TWI803597B - 用於形狀度量之基板固持設備和方法 - Google Patents

用於形狀度量之基板固持設備和方法 Download PDF

Info

Publication number
TWI803597B
TWI803597B TW108109297A TW108109297A TWI803597B TW I803597 B TWI803597 B TW I803597B TW 108109297 A TW108109297 A TW 108109297A TW 108109297 A TW108109297 A TW 108109297A TW I803597 B TWI803597 B TW I803597B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
liquid
film
holding
wafer
Prior art date
Application number
TW108109297A
Other languages
English (en)
Chinese (zh)
Other versions
TW201941361A (zh
Inventor
姜浩莫
安東 德維利耶
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201941361A publication Critical patent/TW201941361A/zh
Application granted granted Critical
Publication of TWI803597B publication Critical patent/TWI803597B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Robotics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW108109297A 2018-03-19 2019-03-19 用於形狀度量之基板固持設備和方法 TWI803597B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862645128P 2018-03-19 2018-03-19
US62/645,128 2018-03-19

Publications (2)

Publication Number Publication Date
TW201941361A TW201941361A (zh) 2019-10-16
TWI803597B true TWI803597B (zh) 2023-06-01

Family

ID=67905048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108109297A TWI803597B (zh) 2018-03-19 2019-03-19 用於形狀度量之基板固持設備和方法

Country Status (6)

Country Link
US (2) US11247309B2 (https=)
JP (1) JP7289027B2 (https=)
KR (1) KR102719817B1 (https=)
CN (1) CN111699548B (https=)
TW (1) TWI803597B (https=)
WO (1) WO2019183023A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111699548B (zh) * 2018-03-19 2023-12-05 东京毅力科创株式会社 基片固持设备和形状度量方法
US12469725B2 (en) 2021-06-27 2025-11-11 Delta Design, Inc. Method for determining corrective film pattern to reduce semiconductor wafer bow

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020045407A1 (en) * 1998-10-28 2002-04-18 Doan Trung Tri Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
US6439967B2 (en) * 1998-09-01 2002-08-27 Micron Technology, Inc. Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies
US20130154675A1 (en) * 2010-03-31 2013-06-20 Hitachi High-Technologies Corporation Substrate holding device and method, and inspection apparatus and method using the substrate holding device and method

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57141331A (en) * 1981-02-24 1982-09-01 Nec Home Electronics Ltd Thin plate piece conveying method
US5235995A (en) * 1989-03-27 1993-08-17 Semitool, Inc. Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
JPH06331339A (ja) 1993-05-21 1994-12-02 Hitachi Cable Ltd 薄板の変形測定方法及びその装置
JPH0776774A (ja) 1993-06-24 1995-03-20 Nissin Electric Co Ltd 基板保持装置
JPH09258432A (ja) * 1996-03-21 1997-10-03 Toshiba Corp ガラスマスクの保持装置、及びこれを有する露光装置及び検査装置、並びにガラスマスクの保持方法、製造方法及び検査方法
JP2001196446A (ja) 2000-01-06 2001-07-19 Olympus Optical Co Ltd ホルダ装置
JP4108941B2 (ja) * 2000-10-31 2008-06-25 株式会社荏原製作所 基板の把持装置、処理装置、及び把持方法
JP3770078B2 (ja) * 2000-11-29 2006-04-26 セイコーエプソン株式会社 薄板状被測定物の保持装置及び保持方法、水晶板のカット面検査装置及び検査方法、薄板状被測定物の平坦度測定装置及び測定方法
JP2005019439A (ja) * 2003-06-23 2005-01-20 Tokyo Seimitsu Co Ltd ウェーハ受渡し方法、ウェーハ受渡し装置及びそれを用いたウェーハ加工装置
JP4265306B2 (ja) 2003-06-27 2009-05-20 株式会社東京精密 ウェーハ受渡し装置
US7181132B2 (en) * 2003-08-20 2007-02-20 Asm International N.V. Method and system for loading substrate supports into a substrate holder
US7301623B1 (en) * 2003-12-16 2007-11-27 Nanometrics Incorporated Transferring, buffering and measuring a substrate in a metrology system
US10896842B2 (en) * 2009-10-20 2021-01-19 Tokyo Electron Limited Manufacturing method of sample table
NL2007182A (en) * 2010-08-23 2012-02-27 Asml Netherlands Bv Fluid handling structure, module for an immersion lithographic apparatus, lithographic apparatus and device manufacturing method.
CN103278103B (zh) * 2013-05-18 2016-01-06 大连理工大学 一种薄基片变形的测量方法与装置
JP2015060852A (ja) * 2013-09-17 2015-03-30 株式会社東芝 半導体装置の製造方法及び製造装置
AT517792A3 (de) * 2013-09-26 2018-04-15 Suss Microtec Lithography Gmbh Aufspannvorrichtung zum Ansaugen und Halten eines Wafers
CN111699548B (zh) * 2018-03-19 2023-12-05 东京毅力科创株式会社 基片固持设备和形状度量方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6439967B2 (en) * 1998-09-01 2002-08-27 Micron Technology, Inc. Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies
US20020045407A1 (en) * 1998-10-28 2002-04-18 Doan Trung Tri Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
US20130154675A1 (en) * 2010-03-31 2013-06-20 Hitachi High-Technologies Corporation Substrate holding device and method, and inspection apparatus and method using the substrate holding device and method

Also Published As

Publication number Publication date
US20220143786A1 (en) 2022-05-12
CN111699548A (zh) 2020-09-22
TW201941361A (zh) 2019-10-16
WO2019183023A1 (en) 2019-09-26
CN111699548B (zh) 2023-12-05
US20190283218A1 (en) 2019-09-19
JP2021518664A (ja) 2021-08-02
US11247309B2 (en) 2022-02-15
JP7289027B2 (ja) 2023-06-09
US11484993B2 (en) 2022-11-01
KR102719817B1 (ko) 2024-10-18
KR20200124311A (ko) 2020-11-02

Similar Documents

Publication Publication Date Title
US12276922B2 (en) Backside deposition tuning of stress to control wafer bow in semiconductor processing
JP6294324B2 (ja) ウェハー及びフィルムフレームの両方のための単一超平坦ウェハーテーブル構造
TWI750999B (zh) 積層裝置及積層方法
US10879094B2 (en) Electrostatic chucking force measurement tool for process chamber carriers
US10319623B2 (en) Conveyance hand, conveyance apparatus, lithography apparatus, manufacturing method of article, and holding mechanism
TWI801437B (zh) 積層基板之製造方法、積層基板之製造裝置、及記錄有積層基板之製造程序之電腦可讀取媒介
US11484993B2 (en) Substrate holding apparatus and method for shape metrology
CN109314069B (zh) 用于部件堆叠和/或拾放过程的微型多拾取元件
JP6497761B2 (ja) 静電チャック用薄膜電極
KR20200047379A (ko) 고정 시스템, 지지판 및 그 제조 방법
JP7786482B2 (ja) 基板補正装置、基板積層装置、基板処理システム、基板補正方法、基板処理方法、および半導体装置の製造方法
CN106463385B (zh) 辊对辊式晶片背面颗粒及污染移除
JP2019071329A (ja) 基板接合方法および基板接合装置
JP2010062439A (ja) 半導体装置の製造方法および半導体装置の製造装置
US20250167024A1 (en) Wafer support for measuring wafer geometry
US20090148256A1 (en) Support Pin with Dome Shaped Upper Surface
KR102877860B1 (ko) 기판 제조 장치의 관리 방법
JP2010067761A (ja) 基板保持治具
US11300880B2 (en) Coating system and calibration method thereof
TW202522678A (zh) 用於高翹曲晶圓的真空卡盤
JP2013542605A (ja) 回転軸の位置を決定する方法
KR20060105817A (ko) 웨이퍼 카세트 스테이션
KR20060124279A (ko) 티칭 플레이트를 구비한 반도체 웨이퍼 이송장치