藉由光圈驅動部39之驅動,以光圈AP之遮光部將脈衝光之整個照射區域遮擋。也就是說,自曝光頭32c遮擋光之照射。其結果,於圖15所示之動作中,未對曝光區域Ac進行曝光。In the exposure head 32c, the aperture driving unit 39 is driven to block the entire irradiation area of the pulse light with the light shielding unit of the aperture AP. In other words, the irradiation of the self-exposure head 32c is blocked. As a result, in the operation shown in FIG. 15, the exposure area Ac is not exposed.

然後,一面於副掃描方向(負X軸方向)移動一個曝光區域之份量,一面以對應之曝光圖案對位於各個曝光頭之曝光位置的曝光區域進行第三次光之照射。Then, while moving a portion of the exposure area in the sub-scanning direction (negative X-axis direction), the exposure area located at the exposure position of each exposure head is irradiated with light for the third time with the corresponding exposure pattern.

具體而言,如圖16所示,曝光頭32a根據照射控制信號Sb朝向曝光區域Ab照射光;曝光頭32b根據照射控制信號Sc朝向曝光區域Ac照射光;曝光頭32c根據照射控制信號Sd朝向曝光區域Ad照射光;曝光頭32d根據照射控制信號Se朝向曝光區域Ae照射光;曝光頭32e以虛擬圖案等無助於曝光之圖案照射光。此時,由於曝光區域Aa未位於任一曝光頭之曝光位置,因此光未朝向曝光區域Aa照射。Specifically, as shown in FIG. 16 , the exposure head 32a irradiates light toward the exposure area Ab according to the irradiation control signal Sb; the exposure head 32b irradiates light toward the exposure area Ac according to the irradiation control signal Sc; the exposure head 32c irradiates light toward the exposure area Ad according to the irradiation control signal Sd; the exposure head 32d irradiates light toward the exposure area Ae according to the irradiation control signal Se; and the exposure head 32e irradiates light with a pattern that does not contribute to exposure, such as a virtual pattern. At this time, since the exposure area Aa is not located at the exposure position of any exposure head, light is not irradiated toward the exposure area Aa.

其中,於曝光頭32c及曝光頭32e中,藉由光圈驅動部39之驅動,以光圈AP之遮光部將脈衝光之整個照射區域遮擋。也就是說,自曝光頭32c及曝光頭32e遮擋光之照射。其結果,於圖16所示之動作中,對曝光區域Ad未進行曝光。再者,藉由遮擋來自曝光頭32e之光之照射,可抑制朝向基板9外之多餘之光。In the exposure head 32c and the exposure head 32e, the entire irradiation area of the pulse light is shielded by the light shielding part of the aperture AP by driving the aperture driving part 39. In other words, the irradiation of light from the exposure head 32c and the exposure head 32e is shielded. As a result, in the operation shown in FIG. 16, the exposure area Ad is not exposed. Furthermore, by shielding the irradiation of light from the exposure head 32e, it is possible to suppress excess light from going outside the substrate 9.

根據此一構成,可對全部曝光區域進行二次之曝光。此外,由於使所排列之不同曝光頭之曝光位置依序位於一個曝光區域進行二重曝光,因此其不需要使曝光頭返回至使用相同之曝光頭進行二重曝光時所需要之曝光開始位置、即朝正X軸方向之驅動動作。藉此,可減少曝光頭之動作量,減少用以曝光所需之時間,並且可維持曝光之高位置精度。According to this structure, the entire exposure area can be exposed twice. In addition, since the exposure positions of the arranged different exposure heads are sequentially located in one exposure area for double exposure, it is not necessary to return the exposure head to the exposure start position required when the same exposure head is used for double exposure, that is, to drive the action in the positive X-axis direction. In this way, the movement amount of the exposure head can be reduced, the time required for exposure can be reduced, and the high position accuracy of exposure can be maintained.

接著,對曝光裝置1之動作的另一變形例進行說明。於該變形例中,假定為曝光頭32a因異常而不能照射光之情況。對於曝光頭32a異常之判定,例如,控制部50自圖像資料取得藉由CCD相機41(感測器)攝影之資訊、即自各個曝光頭照射之脈衝光之位置、線寬或光量等資訊。並且,藉由比較其等資訊與理想之照射圖案之資訊,則可判定是否自曝光頭照射適當之脈衝光。再者,圖17、圖18及圖19為表示曝光裝置1之動作狀況的俯視圖。Next, another variation of the operation of the exposure device 1 is described. In this variation, it is assumed that the exposure head 32a cannot irradiate light due to an abnormality. For determining the abnormality of the exposure head 32a, for example, the control unit 50 obtains information such as the position, line width or light amount of the pulse light irradiated from each exposure head from the image data photographed by the CCD camera 41 (sensor). And, by comparing such information with the information of the ideal irradiation pattern, it can be determined whether the appropriate pulse light is irradiated from the exposure head. Furthermore, Figures 17, 18 and 19 are top views showing the operation status of the exposure device 1.

於將基板9設定於載台10上之狀態下,曝光裝置1使用曝光頭32b、曝光頭32c、曝光頭32d及曝光頭32e對各自負責之曝光區域(曝光區域Aa、曝光區域Ab、曝光區域Ac、曝光區域Ad、曝光區域Ae)進行光之照射。When the substrate 9 is set on the stage 10, the exposure device 1 uses the exposure head 32b, the exposure head 32c, the exposure head 32d and the exposure head 32e to irradiate the exposure areas (exposure area Aa, exposure area Ab, exposure area Ac, exposure area Ad, exposure area Ae) respectively responsible for light.

具體而言,如圖17所示,曝光頭32b根據照射控制信號Sa朝向曝光區域Aa照射光;曝光頭32c根據照射控制信號Sb朝向曝光區域Ab照射光;曝光頭32d根據照射控制信號Sc朝向曝光區域Ac照射光;曝光頭32e根據照射控制信號Sd朝向曝光區域Ad照射光。此時,由於曝光區域Ae未位於任一曝光頭之曝光位置,因此光未朝向曝光區域Ae照射。Specifically, as shown in FIG17 , the exposure head 32b irradiates light toward the exposure area Aa according to the irradiation control signal Sa; the exposure head 32c irradiates light toward the exposure area Ab according to the irradiation control signal Sb; the exposure head 32d irradiates light toward the exposure area Ac according to the irradiation control signal Sc; and the exposure head 32e irradiates light toward the exposure area Ad according to the irradiation control signal Sd. At this time, since the exposure area Ae is not located at the exposure position of any exposure head, light is not irradiated toward the exposure area Ae.

再者,假定有因異常而不能自曝光頭32a照射光時,曝光頭32a,因為光圈驅動部39之驅動,而脈衝光之整個照射區域被以光圈AP之遮光部所遮擋。亦即,來自曝光頭32a光之照射被遮擋。Furthermore, if the exposure head 32a cannot emit light due to an abnormality, the exposure head 32a is driven by the aperture driver 39, and the entire irradiation area of the pulse light is blocked by the light shielding portion of the aperture AP. That is, the irradiation of light from the exposure head 32a is blocked.

其次,一面於副掃描方向(負X軸方向)移動一個曝光區域之份量,一面以對應之曝光圖案對位於各個曝光頭之曝光位置的曝光區域進行第二次光之照射。Next, while moving a portion of the exposure area in the sub-scanning direction (negative X-axis direction), the exposure area at the exposure position of each exposure head is irradiated with light for the second time with a corresponding exposure pattern.

具體而言,如圖18所示,曝光頭32b根據照射控制信號Sb朝向曝光區域Ab照射光;曝光頭32c根據照射控制信號Sc朝向曝光區域Ac照射光;曝光頭32d根據照射控制信號Sd朝向曝光區域Ad照射光;曝光頭32e根據照射控制信號Se朝向曝光區域Ae照射光。Specifically, as shown in Figure 18, the exposure head 32b irradiates light toward the exposure area Ab according to the illumination control signal Sb; the exposure head 32c irradiates light toward the exposure area Ac according to the illumination control signal Sc; the exposure head 32d irradiates light toward the exposure area Ad according to the illumination control signal Sd; and the exposure head 32e irradiates light toward the exposure area Ae according to the illumination control signal Se.

在此,於曝光頭32a、曝光頭32b、曝光頭32c及曝光頭32d中,因為光圈驅動部39之驅動,光圈AP之遮光部可將脈衝光之整個照射區域遮擋。也就是說,自曝光頭32a、曝光頭32b、曝光頭32c及曝光頭32d遮擋光之照射。其結果,於圖18所示之動作中,對曝光區域Aa、曝光區域Ab、曝光區域Ac及曝光區域Ad未進行曝光。Here, in the exposure head 32a, the exposure head 32b, the exposure head 32c, and the exposure head 32d, the light shielding portion of the aperture AP can shield the entire irradiation area of the pulse light due to the driving of the aperture driving portion 39. In other words, the irradiation of the self-exposure head 32a, the exposure head 32b, the exposure head 32c, and the exposure head 32d is shielded. As a result, in the operation shown in FIG. 18, the exposure area Aa, the exposure area Ab, the exposure area Ac, and the exposure area Ad are not exposed.

然後,一面於副掃描方向(負X軸方向)移動一個曝光區域之份量,一面以對應之曝光圖案對位於各個曝光頭之曝光位置的曝光區域進行第三次光之照射。Then, while moving a portion of the exposure area in the sub-scanning direction (negative X-axis direction), the exposure area located at the exposure position of each exposure head is irradiated with light for the third time with the corresponding exposure pattern.

具體而言,如圖19所示,曝光頭32b根據照射控制信號Sc朝向曝光區域Ac照射光;曝光頭32c根據照射控制信號Sd朝向曝光區域Ad照射光;曝光頭32d根據照射控制信號Se朝向曝光區域Ae照射光,曝光頭32e以虛擬圖案等無助於曝光之圖案照射光。此時,由於曝光區域Aa未位於任一曝光頭之曝光位置,因此光未朝向曝光區域Aa照射。Specifically, as shown in FIG. 19 , the exposure head 32b irradiates light toward the exposure area Ac according to the irradiation control signal Sc; the exposure head 32c irradiates light toward the exposure area Ad according to the irradiation control signal Sd; the exposure head 32d irradiates light toward the exposure area Ae according to the irradiation control signal Se, and the exposure head 32e irradiates light with a pattern that does not contribute to exposure, such as a virtual pattern. At this time, since the exposure area Aa is not located at the exposure position of any exposure head, light is not irradiated toward the exposure area Aa.

其中,於各個曝光頭中,藉由光圈驅動部39之驅動,光圈AP之遮光部可將脈衝光之整個照射區域遮擋。也就是說,自各個曝光頭遮擋光之照射。其結果,於圖19所示之動作中,對全部曝光區域未進行曝光。In each exposure head, the light shielding portion of the aperture AP can shield the entire irradiation area of the pulse light by driving the aperture driving portion 39. In other words, the irradiation of light from each exposure head is shielded. As a result, in the operation shown in FIG. 19 , the entire exposure area is not exposed.

根據此一構成,即使於曝光頭32a因異常等而不能進行曝光之情況下,只要自圖8至圖16所示之通常動作將光圈AP之遮光部之動作簡單地加以變更,亦可對全部曝光區域進行一次之曝光。According to this structure, even if the exposure head 32a cannot perform exposure due to abnormality, the entire exposure area can be exposed once by simply changing the movement of the light shielding part of the aperture AP from the normal operation shown in Figures 8 to 16.

其次,對曝光裝置1之動作的另一變形例進行說明。於該變形例中,假定曝光頭32a、曝光頭32c及曝光頭32e因異常等而不能照射光之情形。圖20、圖21及圖22為表示曝光裝置1之動作狀況的俯視圖。Next, another modification of the operation of the exposure device 1 will be described. In this modification, it is assumed that the exposure head 32a, the exposure head 32c, and the exposure head 32e cannot irradiate light due to an abnormality or the like. FIG. 20, FIG. 21, and FIG. 22 are top views showing the operation of the exposure device 1.

當將基板9設定於載台10上之狀態時,曝光裝置1使用曝光頭32b及曝光頭32d對各自負責之曝光區域(曝光區域Aa、曝光區域Ab、曝光區域Ac、曝光區域Ad、曝光區域Ae)進行光之照射。When the substrate 9 is placed on the stage 10, the exposure device 1 uses the exposure head 32b and the exposure head 32d to irradiate the exposure areas (exposure area Aa, exposure area Ab, exposure area Ac, exposure area Ad, exposure area Ae) for which they are responsible with light.

具體而言,如圖20所示,曝光頭32b根據照射控制信號Sa朝向曝光區域Aa照射光;曝光頭32d根據照射控制信號Sc朝向曝光區域Ac照射光。此時,由於曝光區域Ae未位於任一曝光頭之曝光位置,因此光未朝向曝光區域Ae照射。Specifically, as shown in Fig. 20, the exposure head 32b irradiates light toward the exposure area Aa according to the irradiation control signal Sa, and the exposure head 32d irradiates light toward the exposure area Ac according to the irradiation control signal Sc. At this time, since the exposure area Ae is not located at the exposure position of any exposure head, light is not irradiated toward the exposure area Ae.

再者,假定因異常等而不能自曝光頭32a、曝光頭32c及曝光頭32e照射光,此時,於曝光頭32a、曝光頭32c及曝光頭32e藉由光圈驅動部39之驅動,脈衝光之整個照射區域被光圈AP之遮光部所遮擋。也就是說,自曝光頭32a、曝光頭32c及曝光頭32e光之照射被遮擋。其結果,於圖20所示之動作中,對曝光區域Ab及曝光區域Ad未進行曝光。Furthermore, assuming that the exposure heads 32a, 32c, and 32e cannot emit light due to an abnormality, in this case, the entire irradiation area of the pulse light is shielded by the light shielding portion of the aperture AP in the exposure heads 32a, 32c, and 32e by driving the aperture driving unit 39. In other words, the irradiation of light from the exposure heads 32a, 32c, and 32e is shielded. As a result, in the operation shown in FIG. 20, the exposure area Ab and the exposure area Ad are not exposed.

其次,一面於副掃描方向(負X軸方向)移動一個曝光區域之份量,一面以對應之曝光圖案對位於各個曝光頭之曝光位置的曝光區域進行第二次光之照射。Next, while moving a portion of the exposure area in the sub-scanning direction (negative X-axis direction), the exposure area at the exposure position of each exposure head is irradiated with light for the second time with a corresponding exposure pattern.

具體而言,如圖21所示,曝光頭32b根據照射控制信號Sb朝向曝光區域Ab照射光;曝光頭32d根據照射控制信號Sd朝向曝光區域Ad照射光。Specifically, as shown in FIG. 21, the exposure head 32b irradiates light toward the exposure area Ab according to the irradiation control signal Sb; and the exposure head 32d irradiates light toward the exposure area Ad according to the irradiation control signal Sd.

其中,曝光頭32a、曝光頭32c及曝光頭32e藉由光圈驅動部39之驅動,脈衝光之整個照射區域被以光圈AP之遮光部遮擋。也就是說,自曝光頭32a、曝光頭32c及曝光頭32e遮擋光之照射。其結果,於圖21所示之動作中,對曝光區域Aa、曝光區域Ac及曝光區域Ae未進行曝光。The exposure heads 32a, 32c and 32e are driven by the aperture driving unit 39, and the entire irradiation area of the pulse light is shielded by the light shielding portion of the aperture AP. In other words, the irradiation of the self-exposure heads 32a, 32c and 32e is shielded. As a result, in the operation shown in FIG. 21, the exposure area Aa, the exposure area Ac and the exposure area Ae are not exposed.

然後,一面於副掃描方向(負X軸方向)移動一個曝光區域之份量,一面以對應之曝光圖案對位於各個曝光頭之曝光位置的曝光區域進行第三次光之照射。Then, while moving a portion of the exposure area in the sub-scanning direction (negative X-axis direction), the exposure area at the exposure position of each exposure head is irradiated with light for the third time with the corresponding exposure pattern.

具體而言,如圖22所示,曝光頭32b根據照射控制信號Sc朝向曝光區域Ac照射光;曝光頭32d根據照射控制信號Se朝向曝光區域Ae照射光。此時,由於曝光區域Aa未位於任一曝光頭之曝光位置,因此光未朝向曝光區域Aa照射。Specifically, as shown in Fig. 22, the exposure head 32b irradiates light toward the exposure area Ac according to the irradiation control signal Sc, and the exposure head 32d irradiates light toward the exposure area Ae according to the irradiation control signal Se. At this time, since the exposure area Aa is not located at the exposure position of any exposure head, light is not irradiated toward the exposure area Aa.

此處,曝光頭32a、曝光頭32b、曝光頭32c及曝光頭32e藉由光圈驅動部39之驅動,脈衝光之整個照射區域被以光圈AP之遮光部所遮擋。亦即,自曝光頭32a、曝光頭32b、曝光頭32c及曝光頭32e光之照射被遮擋。其結果,於圖22所示之動作中,對曝光區域Ab、曝光區域Ac及曝光區域Ad未進行曝光。Here, the exposure heads 32a, 32b, 32c, and 32e are driven by the aperture driving unit 39, and the entire irradiation area of the pulse light is shielded by the light shielding portion of the aperture AP. That is, the irradiation of light from the exposure heads 32a, 32b, 32c, and 32e is shielded. As a result, in the operation shown in FIG. 22, the exposure area Ab, the exposure area Ac, and the exposure area Ad are not exposed.

根據此一構成,即使於曝光頭32a、曝光頭32c及曝光頭32e因異常而不能照射光之情況下,只要自圖8至圖16所示之通常動作將光圈AP之遮光部之動作簡單地加以變更,則可對全部曝光區域進行一次之曝光。According to this structure, even if the exposure head 32a, the exposure head 32c and the exposure head 32e cannot irradiate light due to an abnormality, the entire exposure area can be exposed once by simply changing the movement of the light shielding part of the aperture AP from the normal operation shown in Figures 8 to 16.

<有關藉由以上記載之實施形態產生之功效> 其次,例示藉由以上記載之實施形態所產生之功效。再者,於以下之說明中,該功效係根據以上記載之實施形態所示之具體構成的記載,但其亦可於產生相同功效之範圍內,置換為本說明書所示之其他的具體構成。即,以下為了方便說明,雖僅以對應之具體構成中任一者作為代表進行記載,但其亦可將作為代表記載之具體構成被置換為相對應之其他具體構成。 <About the effects produced by the above described implementation form> Next, the effects produced by the above described implementation form are exemplified. Furthermore, in the following description, the effects are described according to the specific configuration shown in the above described implementation form, but they can also be replaced with other specific configurations shown in this manual within the scope of producing the same effects. That is, for the convenience of explanation, only one of the corresponding specific configurations is described as a representative, but the specific configuration described as a representative can also be replaced with other corresponding specific configurations.

根據以上記載之實施形態,於曝光方法中,第一曝光頭可以對複數個曝光區域中與第一曝光區域相對應之第一曝光圖案、及複數個曝光區域中與第二曝光區域相對應之第二曝光圖案照射光。其中,第一曝光頭係例如對應於曝光頭32a、曝光頭32b、曝光頭32c、曝光頭32d及曝光頭32e中之一者。此外,第一曝光區域及第二曝光區域係例如分別對應於曝光區域Aa、曝光區域Ab、曝光區域Ac、曝光區域Ad、曝光區域Ae中不同之二者。此外,第一曝光圖案及第二曝光圖案係例如分別對應於根據照射控制信號Sa之曝光圖案、根據照射控制信號Sb之曝光圖案、根據照射控制信號Sc之曝光圖案、根據照射控制信號Sd之曝光圖案、及根據照射控制信號Se之曝光圖案中不同之二者。第二曝光頭係可對複數個曝光區域中與第三曝光區域相對應之第三曝光圖案、及複數個曝光區域中與第四曝光區域相對應之第四曝光圖案照射光。此處,第二曝光頭係例如相對應於曝光頭32a、曝光頭32b、曝光頭32c、曝光頭32d及曝光頭32e中與第一曝光頭不同之一者。此外,第三曝光區域及第四曝光區域係例如分別對應於曝光區域Aa、曝光區域Ab、曝光區域Ac、曝光區域Ad、及曝光區域Ae中之不同之二者。此外,第三曝光圖案及第四曝光圖案例如分別對應於根據照射控制信號Sa之曝光圖案、根據照射控制信號Sb之曝光圖案、根據照射控制信號Sc之曝光圖案、根據照射控制信號Sd之曝光圖案、及根據照射控制信號Se之曝光圖案中之不同之二者。並且,複數個曝光區域對曝光頭32a及曝光頭32b被相對地移動。又,當曝光區域Aa位於曝光頭32a之曝光位置之狀態時,根據照射控制信號Sa之曝光圖案自曝光頭32a朝向曝光區域Aa照射光,且當曝光區域Ab位於曝光頭32a之曝光位置之狀態時,根據照射控制信號Sb之曝光圖案自曝光頭32a朝向曝光區域Ab照射光。並且,當曝光區域Ac位於曝光頭32b之曝光位置之狀態時,根據照射控制信號Sc之曝光圖案自曝光頭32b朝向曝光區域Ac照射光,且當曝光區域Ad位於曝光頭32b之曝光位置之狀態時,根據照射控制信號Sd之曝光圖案自曝光頭32b朝向曝光區域Ad照射光。According to the above described embodiment, in the exposure method, the first exposure head can irradiate light to the first exposure pattern corresponding to the first exposure area in the plurality of exposure areas, and the second exposure pattern corresponding to the second exposure area in the plurality of exposure areas. The first exposure head corresponds to one of the exposure head 32a, the exposure head 32b, the exposure head 32c, the exposure head 32d, and the exposure head 32e, for example. In addition, the first exposure area and the second exposure area correspond to different two of the exposure area Aa, the exposure area Ab, the exposure area Ac, the exposure area Ad, and the exposure area Ae, for example. In addition, the first exposure pattern and the second exposure pattern correspond to different two of the exposure pattern according to the irradiation control signal Sa, the exposure pattern according to the irradiation control signal Sb, the exposure pattern according to the irradiation control signal Sc, the exposure pattern according to the irradiation control signal Sd, and the exposure pattern according to the irradiation control signal Se, for example. The second exposure head can irradiate light to a third exposure pattern corresponding to the third exposure area among the plurality of exposure areas, and a fourth exposure pattern corresponding to the fourth exposure area among the plurality of exposure areas. Here, the second exposure head corresponds to, for example, one of the exposure head 32a, the exposure head 32b, the exposure head 32c, the exposure head 32d, and the exposure head 32e that is different from the first exposure head. In addition, the third exposure area and the fourth exposure area correspond to, for example, two different ones of the exposure area Aa, the exposure area Ab, the exposure area Ac, the exposure area Ad, and the exposure area Ae, respectively. In addition, the third exposure pattern and the fourth exposure pattern correspond to, for example, two different ones of the exposure pattern according to the irradiation control signal Sa, the exposure pattern according to the irradiation control signal Sb, the exposure pattern according to the irradiation control signal Sc, the exposure pattern according to the irradiation control signal Sd, and the exposure pattern according to the irradiation control signal Se, respectively. In addition, the plurality of exposure area pairs are relatively moved by the exposure head 32a and the exposure head 32b. When the exposure area Aa is located at the exposure position of the exposure head 32a, light is irradiated from the exposure head 32a toward the exposure area Aa according to the exposure pattern of the irradiation control signal Sa, and when the exposure area Ab is located at the exposure position of the exposure head 32a, light is irradiated from the exposure head 32a toward the exposure area Ab according to the exposure pattern of the irradiation control signal Sb. When the exposure area Ac is located at the exposure position of the exposure head 32b, light is irradiated from the exposure head 32b toward the exposure area Ac according to the exposure pattern of the irradiation control signal Sc, and when the exposure area Ad is located at the exposure position of the exposure head 32b, light is irradiated from the exposure head 32b toward the exposure area Ad according to the exposure pattern of the irradiation control signal Sd.

根據此一構成,藉由使用複數個曝光頭分別進行複數次光之照射,可使用複數個曝光頭實現各式各樣變化的曝光動作。藉此,即使當複數個曝光頭中任一個因異常等而不能曝光之狀態下,只要自圖8至圖16之所示之通常動作將光圈AP之遮光部之動作簡單地加以變更,即可藉由其他曝光頭之預先設定之複數次光之照射作補充曝光,因此其可一面維持曝光之高位置精度,一面提高曝光動作之自由度。According to this configuration, by using a plurality of exposure heads to perform a plurality of light irradiations, various exposure operations can be realized using the plurality of exposure heads. Thus, even when any of the plurality of exposure heads cannot perform exposure due to an abnormality, by simply changing the operation of the light shielding portion of the aperture AP from the normal operation shown in FIG. 8 to FIG. 16 , supplementary exposure can be performed by irradiating a plurality of light irradiations set in advance by other exposure heads, thereby maintaining high exposure position accuracy while increasing the degree of freedom of exposure operation.

此外,當將本說明書例示之其他構成適當地追加至前述構成時、即適當地追加作為前述構成所未提及之本說明書之其他構成之情形時,其亦可產生同樣之功效。Furthermore, when other configurations exemplified in this specification are appropriately added to the aforementioned configurations, that is, when other configurations of this specification that are not mentioned in the aforementioned configurations are appropriately added, the same effects can be produced.

此外,根據以上記載之實施形態,自曝光頭32a照射於不同之曝光區域之各光、及自曝光頭32b照射於不同之曝光區域照射之各光中任一者,係在對應之曝光區域不進行曝光。根據此一構成,藉由將複數個曝光頭中分別照射複數次之光中任一者設定為不進行曝光之構成(例如,虛擬圖案等),其可使用複數個曝光頭實現各式各樣變化的曝光動作(例如,對全部曝光區域進行通常曝光(一重曝光)之情形、或對全部曝光區域進行二重曝光之情形等)。此外,藉由不將曝光頭之電源斷開之操作且變更自曝光頭照射之光的圖案而不曝光,則可節省成為可再次曝光之狀態(例如,照射光之強度穩定之狀態)為止的時間。Furthermore, according to the above described embodiment, any of the lights irradiated from the exposure head 32a to different exposure areas and any of the lights irradiated from the exposure head 32b to different exposure areas do not perform exposure in the corresponding exposure area. According to this configuration, by setting any of the lights irradiated multiple times by the multiple exposure heads to a configuration in which no exposure is performed (for example, a virtual pattern, etc.), it is possible to use multiple exposure heads to realize various exposure operations (for example, a case in which all exposure areas are normally exposed (single exposure) or a case in which all exposure areas are double exposed, etc.). Furthermore, by changing the pattern of the light irradiated from the exposure head without turning off the power of the exposure head and without exposing, the time until the state in which exposure can be performed again (for example, a state in which the intensity of the irradiated light is stable) can be saved.

此外,根據以上記載之實施形態,自曝光頭32a照射於不同之曝光區域之各光、及自曝光頭32b照射於不同之曝光區域照射之各光中任一者,係被遮擋者。根據此一構成,藉由將複數個曝光頭中分別照射複數次之光中任一者遮擋,則可使用複數個曝光頭實現各式各樣變化的曝光動作(例如,對全部曝光區域進行通常曝光(一重曝光)之情形、或對全部曝光區域進行二重曝光之情形等)。亦即,即使於複數個曝光頭中任一個因異常等而不能曝光之狀態下,亦可實現各式各樣變化的曝光動作。此外,藉由不將曝光頭之電源斷開操作之狀態下將自曝光頭照射之光遮擋,則可節省成為可再次曝光之狀態(例如,照射光之強度穩定的狀態)為止的時間。Furthermore, according to the above described implementation form, any one of the lights irradiated to different exposure areas by the exposure head 32a and the lights irradiated to different exposure areas by the exposure head 32b is blocked. According to this configuration, by blocking any one of the lights irradiated multiple times by the multiple exposure heads, various exposure actions (for example, a case where all exposure areas are normally exposed (single exposure) or a case where all exposure areas are double exposed) can be realized using the multiple exposure heads. That is, even in a state where any one of the multiple exposure heads cannot expose due to an abnormality, etc., various exposure actions can be realized. Furthermore, by shielding the light emitted from the exposure head without turning off the power of the exposure head, the time required to reach a state where exposure can be performed again (for example, a state where the intensity of the irradiated light is stable) can be saved.

此外,根據以上所記載之實施形態,曝光頭32a及曝光頭32b係排列於第一方向。其中,第一方向例如對應於X軸方向。複數個曝光區域分別排列於X軸方向。並且,使複數個曝光區域相對地移動之步驟係使複數個曝光區域沿X軸方向移動之步驟。根據此一構成,藉由沿排列有曝光區域之方向配置複數個曝光頭,且使該曝光頭沿排列有曝光區域之方向移動,則可使一個曝光頭之曝光位置有效率地位於複數個曝光區域。因此,由於可將曝光頭之動作方向限定於一個方向以使動作量減少,因而可減少用以曝光所需之時間,且可維持曝光之高位置精度。In addition, according to the embodiment described above, the exposure head 32a and the exposure head 32b are arranged in a first direction. The first direction corresponds to the X-axis direction, for example. A plurality of exposure areas are arranged in the X-axis direction. Furthermore, the step of moving the plurality of exposure areas relative to each other is a step of moving the plurality of exposure areas along the X-axis direction. According to this configuration, by disposing a plurality of exposure heads along the direction in which the exposure areas are arranged and moving the exposure heads along the direction in which the exposure areas are arranged, the exposure position of one exposure head can be efficiently positioned in a plurality of exposure areas. Therefore, since the movement direction of the exposure head can be limited to one direction to reduce the movement amount, the time required for exposure can be reduced, and the high position accuracy of exposure can be maintained.

此外,根據以上記載之實施形態,曝光區域Aa與曝光區域Ab係被鄰接設置。此外,曝光區域Ac與曝光區域Ad係被鄰接設置。根據此一構成,可將用以對複數個曝光區域進行曝光之曝光頭與相對應之曝光區域之間之相對移動最小化。因此,由於可減少曝光頭之動作量,因而可減少用以曝光所需之時間,此外,亦可維持曝光之高位置精度。In addition, according to the above described embodiment, the exposure area Aa and the exposure area Ab are disposed adjacent to each other. In addition, the exposure area Ac and the exposure area Ad are disposed adjacent to each other. According to this configuration, the relative movement between the exposure head for exposing a plurality of exposure areas and the corresponding exposure areas can be minimized. Therefore, since the movement amount of the exposure head can be reduced, the time required for exposure can be reduced, and in addition, the high position accuracy of exposure can be maintained.

此外,根據以上所記載之實施形態,第一曝光區域與第三曝光區域係相同之曝光區域。根據此一構成,其可使用不同之曝光頭對一個曝光區域進行二重曝光。因此,例如,若使排列之2個曝光頭之曝光位置依序位於一個曝光區域進行二重曝光,則不需要進行使曝光頭返回至曝光開始位置之驅動動作、即與用以曝光之副掃描方向之驅動動作(朝負X軸方向之驅動動作)相反側之驅動動作,其中,該曝光開始位置係於使用相同之曝光頭進行二重曝光時為必要之位置。藉此,由於可減少曝光頭之動作量,因而可減少用以曝光所需之時間,且可維持曝光之高位置精度。Furthermore, according to the above-described embodiment, the first exposure area and the third exposure area are the same exposure area. According to this configuration, it is possible to perform double exposure on one exposure area using different exposure heads. Therefore, for example, if the exposure positions of the two arranged exposure heads are sequentially located in one exposure area for double exposure, it is not necessary to perform a driving operation for returning the exposure head to the exposure start position, i.e., a driving operation on the opposite side of the driving operation in the sub-scanning direction for exposure (driving operation in the negative X-axis direction), wherein the exposure start position is a necessary position when the same exposure head is used for double exposure. In this way, since the amount of movement of the exposure head can be reduced, the time required for exposure can be reduced, and high position accuracy of exposure can be maintained.

此外,根據以上記載之實施形態,曝光裝置具備有:曝光頭32a及曝光頭32b,其對基板9進行曝光;移動部,其使複數個曝光區域對曝光頭32a及曝光頭32b相對地移動;及控制部50,其用以控制曝光頭32a及曝光頭32b之曝光動作。其中,移動部例如對應於載台驅動部20等。其中,於基板9設置有複數個曝光區域。此外,曝光頭32a係可根據與複數個曝光區域中之曝光區域Aa相對應之照射控制信號Sa之曝光圖案、及根據與複數個曝光區域中之曝光區域Ab相對應之照射控制信號Sb之曝光圖案照射光。此外,曝光頭32b可根據與複數個曝光區域中之曝光區域Ac相對應之照射控制信號Sc之曝光圖案、及根據與複數個曝光區域中之曝光區域Ad相對應之照射控制信號Sd之曝光圖案照射光。並且,控制部50係於曝光區域Aa位於曝光頭32a之曝光位置之狀態下,根據照射控制信號Sa之曝光圖案使光自曝光頭32a朝向曝光區域Aa照射,且於曝光區域Ab位於曝光頭32a之曝光位置之狀態下,根據照射控制信號Sb之曝光圖案使光自曝光頭32a朝向曝光區域Ab照射。此外,控制部50係於曝光區域Ac位於曝光頭32b之曝光位置之狀態下,根據照射控制信號Sc之曝光圖案使光自曝光頭32b朝向曝光區域Ac照射,且於曝光區域Ad位於曝光頭32b之曝光位置之狀態下,根據照射控制信號Sd之曝光圖案使光自曝光頭32b朝向曝光區域Ad照射。In addition, according to the above described embodiment, the exposure device includes: an exposure head 32a and an exposure head 32b, which expose the substrate 9; a moving part, which moves a plurality of exposure areas relative to the exposure head 32a and the exposure head 32b; and a control part 50, which is used to control the exposure action of the exposure head 32a and the exposure head 32b. The moving part corresponds to the stage driving part 20, etc., for example. A plurality of exposure areas are provided on the substrate 9. In addition, the exposure head 32a can irradiate light according to an exposure pattern of an irradiation control signal Sa corresponding to an exposure area Aa among the plurality of exposure areas, and according to an exposure pattern of an irradiation control signal Sb corresponding to an exposure area Ab among the plurality of exposure areas. In addition, the exposure head 32b may irradiate light according to an exposure pattern of an irradiation control signal Sc corresponding to an exposure area Ac among the plurality of exposure areas, and according to an exposure pattern of an irradiation control signal Sd corresponding to an exposure area Ad among the plurality of exposure areas. Furthermore, the control unit 50 irradiates light from the exposure head 32a toward the exposure area Aa according to the exposure pattern of the irradiation control signal Sa when the exposure area Aa is located at the exposure position of the exposure head 32a, and irradiates light from the exposure head 32a toward the exposure area Ab according to the exposure pattern of the irradiation control signal Sb when the exposure area Ab is located at the exposure position of the exposure head 32a. In addition, the control unit 50 causes light to be irradiated from the exposure head 32b toward the exposure area Ac according to the exposure pattern of the exposure control signal Sc when the exposure area Ac is located at the exposure position of the exposure head 32b, and causes light to be irradiated from the exposure head 32b toward the exposure area Ad according to the exposure pattern of the exposure control signal Sd when the exposure area Ad is located at the exposure position of the exposure head 32b.

根據此一構成,藉由使用複數個曝光頭分別進行複數次光之照射,其可使用複數個曝光頭實現各式各樣變化的曝光動作。藉此,即使於複數個曝光頭中任一個因異常等而不能曝光之狀態下,只要自圖8至圖16之所示之通常動作將光圈AP之遮光部之動作簡單地加以變更,藉由其他曝光頭之預先設定之複數次光之照射以補充曝光,因此,其可一面維持曝光之高位置精度,一面提高曝光動作之自由度。According to this configuration, by using a plurality of exposure heads to perform a plurality of light irradiations, it is possible to use a plurality of exposure heads to realize various exposure operations. Thus, even if any of the plurality of exposure heads cannot perform exposure due to an abnormality, the operation of the light shielding portion of the aperture AP can be simply changed from the normal operation shown in FIG. 8 to FIG. 16, and the exposure can be supplemented by the irradiation of a plurality of light irradiations set in advance by other exposure heads. Therefore, it is possible to maintain high positional accuracy of exposure while increasing the degree of freedom of exposure operation.

再者,即使將本說明書例示之其他構成適當地追加至前述構成時、即適當地追加前述構成所未提及之本說明書的其他構成之情形時,亦可產生同樣之功效。Furthermore, even when other structures illustrated in this specification are appropriately added to the aforementioned structures, that is, when other structures of this specification that are not mentioned in the aforementioned structures are appropriately added, the same effect can be produced.

<有關以上記載之實施形態的變形例> 於以上記載之實施形態中,有時對各個構成要件之尺寸、形狀、相對之配置關係或實施條件等亦有記載,但其等於所有態樣中皆為一例示性而已,而並非用來限定者。 <Variations of the above-described implementation forms> In the above-described implementation forms, the size, shape, relative arrangement relationship or implementation conditions of each component are sometimes described, but they are only examples in all aspects and are not intended to be limiting.

1:曝光裝置 9:基板 10:載台 20:載台驅動部 21:旋轉機構 21a:線性馬達 21b:旋轉軸 22:支撐板 23:副掃描機構 23a:線性馬達 23b:導軌部 24:基座板 25:主掃描機構 25a:線性馬達 25b:導軌部 30:頭部 31:支架 32a:曝光頭 32b:曝光頭 32c:曝光頭 32d:曝光頭 32e:曝光頭 33:照明光學系統 34:雷射振盪器 35:雷射驅動部 36:出射部 37:光圈單元 38:投影光學系統 39:光圈驅動部 40:照射光攝影部 41:CCD相機 42:導軌 43:相機驅動機構 50:控制部 53:載台位置調整部 54a:照射控制部 54b:照射控制部 54c:照射控制部 54d:照射控制部 54e:照射控制部 55:控制切換判定部 60:基台 AP:光圈 Aa:曝光區域 Ab:曝光區域 Ac:曝光區域 Ad:曝光區域 Ae:曝光區域 Sa:照射控制信號 Sb:照射控制信號 Sc:照射控制信號 Sd:照射控制信號 Se:照射控制信號 1: Exposure device 9: Substrate 10: Stage 20: Stage drive unit 21: Rotation mechanism 21a: Linear motor 21b: Rotation axis 22: Support plate 23: Sub-scanning mechanism 23a: Linear motor 23b: Guide rail unit 24: Base plate 25: Main scanning mechanism 25a: Linear motor 25b: Guide rail unit 30: Head unit 31: Bracket 32a: Exposure head 32b: Exposure head 32c: Exposure head 32d: Exposure head 32e: Exposure head 33: Illumination optical system 34: Laser oscillator 35: Laser drive unit 36: Output unit 37: Aperture unit 38: Projection optical system 39: Aperture drive unit 40: Exposure light photography unit 41: CCD camera 42: Guide rail 43: Camera drive mechanism 50: Control unit 53: Stage position adjustment unit 54a: Exposure control unit 54b: Exposure control unit 54c: Exposure control unit 54d: Exposure control unit 54e: Exposure control unit 55: Control switching judgment unit 60: Base AP: Aperture Aa: Exposure area Ab: Exposure area Ac: Exposure area Ad: Exposure area Ae: Exposure area Sa: Exposure control signal Sb: Exposure control signal Sc: Exposure control signal Sd: Exposure control signal Se: Exposure control signal

圖1為表示本實施形態之曝光裝置之構成的側視圖。 圖2為表示本實施形態之曝光裝置之構成的俯視圖。 圖3為表示正常動作時基板上之曝光區域與複數個曝光頭之關係之一例的圖。 圖4為示意表示複數個曝光頭之構成的圖。 圖5為示意表示曝光裝置之各驅動部與控制部之間之連接構成的圖。 圖6為按各個功能表示以控制部為中心之曝光裝置之構成的圖。 圖7為表示曝光裝置之動作流程之一例的流程圖。 圖8為表示曝光裝置之動作狀況的俯視圖。 圖9為表示曝光裝置之動作狀況的俯視圖。 圖10為表示曝光裝置之動作狀況的俯視圖。 圖11為表示曝光裝置之動作狀況的俯視圖。 圖12為表示曝光裝置之動作狀況的俯視圖。 圖13為表示曝光裝置之動作狀況的俯視圖。 圖14為表示曝光裝置之動作狀況的俯視圖。 圖15為表示曝光裝置之動作狀況的俯視圖。 圖16為表示曝光裝置之動作狀況的俯視圖。 圖17為表示曝光裝置之動作狀況的俯視圖。 圖18為表示曝光裝置之動作狀況的俯視圖。 圖19為表示曝光裝置之動作狀況的俯視圖。 圖20為表示曝光裝置之動作狀況的俯視圖。 圖21為表示曝光裝置之動作狀況的俯視圖。 圖22為表示曝光裝置之動作狀況的俯視圖。 FIG. 1 is a side view showing the structure of the exposure device of the present embodiment. FIG. 2 is a top view showing the structure of the exposure device of the present embodiment. FIG. 3 is a diagram showing an example of the relationship between the exposure area on the substrate and a plurality of exposure heads during normal operation. FIG. 4 is a diagram schematically showing the structure of a plurality of exposure heads. FIG. 5 is a diagram schematically showing the connection structure between each drive unit and the control unit of the exposure device. FIG. 6 is a diagram showing the structure of the exposure device centered on the control unit according to each function. FIG. 7 is a flow chart showing an example of the operation flow of the exposure device. FIG. 8 is a top view showing the operation state of the exposure device. FIG. 9 is a top view showing the operation state of the exposure device. FIG. 10 is a top view showing the operation state of the exposure device. FIG. 11 is a top view showing the operation of the exposure device. FIG. 12 is a top view showing the operation of the exposure device. FIG. 13 is a top view showing the operation of the exposure device. FIG. 14 is a top view showing the operation of the exposure device. FIG. 15 is a top view showing the operation of the exposure device. FIG. 16 is a top view showing the operation of the exposure device. FIG. 17 is a top view showing the operation of the exposure device. FIG. 18 is a top view showing the operation of the exposure device. FIG. 19 is a top view showing the operation of the exposure device. FIG. 20 is a top view showing the operation of the exposure device. FIG. 21 is a top view showing the operation of the exposure device. Figure 22 is a top view showing the operation of the exposure device.

9:基板 10:載台 30:頭部 32a:曝光頭 32b:曝光頭 32c:曝光頭 32d:曝光頭 32e:曝光頭 Aa:曝光區域 Ab:曝光區域 Ac:曝光區域 Ad:曝光區域 Ae:曝光區域 9: substrate 10: stage 30: head 32a: exposure head 32b: exposure head 32c: exposure head 32d: exposure head 32e: exposure head Aa: exposure area Ab: exposure area Ac: exposure area Ad: exposure area Ae: exposure area

Claims (6)

一種曝光方法,係使用具備有第一曝光頭及第二曝光頭之曝光裝置的曝光方法;其中,前述曝光裝置係,對設置有複數個曝光區域之基板進行曝光,前述第一曝光頭係可以複數個前述曝光區域中之第一曝光區域相對應之第一曝光圖案、及以複數個前述曝光區域中之第二曝光區域相對應之第二曝光圖案照射光,前述第二曝光頭係可以複數個前述曝光區域中之第三曝光區域相對應之第三曝光圖案、及以複數個前述曝光區域中之第四曝光區域相對應之第四曝光圖案照射光;該曝光方法具備有以下之步驟:使複數個前述曝光區域對前述第一曝光頭及前述第二曝光頭相對地移動之步驟;於前述第一曝光區域位於前述第一曝光頭之曝光位置之狀態下,以前述第一曝光圖案自前述第一曝光頭朝向前述第一曝光區域照射光之步驟;於前述第二曝光區域位於前述第一曝光頭之前述曝光位置之狀態下,以前述第二曝光圖案自前述第一曝光頭朝向前述第二曝光區域照射光之步驟;於前述第三曝光區域位於前述第二曝光頭之前述曝光位置之狀態下,以前述第三曝光圖案自前述第二曝光頭朝向前述第三曝光區域照射光之步驟;及 於前述第四曝光區域位於前述第二曝光頭之前述曝光位置之狀態下,以前述第四曝光圖案自前述第二曝光頭朝向前述第四曝光區域照射光之步驟;前述第一曝光頭與前述第二曝光頭係於第一方向被鄰接配置,複數個前述曝光區域被分別排列於前述第一方向,且使複數個前述曝光區域相對地移動之步驟係使複數個前述曝光區域沿前述第一方向移動之步驟,前述第二曝光區域與前述第三曝光區域係相同之區域,並且依前述第一曝光區域、前述第二曝光區域、前述第四曝光區域之順序,於前述第一方向被鄰接配置,且自前述第一曝光頭照射於前述第二曝光區域之光、及自前述第二曝光頭照射於前述第三曝光區域之光中任一者係被遮擋。 An exposure method is an exposure method using an exposure device having a first exposure head and a second exposure head; wherein the exposure device is used to expose a substrate having a plurality of exposure areas, the first exposure head can irradiate light with a first exposure pattern corresponding to a first exposure area of the plurality of exposure areas and with a second exposure pattern corresponding to a second exposure area of the plurality of exposure areas, and the second exposure head can irradiate light with a third exposure pattern corresponding to a third exposure area of the plurality of exposure areas and with a third exposure pattern corresponding to a third exposure area of the plurality of exposure areas. The method comprises the steps of: irradiating a fourth exposure pattern corresponding to a fourth exposure area in the light area with light; the exposure method comprises the steps of: moving the plurality of exposure areas relative to the first exposure head and the second exposure head; irradiating the first exposure area with light from the first exposure head toward the first exposure area when the first exposure area is located at the exposure position of the first exposure head; irradiating the second exposure area with light from the first exposure head toward the first exposure area when the second exposure area is located at the exposure position of the first exposure head; The first exposure head and the second exposure head are adjacently arranged in a first direction, and the plurality of exposure heads are adjacently arranged in a first direction. The areas are arranged in the first direction, and the step of moving the plurality of exposure areas relatively is a step of moving the plurality of exposure areas along the first direction. The second exposure area and the third exposure area are the same area, and are arranged adjacent to each other in the first direction in the order of the first exposure area, the second exposure area, and the fourth exposure area, and any one of the light irradiated from the first exposure head to the second exposure area and the light irradiated from the second exposure head to the third exposure area is blocked. 如請求項1之曝光方法,其中,自前述第一曝光頭照射於前述第一曝光區域之光、自前述第一曝光頭照射於前述第二曝光區域之光、自前述第二曝光頭照射於前述第三曝光區域之光、及自前述第二曝光頭照射於前述第四曝光區域之光中任一者,係在對應之前述曝光區域不進行曝光。 As in the exposure method of claim 1, any one of the light irradiated from the first exposure head to the first exposure area, the light irradiated from the first exposure head to the second exposure area, the light irradiated from the second exposure head to the third exposure area, and the light irradiated from the second exposure head to the fourth exposure area is not exposed in the corresponding aforementioned exposure area. 如請求項1或2之曝光方法,其中,自前述第一曝光頭照射於前述第一曝光區域之光、自前述第一曝光頭照射於前述第二曝光區域之光、自前述第二曝光頭照射於前述第三曝光區域之光、及自前述第二曝光頭照射於前述第四曝光區域之光中任一者,係被遮擋。 The exposure method of claim 1 or 2, wherein any one of the light irradiated from the first exposure head to the first exposure area, the light irradiated from the first exposure head to the second exposure area, the light irradiated from the second exposure head to the third exposure area, and the light irradiated from the second exposure head to the fourth exposure area is blocked. 如請求項1或2之曝光方法,其中,前述第一曝光區域與前述第二曝光區域係被鄰接設置,前述第三曝光區域與前述第四曝光區域係被鄰接設置。 The exposure method of claim 1 or 2, wherein the first exposure area and the second exposure area are adjacently arranged, and the third exposure area and the fourth exposure area are adjacently arranged. 一種曝光裝置,其具備有:第一曝光頭及第二曝光頭,其用以對基板進行曝光;於前述基板設置有複數個曝光區域,前述第一曝光頭係可對複數個前述曝光區域中之第一曝光區域相對應之第一曝光圖案、及與複數個前述曝光區域中之第二曝光區域相對應之第二曝光圖案照射光,前述第二曝光頭係可對複數個前述曝光區域中之第三曝光區域相對應之第三曝光圖案、及複數個前述曝光區域中之第四曝光區域相對應之第四曝光圖案照射光;該曝光裝置具備有:移動部,其使複數個前述曝光區域對前述第一曝光頭及前述第二曝光頭於第一方向移動;控制部,其用以控制前述第一曝光頭及前述第二曝光頭之曝光動作;遮光部,其根據前述控制部之控制,可選擇性地遮擋前述第一曝光頭及前述第二曝光頭照射之光;及感測器,其被構成為,可檢測前述第一曝光頭及前述第二曝光頭之狀態;且前述控制部係於前述第一曝光區域位於前述第一曝光頭之曝光位置之狀態下,使光自前述第一曝光頭朝向前述第一曝光區域照射前述第一 曝光圖案,然後於前述第二曝光區域位於前述第一曝光頭之前述曝光位置之狀態下,使光自前述第一曝光頭朝向前述第二曝光區域照射前述第二曝光圖案,且前述控制部係於前述第三曝光區域位於前述第二曝光頭之前述曝光位置之狀態下,使光自前述第二曝光頭朝向前述第三曝光區域照射前述第三曝光圖案,然後於前述第四曝光區域位於前述第二曝光頭之前述曝光位置之狀態下,使光自前述第二曝光頭朝向前述第四曝光區域照射前述第四曝光圖案,前述第一曝光頭與前述第二曝光頭係於前述第一方向被鄰接配置,前述第二曝光區域與前述第三曝光區域係相同之區域,並且依前述第一曝光區域、前述第二曝光區域、前述第四曝光區域之順序,於前述第一方向被鄰接配置,前述控制部係被構成為,根據來自前述感測器之資訊,檢測有無前述第一曝光頭及前述第二曝光頭之異常,前述控制部被構成為,當未檢測出前述第一曝光頭及前述第二曝光頭之異常時,藉由前述遮光部將自前述第一曝光頭照射於前述第二曝光區域之光、及自前述第二曝光頭照射於前述第三曝光區域之光的其中一者遮擋,並且,當檢測出前述第一曝光頭之異常時,至少不執行以前述遮光部遮擋自前述第二曝光頭照射於前述第三曝光區域之光,並且當檢測出前述第二曝光頭之異常時,至少不執行以前述遮光部遮擋自前述第一曝光頭照射於前述第二曝光區域之光。 An exposure device, which comprises: a first exposure head and a second exposure head, which are used to expose a substrate; a plurality of exposure areas are arranged on the substrate, the first exposure head can irradiate light to a first exposure pattern corresponding to a first exposure area among the plurality of exposure areas, and a second exposure pattern corresponding to a second exposure area among the plurality of exposure areas, and the second exposure head can irradiate light to a third exposure pattern corresponding to a third exposure area among the plurality of exposure areas, and a fourth exposure pattern corresponding to a fourth exposure area among the plurality of exposure areas; the exposure device comprises: a moving part, which moves the plurality of exposure areas in a first direction relative to the first exposure head and the second exposure head. ; a control unit for controlling the exposure actions of the first exposure head and the second exposure head; a light shielding unit, which can selectively shield the light irradiated by the first exposure head and the second exposure head according to the control of the control unit; and a sensor, which is configured to detect the states of the first exposure head and the second exposure head; and the control unit, when the first exposure area is located at the exposure position of the first exposure head, causes the light to irradiate the first exposure pattern from the first exposure head toward the first exposure area, and then, when the second exposure area is located at the aforementioned exposure position of the first exposure head, causes the light to irradiate the second exposure pattern from the first exposure head toward the second exposure area, and the first exposure head The control unit, when the third exposure area is located at the exposure position before the second exposure head, causes light to irradiate the third exposure pattern from the second exposure head toward the third exposure area, and then, when the fourth exposure area is located at the exposure position before the second exposure head, causes light to irradiate the fourth exposure pattern from the second exposure head toward the fourth exposure area, the first exposure head and the second exposure head are adjacently arranged in the first direction, the second exposure area and the third exposure area are the same area, and are adjacently arranged in the first direction in the order of the first exposure area, the second exposure area, and the fourth exposure area, and the control unit is configured as follows: Based on the information from the sensor, the presence or absence of abnormality of the first exposure head and the second exposure head is detected. The control unit is configured to, when abnormality of the first exposure head and the second exposure head is not detected, shield one of the light irradiated from the first exposure head to the second exposure area and the light irradiated from the second exposure head to the third exposure area by the light shielding unit, and, when abnormality of the first exposure head is detected, at least shielding the light irradiated from the second exposure head to the third exposure area by the light shielding unit is not executed, and when abnormality of the second exposure head is detected, at least shielding the light irradiated from the first exposure head to the second exposure area by the light shielding unit is not executed. 一種曝光方法,係使用具備有第一曝光頭及第二曝光頭之曝光裝置的曝光方法;其中,前述曝光裝置係,對設置有複數個曝光區域之基板進行曝光,前述第一曝光頭係可以複數個前述曝光區域中之第一曝光區域相對應之第一曝光圖案、及以複數個前述曝光區域中之第二曝光區域相對應之第二曝光圖案照射光,前述第二曝光頭係可以複數個前述曝光區域中之第三曝光區域相對應之第三曝光圖案、及以複數個前述曝光區域中之第四曝光區域相對應之第四曝光圖案照射光;該曝光方法具備有以下之步驟:使複數個前述曝光區域對前述第一曝光頭及前述第二曝光頭相對地移動之步驟;於前述第一曝光區域位於前述第一曝光頭之曝光位置之狀態下,以前述第一曝光圖案自前述第一曝光頭朝向前述第一曝光區域照射光之步驟;於前述第二曝光區域位於前述第一曝光頭之前述曝光位置之狀態下,以前述第二曝光圖案自前述第一曝光頭朝向前述第二曝光區域照射光之步驟;於前述第三曝光區域位於前述第二曝光頭之前述曝光位置之狀態下,以前述第三曝光圖案自前述第二曝光頭朝向前述第三曝光區域照射光之步驟;及 於前述第四曝光區域位於前述第二曝光頭之前述曝光位置之狀態下,以前述第四曝光圖案自前述第二曝光頭朝向前述第四曝光區域照射光之步驟;前述第一曝光頭與前述第二曝光頭係於第一方向被鄰接配置,複數個前述曝光區域被分別排列於前述第一方向,且使複數個前述曝光區域相對地移動之步驟係使複數個前述曝光區域沿前述第一方向移動之步驟,前述第二曝光區域與前述第三曝光區域係相同之區域,並且依前述第一曝光區域、前述第二曝光區域、前述第四曝光區域之順序,於前述第一方向被鄰接配置,且前述第二曝光圖案與前述第三曝光圖案係相同之曝光圖案。 An exposure method is an exposure method using an exposure device having a first exposure head and a second exposure head; wherein the exposure device is used to expose a substrate having a plurality of exposure areas, the first exposure head can irradiate light with a first exposure pattern corresponding to a first exposure area among the plurality of exposure areas, and with a second exposure pattern corresponding to a second exposure area among the plurality of exposure areas, and the second exposure head can irradiate light with a third exposure pattern corresponding to a third exposure area among the plurality of exposure areas, and The method comprises the steps of: irradiating light with a fourth exposure pattern corresponding to a fourth exposure area among the plurality of exposure areas; the exposure method comprises the steps of: moving the plurality of exposure areas relative to the first exposure head and the second exposure head; irradiating light with the first exposure pattern from the first exposure head toward the first exposure area when the first exposure area is located at the exposure position of the first exposure head; irradiating light with the first exposure pattern from the first exposure head toward the first exposure area when the second exposure area is located at the exposure position of the first exposure head; The step of irradiating light from the first exposure head toward the second exposure area with the second exposure pattern; the step of irradiating light from the second exposure head toward the third exposure area with the third exposure pattern when the third exposure area is located at the exposure position of the second exposure head; and the step of irradiating light from the second exposure head toward the fourth exposure area with the fourth exposure pattern when the fourth exposure area is located at the exposure position of the second exposure head; the step of irradiating light from the second exposure head toward the fourth exposure area with the fourth exposure pattern when the first exposure head and the second exposure head are located at the exposure position of the second exposure head. The heads are adjacently arranged in a first direction, a plurality of the aforementioned exposure areas are arranged in the aforementioned first direction respectively, and the step of moving the plurality of the aforementioned exposure areas relatively is a step of moving the plurality of the aforementioned exposure areas along the aforementioned first direction, the aforementioned second exposure area and the aforementioned third exposure area are the same area, and are adjacently arranged in the aforementioned first direction in the order of the aforementioned first exposure area, the aforementioned second exposure area, and the aforementioned fourth exposure area, and the aforementioned second exposure pattern and the aforementioned third exposure pattern are the same exposure pattern.
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JP2006145745A (en) * 2004-11-18 2006-06-08 Dainippon Screen Mfg Co Ltd Pattern drawing apparatus and method for drawing pattern
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006145745A (en) * 2004-11-18 2006-06-08 Dainippon Screen Mfg Co Ltd Pattern drawing apparatus and method for drawing pattern
JP2008116646A (en) * 2006-11-02 2008-05-22 Dainippon Screen Mfg Co Ltd Pattern drawing apparatus

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