TWI799798B - 晶棒的切片方法 - Google Patents

晶棒的切片方法 Download PDF

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Publication number
TWI799798B
TWI799798B TW110106984A TW110106984A TWI799798B TW I799798 B TWI799798 B TW I799798B TW 110106984 A TW110106984 A TW 110106984A TW 110106984 A TW110106984 A TW 110106984A TW I799798 B TWI799798 B TW I799798B
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TW
Taiwan
Prior art keywords
slicing method
ingot slicing
ingot
slicing
Prior art date
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TW110106984A
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English (en)
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TW202233379A (zh
Inventor
劉建億
羅唯淳
陳俊合
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環球晶圓股份有限公司
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Priority to TW110106984A priority Critical patent/TWI799798B/zh
Publication of TW202233379A publication Critical patent/TW202233379A/zh
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Publication of TWI799798B publication Critical patent/TWI799798B/zh

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TW110106984A 2021-02-26 2021-02-26 晶棒的切片方法 TWI799798B (zh)

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Application Number Priority Date Filing Date Title
TW110106984A TWI799798B (zh) 2021-02-26 2021-02-26 晶棒的切片方法

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Application Number Priority Date Filing Date Title
TW110106984A TWI799798B (zh) 2021-02-26 2021-02-26 晶棒的切片方法

Publications (2)

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TW202233379A TW202233379A (zh) 2022-09-01
TWI799798B true TWI799798B (zh) 2023-04-21

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TW110106984A TWI799798B (zh) 2021-02-26 2021-02-26 晶棒的切片方法

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201909393A (zh) * 2017-07-10 2019-03-01 日商Ｓｕｍｃｏ股份有限公司 矽晶圓的製造方法
CN112071765A (zh) * 2020-08-18 2020-12-11 徐州鑫晶半导体科技有限公司 确定晶圆加工参数的方法和晶圆的加工方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201909393A (zh) * 2017-07-10 2019-03-01 日商Ｓｕｍｃｏ股份有限公司 矽晶圓的製造方法
CN112071765A (zh) * 2020-08-18 2020-12-11 徐州鑫晶半导体科技有限公司 确定晶圆加工参数的方法和晶圆的加工方法

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Publication number Publication date
TW202233379A (zh) 2022-09-01

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