TWI799502B - 離子植入裝置及測定裝置 - Google Patents

離子植入裝置及測定裝置 Download PDF

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Publication number
TWI799502B
TWI799502B TW108102824A TW108102824A TWI799502B TW I799502 B TWI799502 B TW I799502B TW 108102824 A TW108102824 A TW 108102824A TW 108102824 A TW108102824 A TW 108102824A TW I799502 B TWI799502 B TW I799502B
Authority
TW
Taiwan
Prior art keywords
ion implantation
measurement
measurement device
implantation device
ion
Prior art date
Application number
TW108102824A
Other languages
English (en)
Other versions
TW201935532A (zh
Inventor
井門徳安
狩谷宏行
大浦正英
Original Assignee
日商住友重機械離子科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友重機械離子科技股份有限公司 filed Critical 日商住友重機械離子科技股份有限公司
Publication of TW201935532A publication Critical patent/TW201935532A/zh
Application granted granted Critical
Publication of TWI799502B publication Critical patent/TWI799502B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/244—Detectors; Associated components or circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/023—Means for mechanically adjusting components not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1472—Deflecting along given lines
    • H01J37/1474—Scanning means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/24405—Faraday cages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
    • H01J2237/24514—Beam diagnostics including control of the parameter or property diagnosed
    • H01J2237/24528—Direction of beam or parts thereof in view of the optical axis, e.g. beam angle, angular distribution, beam divergence, beam convergence or beam landing angle on sample or workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
    • H01J2237/24514—Beam diagnostics including control of the parameter or property diagnosed
    • H01J2237/24535—Beam current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31701—Ion implantation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electron Sources, Ion Sources (AREA)
TW108102824A 2018-02-08 2019-01-25 離子植入裝置及測定裝置 TWI799502B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018020944A JP6985951B2 (ja) 2018-02-08 2018-02-08 イオン注入装置および測定装置
JP2018-020944 2018-02-08

Publications (2)

Publication Number Publication Date
TW201935532A TW201935532A (zh) 2019-09-01
TWI799502B true TWI799502B (zh) 2023-04-21

Family

ID=67476927

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108102824A TWI799502B (zh) 2018-02-08 2019-01-25 離子植入裝置及測定裝置

Country Status (5)

Country Link
US (1) US10825654B2 (zh)
JP (1) JP6985951B2 (zh)
KR (1) KR102523799B1 (zh)
CN (1) CN110137067B (zh)
TW (1) TWI799502B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6982531B2 (ja) * 2018-03-26 2021-12-17 住友重機械イオンテクノロジー株式会社 イオン注入装置および測定装置
KR20210017275A (ko) 2019-08-07 2021-02-17 주식회사 엘지화학 상부 냉각 방식 배터리 팩

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080142727A1 (en) * 2006-10-30 2008-06-19 Applied Materials, Inc. Ion beam diagnostics
US20140134833A1 (en) * 2012-11-13 2014-05-15 Sen Corporation Ion implantation apparatus and ion implantation method
TW201501166A (zh) * 2013-06-26 2015-01-01 Sen Corp 離子束測定裝置及離子束測定方法
US20150064887A1 (en) * 2013-08-29 2015-03-05 Sen Corporation Ion implantation apparatus and ion implantation method
TW201735125A (zh) * 2016-03-18 2017-10-01 Sumitomo Heavy Industries Ion Technology Co Ltd 離子植入裝置及測定裝置
TW201801155A (zh) * 2016-03-18 2018-01-01 住友重機械離子技術有限公司 離子植入方法及離子植入裝置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04101399U (ja) * 1991-02-19 1992-09-01 株式会社神戸製鋼所 イオンビーム分析装置におけるビーム軌道モニター用スリツト
JPH0765779A (ja) * 1993-08-24 1995-03-10 Nissin Electric Co Ltd イオン注入装置
US6677598B1 (en) 2003-04-29 2004-01-13 Axcelis Technologies, Inc. Beam uniformity and angular distribution measurement system
JP2005063874A (ja) * 2003-08-19 2005-03-10 Nissin Electric Co Ltd イオン注入装置
GB2427508B (en) * 2004-01-06 2008-06-25 Applied Materials Inc Ion beam monitoring arrangement
US6872953B1 (en) * 2004-05-20 2005-03-29 Axcelis Technologies, Inc. Two dimensional stationary beam profile and angular mapping
JP4901094B2 (ja) 2004-11-30 2012-03-21 株式会社Ｓｅｎ ビーム照射装置
US7202483B2 (en) 2005-04-05 2007-04-10 Olson Joseph C Methods and apparatus for ion beam angle measurement in two dimensions
US7394073B2 (en) 2005-04-05 2008-07-01 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for ion beam angle measurement in two dimensions
JP2008146863A (ja) 2006-12-06 2008-06-26 Nissin Ion Equipment Co Ltd イオンビーム測定方法
JP4784544B2 (ja) 2007-04-03 2011-10-05 日新イオン機器株式会社 イオンビームのビーム幅、発散角の測定方法およびイオン注入装置
JP5311140B2 (ja) 2009-12-01 2013-10-09 日新イオン機器株式会社 イオンビーム測定方法
JP6253524B2 (ja) 2014-06-13 2017-12-27 住友重機械イオンテクノロジー株式会社 ビーム照射装置及びビーム照射方法
JP6403485B2 (ja) 2014-08-08 2018-10-10 住友重機械イオンテクノロジー株式会社 イオン注入装置及びイオン注入方法
JP2017199554A (ja) * 2016-04-27 2017-11-02 日新電機株式会社 イオンビーム照射装置及びイオンビーム照射方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080142727A1 (en) * 2006-10-30 2008-06-19 Applied Materials, Inc. Ion beam diagnostics
US20140134833A1 (en) * 2012-11-13 2014-05-15 Sen Corporation Ion implantation apparatus and ion implantation method
TW201501166A (zh) * 2013-06-26 2015-01-01 Sen Corp 離子束測定裝置及離子束測定方法
US20150001418A1 (en) * 2013-06-26 2015-01-01 Sen Corporation Ion beam measuring device and method of measuring ion beam
US20150064887A1 (en) * 2013-08-29 2015-03-05 Sen Corporation Ion implantation apparatus and ion implantation method
TW201735125A (zh) * 2016-03-18 2017-10-01 Sumitomo Heavy Industries Ion Technology Co Ltd 離子植入裝置及測定裝置
TW201801155A (zh) * 2016-03-18 2018-01-01 住友重機械離子技術有限公司 離子植入方法及離子植入裝置

Also Published As

Publication number Publication date
CN110137067B (zh) 2022-12-02
JP2019139908A (ja) 2019-08-22
CN110137067A (zh) 2019-08-16
US20190244785A1 (en) 2019-08-08
TW201935532A (zh) 2019-09-01
US10825654B2 (en) 2020-11-03
JP6985951B2 (ja) 2021-12-22
KR20190096284A (ko) 2019-08-19
KR102523799B1 (ko) 2023-04-20

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