TWI831326B - Memory module - Google Patents

Abstract

The present invention discloses a memory module. The memory module comprises a circuit board, at least one memory chip, at least one signal input port and a power source input port. The at least one memory chip is disposed on the circuit board. The at least one signal input port is disposed on the circuit board for receiving a control signal. The signal input port is electrically connected with the at least memory chip through the wiring of the circuit board, so that the memory module controls the at least one memory chip. The power source input port is disposed on the circuit board for receiving at least one linear power source. The power source input port is electrically connected with the at least memory chip through the wiring of the circuit board, so that the memory module provides the linear power source to the at least memory chip.

Description

memory module

This case relates to a memory module, especially a memory module that receives linear power.

Usually, a memory module only has a single input port and must use a single input port to receive signals and power at the same time. In order to receive signals and power at the same time, the power received by a traditional memory module is usually a switching power supply. ) provided by the exchange of electrical energy. However, since the switching power received by traditional memory modules is transformed by high-speed switching of electronic components, it has large fluctuation characteristics. Therefore, the noise caused by switching power is high, which makes the memory Noise is also higher when the module receives switched power, resulting in lower stability and lower frequency of traditional memory modules.

Therefore, how to develop a memory module that overcomes the above shortcomings is currently an urgent need.

The purpose of this case is to provide a memory module that uses signal input pins and power input ports to receive control signals and linear power. Since linear power has the characteristics of small fluctuations, the memory module of this case receives linear power. Electric power has the advantage of lower noise, and the memory module in this case also has lower noise when receiving linear power. Therefore, the memory module in this case has higher stability and higher frequency, and can even reach overclocking levels. , thereby improving the performance of the memory module in this case.

To achieve the above object, one embodiment of the present invention is a memory module, including a circuit board, at least one memory chip, at least one signal input pin and a power input port. At least one memory chip is disposed on the circuit board. At least one signal input pin is disposed on the circuit board for receiving control signals. The signal input pin is electrically connected to at least one memory chip through wiring in the circuit board, so that the memory module can control at least one memory chip. The chip is controlled. The power input port is disposed on the circuit board and is used to receive at least one linear power. The power input port is electrically connected to at least one memory chip through wiring in the circuit board, so that the memory module operates on the at least one memory chip. Power supply.

Some typical embodiments embodying the features and advantages of this case will be described in detail in the following description. It should be understood that this case can have various changes in different aspects without departing from the scope of this case, and the descriptions and drawings are essentially for illustrative purposes and are not used to limit this case.

Please refer to Figures 1 and 2. Figure 1 is a structural top view of the memory module in this case, and Figure 2 is a structural bottom view of the memory module shown in Figure 1. The memory module 1 in this case can be a dynamic random access memory (Dynamic Random Access Memory, DRAM), a solid state drive (Solid-State Drive, SSD) or a fifth-generation double data rate synchronous dynamic random access memory. (Double Data Rate Synchronous fifth-generation Dynamic Random Access Memory, DDR5 SDRAM), etc. The memory module 1 is disposed on the main circuit board (not shown) of the electronic device and can receive at least one power source, that is, linear power provided by a linear power supply 7 (linear power supply). The voltage of the linear power It can be 5V, in which the linear power supply 7 can be disposed on the main circuit board of the electronic device, that is, the electronic device can provide power to the memory module 1 using an internal power supply, or the linear power supply 7 can be disposed on the electronic device. In external equipment, that is, the electronic device can provide power to the memory module 1 using an external power supply.

As shown in Figures 1 and 2, the memory module 1 includes a circuit board 2, at least one memory chip 3, at least one signal input pin 4, and a power input port 5. The first figure shows the first side of the circuit board 2 of the memory module 1 and the electronic components located on the first side of the circuit board 2. The second figure shows the circuit board of the memory module 1. The second side of 2 relative to the first side and the electronic components located on the second side of the circuit board 2 . The circuit board 2 has a first side 21 , a second side 22 , a third side 23 and a fourth side 24 . The first side 21 and the second side 22 are arranged oppositely, and the third side 23 and the fourth side 24 are arranged oppositely. As shown in Figure 1, the memory module 1 of this embodiment includes a plurality of memory chips 3. The plurality of memory chips 3 are disposed on the first surface of the circuit board 2. Parts of the plurality of memory chips 3 are The memory chips 3 are arranged in sequence and adjacent to the second side 22 and the third side 23 of the circuit board 2 , and other memory chips 3 in the plurality of memory chips 3 are arranged in sequence and adjacent to the circuit board 2 the second side 22 and the fourth side 24. As shown in Figures 1 and 2, the memory module 1 of this embodiment includes a plurality of signal input pins 4. The plurality of signal input pins 4 constitute the golden fingers of the memory module 1 and are respectively provided on The first and second sides of the circuit board 2 are adjacent to the second side 22 of the circuit board 2 and are located between the third side 23 and the fourth side 24. The signal input pin 4 is used to receive control signal without receiving any power. The signal input pin 4 is electrically connected to the plurality of memory chips 3 through the wiring in the circuit board 2, so that the memory module 1 performs operations on the plurality of memory chips 3 according to the control signal. control. The power input port 5 may include a USB type-A, USB type-B or USB type-C port, and is disposed on the first side of the circuit board 2, adjacent to the first side 21 of the circuit board 2, and connected to the first side 21 of the circuit board 2. The signal input pins 4 are arranged at intervals, and the power input port 5 is used to receive linear power provided by the linear power supply 7 without receiving any control signals, and the power input port 5 is electrically connected through the wiring in the circuit board 2 to the plurality of memory chips 3, so that the memory module 1 supplies power to the plurality of memory chips 3 based on linear power.

In this embodiment, the memory module 1 further includes at least one power management chip 6 (Power Management IC), which is disposed on the first side and the second side of the circuit board 2 and is connected via wiring circuits in the circuit board 2 Connected to the power input port 5 and a plurality of memory chips 3 to receive linear power through the power input port 5 and divide the linear power, for example, divide the 5V linear power into 2.5V, 1.2V and 0.6V. , to supply power to the corresponding memory chips 3 respectively. In this embodiment, one of the plurality of signal input pins 4 is a trigger pin for receiving a sleep signal or a trigger signal in the control signal to perform sleep control or wake-up control on the corresponding memory chip. Then the corresponding memory chip enters the sleep state or changes from the sleep state to the awake state.

To sum up, the memory module in this case uses the signal input pin and the power input port to receive the control signal and linear power respectively. Since the linear power has the characteristics of less fluctuation, compared with the traditional memory module that uses a single input The port receives signals and switched power at the same time. The linear power received by the memory module in this case has the advantage of lower noise, and the memory module in this case also has lower noise when it receives linear power. Therefore, the memory in this case The body module has higher stability and higher frequency, and can even reach overclocking levels, thus improving the performance of the memory module in this case.

1: Memory module 2:Circuit board 21: First side 22: Second side 23:Third side 24:Fourth side 3: Memory chip 4: Signal input pin 5:Power input port 6:Power management chip 7: Linear power supply

Figure 1 is a structural top view of the memory module in this case. Figure 2 is a structural bottom view of the memory module shown in Figure 1 .

1: Memory module

2:Circuit board

21: First side

22: Second side

23:Third side

24:Fourth side

3: Memory chip

4: Signal input pin

5:Power input port

6: Power management chip

7: Linear power supply

Claims (8)

A memory module containing: a circuit board; At least one memory chip is disposed on the circuit board; At least one signal input pin is provided on the circuit board for receiving a control signal. The signal input pin is electrically connected to the at least one memory chip through wiring in the circuit board, so that the memory chip The module controls the at least one memory chip; and A power input port is provided on the circuit board for receiving at least one linear power. The power input port is electrically connected to the at least one memory chip through wiring in the circuit board, so that the memory module Power is supplied to the at least one memory chip. The memory module of claim 1, wherein the at least one linear power is provided by a linear power supply. The memory module as described in claim 1, wherein the power input port includes a USB type-A, USB type-B or USB type-C port. The memory module as described in claim 1, wherein the memory module is a dynamic random access memory module or a solid state hard drive module. The memory module of claim 1, wherein the at least one memory chip includes a volatile memory chip or a non-volatile memory chip. The memory module as claimed in claim 1, wherein the memory module further includes at least one power management chip, which is disposed on the circuit board and is electrically connected to the power input port through wiring in the circuit board. The corresponding memory chips receive the at least one linear power and convert the at least one linear power into the voltage required by the memory chip for power supply. The memory module of claim 1, wherein one of the at least one signal input pin is a trigger pin for receiving a sleep signal or a trigger signal in the control signal to respond to the corresponding The memory chip performs sleep control or wake-up control. The memory module of claim 1, wherein the power input port and the at least one signal input pin are spaced apart.