TWI824045B - 導電性樹脂組成物及半導體裝置 - Google Patents

導電性樹脂組成物及半導體裝置 Download PDF

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Publication number
TWI824045B
TWI824045B TW108138414A TW108138414A TWI824045B TW I824045 B TWI824045 B TW I824045B TW 108138414 A TW108138414 A TW 108138414A TW 108138414 A TW108138414 A TW 108138414A TW I824045 B TWI824045 B TW I824045B
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TW
Taiwan
Prior art keywords
resin composition
conductive resin
particles
mass
semiconductor device
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Application number
TW108138414A
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English (en)
Chinese (zh)
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TW202033567A (zh
Inventor
玉野孝一
Original Assignee
日商住友電木股份有限公司
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Publication of TW202033567A publication Critical patent/TW202033567A/zh
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Publication of TWI824045B publication Critical patent/TWI824045B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymerisation Methods In General (AREA)
TW108138414A 2018-10-24 2019-10-24 導電性樹脂組成物及半導體裝置 TWI824045B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018200424 2018-10-24
JPJP2018-200424 2018-10-24

Publications (2)

Publication Number Publication Date
TW202033567A TW202033567A (zh) 2020-09-16
TWI824045B true TWI824045B (zh) 2023-12-01

Family

ID=70331380

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108138414A TWI824045B (zh) 2018-10-24 2019-10-24 導電性樹脂組成物及半導體裝置

Country Status (4)

Country Link
JP (2) JPWO2020085372A1 (https=)
CN (1) CN112912427B (https=)
TW (1) TWI824045B (https=)
WO (1) WO2020085372A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61141779A (ja) * 1984-10-15 1986-06-28 ナショナル　スタ−チ　アンド　ケミカル　コ−ポレイション 熱安定性接着剤
US5043102A (en) * 1989-11-29 1991-08-27 Advanced Products, Inc. Conductive adhesive useful for bonding a semiconductor die to a conductive support base
CN1247633A (zh) * 1997-12-26 2000-03-15 株式会社日本能源 阻止环氧树脂渗出的试剂和方法
WO2018034234A1 (ja) * 2016-08-19 2018-02-22 住友ベークライト株式会社 ダイアタッチペーストおよび半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07101696B2 (ja) * 1988-07-08 1995-11-01 株式会社住友金属セラミックス 半導体素子塔載用セラミック基板
JPH06350000A (ja) * 1993-06-04 1994-12-22 Hitachi Ltd リードフレームの表面処理剤およびそれを用いた半導体集積回路装置の製造方法
JP2000186261A (ja) * 1998-12-21 2000-07-04 Hitachi Chem Co Ltd 銅フレーム用接着剤、半導体パッケージ及び半導体パッケージの製造法
JP2001181482A (ja) * 1999-12-27 2001-07-03 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP5352970B2 (ja) * 2007-07-04 2013-11-27 住友ベークライト株式会社 樹脂組成物および半導体装置
JP5513734B2 (ja) * 2008-11-27 2014-06-04 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
JP5540916B2 (ja) * 2010-06-15 2014-07-02 デクセリアルズ株式会社 接続構造体の製造方法
JP6747000B2 (ja) * 2016-03-25 2020-08-26 住友ベークライト株式会社 ペースト状接着剤組成物、半導体装置、半導体装置の製造方法および放熱板の接着方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61141779A (ja) * 1984-10-15 1986-06-28 ナショナル　スタ−チ　アンド　ケミカル　コ−ポレイション 熱安定性接着剤
US5043102A (en) * 1989-11-29 1991-08-27 Advanced Products, Inc. Conductive adhesive useful for bonding a semiconductor die to a conductive support base
CN1247633A (zh) * 1997-12-26 2000-03-15 株式会社日本能源 阻止环氧树脂渗出的试剂和方法
WO2018034234A1 (ja) * 2016-08-19 2018-02-22 住友ベークライト株式会社 ダイアタッチペーストおよび半導体装置

Also Published As

Publication number Publication date
JP2022115943A (ja) 2022-08-09
CN112912427B (zh) 2023-08-22
JPWO2020085372A1 (ja) 2021-09-02
WO2020085372A1 (ja) 2020-04-30
TW202033567A (zh) 2020-09-16
JP7359252B2 (ja) 2023-10-11
CN112912427A (zh) 2021-06-04

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