TWI819687B - Under-screen biometric identification module and under-screen biometric identification device - Google Patents

Abstract

Disclosed is an under-screen biometric identification module, comprising: a thin film transistor array substrate, a piezoelectric material layer, a transparent conductive film and a capping layer. The thin film transistor array substrate has a display area and a circuit area, and the circuit area includes a plurality of thin film transistors. The piezoelectric material layer is disposed on the thin film transistor array substrate and completely covers the circuit area. The transparent conductive film is disposed on the piezoelectric material layer and completely covers the circuit area. A capping layer is disposed on the transparent conductive film and completely covers the circuit area. The capping layer has a touch electrode array inside, and the touch electrode array is composed of a plurality of touch electrodes. From the side view of the thin film transistor array substrate, each of the touch electrodes is correspondingly disposed above each of the thin film transistors.

Description

Under-screen biometric modules and under-screen biometric devices

The present invention relates to a biometric recognition module, and in particular, to an under-screen biometric recognition module and an under-screen biometric recognition device.

FIG. 1 is a schematic diagram of a fingerprint recognition module in the prior art. As shown in FIG. 1 , the fingerprint recognition module 100 includes: a thin film transistor array substrate 10 , a piezoelectric material layer 12 , a silver electrode 14 and a capping layer 16 . The circuit area of the thin film transistor array substrate 10 includes a plurality of thin film transistors 10a and 10b. The piezoelectric material layer 12 is disposed on the thin film transistor array substrate 10 and completely covers the circuit area. The silver electrode 14 is disposed on the piezoelectric material layer 12 and completely covers the circuit area. A capping layer 16 is disposed on the silver electrode 14 to completely cover the circuit area.

Generally speaking, the area without metal traces outside the thin film transistors 10a and 10b is a light-transmissive area, but after being covered with the silver electrode 14, it becomes an opaque area.

Therefore, how to provide an under-screen biometric module that can solve the above problems is an important issue that the industry needs to think about.

In view of the above, one aspect of the present disclosure provides an under-screen biometric recognition module, including: a thin film transistor array substrate, a piezoelectric material layer, a transparent conductive film and a capping layer. The thin film transistor array substrate has a display area and a circuit area, and the circuit area includes a plurality of thin film transistors. The piezoelectric material layer is disposed on the thin film transistor array substrate and completely covers the circuit area. The transparent conductive film is disposed on the piezoelectric material layer and completely covers the circuit area. A capping layer is disposed on the transparent conductive film to completely cover the circuit area. There is a touch electrode array inside the covering layer, and the touch electrode array is composed of a plurality of touch electrodes. Wherein, each of the touch electrodes is correspondingly arranged above each of the thin film transistors.

An under-screen biometric identification module includes: a thin film transistor array substrate, a piezoelectric material layer, a transparent conductive film and a capping layer. The thin film transistor array substrate has a display area and a circuit area, and the circuit area includes a plurality of thin film transistors. The piezoelectric material layer is disposed on the thin film transistor array substrate and completely covers the circuit area. The transparent conductive film is disposed on the piezoelectric material layer and completely covers the circuit area. There is a touch electrode array inside the transparent conductive film, and the touch electrode array is composed of a plurality of touch electrodes. A capping layer is disposed on the transparent conductive film and completely covers the circuit area. Wherein, each of the touch electrodes is correspondingly arranged above each of the thin film transistors.

According to one or more embodiments of the present disclosure, the touch electrodes of the touch electrode array are made of silver.

According to one or more embodiments of the present disclosure, the transparent conductive film includes a transparent conductive oxide (TCO), wherein the transparent conductive oxide (TCO) includes indium tin oxide (ITO), indium zinc oxide (IZO) or Antimony zinc oxide (AZO).

According to one or more embodiments of the present disclosure, the shape of the touch electrodes of the touch electrode array includes a mesh shape or a strip shape.

According to one or more embodiments of the present disclosure, the thickness of the transparent conductive film is less than 10 nanometers, the transmittance is greater than 90%, and the surface resistance is less than 10Ω/square.

According to one or more embodiments of the present disclosure, the upper surface of the thin film transistor array substrate further includes a protective layer (Primer C) adjacent to the piezoelectric material layer.

In addition, another aspect of the present disclosure provides an under-screen biometric device, including: a glass substrate; and the aforementioned under-screen biometric module, which is disposed on an upper surface or a lower surface of the glass substrate.

In addition, another aspect of the present disclosure provides an under-screen biometric device, including: a glass substrate; a display module; and the aforementioned under-screen biometric module, disposed between the glass substrate and the display module .

In addition, another aspect of the present disclosure provides an under-screen biometric recognition device, including: a display module; a glass substrate configured on the display module; and the aforementioned under-screen biometric recognition module configured to be embedded in the display module. inside the glass substrate.

In order to facilitate the review committee to have a further understanding of the purpose, shape, structural device characteristics and functions of the present invention, the detailed description is as follows with reference to the embodiments and drawings.

The following disclosure provides different embodiments or examples to achieve different features of the provided subject matter. The specific examples of components and arrangements described below are for simplifying the present disclosure and are not intended to be limiting; the size and shape of the components are not limited by the disclosed range or numerical value, but may depend on the process conditions of the components or the required requirements. characteristic. For example, cross-sectional views are used to describe the technical features of the present invention, and these cross-sectional views are schematic diagrams of idealized embodiments. Therefore, variations in the shapes shown in the illustrations due to manufacturing processes and/or tolerances are to be expected and should not be limited thereby.

Furthermore, spatially relative terms such as "below", "below", "below", "above" and "above" are used to easily describe the elements depicted in the diagram. or the relationship between features; in addition, spatially relative terms include the orientation depicted in the illustrations, but also encompass the different orientations of components in use or operation.

First, please refer to FIG. 2 , which is a schematic diagram of an under-screen biometric recognition module according to an embodiment of the present invention.

As shown in Figure 2, the under-screen biometric module 200 in one embodiment of the present invention includes: a thin film transistor array substrate 210, a piezoelectric material layer 212, a transparent conductive film 214 and a capping layer. 216. The thin film transistor array substrate 210 has a display area and a circuit area, and the circuit area includes a plurality of thin film transistors 210a and 210b. The piezoelectric material layer 212 is disposed on the thin film transistor array substrate 210 and completely covers the circuit area. The transparent conductive film 214 is disposed on the piezoelectric material layer 212 and completely covers the circuit area. A capping layer 216 is disposed on the transparent conductive film 214 to completely cover the circuit area. There is a touch electrode array inside the covering layer 216 , and the touch electrode array is composed of a plurality of touch electrodes 218 . Viewed from the side view of the thin film transistor array substrate 210 , the touch electrodes 218 are correspondingly disposed above the thin film transistors 210 a and 210 b.

In addition, please refer to FIG. 3 , which is a schematic diagram of an under-screen biometric recognition module according to another embodiment of the present invention.

As shown in Figure 3, an under-screen biometric module 300 in another embodiment of the present invention includes: a thin film transistor array substrate 310, a piezoelectric material layer 312, a transparent conductive film 314 and a capping layer )316. The thin film transistor array substrate 310 has a display area and a circuit area, and the circuit area includes a plurality of thin film transistors 310a and 310b. The piezoelectric material layer 312 is disposed on the thin film transistor array substrate 310 and completely covers the circuit area. The transparent conductive film 314 is disposed on the piezoelectric material layer 312 and completely covers the circuit area. There is a touch electrode array inside the transparent conductive film 314, and the touch electrode array is composed of a plurality of touch electrodes 318. A capping layer 316 is disposed on the transparent conductive film 314 and completely covers the circuit area. Viewed from the side view of the thin film transistor array substrate 310, the touch electrodes 318 are correspondingly disposed above the thin film transistors 310a and 310b.

It should be noted here that the touch electrodes 218 in Figure 2 are arranged inside the cover layer 216; and the touch electrodes 318 in Figure 3 are arranged inside the transparent conductive film 314; the other components are in principle same.

In addition, it should be noted that in the under-screen biometric modules 200 and 300 according to the embodiment of the present invention, the touch electrodes 218 and 318 are correspondingly arranged on the thin film transistors 210a, 210b, 310a, Above 310b, the light-transmitting area is increased, so that the light 220 and 320 can penetrate these newly added light-transmitting areas. In addition, the under-screen biometric modules 200 and 300 of the embodiment of the present invention are added with transparent conductive films 214 and 314, which can not only maintain the conductive function but also make the originally opaque areas become light-transmitting areas.

In an embodiment of the present invention, the touch electrodes 218 of the touch electrode array are made of silver.

In one embodiment of the present invention, the transparent conductive film 214 includes a transparent conductive oxide (TCO), wherein the transparent conductive oxide (TCO) includes indium tin oxide (ITO), indium zinc oxide (IZO) or antimony oxide. Zinc (AZO).

In an embodiment of the present invention, the shape of the touch electrodes 218 and 318 of the touch electrode array includes a mesh shape or a strip shape.

In addition, please refer to FIG. 4 and FIG. 5 together. FIG. 4 is a schematic diagram of some components of an under-screen biometric module according to an embodiment of the present invention. FIG. 5 is a schematic diagram of some components of an under-screen biometric recognition module according to another embodiment of the present invention.

As shown in FIG. 4 , in one embodiment of the present invention, the shape of the touch electrodes 218 of the touch electrode array is a mesh, that is to say, the touch electrodes 218 are present inside the cover layer 216 A square with sides of approximately equal length. In addition, in other embodiments of the present invention, the shape of the touch electrodes 318 of the touch electrode array may also be mesh-like, that is, the touch electrodes 318 have approximately equal side lengths inside the transparent conductive film 314 blocks.

As shown in FIG. 5 , in one embodiment of the present invention, the touch electrodes 318 of the touch electrode array are in a strip shape, that is to say, the touch electrodes 318 are inside the transparent conductive film 314 Long strips with unequal side lengths and parallel to each other are present, and the extending direction of the strips can be changed according to design requirements. In addition, in other embodiments of the present invention, the shape of the touch electrodes 218 of the touch electrode array may also be strip-shaped, that is, the touch electrodes 218 have unequal side lengths inside the cover layer 216 and are unequal to each other. Long parallel strips.

In addition, in an embodiment of the present invention, the thickness of the transparent conductive films 214 and 314 is less than 10 nanometers, the transmittance is greater than 90%, and the surface resistance is less than 10Ω/square.

In an embodiment of the present invention, the upper surfaces of the thin film transistor array substrates 210 and 310 further include a protective layer (Primer C) adjacent to the piezoelectric material layer 212 .

In addition, please refer to FIG. 6 and FIG. 7 together. FIG. 6 is a schematic diagram of an under-screen biometric device according to an embodiment of the present invention. FIG. 7 is a schematic diagram of an under-screen biometric recognition device according to another embodiment of the present invention. As shown in FIG. 6 and FIG. 7 , other embodiments of the present invention provide an under-screen biometric device 1000, 2000. The under-screen biometric devices 1000 and 2000 include a glass substrate 600 and the aforementioned under-screen biometric module 200 or 300. The aforementioned under-screen biometric module 200 or 300 is disposed on an upper surface (refer to FIG. 7 ) or a lower surface (refer to FIG. 6 ) of the glass substrate 600 .

In addition, please refer to FIG. 8 and FIG. 9 together. FIG. 8 is a schematic diagram of an under-screen biometric recognition device according to another embodiment of the present invention. FIG. 9 is a schematic diagram of an under-screen biometric recognition device according to yet another embodiment of the present invention.

As shown in FIG. 8 , another embodiment of the present invention provides an under-screen biometric identification device 3000, which includes a glass substrate 600, a display module 700 and the aforementioned under-screen biometric identification module 200 or 300. The aforementioned under-screen biometric identification module 200 or 300 is disposed between the glass substrate 600 and the display module 700 .

In addition, as shown in FIG. 9 , another embodiment of the present invention provides an under-screen biometric recognition device 4000, which includes a display module 700, a glass substrate 600 and the aforementioned under-screen biometric recognition module 200 or 300. The glass substrate 600 is disposed on the display module 700 , and the aforementioned under-screen biometric module 200 or 300 is disposed to be embedded in the glass substrate 600 .

The above embodiments are only used to illustrate the technical solutions of the present invention and are not limiting. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced. without departing from the spirit and scope of the technical solution of the present invention.

10:Thin film transistor array substrate 10 12: Piezoelectric material layer 12 14: Silver electrode 14 16: Covering layer 100:Fingerprint recognition module 200, 300: Under-screen biometric module 210, 310: Thin film transistor array substrate 210a, 210b, 310a, 310b: thin film transistor 212, 312: Piezoelectric material layer 214, 314: Transparent conductive film 216, 316: Covering layer 218, 318: Touch electrode 220, 320: light 600:Glass substrate 700:Display module 1000, 2000, 3000, 4000: under-screen biometric device

In order to make the above and other objects, features, advantages and embodiments of the present invention easier to understand, the accompanying drawings are described as follows: FIG. 1 is a schematic diagram of a fingerprint recognition module in the prior art. FIG. 2 is a schematic diagram of an under-screen biometric recognition module according to an embodiment of the present invention. FIG. 3 is a schematic diagram of an under-screen biometric recognition module according to another embodiment of the present invention. FIG. 4 is a schematic diagram of some components of an under-screen biometric recognition module according to an embodiment of the present invention. FIG. 5 is a schematic diagram of some components of an under-screen biometric recognition module according to another embodiment of the present invention. FIG. 6 is a schematic diagram of an under-screen biometric recognition device according to an embodiment of the present invention. FIG. 7 is a schematic diagram of an under-screen biometric recognition device according to another embodiment of the present invention. FIG. 8 is a schematic diagram of an under-screen biometric recognition device according to another embodiment of the present invention. FIG. 9 is a schematic diagram of an under-screen biometric recognition device according to yet another embodiment of the present invention.

In accordance with common practice, the various features and components in the figures are not drawn to actual scale, but are drawn in a manner intended to best present the specific features and components relevant to the present invention. In addition, the same or similar element symbols are used to refer to similar elements and components between different drawings.

200: Under-screen biometric module

210:Thin film transistor array substrate

210a, 210b: thin film transistor

212: Piezoelectric material layer

214:Transparent conductive film

216: Covering layer

218:Touch electrode

220:Light

Claims (10)

An under-screen biometric identification module includes: a thin film transistor array substrate having a display area and a circuit area, and the circuit area includes a plurality of thin film transistors; a piezoelectric material layer configured on the thin film transistor array On the substrate, the circuit area is completely covered; a transparent conductive film is arranged on the piezoelectric material layer and completely covers the circuit area; and a capping layer (capping layer) is arranged on the transparent conductive film and completely covers the circuit area, wherein there is a touch electrode array inside the covering layer, and the touch electrode array is composed of a plurality of touch electrodes; wherein each touch electrode is correspondingly arranged above each thin film transistor. An under-screen biometric identification module includes: a thin film transistor array substrate having a display area and a circuit area, and the circuit area includes a plurality of thin film transistors; a piezoelectric material layer configured on the thin film transistor array On the substrate, the circuit area is completely covered; a transparent conductive film is disposed on the piezoelectric material layer and completely covers the circuit area, wherein the transparent conductive film has a touch electrode array inside, and the touch electrode array is composed of a plurality of It consists of touch electrodes; and a capping layer, which is disposed on the transparent conductive film and completely covers the circuit area; wherein each touch electrode is correspondingly disposed above each thin film transistor. The under-screen biometric module as claimed in claim 1 or 2, wherein the touch electrodes of the touch electrode array are made of silver. The under-screen biometric module as described in claim 1 or 2, wherein the transparent conductive film includes a transparent conductive oxide (TCO), wherein the transparent conductive oxide (TCO) includes indium tin oxide (ITO), indium oxide Zinc (IZO) or antimony zinc oxide (AZO). The under-screen biometric module as described in claim 1 or 2, wherein the shape of the touch electrodes of the touch electrode array includes a mesh or a strip. The under-screen biometric module as described in claim 1 or 2, wherein the thickness of the transparent conductive film is less than 10 nanometers, the transmittance is greater than 90%, and the surface resistance is less than 10Ω/square. The under-screen biometric module as claimed in claim 1 or 2, wherein the upper surface of the thin film transistor array substrate further includes a protective layer (Primer C) adjacent to the piezoelectric material layer. An under-screen biometric identification device includes: a glass substrate; and the under-screen biometric identification module as described in claim 1 or 2, which is disposed on an upper surface or a lower surface of the glass substrate. An under-screen biometric identification device includes: a glass substrate; a display module; and the under-screen biometric identification module as described in claim 1 or 2, disposed between the glass substrate and the display module. An under-screen biometric identification device, including: a display module; a glass substrate configured on the display module; and the under-screen biometric module as described in claim 1 or 2, configured to be embedded in the glass substrate .

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