TWI826750B - Optical path adjusting mechanism and manufacturing method thereof - Google Patents
Optical path adjusting mechanism and manufacturing method thereof Download PDFInfo
- Publication number
- TWI826750B TWI826750B TW109141869A TW109141869A TWI826750B TW I826750 B TWI826750 B TW I826750B TW 109141869 A TW109141869 A TW 109141869A TW 109141869 A TW109141869 A TW 109141869A TW I826750 B TWI826750 B TW I826750B
- Authority
- TW
- Taiwan
- Prior art keywords
- base
- rotating
- coil
- rotating shaft
- optical path
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 71
- 230000007246 mechanism Effects 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000696 magnetic material Substances 0.000 claims abstract description 49
- 238000003384 imaging method Methods 0.000 description 87
- 238000006073 displacement reaction Methods 0.000 description 73
- 238000010146 3D printing Methods 0.000 description 40
- 238000010586 diagram Methods 0.000 description 29
- 239000000463 material Substances 0.000 description 25
- 238000006243 chemical reaction Methods 0.000 description 12
- 238000011960 computer-aided design Methods 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 8
- 230000005389 magnetism Effects 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 230000006698 induction Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/142—Adjusting of projection optics
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/28—Reflectors in projection beam
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Abstract
Description
本發明是有關於一種光路調整機構及其製造方法。 The invention relates to an optical path adjustment mechanism and a manufacturing method thereof.
隨著科技的日益發展,許多利用逐層建構模型等加成式製造技術(Additive Manufacturing technology)來建造物理三維(Three-Dimensional,3-D)模型的不同方法已紛紛被提出。一般而言,加成式製造技術是將利用電腦輔助設計(Computer-Aided Design,CAD)等軟體建構的3-D模型的設計資料轉換為連續堆疊的多個薄(准二維)橫截面層。然而,透過上述三維列印技術所列印出來的物體的表面精度仍無法符合市場需求,因此如何進一步地提升其所列印出來的物體的表面精度一直是本領域的技術人員所要解決的問題。 With the increasing development of science and technology, many different methods of building physical three-dimensional (3-D) models using additive manufacturing technology such as layer-by-layer construction models have been proposed. Generally speaking, additive manufacturing technology converts design data from 3-D models constructed using software such as Computer-Aided Design (CAD) into continuously stacked multiple thin (quasi-two-dimensional) cross-sectional layers. . However, the surface accuracy of objects printed by the above three-dimensional printing technology still cannot meet market demand. Therefore, how to further improve the surface accuracy of printed objects has always been a problem that those skilled in the art have to solve.
本發明提供一種光路調整機構及其製造方法,可使三維列印裝置列印出來的三維列印物件具有良好的表面精度。 The present invention provides an optical path adjustment mechanism and a manufacturing method thereof, which can enable three-dimensional printing objects printed by a three-dimensional printing device to have good surface accuracy.
本發明的實施例提供一種光路調整機構,包括承載基座、旋轉基座、光學元件、線圈、以及磁性材料。旋轉基座設於鄰近承載基座。旋轉基座設有大致對角位置的第一區域與第二區域。旋轉基座包括承載座和轉軸。光學元件設於承載座。線圈設於旋轉基座。磁性材料設於承載基座且鄰近線圈。承載座和轉軸為一體成型,且旋轉基座只沿虛擬軸線轉動。 Embodiments of the present invention provide an optical path adjustment mechanism, including a carrying base, a rotating base, optical elements, coils, and magnetic materials. The rotating base is located adjacent to the carrying base. The rotating base is provided with a first area and a second area at substantially diagonal positions. The rotating base includes a bearing base and a rotating shaft. The optical element is arranged on the bearing base. The coil is installed on the rotating base. The magnetic material is disposed on the carrying base and adjacent to the coil. The bearing base and the rotating shaft are integrally formed, and the rotating base only rotates along the virtual axis.
本發明的實施例提供一種光路調整機構的製造方法,其包括提供承載基座;組裝旋轉基座於鄰近承載基座,旋轉基座設有大致對角位置的第一區域與第二區域,旋轉基座包括承載座和轉軸;組裝光學元件於承載座;組裝線圈於旋轉基座;以及組裝磁性材料,於承載基座且鄰近線圈。承載座和轉軸為一體成型,且旋轉基座只沿虛擬軸線轉動。 Embodiments of the present invention provide a manufacturing method of an optical path adjustment mechanism, which includes providing a bearing base; assembling a rotating base adjacent to the bearing base, and the rotating base is provided with a first region and a second region at approximately diagonal positions. The base includes a bearing base and a rotating shaft; the optical element is assembled on the bearing base; the coil is assembled on the rotating base; and the magnetic material is assembled on the bearing base and adjacent to the coil. The bearing base and the rotating shaft are integrally formed, and the rotating base only rotates along the virtual axis.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, embodiments are given below and described in detail with reference to the accompanying drawings.
100、200:光學裝置 100, 200: Optical device
110、210:照明系統 110, 210: Lighting system
112、212:光源 112, 212: light source
114、214:光束 114, 214: Beam
114a、214a、500:子影像 114a, 214a, 500: sub-image
116、216:色輪 116, 216: color wheel
117、217:集光柱 117, 217: Light collecting column
118、218:鏡片組 118, 218: Lens set
119:內部全反射稜鏡 119: Internal total reflection
120:數位微鏡裝置 120:Digital micromirror device
130、230:投影鏡頭 130, 230: Projection lens
140、242、244、246:振動機構 140, 242, 244, 246: Vibration mechanism
219:稜鏡 219:稜顡
220:反射式光閥 220: Reflective light valve
240、1000a、1000b、1000c、1000d、1000e、1940:成像位移模組 240, 1000a, 1000b, 1000c, 1000d, 1000e, 1940: imaging displacement module
242a、244a、322、422:光學元件部 242a, 244a, 322, 422: Optical component department
410、1100:承載基座 410, 1100: Bearing base
412:磁性材料座 412: Magnetic material seat
414a、414b、M1、M2、M3、M4、M5、M6:磁性材料 414a, 414b, M1, M2, M3, M4, M5, M6: magnetic materials
420、1200:旋轉基座 420, 1200: Rotating base
424:承載座 424: Bearing seat
426、427a、427b、C1、C2、C3、C4、C5、C6:線圈模組 426, 427a, 427b, C1, C2, C3, C4, C5, C6: coil module
426a:線圈座 426a: Coil seat
426b:線圈 426b: coil
428:轉軸 428:Rotating axis
430:軸線 430:Axis
432:孔洞 432:hole
400:螢幕 400:Screen
1110、1120:第一承載框 1110, 1120: First carrying frame
1300、1311、1312:彈性件 1300, 1311, 1312: elastic parts
1310、1320:彈性件對 1310, 1320: Pair of elastic parts
1400、1410、1420:致動組件 1400, 1410, 1420: Actuation assembly
1500:光學元件部 1500: Optical components department
1610、1620:轉軸 1610, 1620: rotating shaft
1900a、1900b:三維列印裝置 1900a, 1900b: 3D printing device
1910:成型槽 1910: Forming slot
1912:光敏感材料 1912:Light sensitive materials
1920:投影裝置 1920:Projection device
1930:升降載台 1930:Lifting platform
1932:列印區 1932:Print area
X、Y、XY1、XY2、Z、X’、Y’、X’Y’1、X’Y’2、X”、Y”:方向 X, Y, XY1, XY2, Z, X’, Y’, X’Y’1, X’Y’2, X”, Y”: direction
S:參考平面 S: reference plane
w、NW:寬度 w, NW: width
t:厚度 t:Thickness
B:影像光束 B:Image beam
OB:三維列印物件 OB: 3D printing object
圖1為一種光學裝置的結構示意圖。 Figure 1 is a schematic structural diagram of an optical device.
圖2繪示本發明一實施例之光學裝置的結構示意圖。 FIG. 2 is a schematic structural diagram of an optical device according to an embodiment of the present invention.
圖3繪示本發明一實施例之光學裝置的成像示意圖。 FIG. 3 is a schematic diagram of imaging of an optical device according to an embodiment of the present invention.
圖4繪示本發明一實施例之成像位移模組的結構示意圖。 FIG. 4 is a schematic structural diagram of an imaging displacement module according to an embodiment of the present invention.
圖5繪示本發明圖4實施例之沿D-D虛線方向的剖面側視圖。 FIG. 5 is a cross-sectional side view along the dotted line D-D of the embodiment of FIG. 4 of the present invention.
圖6繪示本發明圖4實施例之沿A-A虛線方向的剖面側視圖。 FIG. 6 shows a cross-sectional side view along the dotted line A-A of the embodiment of FIG. 4 of the present invention.
圖7繪示本發明另一實施例之成像位移模組的結構示意圖。 FIG. 7 is a schematic structural diagram of an imaging displacement module according to another embodiment of the present invention.
圖8繪示本發明圖7實施例之沿D-D虛線方向的剖面側視圖。 FIG. 8 is a cross-sectional side view along the dotted line D-D of the embodiment of FIG. 7 of the present invention.
圖9繪示本發明圖7之沿A-A虛線方向的剖面側視圖。 FIG. 9 shows a cross-sectional side view along the dashed line A-A in FIG. 7 of the present invention.
圖10A、圖11A、圖12A分別繪示本發明不同實施例之成像位移模組的結構示意圖。 FIG. 10A , FIG. 11A , and FIG. 12A are respectively schematic structural diagrams of imaging displacement modules according to different embodiments of the present invention.
圖10B、圖11B、圖12B分別繪示圖10A、圖11A、圖12A實施例之成像位移模組的上視圖。 Figures 10B, 11B, and 12B respectively illustrate top views of the imaging displacement module in the embodiments of Figures 10A, 11A, and 12A.
圖10C、圖11C、圖12C分別繪示圖10A、圖11A、圖12A實施例之成像位移模組的剖面側視圖。 10C, 11C, and 12C respectively illustrate cross-sectional side views of the imaging displacement module according to the embodiments of FIGS. 10A, 11A, and 12A.
圖13A繪示本發明一實施例之子影像移動方向概要示意圖。 FIG. 13A is a schematic diagram illustrating the moving direction of the sub-image according to an embodiment of the present invention.
圖13B和圖13C繪示圖13A實施例之子影像的成像位移結果的概要示意圖。 13B and 13C are schematic diagrams illustrating the imaging displacement results of the sub-image in the embodiment of FIG. 13A.
圖14A繪示本發明另一實施例之子影像的移動方向和成像位置的概要示意圖。 FIG. 14A is a schematic diagram illustrating the moving direction and imaging position of the sub-image according to another embodiment of the present invention.
圖14B繪示圖14A實施例之旋轉基座在一圖框時間中相對不同方向旋轉時,其子影像的成像位置的概要對照圖。 FIG. 14B is a schematic comparison diagram of the imaging positions of the sub-images when the rotating base of the embodiment of FIG. 14A is rotated in different directions within a frame time.
圖15繪示本發明另一實施例之成像位移模組的結構立體示意圖。 FIG. 15 is a schematic structural perspective view of an imaging displacement module according to another embodiment of the present invention.
圖16A繪示本發明另一實施例之子影像的移動方向的概要示意圖。 FIG. 16A is a schematic diagram illustrating the moving direction of a sub-image according to another embodiment of the present invention.
圖16B繪示圖16A實施例之子影像成像位置概要示意圖。 FIG. 16B is a schematic diagram illustrating the sub-image imaging position of the embodiment in FIG. 16A.
圖17A及圖17B分別繪示本發明不同實施例之成像位移模組應用於投影鏡頭內部的立體示意圖。 17A and 17B are respectively schematic three-dimensional views of the imaging displacement module applied inside the projection lens according to different embodiments of the present invention.
圖18A繪示本發明一實施例成像位移模組結構立體示意圖。 FIG. 18A is a schematic three-dimensional structural view of an imaging displacement module according to an embodiment of the present invention.
圖18B及圖18C分別繪示圖18A實施例之成像位移模組的第一彈性件的結構立體示意圖及其振幅與時間的關係圖。 18B and 18C are respectively a schematic structural perspective view of the first elastic member of the imaging displacement module in the embodiment of FIG. 18A and a diagram of its amplitude versus time.
圖18D繪示第一彈性件其振幅與時間的關係圖。 FIG. 18D illustrates the relationship between the amplitude of the first elastic member and time.
圖19A與圖19B分別繪示應用本發明上述任一實施例的成像位移模組的不同三維列印裝置示意圖。 19A and 19B respectively illustrate different schematic diagrams of three-dimensional printing devices using the imaging displacement module according to any of the above embodiments of the present invention.
圖19C繪示由圖19A或圖19B的不同三維列印裝置所三維列印出的三維列印物件示意圖。 FIG. 19C is a schematic diagram of a 3D printed object 3D printed by different 3D printing devices of FIG. 19A or 19B.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之多個實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如「上」、「下」、「前」、「後」、「左」、「右」等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明,而非用來限制本發明。 The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of multiple embodiments with reference to the drawings. Directional terms mentioned in the following embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only for reference to the directions in the attached drawings. Accordingly, the directional terms used are intended to illustrate and not to limit the invention.
圖1繪示一種光學裝置的結構示意圖。請參照圖1,光學裝置100包括照明系統110、數位微鏡裝置120、投影鏡頭130以及振動機構140。其中,照明系統110具有光源112,其適於提供光束114,且數位微鏡裝置120配置光束114的傳遞路徑上。此數位微鏡裝置120適於將光束114轉換為多數個子影像114a。此外,
投影鏡頭130配置於這些子影像114a的傳遞路徑上,且數位微鏡裝置120係位於照明系統110與投影鏡頭130之間。另外,振動機構140配置於數位微鏡裝置120與投影鏡頭130之間,且位於這些子影像114a的傳遞路徑上。
Figure 1 shows a schematic structural diagram of an optical device. Referring to FIG. 1 , the
上述之光學裝置100中,光源112所提供的光束114會依序經過色輪(color wheel)116、集光柱(light integration rod)117、鏡片組118及內部全反射稜鏡(TIR Prism)119。之後,內部全反射稜鏡119會將光束114反射至數位微鏡裝置120。此時,數位微鏡裝置120會將光束114轉換成多數個子影像114a,而這些子影像114a會依序通過內部全反射稜鏡119及振動機構140,並經由投影鏡頭130將這些子影像114a投影於螢幕400上。
In the above-mentioned
當這些子影像114a經過振動機構140時,振動機構140會改變部分這些子影像114a的傳遞路徑。也就是說,通過此振動機構140的這些子影像114a會投影在螢幕400上的第一位置(未繪示),另一部份時間內通過此振動機構140的這些子影像114a則會投影在螢幕400上的第二位置(未繪示),其中第一位置與第二位置係在水平方向(X軸)或垂直方向(Z軸)上相差一固定距離。由於振動機構140僅能使這些子影像114a之成像位置在水平方向或垂直方向上移動一固定距離,因此能提高影像之水平解析度或垂直解析度。
When these
圖2係繪示依照本發明一實施例所述之一種光學裝置的結構示意圖。請參照圖2,本實施例之光學裝置200包括照明系統
210、反射式光閥220、投影鏡頭230、成像位移模組240以及螢幕400。其中,照明系統210具有光源212,其適於提供光束214,且反射式光閥220配置光束214的傳遞路徑上。此反射式光閥220適於將光束214轉換為多數個子影像214a。此外,投影鏡頭230配置於這些子影像214a的傳遞路徑上,且反射式光閥220係位於照明系統210與投影鏡頭230之間。
FIG. 2 is a schematic structural diagram of an optical device according to an embodiment of the present invention. Please refer to Figure 2. The
圖3繪示本實施例中,本實施例之光學裝置的成像示意圖。當子影像214a經過成像位移模組240時,成像位移模組240會改變部分這些子影像214a的傳遞路徑。也就是說,通過此成像位移模組240的這些子影像214a會投影在螢幕400上的第一位置(實線方格),而另一部份時間內通過此成像位移模組240的這些子影像214a則會投影在螢幕400上的第二位置(虛線方格),因此能同時提高影像之水平解析度及垂直解析度。上述之照明系統210例如是遠心照明系統或非遠心照明系統。此外,反射式光閥220例如是數位微鏡裝置或單晶矽反射式液晶面板,本實施例中係以數位微鏡裝置為例。上述之光源212提供的光束214會依序經過色輪216、集光柱217、鏡片組218及稜鏡219,而稜鏡219會將光束214反射至反射式光閥220。此時,反射式光閥220會將光束214轉換成多數個子影像214a,而這些子影像214a會依序通過成像位移模組240、稜鏡219或是依序通過稜鏡219、成像位移模組240,並經由投影鏡頭230將這些子影像214a投影於螢幕400上。應注意的是,若使用不同顏色的LED當光源212,則色輪216可
被省略。另外,也可使用微透鏡陣列(lens array)取代集光柱217進行光均勻化。
FIG. 3 is a schematic diagram of imaging of the optical device in this embodiment. When the sub-images 214a pass through the
圖4、5、6分別繪示本發明一實施例之成像位移模組的結構立體示意圖、沿D-D虛線方向的剖面側視圖、以及沿A-A虛線方向的剖面側視圖。請參照圖4、5、6,本實施例中,成像位移模組240包括承載基座410及旋轉基座420。其中,旋轉基座420樞接於承載基座410上,且承載基座410適於控制旋轉基座420於一特定角度θ(未繪示)內來回振動。此旋轉基座420具有光學元件部422,此光學元件部422係位於上述這些子影像214a(如圖2中所示)的傳遞路徑上。而且,當旋轉基座420於此特定角度θ內來回振動時,此光學元件部422可使這些子影像214a之成像位置於一軸線430上移動一距離。換言之,成像位移模組240(如圖4中所示)之光學元件部422可使這些子影像214a之成像位置同時在水平方向(X軸)和在垂直方向(Z軸)上各移動一距離。
4, 5, and 6 respectively illustrate a schematic structural perspective view of an imaging displacement module according to an embodiment of the present invention, a cross-sectional side view along the dashed line D-D, and a cross-sectional side view along the dashed line A-A. Please refer to Figures 4, 5, and 6. In this embodiment, the
上述之成像位移模組240中,承載基座410例如包括磁性材料座412、兩磁性材料414a、414b以及感應模組(未繪示)。旋轉基座420例如包括光學元件部422、承載座424、線圈模組426以及轉軸428。轉軸428上下兩端係藉由孔洞432而樞接於底座(未繪示)上。此外,感應模組配置於承載基座410上,而線圈模組426配置於旋轉基座420上,且感應模組係藉由線圈模組426控制旋轉基座420於此特定角度θ內來回振動。更詳細地說,承載基座410中例如具有磁性材料414a、414b,且感應模組係藉由改變
線圈模組426之磁性,使線圈模組426與磁性材料414之間產生吸引力及排斥力兩者至少其中之一,以控制旋轉基座420於此特定角度θ內來回振動,進而改變上述這些子影像214a之成像位置。
In the above-mentioned
本發明一實施例中,感應模組例如包括電路板(未繪示)以及感應器(未繪示)。其中,電路板配置於底座上,而感應器配置於承載基座上。此感應器係用以感應旋轉基座之轉軸428擺動幅度,當轉軸428向磁性材料414a擺動一定幅度時,電路板會改變線圈模組426之磁性,使線圈模組426與磁性材料414a之間產生排斥力(使線圈模組426與磁性材料414b之間產生吸引力),進而使線圈模組426遠離磁性材料414a。而當轉軸428向磁性材料414b擺動一定幅度時,電路板會改變線圈模組426之磁性,使線圈模組426與磁性材料414b之間產生排斥力(使線圈模組426與磁性材料414a之間產生吸引力),進而使線圈模組426遠離磁性材料414b。藉由使線圈模組426貼近/遠離或遠離/貼近磁性材料414a/414b,可使旋轉基座420於此特定角度θ內來回振動,進而改變上述這些子影像214a之成像位置。
In one embodiment of the present invention, the sensing module includes, for example, a circuit board (not shown) and a sensor (not shown). Among them, the circuit board is arranged on the base, and the sensor is arranged on the carrying base. This sensor is used to sense the swing amplitude of the
上述之成像位移模組240中,線圈模組426例如包括線圈座426a以及線圈426b。其中,線圈426b係圍繞於線圈座426a上,電路板例如係藉由改變線圈426b中電流之方向,而使線圈模組426改變磁性。值得注意的是,在本實施例中,可藉由射出模具使旋轉基座420之轉軸428與光學元件部422一體成型。而在一實施例中,也可將旋轉基座420之轉軸428與光學元件部422是
分開製造,再將光學元件部422與轉軸428組裝在一起。此外,光學元件部422可為一反射片或一透鏡。
In the above-mentioned
圖7、8、9分別繪示本發明另一實施例之成像位移模組的結構立體示意圖、沿D-D虛線方向的剖面側視圖、以及沿A-A虛線方向的剖面側視圖。與圖4、5、6之實施例不同點在於,圖4中轉軸428上下兩端分別為水平和垂直配置,而本實施例將轉軸428上下兩端係水平配置。此外,本實施例將線圈模組分成兩部分427a、427b。當轉軸428向磁性材料414a擺動一定幅度時,電路板會改變線圈模組427a、427b之磁性,使線圈模組427a與磁性材料414a之間產生排斥力,同時使線圈模組427b與磁性材料部414b之間產生吸引力,進而使線圈模組427a遠離磁性材料414a。而當轉軸428向磁性材料414b擺動一定幅度時,電路板會改變線圈模組427a、427b之磁性,使線圈模組427b與磁性材料414b之間產生排斥力,同時使線圈模組427a與磁性材料部414a之間產生吸引力,進而使線圈模組427b遠離磁性材料414b。藉由使線圈模組427a、427b貼近/遠離或遠離/貼近磁性材料414a/414b,可使旋轉基座420於此特定角度θ內來回振動,進而改變上述這些子影像214a之成像位置。
7 , 8 , and 9 respectively illustrate a schematic structural perspective view of an imaging displacement module according to another embodiment of the present invention, a cross-sectional side view along the dotted line D-D, and a cross-sectional side view along the dotted line A-A. The difference from the embodiments in Figures 4, 5, and 6 is that in Figure 4, the upper and lower ends of the
圖10A繪示本發明另一實施例之成像位移模組的結構立體示意圖。圖10B繪示圖10A實施例的上視圖。圖10C繪示圖10A實施例的剖面側視圖。請先參照圖10A、圖10B以及圖10C,在本實施例中,成像位移模組1000a包括承載基座1100以及旋轉
基座1200。旋轉基座1200經由至少一彈性件1300耦接至承載基座1100。承載基座1100適於控制旋轉基座1200相對於參考平面S的雙軸旋轉。在本實施例中,參考平面S的雙軸例如為第一方向X上的第一轉軸1610以及第二方向Y上的第二轉軸1620。第一轉軸1610以及第二轉軸1620的夾角為90度,並且第一轉軸1610以及第二轉軸1620定義出參考平面S。承載基座1100以及旋轉基座1200相對於第一轉軸1610對稱。旋轉基座1200相對於第一轉軸1610以及第二轉軸1620兩者之至少其中之一旋轉。
FIG. 10A is a schematic structural perspective view of an imaging displacement module according to another embodiment of the present invention. Figure 10B illustrates a top view of the embodiment of Figure 10A. Figure 10C illustrates a cross-sectional side view of the embodiment of Figure 10A. Please refer to Figure 10A, Figure 10B and Figure 10C. In this embodiment, the
另一方面,在本實施例中,成像位移模組1000a更包括光學元件部1500。光學元件部1500設置在旋轉基座1200上。光學元件部包括反射鏡或透鏡。
On the other hand, in this embodiment, the
在本實施例中,至少一彈性件包括一第一彈性件對1310以及一第二彈性件對1320。承載基座1100包括第一承載框1110以及第二承載框1120,第一承載框1110設置於第二承載框1120上。第二承載框1120環繞第一承載框1110。第一承載框1110經由第一彈性件對1310耦接至旋轉基座1200,第二承載框1120經由第二彈性件對1320耦接至第一承載框1110。第一彈性件對1310沿雙軸的其中之一轉軸1620設置在第一承載框1110的相對兩側,第二彈性件對1320沿雙軸的其中之另一轉軸1610設置在第二承載框1120之相對兩側。
In this embodiment, at least one elastic member includes a first
在本實施例中,至少一彈性件1300為彈簧。於其他實施例中,至少一彈性件1300也可以是其他彈性可變形的物體,如板
金件、薄金屬、扭轉彈簧或者塑膠,本發明並不以此為限。
In this embodiment, at least one
在本實施例中,成像位移模組1000a更包括多個致動組件1400。這些多個致動組件1400設置在至少承載基座1100及旋轉基座1200兩者其中之一。承載基座1100係利用這些致動組件1400控制旋轉基座1200相對於參考平面S的雙軸旋轉。
In this embodiment, the
更具體來說,在本實施例中,這些多個致動組件1400包括第一致動組件1410以及第二致動組件1420。第一致動組件1410設置在承載基座1100上,沿著第二方向Y排列。承載基座1100利用第二致動組件1420控制旋轉基座1200相對於第二轉軸1620旋轉,此時旋轉基座1200與第一承載框1110同時相對於第二承載框1120旋轉。另一方面,第二致動組件1420設置在承載基座1100上,沿著第一方向X排列。承載基座1100利用第二致動組件1420控制旋轉基座1200相對於第二轉軸1620旋轉,此時旋轉基座1200相對於第一承載框1110旋轉。
More specifically, in this embodiment, the plurality of
在本實施例中,第一致動組件1410包括兩個磁性材料M1、M2以及一個線圈模組C1。磁性材料M1、M2對稱第一轉軸1610設置於承載基座1100。線圈模組C1設置於承載基座1100上,並且線圈模組C1位於磁性材料M1、M2之間。第二致動組件1420包括兩個磁性材料M3、M4以及兩個線圈模組C2、C3。兩個磁性材料M3、M4對稱第二轉軸1620設置於承載基座1100上。兩個線圈模組C2、C3對稱第二轉軸1620設置於光學元件部1500上。兩個線圈模組C2、C3位於兩個磁性材料M3、M4之間。磁性材
料M3、M4與線圈模組C2、C3沿著第一方向X排列。值得一提的是,本實施例的成像位移模組1000a所使用的線圈總長度最小,其轉動慣量最小。
In this embodiment, the
具體而言,在本實施例中,感應模組(未繪示)藉由改變線圈模組C1、C2、C3的磁性,以控制旋轉基座1200相對於參考平面S的雙軸旋轉。感應模組(未繪示)包括電路板以及感應器。感應器係用以感應第一轉軸1610以及第二轉軸1620的擺動幅度。當第一轉軸1610或第二轉軸1620的擺動一定幅度時,電路板藉由改變線圈模組C1、C2、C3上的電流方向,使線圈模組C1、C2、C3改變磁性。因此,線圈模組C1、C2、C3與磁性材料M1、M2、M3、M4之間產生排斥力或吸引力,使線圈模組C1、C2、C3遠離或靠近磁性材料M1、M2、M3、M4,進而控制旋轉基座1200相對於參考平面S的雙軸旋轉。
Specifically, in this embodiment, the induction module (not shown) controls the biaxial rotation of the rotating
在本實施例中,多個致動組件包括磁性材料及線圈所構成。於其他實施例中,這些致動組件也可以是利用壓電材料或者步進馬達來達到如同本實施例中的致動效果,本發明不以此為限。 In this embodiment, the plurality of actuating components include magnetic materials and coils. In other embodiments, these actuating components may also use piezoelectric materials or stepper motors to achieve the same actuating effect as in this embodiment, and the invention is not limited thereto.
在此必須說明的是,下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。 It must be noted here that the following embodiments follow the component numbers and part of the content of the previous embodiments, where the same numbers are used to represent the same or similar elements, and descriptions of the same technical content are omitted. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be repeated in the following embodiments.
圖11A繪示本發明另一實施例之成像位移模組的結構立體示意圖。圖11B繪示圖11A實施例之成像位移模組的上視圖。
圖11C繪示圖11A實施例之成像位移模組的剖面側視圖。請同時參考圖11A、圖11B以及圖11C,本實施例的成像位移模組1000b與成像位移模組1000a主要的差異是在於:本實施例的第二致動組件1420中的線圈模組C4設置在旋轉基座1200上,並且線圈模組C4環繞旋轉基座1200的光學元件部1500。值得一提的是,本實施例的所使用到的線圈數量少,製程上相對來說較為簡單。
FIG. 11A is a schematic structural perspective view of an imaging displacement module according to another embodiment of the present invention. FIG. 11B shows a top view of the imaging displacement module of the embodiment of FIG. 11A.
FIG. 11C shows a cross-sectional side view of the imaging displacement module of the embodiment of FIG. 11A. Please refer to FIG. 11A, FIG. 11B and FIG. 11C at the same time. The main difference between the
圖12A繪示本發明另一實施例之成像位移模組的結構立體示意圖。圖12B繪示圖12A實施例之成像位移模組的上視圖。圖12C繪示圖12A實施例之成像位移模組的剖面側視圖。請同時參考圖12A、圖12B以及圖12C,本實施例的成像位移模組1000c與成像位移模組1000a主要的差異例如如下。在本實施例中,承載基座1100以及旋轉基座1200除了相對於第一轉軸1610對稱之外還相對於第二轉軸1620對稱。在本實施例中,第一彈性件對1310沿著第一轉軸1610設置在第二承載框1120之相對兩側,第二彈性件對1320沿著第二轉軸1620設置在第一承載框1110的相對兩側。此外,在本實施例中,第一致動組件1410包括兩個磁性材料M5、M6以及兩個線圈模組C5、C6。磁性材料M5、M6皆對稱於第一轉軸1610,並設置在承載基座1100上。線圈模組C5、C6皆對稱於第一轉軸1610,並設置在光學元件部1500上。磁性材料M5、M6以及線圈模組C5、C6沿著第二方向排列,線圈模組C5、C6位於磁性材料M5、M6之間。
FIG. 12A is a schematic structural perspective view of an imaging displacement module according to another embodiment of the present invention. FIG. 12B shows a top view of the imaging displacement module of the embodiment of FIG. 12A. FIG. 12C shows a cross-sectional side view of the imaging displacement module of the embodiment of FIG. 12A. Please refer to FIG. 12A, FIG. 12B and FIG. 12C at the same time. The main differences between the
在本實施例中,第一致動組件1410與第二致動組件1420
分別對稱於第一轉軸1610以及第二轉軸1620配置。也就是說,本實施例的成像位移模組1000c的第一致動組件1410以及第二致動組件1420具有高度對稱性,馬達可以設定相同出力,控制上較為容易。再者,第一致動組件1410以及第二致動組件1420相對於前述的實施例具有較長的力臂,因此啟動成像位移模組1000c的所需的力量相對較小。此外,由於四個磁性材料或四個線圈模組之間距離較遠,相對於前述的實施例來說,彼此之間較不易被干擾。
In this embodiment, the
圖13A繪示本發明一實施例之子影像的移動方向的概要示意圖。圖13B和圖13C繪示圖13A實施例之子影像的成像位移結果的概要示意圖。請同時參照圖13A以及圖13B,在本發明實施例中,成像位移模組適用於光學裝置,成像位移模組切換多個子影像的成像位置,以讓這些子影像500沿多個移動方向的其中之一移動一距離。這些子影像500的位置係依據旋轉基座1200的旋轉方式來決定。具體來說,在本實施例中,當旋轉基座1200相對於第一轉軸1610或第二轉軸1620其中之一旋轉時,這些子影像500的位置例如在圖2的螢幕400上,沿多個移動方向其中之一移動一距離,多個移動方向例如是第一方向X或第二方向Y。在本實施例中,此距離為約0.7倍畫素寬度。因此,這些子影像500由原先的位置(實線方格)可以擺動至四個不同的位置(虛線方格),換言之,可以提高影像解析度至原先的四倍影像解析度。在另一實施例中,請參考圖13C,當旋轉基座1200相對於第一轉軸1610或/且第二轉軸1620旋轉時,這些子影像500可沿多個移動方向例如
是第一方向X、第二方向Y、第三方向XY1及第四方向XY2其中之一移動。更進一步的說,當旋轉基座1200相對於第一轉軸1610及第二轉軸1620同時旋轉時,這些子影像500例如在第三方向XY1或第四方向XY2上移動一距離,其中第三方向XY1及第四方向XY2是介於第一方向X及第二方向Y之間。
FIG. 13A is a schematic diagram illustrating the moving direction of a sub-image according to an embodiment of the present invention. 13B and 13C are schematic diagrams illustrating the imaging displacement results of the sub-image in the embodiment of FIG. 13A. Please refer to FIG. 13A and FIG. 13B at the same time. In the embodiment of the present invention, the imaging displacement module is suitable for an optical device. The imaging displacement module switches the imaging positions of multiple sub-images so that the sub-images 500 move along one of the multiple moving directions. One moves one distance. The positions of these
圖14A繪示本發明另一實施例之子影像的移動方向和成像位置的概要示意圖。圖14B繪示圖14A實施例之旋轉基座在一圖框時間中相對不同方向旋轉時,其子影像的成像位置的概要對照圖。請先參照圖14A,在本實施例中,當旋轉基座相對於第一轉軸或第二轉軸其中之一旋轉時,這些子影像500沿方向X’或Y’其中之一移動。更進一步的說,當旋轉基座相對於第一轉軸及第二轉軸同時旋轉時,這些子影像500在方向X’Y’1或方向X’Y’2其中之一移動一距離,其中方向X’Y’1及方向X’Y’2是介於方向X’及方向Y,之間。
FIG. 14A is a schematic diagram illustrating the moving direction and imaging position of the sub-image according to another embodiment of the present invention. FIG. 14B is a schematic comparison diagram of the imaging positions of the sub-images when the rotating base of the embodiment of FIG. 14A is rotated in different directions within a frame time. Please refer to FIG. 14A first. In this embodiment, when the rotating base rotates relative to one of the first rotating axis or the second rotating axis, the
請再參照圖14A,當旋轉基座相對於第一轉軸及第二轉軸兩者至少其中之一旋轉時,這些子影像500的位置沿方向X’、Y’、X’Y’1及X’Y’2位移的示意圖。具體來說,在本實施例中,這些子影像500在方向X’以及在方向Y’上移動的距離皆為1畫素寬度,這些子影像500在方向X’Y’1或方向X’Y’2上移動的距離約為1.4畫素寬度。
Please refer to FIG. 14A again. When the rotating base rotates relative to at least one of the first rotating axis and the second rotating axis, the positions of these
更詳細的說,在圖14A及14B中,其標記的數字標號1至9分別代表同一子影像於不同的時間下位於不同的位置標號。
數字標號1代表的是子影像500沒有移動的位置。數字標號3、7代表的是子影像500在方向X’上向右或向左移動的位置。數字標號5、9代表的是子影像500在方向Y’上向下或向上移動的位置。數字標號2、6代表的是子影像500在方向X’Y’1上移動的位置。數字標號4、8代表的是子影像500在方向X’Y’2上移動的位置。
To be more specific, in FIGS. 14A and 14B , the labeled
圖14B中的數字標號1所代表的意思是在此時間區間內,這些子影像500在對應圖14A的數字標號1的位置上。同樣地,圖14B中的數字標號2至9所代表的意思是在各個不同時間區間內,這些子影像500在對應圖14A的數字標號2~9的位置上。
The
圖14B的縱軸對應到在不同的時間區間內,子影像500可沿著不同的方向移動(方向X’或/及方向Y’)。舉例而言,當在數字標號為1時,其在方向X’及方向Y’對應的縱軸值皆為0,代表子影像500不往方向X’也不往方向Y’作動。當在數字標號為2時,其在方向X’及方向Y’對應的縱軸值皆為正,代表子影像500由位置1往方向X’和方向Y’之間的方向移動到位置2,也就是方向X’Y’1。當在數字標號為3時,其在方向X’對應的縱軸值為正及方向Y’對應的縱軸值為0,代表子影像500由位置1往方向X’作動到位置3。當在數字標號為4時,其在方向X’對應的縱軸值為正,在方向Y’對應的縱軸值為負,代表的是子影像500由位置1往方向X’和負的方向Y’向量合成的方向作動到位置4,也就是方向X’Y’的反方向。接續的數字標號以此類推,在此不再贅述。應注意的是,在此處僅為舉例這些子影像500可在方向X’、方向
Y’方向X’Y’1或方向X’Y’2上移動的其中一種順序,本發明並不以此為限。另外,子影像500(實線方格)可以在圖14B移動至不同的九個位置(虛線方格),換言之,可以提高影像解析度至原先的九倍影像解析度。
The vertical axis of FIG. 14B corresponds to the fact that the sub-image 500 can move in different directions (direction X' or/and direction Y') in different time intervals. For example, when the numerical label is 1, the corresponding vertical axis values in the direction X' and the direction Y' are both 0, which means that the sub-image 500 does not move in the direction X' nor in the direction Y'. When the digital label is 2, the corresponding vertical axis values in direction X' and direction Y' are both positive, which means that the sub-image 500 moves from
圖15繪示本發明另一實施例之成像位移模組的結構立體示意圖。請參照圖15,在本實施例中,成像位移模組1000d與成像位移模組1000b主要的差異在於:本實施例的第一轉軸1610與第二轉軸1620具有一夾角。舉例而言,本實施例的夾角為45度,也就是說,本發明的範例實施例之第一轉軸1610與第二轉軸1620並不限定於兩者彼此互相垂直。
FIG. 15 is a schematic structural perspective view of an imaging displacement module according to another embodiment of the present invention. Please refer to FIG. 15 . In this embodiment, the main difference between the
圖16A繪示本發明另一實施例之子影像的移動方向的概要示意圖。圖16B繪示圖16A實施例之子影像的成像位置的概要示意圖。請參照圖16A,具體來說,在本實施例中,當旋轉基座相對於第一轉軸或第二轉軸其中之一旋轉時,這些子影像的位置沿方向X”或方向Y”移動一距離。在本實施例中,此距離在沿方向X”時為1倍畫素寬度,沿方向Y”時為約1.1倍畫素寬度。因此,這些子影像由原先的位置(實線方格)可以擺動至四個不同的位置(虛線方格),換言之,可以提高影像解析度至原先的四倍影像解析度。 FIG. 16A is a schematic diagram illustrating the moving direction of a sub-image according to another embodiment of the present invention. FIG. 16B is a schematic diagram illustrating the imaging position of the sub-image in the embodiment of FIG. 16A. Please refer to Figure 16A. Specifically, in this embodiment, when the rotating base rotates relative to one of the first rotating axis or the second rotating axis, the positions of these sub-images move a distance along the direction X” or the direction Y”. . In this embodiment, the distance is 1 times the pixel width along the direction X" and about 1.1 times the pixel width along the direction Y". Therefore, these sub-images can swing from the original position (solid line square) to four different positions (dashed line square). In other words, the image resolution can be increased to four times the original image resolution.
圖17A繪示本發明一實施例之成像位移模組應用於投影鏡頭內部的立體示意圖。圖17B繪示本發明另一實施例之成像位移模組應用於投影鏡頭內部的立體示意圖。請同時參照圖17A以及圖17B,本發明之實施例的成像位移模組也可以置於投影鏡頭 的內部或者投影鏡頭的前方,以使投射出的影像解析度提升為原先四倍的影像解析度。 FIG. 17A is a schematic three-dimensional view of an imaging displacement module applied inside a projection lens according to an embodiment of the present invention. FIG. 17B is a schematic three-dimensional view of an imaging displacement module applied inside a projection lens according to another embodiment of the present invention. Please refer to Figure 17A and Figure 17B at the same time. The imaging displacement module according to the embodiment of the present invention can also be placed on the projection lens. inside or in front of the projection lens, so that the resolution of the projected image is increased to four times the original image resolution.
圖18A繪示本發明一實施例之成像位移模組的結構立體示意圖。圖18B繪示圖18A實施例之成像位移模組的第一彈性件的結構立體示意圖。圖18C繪示圖18A實施例之成像位移模組的第一彈性件之振幅與時間的關係圖。圖18D繪示用以驅動第一彈性件的訊號其振幅與時間的關係圖。 FIG. 18A is a schematic structural perspective view of an imaging displacement module according to an embodiment of the present invention. FIG. 18B is a schematic structural perspective view of the first elastic member of the imaging displacement module according to the embodiment of FIG. 18A. FIG. 18C is a graph showing the relationship between the amplitude and time of the first elastic member of the imaging displacement module of the embodiment of FIG. 18A. FIG. 18D is a diagram illustrating the relationship between the amplitude and time of the signal used to drive the first elastic member.
圖18A的成像位移模組可以由前述實施例之敘述中獲致足夠的教示、建議與實施說明。因此,在圖18A中僅標示下列段落說明所需的元件符號,其他部分不再贅述。此外,由於本實施例中的第一彈性件對1310類似於第二彈性件對1320,因此下列段落係以第一彈性件對1310舉例來說明,第二彈性件對1320的操作方式可以此類推。
The imaging displacement module of FIG. 18A can obtain sufficient teachings, suggestions and implementation instructions from the description of the foregoing embodiments. Therefore, only the component symbols required for the description in the following paragraphs are marked in FIG. 18A , and other parts will not be described again. In addition, since the first
請參照圖18A,舉例而言,在本實施例中,第一彈性件對1310包括第一彈性件1311以及第二彈性件1312。第一彈性件1311以及第二彈性件1312係以彼此垂直的方式沿著本實施例的成像位移模組1000e的第一轉軸1610設置,此配置方式可使第一轉軸1610通過光學元件部1500的軸心。
Please refer to FIG. 18A. For example, in this embodiment, the first
一般來說,當第一彈性件1311的振幅由一方向轉換至另一方向時,其振幅轉換的過程所需的時間稱為轉換時間(transition time)T。轉換時間T的長短決定了子影像的顯示品質。由於轉換時間T與第一彈性件1311的自然頻率成反比,而自然頻率與第一彈
性件1311的結構參數有關。因此前述所提到影響自然頻率的因素皆可為影響轉換時間T的因素。
Generally speaking, when the amplitude of the first
請參照圖18B。承上述,轉換時間T與第一彈性件1311的結構參數有關。在本實施例中,第一彈性件1311的頸部寬度NW的結構參數例如是第一彈性件1311的寬度w的0.2倍至0.6倍。此外,第一彈性件1311的厚度t也是影響轉換時間T的一個原因。在一實施例中,第一彈性件1311的厚度t至少在0.2毫米(mm)以上。此厚度的設計可使第一彈性件1311的自然頻率至少大於90Hz。由於自然頻率與轉換時間T成反比,因此此厚度設計也可以有效地降低轉換時間T。
Please refer to Figure 18B. Based on the above, the conversion time T is related to the structural parameters of the first
除了前述所提到的第一彈性件1311的結構參數會影響轉換時間T之外,影響轉換時間T的因素還包括第一彈性件1311的振動方式。請同時參照圖18C以及圖18D,在本實施例中,藉由改變第一彈性件1311的振動方式以降低轉換時間T。具體而言,在第一彈性件1311的振幅由一方向轉為另一方向時,其驅動訊號波形如同圖18D所示。此外,驅動訊號波形也不僅限於如圖18D所示的方波形式驅動訊號,也可以是正弦波形式的驅動訊號波形。轉換時間T小於1毫秒,較佳範圍在1~0.05毫秒之間,使得光學裝置可提供良好的顯示品質。
In addition to the aforementioned structural parameters of the first
為了更了解前述實施例中所提到的成像位移模組的實際應用,下列段落提出多個範例實施例。圖19A與圖19B分別繪示應用本發明上述任一實施例的成像位移模組的不同三維列印裝置
示意圖,而圖19C所示為由圖19A或圖19B的不同三維列印裝置所三維列印出的三維列印物件示意圖。在本應用範例實施例中,三維列印裝置例如藉由計算機輔助設計(Computer Aided Design,簡稱為CAD)或動畫模擬軟件等建構而成的立體模型的多層橫截面逐步製造出三維物件。請先參照圖19A,在本應用範例實施例中的三維列印裝置1900a所採用的三維列印技術例如是採用立體光固化成型法(Stereo Lithography,簡稱為SLA),三維列印裝置1900a包括成型槽1910、投影裝置1920、升降載台1930以及前述實施例所述及的任一的成像位移模組1940,其中三維列印裝置1900a用以形成三維列印物件OB,其中圖19A的三維列印裝置例如是下沉式的三維列印裝置1900a。
In order to better understand the practical application of the imaging displacement module mentioned in the foregoing embodiments, the following paragraphs propose multiple example embodiments. Figure 19A and Figure 19B respectively illustrate different three-dimensional printing devices using the imaging displacement module according to any of the above embodiments of the present invention.
A schematic diagram, and FIG. 19C shows a schematic diagram of a 3D printed object 3D printed by the different 3D printing device of FIG. 19A or 19B. In this application example embodiment, the three-dimensional printing device gradually produces a three-dimensional object from multi-layer cross-sections of a three-dimensional model constructed by computer-aided design (CAD) or animation simulation software. Please refer to FIG. 19A first. In this application example, the 3D printing technology used by the
以下段落將對本應用範例實施例中的三維列印裝置1900a的各組件進行詳細地介紹。
The following paragraphs will introduce each component of the three-
成型槽1910用以容置光敏感材料1912,其中光敏感材料1912在具有特定波長的光束照射下,會產生光聚合反應而固化。投影裝置1920中具有發光元件,其所採用的發光元件可以是發光二極體(Light Emitting Diode,簡稱為LED)、雷射(Laser)或其他適用的發光元件,發光元件適於發出影像光束B,其中影像光束B可提供能固化光敏感材料1912的波段的光線(例如紫外線),但影像光束B的波段並不以此為限制,只要是能夠固化光敏感材料1912即可。升降載台1930具有列印區1932,且適於在成型槽1910內移動。此外,本應用範例實施例中的三維列印裝置1900a還包括
控制器(未繪示)與輸入介面(未繪示),控制器與投影裝置1920、升降載台1930以及輸入介面電性連接,使用者可以通過輸入介面並通過電腦輔助設計(Computer Aided Design,簡稱為:CAD)或動畫建模軟體以輸入三維列印物件OB的三維實體模型。具體而言,輸入介面可以是滑鼠、鍵盤、觸控裝置或者是其他能夠使使用者輸入三維列印物件OB的三維實體模型的介面。控制器依據三維實體模型控制升降載台1930與影像光束B的作動方式。具體而言,控制器可以是計算器、微處理器(Micro Controller Unit,簡稱為:MCU)、中央處理單元(Central Processing Unit,簡稱為:CPU),或是其他可程式化的控制器(Microprocessor)、數位信號處理器(Digital Signal Processor,簡稱為:DSP)、可程式化控制器、專用積體電路(Application Specific Integrated Circuits,簡稱為:ASIC)、可程式化邏輯裝置(Programmable Logic Device,簡稱為:PLD)或其他類似裝置。在本應用範例實施例中,成像位移模組1940配置於投影裝置1920的外部,且成像位移模組1940配置於影像光束B的路徑上,在其他的應用範例實施例中,成像位移模組1940可以配置於投影裝置1920內,只要成像位移模組1940配置在影像光束B的路徑上即可,成像位移模組1940配置的位置並不以此為限。
The
接下來介紹光固化成型的三維列印製程,其製程大致如下:首先,利用電腦輔助設計(Computer Aided Design,簡稱為:CAD)設計出三維實體模型,利用離散程式將三維實體模型進行切
片處理,進而得到多個分層的掃描路徑。接著,依據各個切層的掃描路徑精確控制影像光束B和升降載台1930的運動。由圖19A可看出列印區1932浸入於光敏感材料1912中,影像光束B按第一切層的掃描路徑照射到部分光敏感材料1912,此部分光敏感材料1912產生光聚合反應而固化,生成出三維列印物件OB的其中一個截面,進而得到第一固化層附著於列印區1932上。之後,升降載台1930向下移動少許距離,且原先形成的第一固化層對應向下移動少許距離,而原先形成的第一固化層的上表面可以當作承載面,使第一固化層上覆蓋另一層光敏感材料1912,再依據第二切層的掃描路徑精確控制影像光束B,使影像光束B按第二切層的掃描路徑照射到另一層光敏感材料1912的表面,進而得到第二固化層,依照這樣的模式不斷製作多層後可形成如圖19C所繪示的三維列印物件OB。應注意的是,圖19C所繪示的三維列印物件OB的形狀僅為舉例,三維列印物件OB的形狀並不以此為限。
Next, we will introduce the three-dimensional printing process of stereolithography. The process is roughly as follows: First, use Computer Aided Design (CAD) to design a three-dimensional solid model, and use discrete programs to cut the three-dimensional solid model.
Slice processing is performed to obtain multiple hierarchical scan paths. Then, the movement of the image beam B and the
請參照圖19B,圖19B繪示應用本發明上述實施例的成像位移模組的另一種三維列印裝置示意圖,請先參照圖19B,圖19B所示的三維列印裝置1900b類似於圖19A所示的三維列印裝置1900a,其主要差異在於:成型槽1910的材料包括透明材料或透光材料,且升降載台1930與投影裝置1920分別配置於成型槽1910的相對兩側,其中圖19B的三維列印裝置1900b例如是上拉式的三維列印裝置1900b。由於成型槽1910的材料包括透明材料或透光材料,因此影像光束B可以通過成型槽1910照射光敏感材
料1912。當進行三維列印時,影像光束B按第一切層的掃描路徑照射到部分光敏感材料1912,此部分光敏感材料1912產生光聚合反應而固化,生成出三維列印物件OB的其中一個截面,進而得到第一固化層附著于列印區1932上。之後,升降載台1930向上移動少許距離,且原先形成的第一固化層對應向上移動少許距離,而原先形成的第一固化層的下表面可以當作承載面,以使第一固化層的下表面覆蓋另一層光敏感材料1912再依據第二切層的掃描路徑精確控制影像光束B,使影像光束B按第二切層的掃描路徑照射到另一層光敏感材料1912的表面,進而得到第二固化層,依照這樣的模式不斷製作多層後可形成如圖19C所繪示的三維列印物件OB。
Please refer to Figure 19B. Figure 19B is a schematic diagram of another three-dimensional printing device using the imaging displacement module according to the above embodiment of the present invention. Please refer to Figure 19B first. The three-
請同時參照圖19A與圖19B,由於成像位移模組1940配置在影像光束B的路徑上,影像光束B經由成像位移模組1940後,在不同的時間下,影像光束B會投射至不同的位置,詳言之,圖19A與圖19B所繪示的實線,是影像光束B在某一時刻下,影像光束B所投射的位置;而圖19A與圖19B所繪示的虛線,則是影像光束B在另一時刻下,影像光束B所投射的位置。成像位移模組1940的細部的作動方式可以由前述實施例的敍述中獲致足夠的教示、建議與實施說明,在此不再贅述。因此,由於本應用範例實施例的三維列印裝置1900a與1900b具有前述任一實施例所提到的成像位移模組1940,可以使投影裝置1920所投射出的影像光束B的像素提高,以使三維列印裝置1900a與1900b固化光敏感
材料1912時能夠獲得更高的解析度,進而使得三維列印物件OB具有更佳的表面精度。
Please refer to Figure 19A and Figure 19B at the same time. Since the
綜上所述,在本發明的範例實施例的三維列印裝置中,由於光路調整結構中的旋轉基座設有大致對角位置的第一區域與第二區域,且承載座和轉軸為一體成型,且旋轉基座只沿虛擬軸線轉動,因此當影像光束經過旋轉基座上的光學元件時,影像光束的光路會因為光學元件被旋轉基座所帶動而被光學元件所改變。由於影像光束的光路會被光路調整結構所改變,因此本發明實施例的三維列印裝置能夠使影像光束所形成的影像畫面的像素提高,進而使三維列印裝置所列印出的三維列印物件具有更佳的表面精度。 To sum up, in the three-dimensional printing device according to the exemplary embodiment of the present invention, since the rotating base in the optical path adjustment structure is provided with a first area and a second area at approximately diagonal positions, and the bearing base and the rotating shaft are integrated The rotating base only rotates along the virtual axis, so when the image beam passes through the optical element on the rotating base, the optical path of the image beam will be changed by the optical element because the optical element is driven by the rotating base. Since the optical path of the image beam will be changed by the optical path adjustment structure, the three-dimensional printing device according to the embodiment of the present invention can increase the pixels of the image frame formed by the image beam, thereby improving the three-dimensional printing produced by the three-dimensional printing device. Objects have better surface accuracy.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed above through embodiments, they are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the appended patent application scope.
1900a:三維列印裝置 1900a: Three-dimensional printing device
1910:成型槽 1910: Forming slot
1912:光敏感材料 1912:Light sensitive materials
1920:投影裝置 1920:Projection device
1930:升降載台 1930:Lifting platform
1932:列印區 1932:Print area
1940:成像位移模組 1940: Imaging displacement module
B:影像光束 B:Image beam
OB:三維列印物件 OB: 3D printing object
Claims (11)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104101729 | 2015-01-19 | ||
TW104101729 | 2015-01-19 | ||
TW104119521 | 2015-06-16 | ||
TW104119521 | 2015-06-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202115480A TW202115480A (en) | 2021-04-16 |
TWI826750B true TWI826750B (en) | 2023-12-21 |
Family
ID=56466136
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106111043A TWI613503B (en) | 2015-01-19 | 2015-12-04 | Optical path adjusting mechanism |
TW104140907A TWI584045B (en) | 2015-01-19 | 2015-12-04 | Imaging displacement module |
TW106111087A TWI713722B (en) | 2015-01-19 | 2015-12-04 | Three dimensional printing apparatus |
TW109141869A TWI826750B (en) | 2015-01-19 | 2015-12-04 | Optical path adjusting mechanism and manufacturing method thereof |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106111043A TWI613503B (en) | 2015-01-19 | 2015-12-04 | Optical path adjusting mechanism |
TW104140907A TWI584045B (en) | 2015-01-19 | 2015-12-04 | Imaging displacement module |
TW106111087A TWI713722B (en) | 2015-01-19 | 2015-12-04 | Three dimensional printing apparatus |
Country Status (2)
Country | Link |
---|---|
CN (2) | CN105807385A (en) |
TW (4) | TWI613503B (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117250717A (en) * | 2016-09-30 | 2023-12-19 | 扬明光学股份有限公司 | Light path adjusting mechanism and optical mechanism |
CN106681086B (en) * | 2016-12-29 | 2020-11-24 | 成都迅达光电有限公司 | Support of oscillating mirror, oscillating mirror and projector |
KR102046473B1 (en) * | 2017-03-08 | 2019-11-19 | 삼성전기주식회사 | Mirror Module for OIS and Camera module including the same |
CN106918975B (en) * | 2017-03-28 | 2018-11-09 | 苏州佳世达光电有限公司 | Optical element adjusting apparatus and use its projection arrangement |
CN108693686B (en) * | 2017-04-06 | 2020-11-03 | 中强光电股份有限公司 | Projection device |
TWI636343B (en) * | 2017-07-21 | 2018-09-21 | 陳德利 | Laser projection device |
CN109856898B (en) * | 2017-11-30 | 2021-12-31 | 中强光电股份有限公司 | Projector, optical-mechanical module, image resolution enhancement device and driving method thereof |
CN110082999B (en) * | 2018-01-26 | 2021-11-16 | 中强光电股份有限公司 | Projector, optical engine and pixel shifting device |
TWI698696B (en) * | 2018-05-11 | 2020-07-11 | 揚明光學股份有限公司 | Light path adjustment mechanism and fabrication method thereof |
CN110554550B (en) | 2018-05-31 | 2021-08-17 | 中强光电股份有限公司 | Projection device |
TWI663423B (en) | 2018-06-29 | 2019-06-21 | 揚明光學股份有限公司 | Image displacement device and fabrication method thereof |
TWI675224B (en) | 2018-06-29 | 2019-10-21 | 揚明光學股份有限公司 | Image displacement module and fabrication method thereof |
CN110658665B (en) | 2018-06-29 | 2021-10-01 | 中强光电股份有限公司 | Projection device and imaging module thereof |
CN208636638U (en) | 2018-06-29 | 2019-03-22 | 中强光电股份有限公司 | Projection arrangement and its image-forming module |
TWI691778B (en) | 2018-11-30 | 2020-04-21 | 揚明光學股份有限公司 | Light path adjustment mechanism and fabrication method thereof |
JP7155967B2 (en) * | 2018-12-04 | 2022-10-19 | セイコーエプソン株式会社 | Optical path shift device and image display device |
CN117872557A (en) * | 2019-04-02 | 2024-04-12 | 扬明光学股份有限公司 | Light path adjusting mechanism |
TWI765235B (en) * | 2020-02-27 | 2022-05-21 | 揚明光學股份有限公司 | Light path adjustment mechanism and fabrication method thereof |
CN113495335B (en) * | 2020-03-18 | 2023-08-25 | 扬明光学股份有限公司 | Optical path adjusting mechanism and manufacturing method thereof |
CN113835183B (en) * | 2020-06-22 | 2024-08-27 | 扬明光学股份有限公司 | Optical path adjusting mechanism and manufacturing method thereof |
JP2022082000A (en) * | 2020-11-20 | 2022-06-01 | セイコーエプソン株式会社 | Optical device and display |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI243276B (en) * | 2004-11-12 | 2005-11-11 | Young Optics Inc | Imaging displacement module and optical projection device |
TWM327045U (en) * | 2007-06-05 | 2008-02-11 | Young Optics Inc | Imaging displacement module |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60037710T2 (en) * | 1999-11-16 | 2008-06-05 | Fujinon Corp. | vibration isolator |
US6826540B1 (en) * | 1999-12-29 | 2004-11-30 | Virtual Personalities, Inc. | Virtual human interface for conducting surveys |
US7023603B2 (en) * | 2002-04-30 | 2006-04-04 | Hewlett-Packard Development Company, L.P. | Micro-mirror device including dielectrophoretic microemulsion |
CN1797176A (en) * | 2004-12-30 | 2006-07-05 | 扬明光学股份有限公司 | Subassembly of imaging displacement and optical projection device |
US7279812B2 (en) * | 2005-01-18 | 2007-10-09 | Hewlett-Packard Development Company, L.P. | Light direction assembly shorted turn |
CN100340899C (en) * | 2005-06-08 | 2007-10-03 | 中国科学院上海光学精密机械研究所 | double-optical-wedge beam deflection mechanical device |
US20070076171A1 (en) * | 2005-09-20 | 2007-04-05 | Fasen Donald J | Wobulator position sensing system and method |
CN201066401Y (en) * | 2007-07-23 | 2008-05-28 | 扬明光学股份有限公司 | Imaging shift module |
TWI376564B (en) * | 2009-06-05 | 2012-11-11 | Young Optics Inc | Imaging displacement module |
TW201228808A (en) * | 2011-01-14 | 2012-07-16 | Microjet Technology Co Ltd | Three-dimensional make-up machine |
AU2012212488B2 (en) * | 2011-01-31 | 2017-02-09 | Global Filtration Systems, A Dba Of Gulf Filtration Systems Inc. | Method and apparatus for making three-dimensional objects from multiple solidifiable materials |
JP5991024B2 (en) * | 2012-05-22 | 2016-09-14 | セイコーエプソン株式会社 | Mirror device, optical scanner and image forming apparatus |
TWM492012U (en) * | 2014-08-19 | 2014-12-11 | 國立臺灣科技大學 | Multifunctional 3D scanning and printing apparatus |
-
2015
- 2015-12-04 TW TW106111043A patent/TWI613503B/en active
- 2015-12-04 TW TW104140907A patent/TWI584045B/en active
- 2015-12-04 TW TW106111087A patent/TWI713722B/en active
- 2015-12-04 CN CN201510887198.4A patent/CN105807385A/en active Pending
- 2015-12-04 TW TW109141869A patent/TWI826750B/en active
- 2015-12-04 CN CN202310059447.5A patent/CN115963683A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI243276B (en) * | 2004-11-12 | 2005-11-11 | Young Optics Inc | Imaging displacement module and optical projection device |
TWM327045U (en) * | 2007-06-05 | 2008-02-11 | Young Optics Inc | Imaging displacement module |
Also Published As
Publication number | Publication date |
---|---|
TWI613503B (en) | 2018-02-01 |
CN115963683A (en) | 2023-04-14 |
TW201627745A (en) | 2016-08-01 |
CN105807385A (en) | 2016-07-27 |
TWI584045B (en) | 2017-05-21 |
TW202115480A (en) | 2021-04-16 |
TW201723631A (en) | 2017-07-01 |
TW201723632A (en) | 2017-07-01 |
TWI713722B (en) | 2020-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI826750B (en) | Optical path adjusting mechanism and manufacturing method thereof | |
US11747609B2 (en) | Optical path adjusting mechanism | |
TWI568601B (en) | Three dimensional printing apparatus and prining method thereof | |
TWI548533B (en) | Three-dimensional printing apparatus | |
US9632420B2 (en) | Production of a volume object by lithography, having improved spatial resolution | |
TWI630124B (en) | Three dimensional printing apparatus | |
TWI580519B (en) | Three dimensional printing apparatus | |
JP6284961B2 (en) | Stereolithography method and photocuring method of photosensitive resin | |
US9302460B2 (en) | Three dimensional printing apparatus | |
US20150328833A1 (en) | Stereolithography rapid prototyping apparatus and method | |
US20180029299A1 (en) | Additive manufacturing with offset stitching | |
JP6058819B2 (en) | 3D object production | |
JP2016540665A (en) | Additive manufacturing apparatus and method | |
US20180188711A1 (en) | Control device | |
US20070008311A1 (en) | High resolution and rapid three dimensional object generator advanced | |
JP2010036537A (en) | Photo-fabricating apparatus | |
TW201511928A (en) | Stereolithography machine with improved optical unit | |
JP6210784B2 (en) | 3D modeling apparatus and 3D modeling method | |
CN107486985B (en) | A kind of unilateral side speed change demoulding control system for rapid prototyping and quick molding method | |
KR102443272B1 (en) | 3d printer and 3d printing method using overlapped light irradiation along a specific path | |
TWM550666U (en) | Multi-material stereolithography modeling system with real-time image scanning | |
JP4834297B2 (en) | Stereolithography apparatus and stereolithography method | |
JPH0376631A (en) | Three dimensional model molding machine | |
TW201700266A (en) | A vat photopolymerization device | |
JP2007017922A (en) | System |