TWI821085B - Interposer manufacturing method for electronic components - Google Patents

Abstract

The present invention is a method for manufacturing interposers of electronic components. The steps include: 1. Cleaning process; 2. Arrangement process; 3. Temporary fixing process; 4. Infusion process; 5. Removal process; 6. Mold opening process; 7. Finishing process; and 8. Film coating process. The invention simplifies the back-stage semiconductor chip and circuit board hot-pressing manufacturing process. It has high confidentiality for upstream, mid-stream and downstream chip designs and is easy for manufacturers to integrate. Semiconductor chip designers do not need to deliver detailed design circuit diagrams to interposer manufacturers. They only need to By revealing the dot pattern of semiconductor chip pins to downstream OEMs, multi-layer three-dimensional circuit boards can be stacked, effectively dividing labor and simplifying the hot-pressing lamination process, improving the industry's manufacturing efficiency and effectively protecting upstream and downstream production secrets.

Description

Interposer manufacturing method for electronic components

The present invention relates to an interposer for electronic components and a manufacturing method thereof, in particular to an interposer used for connecting a semiconductor chip to a circuit board. The interposer includes a base glue and conductive pillars embedded therein.

The electronics industry is developing rapidly, and the development trend of its semiconductor chips is miniaturization and high performance. The terminal pitch of the semiconductor die becomes narrower, and the extent to which a printed circuit board on which the semiconductor die is mounted can have a fine pitch is limited. Furthermore, the development of interposers for high-density interconnection to connect semiconductor dies and printed circuit board technology is a future development direction. Previous technology has focused on research on an interposer manufacturing method for semiconductor devices. For example, the Republic of China Patent No. TWI689996B discloses an interposer manufacturing method for a waferless substrate, including providing a carrier board, forming a buffer layer on the upper surface of the carrier board, and The steps of forming a conductive channel on the buffer layer, forming an insulating isolation layer on the buffer layer, forming a circuit redistribution layer, forming an electrode channel on the surface of the circuit redistribution layer, and detaching the carrier board, thereby enabling After the conductive paths are pre-formed on the dissociated carrier, deposition or coating techniques are used to form an insulating isolation layer covering the conductive paths. The interposer does not have a substrate such as a wafer, glass or organic layer, and can make the conductive paths More precise and finer, the number and density of its pins are greatly increased, and there is no need to thin the interposer through chemical mechanical polishing. Therefore, the man-hours of the grinding process can be completely saved, thereby increasing the production speed of the interposer and making the interposer The interposer layer will not cause structural damage or cracks due to drilling and grinding processes, which can effectively improve yield and reduce manufacturing costs.

The prior art is directed to research on an interposer for disposing a semiconductor chip and external terminals on two opposite sides and a manufacturing method thereof, as disclosed in the Republic of China Patent No. TW202008547A, in which the interposer includes a first rewiring structure, a second rewiring structure on the wiring structure and electrically coupled to the first rewiring structure, and an active device interposed between the first rewiring structure and the second rewiring structure. The semiconductor chip is disposed on the first redistribution structure and is electrically connected to the first redistribution structure. The size of the first conductive pattern of the first redistribution structure is smaller than the size of the second conductive pattern of the second redistribution structure and the external terminal is provided on the second redistribution structure and is electrically connected to the second redistribution structure. The active surface of the active device is in contact with the first redistribution structure and the active device is electrically coupled to the second redistribution structure through the first redistribution structure.

Previous technology has focused on research on interposer substrates and manufacturing methods, as disclosed in the Republic of China Patent No. TW201442168A, which provides high exothermic and high-speed response (good high-frequency characterization) for semiconductor devices, and easy loading of semiconductor wafers, etc. Furthermore, the interposer substrate can be strongly bonded to a wiring substrate or a semiconductor wafer and a method of manufacturing the same. It forms an insulating layer made of aluminum oxide, diamond, aluminum nitride or silicon nitride on a plate-shaped single crystal silicon base material by chemical evaporation or physical evaporation. Then, the above single crystal silicon base material is The material is formed into a single crystal silicon substrate, and an interposer substrate having a thermally conductive insulating layer on the single crystal silicon substrate is obtained.

The prior art focuses on research on the manufacturing method of an interposer, as disclosed in the Republic of China Patent No. TWI482250B, which includes a base with a contact pad structure and a stud operatively connected to the contact pad structure. A solder ball/tin is placed over the contact pad structure and formed around the stud. The manufacturing method of the interposer includes: forming a contact pad structure on a first side of a substrate; fixing a stud on the contact pad structure; forming a solder ball/tin surrounding at least a portion of the stud .

The interposer is the medium used to connect the semiconductor chip to the circuit board, which includes a base glue and a conductive pillar embedded therein. The present invention is an interposer manufacturing method for electronic components. The steps are: 1. Cleaning process. The cleaning process is Clean the surface of the conductive pillar, the upper mold and the lower mold. The upper mold is a flat plate, and the surface of the flat plate is provided with a plurality of through holes larger than the diameter of the conductive pillar. The lower mold has a bottom surface, and the bottom surface and the surrounding support edges The strips surround it to form an accommodation space; 2. A whole-row process in which the upper mold is covered on the lower mold, and the lower surface of the upper mold contacts the top of the supporting edge strips of the lower mold, and then multiple conductive The pillars are placed on the surface of the upper mold, and a plurality of conductive pillars are filled into a plurality of through-holes in the upper mold by magnetic attraction, vibration or needle pricking; 3. Temporary fixing process. This temporary fixing process is to fill the through-holes with conductive The upper mold of the pillar is covered with a layer of temporary adhesive tape on the upper surface. After the upper part of the temporary adhesive tape is pressed, the conductive pillar is further pressed into the through hole of the upper mold, so that one side of the conductive pillar is pressed against the lower mold. The bottom surface; 4. The pouring process. This pouring process is to pour the base glue into the filling opening of the upper mold into its accommodation space. The base glue can be filled from the bottom to fix the surrounding conductive pillars, and then the base glue is heated and solidified. The conductive pillars can be fixed on the bottom surface of the lower mold; 5. Removal process, the removal process is to tear off the temporary adhesive tape on the outer surface of the upper mold; 6. Mold opening process, the mold opening process is to remove the upper mold Separate from the lower mold, and take out the interposer semi-finished product from its accommodation space; 7. Finishing process, which is to clean the surface of the interposer semi-finished product with plasma to remove surface impurities. After cleaning, it is the finished interposer layer; and 8. Film coating process. This film coating process covers the surface of the interposer finished product with a protective film to proceed to the next stage of manufacturing or shipping process. Another interposer manufacturing method for electronic components has the following steps: 1. Cleaning process. The cleaning process is to clean the surfaces of the conductive pillars, upper mold and lower mold. The upper mold is a flat plate, and the surface of the flat plate is provided with a surface larger than There are a plurality of through holes with a diameter of the conductive pillar, and the lower mold has a bottom surface. The bottom surface and the surrounding support strips form a receiving space; 2. The whole row process, the whole row process covers the upper mold on the lower mold. And the lower surface of the upper mold is in contact with the top of the supporting edge of the lower mold, and then a plurality of conductive pillars are placed on the surface of the upper mold, and the plurality of conductive pillars are filled into the plurality of upper mold by magnetic attraction, vibration or needle pricking. In the through hole; 3. Temporary solidification process, this temporary solidification process is to fill the through hole with the mold on the conductive pillar, and the upper surface of the upper mold is covered with a layer of temporary adhesive tape. After the temporary adhesive tape adheres to the conductive pillar, the upper mold will be Remove, and further apply pressure on the top of the temporary adhesive tape to make the temporary adhesive tape adhere to the conductive pillar and press it into the lower mold, so that one side of the conductive pillar can resist the bottom surface of the lower mold; 4. Infusion process, this infusion process is to apply the base glue Pour the base glue into the gap between the conductive pillars and into its accommodating space. The base glue can be filled from the bottom to fix the surroundings of the conductive pillars. The base glue is then heated and solidified so that the conductive pillars can be fixed and standing on the bottom surface of the lower mold; 5. Remove Process, the removal process is to tear off the temporary tape on the outer surface of the upper mold; 6. Mold opening process, the mold opening process is to remove the lower mold, and take out the intermediate layer semi-finished product from its accommodation space; 7. Finishing The finishing process is to clean the surface of the interposer semi-finished product with plasma to remove surface impurities. After cleaning, the finished interposer is obtained; and 8. The coating process is to cover the finished interposer with a protective film. On the surface, proceed to the next stage of manufacturing or shipping process. Among them, the cleaning process uses at least one of water washing, pickling and solvent washing. Wherein, the conductive pillar is at least one cylindrical, round nail-shaped, square cylindrical, hexagonal cylindrical, polygonal cylindrical and semi-cylindrical shape. Among them, the conductive pillar uses at least one copper pillar, copper-iron alloy, surface-treated copper pillar, tin pillar, lead pillar, gold pillar, platinum pillar and carbon pillar. Among them, the outermost diameter of the conductive pillars ranges from 0.01 microns to 1500 microns, and the height of the conductive pillars ranges from 0.1 microns to 10 microns. The thermal conductivity (k value) of the conductive pillars is in the 20°C environment. At 200 W/mK~400 W/mK. Among them, the entire process involves spraying a thin layer of release agent on the inner wall surfaces of the upper mold and the lower mold. Among them, the lower mold that is different from the previous entire row of processes is replaced during the temporary fixing process to change the area and height of the lower mold. Among them, the temporary adhesive tape used in the temporary adhesive process has an adhesive layer, and the adhesive layer uses at least one heat-releasable adhesive type and a light-releasable adhesive type. Among them, the base glue used in the infusion process is a heat dissipation material with high thermal conductivity (high k value). Among them, the base glue filled in the pouring process fills the accommodation space of the upper mold and the lower mold. Among them, the removal process uses heat or light to remove the temporary adhesive tape. Furthermore, in the finishing process, the surface of the interposer semi-finished product is subjected to at least one step of plasma, etching and grinding to make the surface of the interposer semi-finished product smooth. Wherein, the protective film used in the film coating process is at least one polyolefin type and polyester type protective film. The invention simplifies the back-stage semiconductor chip and circuit board hot-pressing manufacturing process. It has high confidentiality for upstream, mid-stream and downstream chip designs and is easy for manufacturers to integrate. Semiconductor chip designers do not need to deliver detailed design circuit diagrams to interposer manufacturers. They only need to By revealing the dot pattern of semiconductor chip pins to downstream OEMs, multi-layer three-dimensional circuit boards can be stacked, effectively dividing labor and simplifying the hot-pressing lamination process, improving the industry's manufacturing efficiency and effectively protecting upstream and downstream production secrets. The manufacturing method of the present invention is different from the conventional techniques in that it is novel, progressive and has practical benefits. Regarding the technology, means and effects used in this creation, a preferred embodiment is given below and explained in detail with diagrams. I believe that the above-mentioned purpose, structure and characteristics of this creation can be obtained through this in-depth and specific understanding. .

The following describes the implementation of the present invention through specific embodiments. Those familiar with this art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. This invention can also be implemented or applied through other different specific embodiments, and various details in this description can also be modified and changed in various ways based on different viewpoints and applications without departing from the spirit of this invention.

First, please read Figure 1, which is a flow chart showing the interposer manufacturing method of the electronic component of the present invention, and refer to Figures 2 to 4 to illustrate that the present invention is an interposer manufacturing method of electronic components. The steps are: 1. Cleaning process 101 , the cleaning process 101 is to clean the surfaces of the conductive pillar 901, the upper mold 1001 and the lower mold 1101. The upper mold 1001 is a flat plate, and the surface of the flat plate is provided with a plurality of through holes 10011 that are larger than the diameter of the conductive pillar 901. The lower mold 1101 has a bottom surface 11011, and the bottom surface 11011 and the surrounding support strips 11012 form a receiving space 110121, as shown in the space pointed by the hollow arrow in Figure 2; 2. The whole row process 201, the whole row process 201 The upper mold 1001 is covered on the lower mold 1101, and the lower surface of the upper mold 1001 contacts the top of the support side strip 11012 of the lower mold 1101. Then a plurality of conductive pillars 901 are placed on the surface of the upper mold 1001, and the magnetic Fill the plurality of conductive pillars 901 into the plurality of through holes 10011 in the upper mold 1001 by suction, vibration or needle pricking; 3. Temporary fixing process 301, the temporary fixing process 301 is to fill the through holes 10011 with the conductive pillars 901 in the upper mold 1001, the upper surface of the upper mold 1001 is covered with a layer of temporary tape 1201. After the upper part of the temporary tape 1201 is pressed, the conductive post 901 is further pressed into the through hole 10011 of the upper mold 1001, so that one side of the conductive post 901 is against Fix the bottom surface 11011 of the lower mold 1101; or another temporary fixing process 301 is to fill the through holes 10011 with the conductive pillars 901 on the upper mold 1001, and the upper surface of the upper mold 1001 is covered with a layer of temporary tape 1201. The temporary tape After 1201 adheres the conductive post 901, remove the upper mold 1001, and further press the upper part of the temporary tape 1201 so that the temporary tape 1201 adheres to the conductive post 901 and presses it into the lower mold 1101, so that one side of the conductive post 901 resists the lower mold. The bottom surface 11011 of 1101; 4. The pouring process 401. The pouring process 401 is to pour the base glue 1301 into the filling opening 10013 of the upper mold 1001 or the gap between the conductive pillars 901 into its accommodation space 110121. The base glue 1301 can be poured from the bottom Fill and fix the surroundings of the conductive pillars 901, and then heat and solidify the base glue 1301 so that the conductive pillars 901 can stand firmly on the bottom surface 11011 of the lower mold 1101; 5. Removal process 501, which removes the temporary adhesive tape 1201 Tear off the outer surface 10012 of the upper mold 1001; 6. The mold opening process 601, which is to separate the upper mold 1001 and the lower mold 1101, and take out the intermediate layer semi-finished product 1401 from the accommodation space 110121; or another The mold opening process 601 is to remove the lower mold 1101 and take out the interposer semi-finished product 1401 from its accommodation space 110121; 7. The finishing process 701 is to clean the surface of the interposer semi-finished product 1401 with plasma to remove the surface. Impurities, after cleaning, are the finished interposers 1501; and 8. Film coating process 801. The film coating process 801 is to cover the surface of the finished interposers 1501 with the protective film 1601 for the next stage of the process or shipping process.

Among them, the cleaning process 101 uses at least one of water washing, pickling and solvent washing. Among them, the conductive pillar 901 is at least one cylindrical shape, round nail shape, square column shape, hexagonal column shape, polygonal column shape and semi-cylindrical shape. Among them, the conductive pillar 901 uses at least one copper pillar, copper-iron alloy, surface-treated copper pillar, tin pillar, lead pillar, gold pillar, platinum pillar and carbon pillar. Among them, the entire process 201 sprays a thin layer of release agent on the inner wall surfaces of the upper mold 1001 and the lower mold 1101. Among them, the lower mold 1101 different from the previous entire row process 201 is replaced in the temporary fixing process 301 to change the area and height of the lower mold 1101. Among them, the temporary adhesive tape 1201 used in the temporary adhesive process 301 has an adhesive layer, and the adhesive layer uses at least one heat-releasable adhesive type and a light-releasable adhesive type. Among them, the base glue 1301 used in the infusion process 401 is a heat dissipation material with high thermal conductivity (high k value). Among them, the base glue 1301 filled in the pouring process 401 fills the accommodation space 110121 of the upper mold 1001 and the lower mold 1101. The removal process 501 uses heating or lighting to remove the temporary adhesive tape 1201 . Furthermore, the finishing process 701 performs at least one process of plasma, etching and grinding on the surface of the interposer semi-finished product 1401 to make the surface of the interposer semi-finished product 1401 smooth. Among them, the protective film 1601 used in the film coating process 801 is at least one polyolefin and polyester protective film 1601.

Figure 2 shows an exploded view of the upper mold 1001, the lower mold 1101 and the conductive pillar 901 in the interlayer manufacturing method of the electronic component of this invention. It further explains that the conductive pillar 901 is a columnar substance with conductive function, and the conductive pillar 901 is at least A cylindrical, round nail, square, hexagonal, polygonal and semi-cylindrical shape. The conductive pillar 901 uses at least one copper pillar, copper-iron alloy, surface-treated copper pillar, tin pillar, lead pillar, gold pillar, platinum pillar and carbon pillar. Among them, the outermost diameter of the conductive pillar 901 ranges from 0.01 micron to 1500 micron, the height of the conductive pillar 901 ranges from 0.1 micron to 10 micron, and the thermal conductivity (Thermal Conductivity, k) of the conductive pillar 901 in a 20°C environment value) is between 200 W/mK~400 W/mK. The upper mold 1001 has a flat plate structure, and the surface of the flat plate is provided with a plurality of through holes 10011 that are larger than the diameter of the conductive pillar 901. The through holes 10011 provide the conductive pillars 901 to enter the upper mold from the outer surface 10012 of the upper mold 1001. 1001 and the lower mold 1101 are formed in the accommodation space 110121, and have the function of supporting the conductive pillar 901 to stand; a pouring opening 10013 is provided on one side of the upper mold 1001 to provide the base glue 1301 to be poured into the upper mold 1001 and the lower mold 1101. The accommodation space is 110121. The lower mold 1101 has a bottom surface 11011, and the bottom surface 11011 and the surrounding support strips 11012 form an accommodating space 110121. When the upper mold 1001 covers the lower mold 1101, and the lower surface of the upper mold 1001 partially contacts the top of the supporting edge 11012 of the lower mold 1101.

In order to enable the review committee to further understand the actual manufacturing situation of this invention, Figure 3 is a schematic diagram showing the interposer manufacturing method of the electronic component of this invention, and refer to Figures 1 and 2 which illustrate the conductive pillars 901, After the surfaces of the upper mold 1001 and the lower mold 1101 are cleaned, continue as shown in Figure 3. The entire process 201 is to spray a thin layer on the lower surface of the upper mold 1001 and the bottom of the lower mold 1101, that is, the inner wall surface. Release agent, the upper mold 1001 covers the lower mold 1101, and the lower surface of the upper mold 1001 contacts the top of the support side strip 11012 of the lower mold 1101. The lower mold 1101 has a bottom surface 11011, and the bottom surface 11011 and the surrounding support side strips 11012 forms an accommodation space 110121 around it, and then places the plurality of conductive pillars 901 on the surface of the upper mold 1001, and fills the plurality of conductive pillars 901 into the plurality of through holes 10011 of the upper mold 1001 by magnetic attraction, vibration or needle pricking. . After the whole row of process 201, the temporary fixing process 301 is to fill the through holes 10011 with the conductive pillars 901 on the mold 1001, and the upper surface of the upper mold 1001 is covered with a layer of temporary adhesive tape 1201. After the upper part of the temporary adhesive tape 1201 is pressed, The conductive post 901 is further pressed into the through hole 10011 of the upper mold 1001, so that one side of the conductive post 901 resists the bottom surface 11011 of the lower mold 1101. After the entire process 201, the pouring process 401 is to pour the base glue 1301 through the pouring opening 10013 of the upper mold 1001 through the glue injector 13011 into its accommodation space 110121. The base glue 1301 can be filled and fixed from the bottom to fix the conductive pillars. 901, and then heat and solidify the base glue 1301 so that the conductive pillar 901 can stand fixedly on the bottom surface 11011 of the lower mold 1101. After the infusion process 401, the removal process 501 is to remove the temporary adhesive tape 1201 on the outer surface 10012 of the upper mold 1001. After the removal process 501, the mold opening process 601 is to separate the upper mold 1001 and the lower mold 1101, and take out the intermediate layer semi-finished product 1401 from the accommodation space 110121. Following the mold opening process 601, the finishing process 701 is to clean the surface of the interposer semi-finished product 1401 with plasma to remove surface impurities. After cleaning, the interposer semi-finished product 1501 is obtained. The schematic diagram shows that the surface of the interposer semi-finished product 1501 is further processed by at least Plasma, etching and grinding are performed to make the surface of the interposer semi-finished product 1401 smooth. Following the finishing process 701, the film process 801 covers the surface of the finished interposer 1501 with the protective film 1601 to protect the finished interposer 1501 for the next stage of the process or shipping process.

Figure 4 is a schematic diagram showing the interposer manufacturing method of another electronic component of the present invention. Refer to Figures 1 and 2. It illustrates that after the surface cleaning of the conductive pillar 901, the upper mold 1001 and the lower mold 1101 is carried out through the cleaning process 101, As shown in Figure 4, the entire process 201 is to cover the upper mold 1001 on the lower mold 1101, and the lower surface of the upper mold 1001 contacts the top of the support side strip 11012 of the lower mold 1101. The lower mold 1101 has a The bottom surface 11011, the bottom surface 11011 and the surrounding support strips 11012 form an accommodation space 110121, and then the plurality of conductive pillars 901 are placed on the surface of the upper mold 1001, and the plurality of conductive pillars 901 are magnetically attracted, vibrated or needle-pierced. Fill in the plurality of through holes 10011 in the upper mold 1001. After the whole row of process 201, the temporary fixing process 301 is to fill the through holes 10011 with the conductive pillars 901 on the mold 1001, and the upper surface of the upper mold 1001 is covered with a layer of temporary adhesive tape 1201, and the temporary adhesive tape 1201 adheres to the conductive pillars 901 Then the upper mold 1001 is removed, and the upper part of the temporary tape 1201 is further pressed to make the temporary tape 1201 adhere to the conductive post 901 and pressed into the lower mold 1101, so that one side of the conductive post 901 is pressed against the bottom surface 11011 of the lower mold 1101. After the entire process 201, the filling process 401 is to pour the base glue 1301 through the glue injector 13011 into the gap between the conductive pillars 901 into its accommodating space 110121. The base glue 1301 can fill and fix the conductive pillars 901 from the bottom. Around the base glue 1301, the base glue 1301 is heated and solidified so that the conductive pillar 901 can be fixed and standing on the bottom surface 11011 of the lower mold 1101. After the infusion process 401, the removal process 501 is to remove the temporary adhesive tape 1201 on the outer surface 10012 of the upper mold 1001. After the removal process 501, the mold opening process 601 is to remove the lower mold 1101, and take out the intermediate layer semi-finished product 1401 from the accommodation space 110121. Following the mold opening process 601, the finishing process 701 is to clean the surface of the interposer semi-finished product 1401 with plasma to remove surface impurities. After cleaning, the interposer semi-finished product 1501 is obtained. The schematic diagram shows that the surface of the interposer semi-finished product 1501 is further processed by at least Plasma, etching and grinding are performed to make the surface of the interposer semi-finished product 1401 smooth. Following the finishing process 701, the film process 801 covers the surface of the finished interposer 1501 with the protective film 1601 to protect the finished interposer 1501 for the next stage of the process or shipping process. This method removes the upper mold 1001 in the temporary solidification process 301, eliminating the disadvantage of spraying a thin layer of release agent on the upper mold 1001 and the lower mold 1101, causing the conductive pillar 901 to be contaminated by the release agent.

The above process description is a description of the manufacturing method of the interposer. Subsequently, the interposer of the present invention is hot-pressed between the semiconductor chip and the circuit board, and the conductive pillars 901 of the interposer of the present invention are bonded to each other through the pins of the semiconductor wafer. The conductive pillars The other end of 901 is connected to the circuit of the circuit board to form a conductive circuit. The chips/interposers/circuit boards are stacked in multiple layers to form a three-dimensional circuit. The semiconductor chips are stacked on the conductive pillars 901 in a conductive manner, and several groups Semiconductor wafers are connected to each other using interposers, and then all of them are packaged in a single electronic component. The thickness of the semiconductor wafer and interposer is between 0.2mm and 0.7mm. The entire electronic component package volume can be reduced, achieving the effect of miniaturizing electronic components.

The present invention is an interposer manufacturing method for electronic components. It simplifies the manufacturing process of hot pressing of semiconductor wafers and circuit boards in the back-end. It has high confidentiality for upstream, mid-stream and downstream wafer designs and is easy for manufacturers to integrate. Semiconductor wafer designers do not need to deliver detailed information. Design the circuit diagram to the interposer manufacturer, and only need to disclose the lattice pattern of the semiconductor chip pins to the downstream foundry to stack up a multi-layer three-dimensional circuit board. This effectively divides labor and simplifies the hot-press lamination process, improving the manufacturing quality of the industry. Efficiency and effective protection of upstream and downstream production secrets. The characteristics of the manufacturing method of the present invention are different from the conventional techniques in the past, and its novelty, progress and practical benefits are unmistakable. Therefore, it can effectively improve the lack of common knowledge and has considerable practicality in use.

In summary, the specific structure disclosed in the embodiments of this invention can indeed provide applications for interposer manufacturing of electronic components. In terms of its overall manufacturing method and structure, it has not been seen in similar products, nor has it been disclosed before the application. , has since complied with the statutory requirements of the Patent Law, and has filed an invention patent application in accordance with the law.

However, the above is only one of the preferred embodiments of this invention, and it should not be used to limit the scope of the implementation of this invention. That is, all equivalent changes and modifications made based on the patent scope of this invention and the content of the invention description are all It should still be within the scope of this creative patent.

101: Cleaning process 201: Whole row process 301: Temporary solidification process 401: Infusion process 501:Remove process 601: Mold opening process 701: Finishing process 801: Film coating process 901:Conductive pillar 1001: Upper mold 10011:Through holes 10012:Outer surface 10013:Pouring opening 1101: Lower the mold 11011: Bottom 11012: Support side strip 110121: Accommodation space 1201: Temporary fixing tape 1301: Base glue 13011: Glue injection device 1401: Interposer semi-finished product 1501: Finished interposer layer 1601:Protective film

Figure 1 is a flow chart showing the interposer manufacturing method of the electronic component of the present invention. Figure 2 shows an exploded view of the upper mold, lower mold and conductive pillars in the interposer manufacturing method of the electronic component of this invention. Figure 3 is a schematic diagram showing the interposer manufacturing method of the electronic component of this invention. Figure 4 is a schematic diagram showing an interposer manufacturing method of another electronic component of the present invention.

101: Cleaning process

201: Whole row process

301: Temporary solidification process

401: Infusion process

501:Remove process

601: Mold opening process

701: Finishing process

801: Film coating process

Claims (11)

A method for manufacturing interposers of electronic components. The steps include: 1. Cleaning process. The cleaning process is to clean the surfaces of conductive pillars, upper molds and lower molds. The upper mold is a flat plate, and the surface of the flat plate is provided with a surface larger than the There are a plurality of through holes with the diameter of the conductive pillars. The lower mold has a bottom surface. The bottom surface and the surrounding support strips form a receiving space. The outermost diameter of the conductive pillars ranges from 0.01 micron to 1500 microns. The height of the conductive pillars ranges from 0.01 to 1500 microns. At 0.1 micron ~ 10 micron, the thermal conductivity (k value) of the conductive pillar in an environment of 20°C is between 200W/mK ~ 400W/mK; 2. The whole row process, which covers the upper mold On the lower mold, and the lower surface of the upper mold contacts the top of the supporting edge of the lower mold, then place a plurality of conductive pillars on the surface of the upper mold, and fill in the plurality of conductive pillars with magnetic attraction, vibration or needle pricking. into the plurality of through holes of the upper mold; 3. Temporary fixing process. This temporary fixing process is to fill the through holes with the conductive pillars on the mold, and the upper surface of the upper mold is covered with a layer of temporary adhesive tape, which is used in the temporary fixing process. The temporary adhesive tape has an adhesive layer, and the adhesive layer uses at least one heat-releasable adhesive and a light-releasable adhesive. After the upper part of the temporary adhesive tape is pressed, the conductive pillar is further pressed into the upper mold. Through the hole, one side of the conductive pillar is pressed against the bottom surface of the lower mold; 4. The pouring process is to pour the base glue into the filling opening of the upper mold into its accommodation space. The base glue can be poured from the bottom Fill and fix the surrounding conductive pillars, and then heat and solidify the base glue so that the conductive pillars can stand firmly on the bottom surface of the lower mold; 5. Removal process, this removal process is to remove the temporary adhesive tape from the outer surface of the upper mold , the removal process is to use heating or lighting to remove the temporary adhesive tape; 6. Mold opening process, the mold opening process is to separate the upper mold and the lower mold, and take out the intermediary from their accommodation space layer semi-finished product; 7. finishing process, which is to clean the surface of the interposer semi-finished product with plasma to remove surface impurities. After cleaning, it is the finished interposer; and 8. coating process, which is to protect the The film covers the surface of the finished interposer and proceeds to the next stage of manufacturing or shipping. A method for manufacturing interposers of electronic components. The steps include: 1. Cleaning process. The cleaning process is to clean the surfaces of conductive pillars, upper molds and lower molds. The upper mold is a flat plate, and the surface of the flat plate is provided with a surface larger than the There are a plurality of through holes with the diameter of the conductive pillars. The lower mold has a bottom surface. The bottom surface and the surrounding support strips form a receiving space. The outermost diameter of the conductive pillars ranges from 0.01 micron to 1500 microns. The height of the conductive pillars ranges from 0.01 to 1500 microns. At 0.1 micron ~ 10 micron, the thermal conductivity (k value) of the conductive pillar in an environment of 20°C is between 200W/mK ~ 400W/mK; 2. The whole row process, which covers the upper mold On the lower mold, and the lower surface of the upper mold contacts the top of the supporting edge of the lower mold, then place a plurality of conductive pillars on the surface of the upper mold, and fill in the plurality of conductive pillars with magnetic attraction, vibration or needle pricking. into the plurality of through holes of the upper mold; 3. Temporary fixing process. This temporary fixing process is to fill the through holes with the conductive pillars on the mold, and the upper surface of the upper mold is covered with a layer of temporary adhesive tape, which is used in the temporary fixing process. The temporary adhesive tape has an adhesive layer, and the adhesive layer uses at least one heat-releasable adhesive type and a light-releasable adhesive type. After the temporary adhesive tape adheres to the conductive pillars, the upper mold is removed, and the temporary adhesive tape is further removed. The upper part of the solid tape is pressed so that the temporary tape adheres to the conductive pillar and is pressed into the lower mold, so that one side of the conductive pillar is pressed against the bottom surface of the lower mold; 4. The pouring process. This pouring process is to pour the base glue into the gap between the conductive pillars. In its accommodation space, the base glue can be filled and fixed around the conductive pillars from the bottom, and then the base glue is heated and solidified so that the conductive pillars can be solidified. Stationary on the bottom surface of the lower mold; 5. Removal process, the removal process is to tear off the temporary adhesive tape on the outer surface of the upper mold, the removal process is to use heating or light to remove the temporary adhesive tape; 6. Open Molding process, the mold opening process is to remove the lower mold, and take out the intermediate layer semi-finished product from its accommodation space; 7. Finishing process, the finishing process is to clean the surface of the interposer semi-finished product with plasma to remove surface impurities and clean it. After that, the interposer is finished; and 8. The film coating process is to cover the surface of the interposer with a protective film for the next stage of the process or shipping process. The interposer manufacturing method for electronic components according to claim 1 or 2, wherein the cleaning process uses at least one of water washing, acid washing and solvent washing. The interposer manufacturing method of electronic components as claimed in claim 1 or 2, wherein the conductive pillar is at least one cylindrical, round nail, square, hexagonal, polygonal or semi-cylindrical shape. The interposer manufacturing method of electronic components as described in claim 1 or 2, wherein the conductive pillar uses at least one copper pillar, copper-iron alloy, surface-treated copper pillar, tin pillar, lead pillar, gold pillar, platinum pillar and carbon pillar. The interposer manufacturing method for electronic components as described in claim 1 or 2, wherein the entire process involves spraying a thin layer of release agent on the inner wall surfaces of the upper mold and the lower mold. The interposer manufacturing method of electronic components as described in claim 1 or 2, wherein the lower mold that is different from the previous entire process is replaced during the temporary fixing process to change the area and height of the lower mold. The interposer manufacturing method for electronic components as described in claim 1 or 2, wherein the filling process The base glue used is a heat dissipation material with high thermal conductivity (high k value). The interposer manufacturing method for electronic components as described in claim 1, wherein the base glue filled in the pouring process fills the accommodation space of the upper mold and the lower mold. The interposer manufacturing method for electronic components as described in claim 1 or 2 further includes a finishing process in which the surface of the interposer semi-finished product is subjected to at least one plasma, etching and grinding to make the surface of the interposer semi-finished product smooth. The interlayer manufacturing method for electronic components as claimed in claim 1 or 2, wherein the protective film used in the film coating process is at least one polyolefin-based and polyester-based protective film.

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