TWI754325B - 包括具有改善的電漿處理垂直度的聚焦環的電漿處理裝置 - Google Patents

包括具有改善的電漿處理垂直度的聚焦環的電漿處理裝置 Download PDF

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Publication number
TWI754325B
TWI754325B TW109124243A TW109124243A TWI754325B TW I754325 B TWI754325 B TW I754325B TW 109124243 A TW109124243 A TW 109124243A TW 109124243 A TW109124243 A TW 109124243A TW I754325 B TWI754325 B TW I754325B
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TW
Taiwan
Prior art keywords
plasma processing
body portion
focus ring
substrate
processing apparatus
Prior art date
Application number
TW109124243A
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English (en)
Chinese (zh)
Other versions
TW202123299A (zh
Inventor
金龍洙
金亨源
鄭熙錫
Original Assignee
南韓商吉佳藍科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 南韓商吉佳藍科技股份有限公司 filed Critical 南韓商吉佳藍科技股份有限公司
Publication of TW202123299A publication Critical patent/TW202123299A/zh
Application granted granted Critical
Publication of TWI754325B publication Critical patent/TWI754325B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
TW109124243A 2019-08-29 2020-07-17 包括具有改善的電漿處理垂直度的聚焦環的電漿處理裝置 TWI754325B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20190106616 2019-08-29
KR10-2019-0106616 2019-08-29
KR20190113748 2019-09-16
KR10-2019-0113748 2019-09-16
KR1020190127675A KR102077974B1 (ko) 2019-08-29 2019-10-15 플라즈마 처리 수직도가 향상된 포커스링을 포함하는 플라즈마 처리 장치
KR10-2019-0127675 2019-10-15

Publications (2)

Publication Number Publication Date
TW202123299A TW202123299A (zh) 2021-06-16
TWI754325B true TWI754325B (zh) 2022-02-01

Family

ID=69514215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109124243A TWI754325B (zh) 2019-08-29 2020-07-17 包括具有改善的電漿處理垂直度的聚焦環的電漿處理裝置

Country Status (3)

Country Link
KR (1) KR102077974B1 (ko)
CN (1) CN112447477B (ko)
TW (1) TWI754325B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102077975B1 (ko) * 2019-10-15 2020-02-14 주식회사 기가레인 플라즈마 처리 수직도가 향상된 플라즈마 처리 장치
CN118280802A (zh) * 2022-12-31 2024-07-02 江苏鲁汶仪器股份有限公司 一种聚焦环以及等离子体刻蚀设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW514996B (en) * 1999-12-10 2002-12-21 Tokyo Electron Ltd Processing apparatus with a chamber having therein a high-corrosion-resistant sprayed film
US20080239691A1 (en) * 2007-03-27 2008-10-02 Tokyo Electron Limited Thermally conductive sheet and substrate mounting device including same
CN107610999A (zh) * 2017-08-28 2018-01-19 北京北方华创微电子装备有限公司 下电极机构及反应腔室
JP2019054113A (ja) * 2017-09-15 2019-04-04 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
KR20190046439A (ko) * 2017-10-26 2019-05-07 에이피티씨 주식회사 히터 패턴을 내장한 웨이퍼 척 및 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070048357A (ko) * 2005-11-04 2007-05-09 주성엔지니어링(주) 균일한 플라즈마를 생성하는 정전척
JP2008078208A (ja) * 2006-09-19 2008-04-03 Tokyo Electron Ltd フォーカスリング及びプラズマ処理装置
CN101303963B (zh) * 2007-05-11 2012-12-26 中芯国际集成电路制造(上海)有限公司 一种消除蚀刻图形偏移的方法及装置
KR101174816B1 (ko) * 2009-12-30 2012-08-17 주식회사 탑 엔지니어링 플라즈마 처리 장치의 포커스 링 및 이를 구비한 플라즈마 처리 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW514996B (en) * 1999-12-10 2002-12-21 Tokyo Electron Ltd Processing apparatus with a chamber having therein a high-corrosion-resistant sprayed film
US20080239691A1 (en) * 2007-03-27 2008-10-02 Tokyo Electron Limited Thermally conductive sheet and substrate mounting device including same
CN107610999A (zh) * 2017-08-28 2018-01-19 北京北方华创微电子装备有限公司 下电极机构及反应腔室
JP2019054113A (ja) * 2017-09-15 2019-04-04 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
KR20190046439A (ko) * 2017-10-26 2019-05-07 에이피티씨 주식회사 히터 패턴을 내장한 웨이퍼 척 및 제조 방법

Also Published As

Publication number Publication date
TW202123299A (zh) 2021-06-16
CN112447477B (zh) 2021-09-24
KR102077974B1 (ko) 2020-02-14
CN112447477A (zh) 2021-03-05

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