TWI756411B - 加成硬化型聚矽氧組成物、該組成物之製造方法及光學半導體裝置 - Google Patents
加成硬化型聚矽氧組成物、該組成物之製造方法及光學半導體裝置 Download PDFInfo
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- TWI756411B TWI756411B TW107114130A TW107114130A TWI756411B TW I756411 B TWI756411 B TW I756411B TW 107114130 A TW107114130 A TW 107114130A TW 107114130 A TW107114130 A TW 107114130A TW I756411 B TWI756411 B TW I756411B
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
- C08G77/52—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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| JP7103974B2 (ja) * | 2019-02-25 | 2022-07-20 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物、光反射材用シリコーン硬化物、光反射材及び光半導体装置 |
| JP7360910B2 (ja) * | 2019-11-18 | 2023-10-13 | 株式会社カネカ | 硬化性組成物及び該組成物を封止剤として用いた半導体装置。 |
| CN113652194B (zh) * | 2021-08-19 | 2023-05-05 | 广东万木新材料科技有限公司 | 一种苯基聚硅氧烷胶黏剂及其制备方法 |
| CN113930157B (zh) * | 2021-10-29 | 2022-05-06 | 上海宜瓷龙新材料股份有限公司 | 一种无防腐剂的水性建筑涂料及其制备方法 |
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| JP2008291148A (ja) * | 2007-05-25 | 2008-12-04 | Shin Etsu Chem Co Ltd | 耐熱性に優れたシリコーンゲル組成物 |
| JP2014189789A (ja) * | 2013-03-28 | 2014-10-06 | Sekisui Chem Co Ltd | 光半導体装置用硬化性組成物及びそれを用いた光半導体装置 |
| JP2016169331A (ja) * | 2015-03-13 | 2016-09-23 | 信越化学工業株式会社 | 積層体の製造方法及び該方法に用いる硬化性シリコーンゲル組成物 |
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| JP3344286B2 (ja) | 1997-06-12 | 2002-11-11 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物 |
| JP2002060719A (ja) * | 2000-08-21 | 2002-02-26 | Shin Etsu Chem Co Ltd | 接着性シリコーンゴム組成物及び半導体装置 |
| JP4009067B2 (ja) | 2001-03-06 | 2007-11-14 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物 |
| JP2004186168A (ja) | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
| TW200427111A (en) * | 2003-03-12 | 2004-12-01 | Shinetsu Chemical Co | Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device |
| CN103827218B (zh) | 2011-12-08 | 2016-03-16 | 迈图高新材料日本合同公司 | 氢硅烷化固化型硅橡胶组合物 |
| US20150346601A1 (en) * | 2013-04-26 | 2015-12-03 | Chi Mei Corporation | Photosensitive polysiloxane composition, protective film and element having the protective film |
| KR101701142B1 (ko) * | 2013-09-03 | 2017-02-01 | 다우 코닝 코포레이션 | 실리콘 봉지재용 첨가제 |
| KR102338110B1 (ko) * | 2013-12-16 | 2021-12-09 | 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 | 부가 경화형 실리콘 조성물 |
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| JP2008291148A (ja) * | 2007-05-25 | 2008-12-04 | Shin Etsu Chem Co Ltd | 耐熱性に優れたシリコーンゲル組成物 |
| JP2014189789A (ja) * | 2013-03-28 | 2014-10-06 | Sekisui Chem Co Ltd | 光半導体装置用硬化性組成物及びそれを用いた光半導体装置 |
| JP2016169331A (ja) * | 2015-03-13 | 2016-09-23 | 信越化学工業株式会社 | 積層体の製造方法及び該方法に用いる硬化性シリコーンゲル組成物 |
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| TW201843240A (zh) | 2018-12-16 |
| JP2018184580A (ja) | 2018-11-22 |
| CN108795049B (zh) | 2021-05-18 |
| JP6751368B2 (ja) | 2020-09-02 |
| KR102482134B1 (ko) | 2022-12-29 |
| CN108795049A (zh) | 2018-11-13 |
| KR20180120595A (ko) | 2018-11-06 |
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