TWI742579B - 熱交換系統 - Google Patents

熱交換系統 Download PDF

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Publication number
TWI742579B
TWI742579B TW109109589A TW109109589A TWI742579B TW I742579 B TWI742579 B TW I742579B TW 109109589 A TW109109589 A TW 109109589A TW 109109589 A TW109109589 A TW 109109589A TW I742579 B TWI742579 B TW I742579B
Authority
TW
Taiwan
Prior art keywords
circuit
temperature
heat
branch
heat exchange
Prior art date
Application number
TW109109589A
Other languages
English (en)
Chinese (zh)
Other versions
TW202043694A (zh
Inventor
伊藤彰浩
南谷隆弘
新田慎一
Original Assignee
日商Ckd股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ckd股份有限公司 filed Critical 日商Ckd股份有限公司
Publication of TW202043694A publication Critical patent/TW202043694A/zh
Application granted granted Critical
Publication of TWI742579B publication Critical patent/TWI742579B/zh

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F28D20/021Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material and the heat-exchanging means being enclosed in one container
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/053Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
    • F28D1/0535Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00Compression machines, plants or systems with non-reversible cycle
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • F28F27/02Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus for controlling the distribution of heat-exchange media between different channels
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0431Apparatus for thermal treatment
    • H10P72/0434Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029Heat sinks
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Control Of Temperature (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
TW109109589A 2019-04-23 2020-03-23 熱交換系統 TWI742579B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-081863 2019-04-23
JP2019081863 2019-04-23

Publications (2)

Publication Number Publication Date
TW202043694A TW202043694A (zh) 2020-12-01
TWI742579B true TWI742579B (zh) 2021-10-11

Family

ID=72942477

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109109589A TWI742579B (zh) 2019-04-23 2020-03-23 熱交換系統

Country Status (6)

Country Link
US (1) US12196500B2 (https=)
JP (1) JP7404354B2 (https=)
KR (1) KR102547057B1 (https=)
CN (1) CN113811833B (https=)
TW (1) TWI742579B (https=)
WO (1) WO2020217800A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7596912B2 (ja) * 2021-04-27 2024-12-10 住友電気工業株式会社 熱交換器及びウエハ保持部材
TWI786621B (zh) * 2021-05-04 2022-12-11 緯創資通股份有限公司 熱循環裝置、檢測裝置及溫度控制方法
JP7493895B2 (ja) * 2021-08-20 2024-06-03 Ckd株式会社 温度制御システム
JP7725328B2 (ja) * 2021-10-14 2025-08-19 東京エレクトロン株式会社 支持装置、検査システム及び支持装置の制御方法
TW202346780A (zh) * 2022-03-30 2023-12-01 日商巴川製紙所股份有限公司 溫度均等化單元
JP2025043006A (ja) * 2023-09-15 2025-03-28 Ckd株式会社 蓄熱ユニット状態監視システム
WO2025074905A1 (ja) * 2023-10-03 2025-04-10 東京エレクトロン株式会社 基板支持アセンブリ、基板処理装置、及び基板処理方法
JP2025081992A (ja) * 2023-11-16 2025-05-28 株式会社荏原製作所 熱媒体供給装置
WO2026004602A1 (ja) * 2024-06-25 2026-01-02 東京エレクトロン株式会社 熱媒体制御装置および熱媒体の制御方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006038266A (ja) * 2004-07-22 2006-02-09 Univ Of Tokushima 蓄熱装置
TW201810495A (zh) * 2016-05-05 2018-03-16 應用材料股份有限公司 用於電漿處理腔室中晶圓載體的先進溫度控制

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5912439U (ja) 1982-07-13 1984-01-25 株式会社戸上電機製作所 開閉器の消弧装置
JPS61128043A (ja) * 1984-11-28 1986-06-16 Shinryo Air Conditioning Co Ltd 蓄熱回路を有する空気調和装置
JPH0331666A (ja) * 1989-06-28 1991-02-12 Matsushita Electric Ind Co Ltd ヒートポンプ式空気調和機
JPH1038401A (ja) * 1996-07-24 1998-02-13 Daikin Ind Ltd 蓄熱式冷凍装置
CN101558270B (zh) * 2006-12-27 2011-07-20 奥利安机械股份有限公司 对温度进行精密调整的装置
WO2009049096A1 (en) * 2007-10-09 2009-04-16 Advanced Thermal Sciences Corp. Thermal control system and method
KR100925236B1 (ko) * 2007-10-18 2009-11-05 주식회사 글로벌스탠다드테크놀로지 반도체 제조 장비의 온도 조절 시스템
JP2009250810A (ja) * 2008-04-07 2009-10-29 Seiko Epson Corp 電子部品の温度制御装置およびハンドラ装置
US20100263842A1 (en) * 2009-04-17 2010-10-21 General Electric Company Heat exchanger with surface-treated substrate
GB0919934D0 (en) * 2009-11-16 2009-12-30 Sunamp Ltd Energy storage systems
JP5912439B2 (ja) 2011-11-15 2016-04-27 東京エレクトロン株式会社 温度制御システム、半導体製造装置及び温度制御方法
JP5983187B2 (ja) * 2012-08-28 2016-08-31 株式会社デンソー 車両用熱管理システム
JP6014513B2 (ja) 2012-08-29 2016-10-25 東京エレクトロン株式会社 プラズマエッチング装置及び制御方法
JP6437113B2 (ja) * 2015-05-26 2018-12-12 三菱電機株式会社 ヒートポンプ給湯システム
JP6520802B2 (ja) * 2016-04-19 2019-05-29 三菱電機株式会社 蓄熱システム
KR101750410B1 (ko) * 2016-11-30 2017-06-23 주식회사 티이애플리케이션 빙축열 시스템
JP6639567B2 (ja) 2017-06-26 2020-02-05 株式会社巴川製紙所 冷却部材
CN108375248A (zh) * 2017-12-29 2018-08-07 青岛海尔空调器有限总公司 空调器系统
KR101940287B1 (ko) * 2018-02-08 2019-01-18 (주)테키스트 반도체 제조용 온도 조절 장치
KR101936425B1 (ko) 2018-04-23 2019-01-08 주식회사 셀빛 급가열 및 급냉각을 위한 칠러 시스템

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006038266A (ja) * 2004-07-22 2006-02-09 Univ Of Tokushima 蓄熱装置
TW201810495A (zh) * 2016-05-05 2018-03-16 應用材料股份有限公司 用於電漿處理腔室中晶圓載體的先進溫度控制

Also Published As

Publication number Publication date
US20220187027A1 (en) 2022-06-16
CN113811833A (zh) 2021-12-17
KR20210143834A (ko) 2021-11-29
JPWO2020217800A1 (https=) 2020-10-29
WO2020217800A1 (ja) 2020-10-29
KR102547057B1 (ko) 2023-06-26
JP7404354B2 (ja) 2023-12-25
CN113811833B (zh) 2022-10-04
US12196500B2 (en) 2025-01-14
TW202043694A (zh) 2020-12-01

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