TWI829746B - 顯示裝置、顯示模組、電子裝置及顯示裝置的製造方法 - Google Patents

顯示裝置、顯示模組、電子裝置及顯示裝置的製造方法 Download PDF

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TWI829746B
TWI829746B TW108130547A TW108130547A TWI829746B TW I829746 B TWI829746 B TW I829746B TW 108130547 A TW108130547 A TW 108130547A TW 108130547 A TW108130547 A TW 108130547A TW I829746 B TWI829746 B TW I829746B
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layer
light
oxide
conductive layer
insulating layer
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TW108130547A
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TW202025112A (zh
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山崎舜平
楠紘慈
江口晋吾
池田𨺓之
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日商半導體能源研究所股份有限公司
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)
  • Manufacturing & Machinery (AREA)
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TW108130547A 2018-09-05 2019-08-27 顯示裝置、顯示模組、電子裝置及顯示裝置的製造方法 TWI829746B (zh)

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JP2018-166335 2018-09-05
JP2018166336 2018-09-05
JP2018166335 2018-09-05
JP2018-166336 2018-09-05

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TWI829746B true TWI829746B (zh) 2024-01-21

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US (2) US11908850B2 (https=)
JP (3) JP7517989B2 (https=)
KR (2) KR102923228B1 (https=)
CN (2) CN112639937B (https=)
TW (2) TWI829746B (https=)
WO (1) WO2020049392A1 (https=)

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JP7313358B2 (ja) 2018-09-07 2023-07-24 株式会社半導体エネルギー研究所 表示装置、表示モジュール、及び電子機器
KR20200091818A (ko) * 2019-01-23 2020-07-31 소후 인코포레이티드 도포성이 우수한 치과용 도재 페이스트
WO2020217959A1 (ja) * 2019-04-23 2020-10-29 京セラ株式会社 マイクロｌｅｄ素子基板および表示装置
KR20220017474A (ko) 2019-06-07 2022-02-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 복합 디바이스
US11710760B2 (en) 2019-06-21 2023-07-25 Semiconductor Energy Laboratory Co., Ltd. Display device, display module, electronic device, and manufacturing method of display device
CN114402441A (zh) * 2019-09-20 2022-04-26 德国亚琛工业大学 用于初始化量子点的部件
CN114641816A (zh) 2019-11-21 2022-06-17 株式会社半导体能源研究所 显示装置、显示模块、电子设备及显示装置的制造方法
KR102882579B1 (ko) * 2020-04-27 2025-11-07 삼성디스플레이 주식회사 표시 장치 및 그의 제조 방법
CN115699140B (zh) * 2020-06-18 2024-12-20 日亚化学工业株式会社 图像显示装置的制造方法以及图像显示装置
FR3112902B1 (fr) * 2020-07-22 2022-12-16 Aledia Dispositif optoélectronique flexible et son procédé de fabrication
JP7619013B2 (ja) * 2020-11-17 2025-01-22 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法および電子機器
JP7621783B2 (ja) * 2020-12-10 2025-01-27 スタンレー電気株式会社 半導体発光装置及び半導体発光素子の支持基板
KR20230145080A (ko) 2021-02-12 2023-10-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 전자 기기
CN115148887A (zh) * 2021-03-31 2022-10-04 中强光电股份有限公司 发光二极管线路基板及其制造方法
US20240257671A1 (en) 2021-05-13 2024-08-01 Semiconductor Energy Laboratory Co., Ltd. Electronic device
JP7652632B2 (ja) 2021-06-09 2025-03-27 株式会社ジャパンディスプレイ 表示装置及び表示装置の製造方法
JPWO2023017362A1 (https=) 2021-08-12 2023-02-16
CN114068610B (zh) * 2021-12-16 2024-11-22 宁波升谱光电股份有限公司 一种功率开关器件及其制作方法
CN114388486B (zh) * 2021-12-16 2025-07-11 Tcl华星光电技术有限公司 显示面板及其制作方法
WO2023225805A1 (zh) * 2022-05-23 2023-11-30 京东方科技集团股份有限公司 显示面板及显示装置
JP7801972B2 (ja) * 2022-08-31 2026-01-19 株式会社ジャパンディスプレイ Ｌｅｄ実装基板及びその製造方法
US20240188330A1 (en) * 2022-12-01 2024-06-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display apparatus, and driving method of semiconductor device

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