TWI727550B - Optical identification module - Google Patents

Optical identification module Download PDF

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TWI727550B
TWI727550B TW108145688A TW108145688A TWI727550B TW I727550 B TWI727550 B TW I727550B TW 108145688 A TW108145688 A TW 108145688A TW 108145688 A TW108145688 A TW 108145688A TW I727550 B TWI727550 B TW I727550B
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semiconductor substrate
light
identification module
optical identification
sensing area
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TW108145688A
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TW202123072A (en
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李仲仁
鍾建屏
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大陸商廣州印芯半導體技術有限公司
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Abstract

An optical identification module including a semiconductor substrate, a plurality of shielding layers and a micro lens is provided. The semiconductor substrate has at least one sensing region. The shielding layers are located above the semiconductor substrate. Each of the shielding layers has at least one opening. Openings of the shielding layers form at least one light penetrating hole to cause external light to be obliquely transmitted to the sensing region through the light penetrating hole. The orthographic projection position of each opening on the semiconductor substrate and the sensing region have a shift parallel to the semiconductor substrate. The micro lens is disposed on an opening of a shielding layer furthest from the semiconductor substrate among the shielding layers to obliquely guide the external light to the sensing region.

Description

光學識別模組Optical recognition module

本發明是有關於一種光學模組,且特別是有關於一種光學識別模組。The present invention relates to an optical module, and particularly relates to an optical identification module.

隨著物聯網技術的蓬勃發展,生物辨識技術的應用及需求因此迅速擴張。目前市面上常見的生物辨識技術主要是利用光學、電容或超音波等方式識別指紋、掌紋、靜脈分佈、虹膜、視網膜或臉部特徵等生物特徵,藉此達到身分辨識或認證的目的。相較於以電容或超音波方式識別生物特徵的識別模組,以光學方式識別生物特徵的光學識別模組藉由影像感測器的感測區接收被待測物反射的光,以進行生物特徵的識別,因此具有耐用度高且成本低廉的優勢。然而,被待測物反射的光束容易散亂地傳遞至感測區,而造成取像品質不佳,影響識別結果。此外,屏下式光學識別模組的檢測光源(通常為有機發光二極體面板的發光畫素)所發出的光會有一大部分往正下方照射,而使得畫素正下方的感測區大量接收到此與指紋無關的光而形成較大的雜訊,而進而影響識別的結果。With the vigorous development of the Internet of Things technology, the application and demand of biometrics technology is expanding rapidly. At present, the common biometric identification technologies on the market mainly use optical, capacitive, or ultrasonic methods to identify biometric features such as fingerprints, palm prints, vein distribution, iris, retina, or facial features, so as to achieve the purpose of identification or authentication. Compared with the recognition module that recognizes biological characteristics by capacitive or ultrasonic methods, the optical recognition module that recognizes biological characteristics optically receives the light reflected by the object to be measured through the sensing area of the image sensor to perform biological The feature recognition therefore has the advantages of high durability and low cost. However, the light beam reflected by the object to be measured is easily scattered to the sensing area, resulting in poor image quality and affecting the recognition result. In addition, a large part of the light emitted by the detection light source (usually the light-emitting pixels of the organic light-emitting diode panel) of the under-screen optical recognition module will illuminate directly below, so that the sensing area directly below the pixel is large. Receiving this light that has nothing to do with fingerprints results in larger noise, which in turn affects the recognition result.

本發明提供一種光學識別模組,其具有良好的辨識能力。The invention provides an optical identification module, which has good identification capabilities.

本發明的光學識別模組包括半導體基底、多個屏蔽層以及微透鏡。半導體基底具有至少一感測區。這些屏蔽層設置在半導體基底上方,其中各屏蔽層具有至少一開口,且這些屏蔽層的多個開口形成至少一光通孔,以使外界的光經由該至少一光通孔傾斜傳遞至此至少一感測區。各開口於半導體基底上的正投影位置與此至少一感測區具有一平行於半導體基底的位移。微透鏡設置在這些屏蔽層中最遠離半導體基底的屏蔽層所具有的開口上,以將外界的光經由此至少一光通孔傾斜導引至此至少一感測區。The optical identification module of the present invention includes a semiconductor substrate, a plurality of shielding layers and microlenses. The semiconductor substrate has at least one sensing area. The shielding layers are arranged above the semiconductor substrate, wherein each shielding layer has at least one opening, and the plurality of openings of the shielding layers form at least one light through hole, so that external light is obliquely transmitted to the at least one through the at least one light through hole. Sensing area. The orthographic projection position of each opening on the semiconductor substrate and the at least one sensing area have a displacement parallel to the semiconductor substrate. The micro lens is arranged on the opening of the shielding layer farthest from the semiconductor substrate among the shielding layers, so as to obliquely guide external light to the at least one sensing area through the at least one light through hole.

在本發明的一實施例中,微透鏡將來自手指的指紋脊線反射的相對半導體基板傾斜的斜向光傾斜導引至此至少一感測區,將非指紋脊線反射的光導引至此至少一感測區之外。In an embodiment of the present invention, the microlens obliquely guides the oblique light reflected from the fingerprint ridge line of the finger to the at least one sensing area, and guides the light reflected by the non-fingerprint ridge line to the at least one sensing area. One outside the sensing area.

在本發明的一實施例中,多個屏蔽層的多個開口於半導體基板上的正投影沿著一排列方向依序排列,且排列方向與半導體基板的表面平行。In an embodiment of the present invention, the orthographic projections of the plurality of openings of the plurality of shielding layers on the semiconductor substrate are sequentially arranged along an arrangement direction, and the arrangement direction is parallel to the surface of the semiconductor substrate.

在本發明的一實施例中,光通孔的延伸方向與半導體基版之間具有一夾角,且夾角不等於90度。In an embodiment of the present invention, there is an included angle between the extending direction of the light through hole and the semiconductor substrate, and the included angle is not equal to 90 degrees.

在本發明的一實施例中,微透鏡一邊的平均切線斜率大於另一邊的平均切線斜率。In an embodiment of the present invention, the average tangent slope of one side of the microlens is greater than the average tangent slope of the other side.

在本發明的一實施例中,微透鏡呈鏡像對稱。In an embodiment of the present invention, the microlenses are mirror-symmetrical.

在本發明的一實施例中,微透鏡於半導體基底上的正投影與多個屏蔽層的至少其中之一重疊。In an embodiment of the present invention, the orthographic projection of the microlens on the semiconductor substrate overlaps with at least one of the plurality of shielding layers.

在本發明的一實施例中,至少一感測區為多個感測區,且微透鏡的中心於半導體基底上的正投影位於這些感測區之間。In an embodiment of the present invention, at least one sensing area is a plurality of sensing areas, and the orthographic projection of the center of the microlens on the semiconductor substrate is located between the sensing areas.

在本發明的一實施例中,多個屏蔽層的材質為金屬。In an embodiment of the present invention, the material of the multiple shielding layers is metal.

在本發明的一實施例中,多個屏蔽層是藉由積體電路的一金屬內連線而形成。In an embodiment of the present invention, the multiple shielding layers are formed by a metal interconnection of the integrated circuit.

在本發明的一實施例中,光學識別模組還包括反射層,設置於半導體基底的頂面上,反射層具有至少一針孔,針孔在半導體基底上的正投影與至少一感測區重疊。In an embodiment of the present invention, the optical identification module further includes a reflective layer disposed on the top surface of the semiconductor substrate, the reflective layer has at least one pinhole, an orthographic projection of the pinhole on the semiconductor substrate and at least one sensing area overlapping.

在本發明的一實施例中,反射層的針孔與多個屏蔽層中最接近半導體基底的屏蔽層的開口於半導體基底上的正投影彼此重疊。In an embodiment of the present invention, the pinhole of the reflective layer and the orthographic projection of the opening of the shielding layer closest to the semiconductor substrate among the plurality of shielding layers on the semiconductor substrate overlap with each other.

在本發明的一實施例中,上述反射層的針孔的尺寸小於感測區的尺寸。In an embodiment of the present invention, the size of the pinhole of the reflective layer is smaller than the size of the sensing area.

在本發明的一實施例中,上述的光學識別模組更包括多個介電層,其中各介電層分別位於其中二屏蔽層之間。In an embodiment of the present invention, the above-mentioned optical identification module further includes a plurality of dielectric layers, and each of the dielectric layers is located between two of the shielding layers.

基於上述,本發明的實施例的光學識別模組中,利用多個屏蔽層及微透鏡以將外界的光傾斜導引至感測區,以有效改善光學干擾(crosstalk)、達到光學降噪並提升影像解析度,也可避免檢測光源所發出的朝向正下方傳遞的強光影響識別結果。因此,本發明的實施例的光學識別模組可具有良好的辨識能力。Based on the above, in the optical identification module of the embodiment of the present invention, a plurality of shielding layers and microlenses are used to obliquely guide external light to the sensing area, so as to effectively improve optical interference (crosstalk) and achieve optical noise reduction and Improving the image resolution can also prevent the strong light emitted by the detection light source from affecting the recognition result. Therefore, the optical identification module of the embodiment of the present invention can have good identification capabilities.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

在圖式中,各圖式繪示的是特定示範實施例中所使用的方法、結構及/或材料的通常性特徵。然而,所述圖式並不侷限於下列實施例的結構或特徵,且這些圖式不應被解釋為界定或限制由這些示範實施例所涵蓋的範圍或性質。舉例來說,為了清楚起見,各膜層、區域及/或結構的相對厚度及位置可能縮小或放大。In the drawings, each drawing shows the general characteristics of the methods, structures, and/or materials used in a specific exemplary embodiment. However, the drawings are not limited to the structures or features of the following embodiments, and these drawings should not be construed as defining or limiting the scope or properties covered by these exemplary embodiments. For example, for clarity, the relative thickness and position of each layer, region, and/or structure may be reduced or enlarged.

在各圖式中使用相似或相同的元件符號傾向於標示相似或相同元件或特徵的存在。圖式中的相似元件符號標示相似的元件並且將省略其贅述。The use of similar or identical element symbols in the various drawings tends to indicate the existence of similar or identical elements or features. Similar component symbols in the drawings indicate similar components and will not be described in detail.

下列實施例所列舉的光學識別模組適於擷取待測物的生物特徵。待測物可為手指或手掌。對應地,生物特徵可為指紋、靜脈或掌紋,但不以此為限。The optical identification module listed in the following embodiments is suitable for capturing the biological characteristics of the test object. The test object can be a finger or a palm. Correspondingly, the biological characteristics can be fingerprints, veins or palm prints, but not limited to this.

圖1是依照本發明的一實施例的光學識別模組的剖面示意圖。請參照圖1,本實施例的光學識別模組100包括半導體基底110、多個屏蔽層120以及微透鏡L1。FIG. 1 is a schematic cross-sectional view of an optical identification module according to an embodiment of the present invention. Please refer to FIG. 1, the optical identification module 100 of this embodiment includes a semiconductor substrate 110, a plurality of shielding layers 120, and a microlens L1.

半導體基底110具有至少一感測區R,所述至少一感測區R為半導體基底110中的收光區域,適於接收被待測物(例如手指)反射的光(即外界的光IL,其帶有生物特徵資訊)。舉例來說,一個感測區R可為電荷耦合元件(Charge Coupled Device, CCD)、互補式金屬氧化物半導體元件(Complementary Metal-Oxide Semiconductor, CMOS)或其他適當種類的影像感測器的一個像素或數個像素,而在本實施例中半導體基板110上具有排成二維陣列的感測區R(例如排成陣列的像素)。The semiconductor substrate 110 has at least one sensing area R. The at least one sensing area R is a light-receiving area in the semiconductor substrate 110 and is suitable for receiving light reflected by an object to be measured (such as a finger) (ie, external light IL, It carries biometric information). For example, a sensing region R can be a pixel of a charge coupled device (CCD), a complementary metal-oxide semiconductor (CMOS) or other appropriate type of image sensor Or several pixels. In this embodiment, the semiconductor substrate 110 has sensing regions R arranged in a two-dimensional array (for example, pixels arranged in an array).

這些屏蔽層120設置在半導體基底110上方。進一步而言,其中各屏蔽層120具有至少一開口OP,且這些屏蔽層120的多個開口OP形成至少一光通孔TH,以使外界的光IL經由至少一光通孔TH傾斜傳遞至此至少一感測區R,如圖1所示,光通孔TH可導引外界小部分朝向正下方傳遞的光及外界大部分的斜向光,然而在其它實施例中,也可以都導引斜向光,其中每個開口OP於半導體基底110上的正投影位置與至少一感測區R具有一平行於半導體基底110的位移,藉此改善光學干擾、達到光學降噪並提升影像解析度同時也可避免檢測光源所發出的朝向正下方傳遞的強光影響識別結果。另一方面,在本實施例中,這些屏蔽層120是藉由光學識別模組100的一金屬內連線而形成。換言之,在本實施例中,這些屏蔽層120的材質為金屬(如:銅、鎢或鋁等金屬),但本發明不以此為限。在另一實施例中,這些屏蔽層120亦可由光學識別模組100中其他的結構(如:黑光阻)而形成,本發明皆不以此為限。These shielding layers 120 are disposed on the semiconductor substrate 110. Furthermore, each of the shielding layers 120 has at least one opening OP, and the plurality of openings OP of the shielding layers 120 form at least one light through hole TH, so that the external light IL is obliquely transmitted to the at least one through the at least one light through hole TH. A sensing area R, as shown in FIG. 1, the light through hole TH can guide a small part of the outside light that passes directly below and most of the oblique light from the outside. However, in other embodiments, both can also be guided obliquely. The front projection position of each opening OP on the semiconductor substrate 110 and the at least one sensing region R have a displacement parallel to the semiconductor substrate 110, thereby improving optical interference, achieving optical noise reduction, and improving image resolution. It can also prevent the strong light emitted by the detection light source from affecting the recognition result. On the other hand, in this embodiment, the shielding layers 120 are formed by a metal interconnection of the optical identification module 100. In other words, in this embodiment, the material of the shielding layer 120 is metal (for example, metal such as copper, tungsten, or aluminum), but the present invention is not limited to this. In another embodiment, the shielding layers 120 can also be formed by other structures (such as black photoresist) in the optical identification module 100, and the present invention is not limited thereto.

微透鏡L1設置在這些屏蔽層120中最遠離半導體基底110的屏蔽層120(即圖1中最上方的屏蔽層120)所具有的開口OP上,以將外界的光IL經由此至少一光通孔TH傾斜導引至此至少一感測區R,如圖1所示,可以導引小部分朝向正下方傳遞的光、大部分斜向光,然而在其它實施例中,也可以都導引斜向光。如此一來,便能使至少一感測區R讀取並辨識外界光線所攜帶的影像資訊。The microlens L1 is disposed on the opening OP of the shielding layer 120 (that is, the uppermost shielding layer 120 in FIG. 1) of the shielding layers 120 farthest from the semiconductor substrate 110, so as to pass external light IL through at least one light. The hole TH obliquely guides to at least one sensing area R. As shown in FIG. 1, it can guide a small part of the light transmitted directly below and most of the oblique light. However, in other embodiments, both can be guided obliquely. To light. In this way, the at least one sensing area R can read and recognize the image information carried by the external light.

如圖1所示,在本實施例中,光學識別模組100還包括多個介電層DL,且各介電層DL分別位於相鄰二屏蔽層120之間,或者是覆蓋屏蔽層120。As shown in FIG. 1, in this embodiment, the optical identification module 100 further includes a plurality of dielectric layers DL, and each dielectric layer DL is located between two adjacent shielding layers 120 or covering the shielding layer 120.

如圖1所示,在本實施例中,這些屏蔽層120的這些開口OP於半導體基板110上的正投影沿著一排列方向D1(如圖1的水平方向)依序排列,且排列方向D1與半導體基板110的表面平行,因此,這些開口OP能形成至少一光通孔TH。如此,在本實施例中,至少一光通孔TH的延伸方向會與半導體基板110之間具有一夾角,且夾角不等於90度。如此一來,便能使外界的光IL經由至少一光通孔TH傾斜傳遞至此至少一感測區R,藉此改善光學干擾、達到光學降噪並提升影像解析度,也可避免檢測光源所發出的朝向正下方傳遞的強光影響識別結果。As shown in FIG. 1, in this embodiment, the orthographic projections of the openings OP of the shielding layer 120 on the semiconductor substrate 110 are sequentially arranged along an arrangement direction D1 (the horizontal direction in FIG. 1), and the arrangement direction D1 Parallel to the surface of the semiconductor substrate 110, these openings OP can form at least one light through hole TH. Thus, in this embodiment, the extending direction of the at least one optical through hole TH has an included angle with the semiconductor substrate 110, and the included angle is not equal to 90 degrees. In this way, the external light IL can be obliquely transmitted to the at least one sensing area R through the at least one light through hole TH, thereby improving optical interference, achieving optical noise reduction, and improving image resolution, and also avoiding detection of the light source. The strong light transmitted directly below affects the recognition result.

在本實施例中,微透鏡L1一邊的平均切線斜率大於另一邊的平均切線斜率(例如圖1中微透鏡L1的左邊較為陡峭,而右邊較為平緩),以更有效率的會聚光束並傾斜引導外界的光IL至此至少一感測區R,進而能使此至少一感測區R能讀取並更清晰的辨識外界光線中的影像資訊。In this embodiment, the average tangent slope of one side of the microlens L1 is greater than the average tangent slope of the other side (for example, the left side of the microlens L1 in Figure 1 is steeper, and the right side is more gentle), so as to converge the beam more efficiently and guide it obliquely The external light IL reaches the at least one sensing area R, so that the at least one sensing area R can read and more clearly recognize the image information in the external light.

圖2是依照本發明一實施例的電子裝置的剖面示意圖。請參照圖2,本實施例的電子裝置ED包括如圖1的光學識別模組100、保護玻璃CG、顯示面板的基板DP以及基板DP上的有機發光二極體(organic light-emitting diode)50。如圖2所示(光學識別模組100所包括的構件請參考圖1所示),在本實施例中,來自手指的指紋脊線FP反射的光IL為相對半導體基板110傾斜的斜向光IL,微透鏡L1將來自手指的指紋脊線FP反射的光IL(斜向光)傾斜導引至光學識別模組100的此至少一感測區R,而非指紋脊線反射的光NIL被導引至此至少一感測區R之外。在本實施例中,由於檢測光源(例如為朗伯特光源(Lambertian))所發光的光指向性高,因此來自檢測光源的雜訊以30度角內入射居絕大部分,來自待測物反射的光IL則以斜向入射居多。故本發明的一實施例以微透鏡L1接收光IL(斜向光)進入至少一感測區R,直下的會產生雜訊的光(即直接來自有機發光二極體50而非手指反射的光)則偏折到感測區R之外。2 is a schematic cross-sectional view of an electronic device according to an embodiment of the invention. Please refer to FIG. 2, the electronic device ED of this embodiment includes an optical identification module 100 as shown in FIG. 1, a cover glass CG, a substrate DP of a display panel, and an organic light-emitting diode 50 on the substrate DP. . As shown in FIG. 2 (please refer to FIG. 1 for components included in the optical identification module 100), in this embodiment, the light IL reflected by the fingerprint ridge FP of the finger is an oblique light inclined with respect to the semiconductor substrate 110 IL, the microlens L1 obliquely guides the light IL (oblique light) reflected from the fingerprint ridge line FP of the finger to the at least one sensing area R of the optical identification module 100, and the light NIL reflected by the non-fingerprint ridge line is obliquely guided Guided to the outside of at least one sensing area R. In this embodiment, since the light emitted by the detection light source (such as a Lambertian light source) has high directivity, most of the noise from the detection light source is incident at an angle of 30 degrees and comes from the object under test. The reflected light IL is mostly incident obliquely. Therefore, in an embodiment of the present invention, the light IL (oblique light) received by the microlens L1 enters at least one sensing area R, and the light that directly generates noise (that is, the light directly coming from the organic light-emitting diode 50 instead of the reflection from the finger) Light) is deflected out of the sensing area R.

圖3是依照本發明的另一實施例的光學識別模組的剖面示意圖。請參照圖3,本實施例的光學識別模組200與圖1中光學識別模組100類似,而兩者的主要差異如下所述。在本實施例中,光學識別模組200還可包括一反射層RL1,設置在半導體基底110的頂面上,且位於感測區R與屏蔽層120之間。反射層RL1具有至少一針孔PH,至少一針孔PH在半導體基底110上的正投影與至少一感測區R重疊,以進一步改善光學干擾、達到光學降噪並提升影像解析度。3 is a schematic cross-sectional view of an optical identification module according to another embodiment of the invention. Please refer to FIG. 3, the optical identification module 200 of this embodiment is similar to the optical identification module 100 in FIG. 1, and the main differences between the two are as follows. In this embodiment, the optical identification module 200 may further include a reflective layer RL1 disposed on the top surface of the semiconductor substrate 110 and located between the sensing region R and the shielding layer 120. The reflective layer RL1 has at least one pinhole PH, and the orthographic projection of the at least one pinhole PH on the semiconductor substrate 110 overlaps with at least one sensing region R to further improve optical interference, achieve optical noise reduction, and improve image resolution.

在本實施例中,反射層RL1的至少一個針孔PH與這些屏蔽層120中最接近半導體基底110的屏蔽層120的開口OP於半導體基底110上的正投影重疊。此外,針孔PH的尺寸小於感測區R尺寸,以有效抑制光學干擾。In this embodiment, at least one pinhole PH of the reflective layer RL1 overlaps with the orthographic projection of the opening OP of the shielding layer 120 closest to the semiconductor substrate 110 among the shielding layers 120 on the semiconductor substrate 110. In addition, the size of the pinhole PH is smaller than the size of the sensing area R to effectively suppress optical interference.

圖4A是依照本發明的又一實施例的光學識別模組的剖面示意圖,而圖4B是依照本發明的再一實施例的光學識別模組的上視示意圖。請先參照圖4A,本實施例的光學識別模組300與圖3中光學識別模組200類似,而兩者的主要差異如下所述。請參照圖4A,在本實施例中,微透鏡L2呈鏡像對稱。此外,微透鏡L2於半導體基底110上的投影與多個屏蔽層120A的至少其中之一重疊,以阻擋檢測光源所發出的朝向正下方傳遞的雜訊及強光。進一步而言,在本實施例中,至少一感測區R為多個感測區R,例如為圖4A所示的兩個感測區R共用一個微透鏡L2,最接近半導體基底110的屏蔽層120A具有多個開口OP(例如圖4A中的兩個開口),且分別與這些屏蔽層120A上的多個開口OP形成多個光通孔TH(例如圖4A中的兩個光通孔TH)。反射層RL2具有多個針孔PH,這些針孔PH在半導體基底110上的正投影分別與這些感測區R重疊,且微透鏡L2的中心於半導體基底110上的正投影位於這些感測區R之間,在本實施例中,微透鏡L2與這些感測區R的設置關係是一對二。然而,在另一實施例中,一個微透鏡L2所對應的感測區R的數量可依需求改變,而不限於圖4A所示的兩個,請參照圖4B所示的光學識別模組300的上視示意圖,一個微透鏡L2所對應的感測區R的數量例如可以為四個,也就是微透鏡L2與這些感測器R的關係為一對四,且微透鏡L2的中心於半導體基底110上的正投影位於四個感測區R之間。此外,在本實施例中,雖是以光學識別模組300具備反射層RL2為例,但本發明不以此為限。在另一實施例中,光學識別模組300亦可不具備反射層RL2。4A is a schematic cross-sectional view of an optical identification module according to another embodiment of the present invention, and FIG. 4B is a schematic top view of an optical identification module according to still another embodiment of the present invention. Please refer to FIG. 4A first. The optical identification module 300 of this embodiment is similar to the optical identification module 200 in FIG. 3, and the main differences between the two are as follows. Please refer to FIG. 4A. In this embodiment, the microlens L2 is mirror-symmetrical. In addition, the projection of the microlens L2 on the semiconductor substrate 110 overlaps with at least one of the plurality of shielding layers 120A, so as to block noise and strong light transmitted directly below from the detection light source. Furthermore, in this embodiment, at least one sensing region R is a plurality of sensing regions R, for example, two sensing regions R shown in FIG. 4A share a microlens L2, which is closest to the shielding of the semiconductor substrate 110 The layer 120A has a plurality of openings OP (for example, the two openings in FIG. 4A), and respectively forms a plurality of optical through holes TH (for example, the two optical through holes TH in FIG. 4A) with the plurality of openings OP on the shielding layer 120A. ). The reflective layer RL2 has a plurality of pinholes PH. The orthographic projections of the pinholes PH on the semiconductor substrate 110 overlap the sensing regions R, and the orthographic projections of the center of the microlens L2 on the semiconductor substrate 110 are located in these sensing regions. Between R, in this embodiment, the arrangement relationship between the microlens L2 and these sensing regions R is one-to-two. However, in another embodiment, the number of sensing regions R corresponding to one microlens L2 can be changed as required, and is not limited to the two shown in FIG. 4A. Please refer to the optical identification module 300 shown in FIG. 4B. In the top view schematic diagram, the number of sensing regions R corresponding to a microlens L2 can be, for example, four, that is, the relationship between the microlens L2 and these sensors R is one to four, and the center of the microlens L2 is on the semiconductor The orthographic projection on the substrate 110 is located between the four sensing regions R. In addition, in this embodiment, although the optical identification module 300 is provided with the reflective layer RL2 as an example, the present invention is not limited to this. In another embodiment, the optical identification module 300 may not have the reflective layer RL2.

圖5是依照本發明的另一實施例的光學識別模組的剖面示意圖。請參照圖5,本實施例的光學識別模組400與圖3中的光學識別模組200類似,而兩者的主要差異如下所述。在光學識別模組400中,微透鏡L3呈鏡像對稱(例如在圖5中是左右對稱的)。藉由這些屏蔽層120的這些開口OP所形成光通孔TH的導引,亦能將鏡像對稱的微透鏡L3所會聚的光IL傾斜導引至感測區R。5 is a schematic cross-sectional view of an optical identification module according to another embodiment of the invention. Please refer to FIG. 5, the optical identification module 400 of this embodiment is similar to the optical identification module 200 in FIG. 3, and the main differences between the two are as follows. In the optical identification module 400, the microlens L3 is mirror-symmetrical (for example, it is bilaterally symmetrical in FIG. 5). By guiding the light through holes TH formed by the openings OP of the shielding layer 120, the light IL condensed by the mirror-symmetric microlens L3 can also be obliquely guided to the sensing region R.

綜上所述,本發明的實施例的光學識別模組中,利用多個屏蔽層及微透鏡以將外界的光傾斜導引至感測區,以有效改善光學干擾(crosstalk)、達到光學降噪並提升影像解析度,也可避免檢測光源所發出的朝向正下方傳遞的強光影響識別結果。因此,本發明的實施例的光學識別模組可具有良好的辨識能力。In summary, in the optical identification module of the embodiment of the present invention, a plurality of shielding layers and microlenses are used to obliquely guide external light to the sensing area, so as to effectively improve optical interference (crosstalk) and achieve optical degradation. Noise can improve the image resolution, and it can also avoid the strong light emitted by the detection light source from affecting the recognition result. Therefore, the optical identification module of the embodiment of the present invention can have good identification capabilities.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

100、200、300、400:光學識別模組100, 200, 300, 400: optical recognition module

110:半導體基板110: Semiconductor substrate

120、120A:屏蔽層120, 120A: shielding layer

50:有機發光二極體50: organic light-emitting diode

CG:保護玻璃CG: protective glass

DL:介電質DL: Dielectric

DP:顯示面板DP: display panel

D1:排列方向D1: Arrangement direction

ED:電子裝置ED: Electronic device

FP:指紋脊線FP: Fingerprint Ridge

IL:光IL: light

NIL:非指紋脊線反射的光NIL: light reflected by non-fingerprint ridges

L1、L2、L3:微透鏡L1, L2, L3: micro lens

OP:開口OP: opening

PH:針孔PH: pinhole

R:感測區R: Sensing area

RL1、RL2:反射層RL1, RL2: reflective layer

TH:光通孔TH: Light through hole

圖1是依照本發明的一實施例的光學識別模組的剖面示意圖。 圖2是依照本發明的一實施例的電子裝置的剖面示意圖。 圖3是依照本發明的另一實施例的光學識別模組的剖面示意圖。 圖4A是依照本發明的又一實施例的光學識別模組的剖面示意圖。 圖4B是依照本發明的再一實施例的光學識別模組的上視示意圖。 圖5是依照本發明的另一實施例的光學識別模組的剖面示意圖。 FIG. 1 is a schematic cross-sectional view of an optical identification module according to an embodiment of the present invention. 2 is a schematic cross-sectional view of an electronic device according to an embodiment of the invention. 3 is a schematic cross-sectional view of an optical identification module according to another embodiment of the invention. 4A is a schematic cross-sectional view of an optical identification module according to another embodiment of the present invention. 4B is a schematic top view of an optical identification module according to still another embodiment of the present invention. 5 is a schematic cross-sectional view of an optical identification module according to another embodiment of the invention.

100:光學識別模組 100: Optical recognition module

110:半導體基板 110: Semiconductor substrate

120:屏蔽層 120: shielding layer

DL:介電質 DL: Dielectric

D1:排列方向 D1: Arrangement direction

IL:光 IL: light

L1:微透鏡 L1: Micro lens

OP:開口 OP: opening

R:感測區 R: Sensing area

TH:光通孔 TH: Light through hole

Claims (8)

一種光學識別模組,包括:一半導體基底,具有至少一感測區;多個屏蔽層,設置在該半導體基底上方,其中各屏蔽層具有至少一開口,且該些屏蔽層的多個開口形成至少一光通孔,以使外界的光經由該至少一光通孔傾斜傳遞至該至少一感測區,其中各該開口於該半導體基底上的正投影位置與該至少一感測區具有一平行於該半導體基底的位移;以及一微透鏡,設置在該些屏蔽層中最遠離該半導體基底的屏蔽層所具有的開口上,以將外界的光經由該至少一光通孔傾斜導引至該至少一感測區,該微透鏡一邊的平均切線斜率大於另一邊的平均切線斜率,以將來自手指的指紋脊線反射的相對該半導體基板傾斜的斜向光傾斜導引至該至少一感測區,將非該指紋脊線反射的光導引至該至少一感測區之外。 An optical identification module includes: a semiconductor substrate with at least one sensing area; a plurality of shielding layers arranged above the semiconductor substrate, wherein each shielding layer has at least one opening, and the plurality of openings of the shielding layers are formed At least one light through hole, so that external light is obliquely transmitted to the at least one sensing area through the at least one light through hole, wherein the orthographic projection position of each opening on the semiconductor substrate and the at least one sensing area have a Parallel to the displacement of the semiconductor substrate; and a microlens disposed on the opening of the shielding layer farthest from the semiconductor substrate among the shielding layers, so as to obliquely guide external light to the shielding layer through the at least one light through hole In the at least one sensing area, the average tangent slope of one side of the microlens is greater than the average tangent slope of the other side, so as to obliquely guide the oblique light reflected from the fingerprint ridge line of the finger to the at least one sensor. The detection area guides the light not reflected by the fingerprint ridge line to the outside of the at least one sensing area. 如申請專利範圍第1項所述的光學識別模組,其中該些屏蔽層的該些開口於該半導體基板上的正投影沿著一排列方向依序排列,且該排列方向與該半導體基板的表面平行。 As described in the first item of the scope of patent application, the orthographic projections of the openings of the shielding layers on the semiconductor substrate are sequentially arranged along an arrangement direction, and the arrangement direction is the same as that of the semiconductor substrate. The surfaces are parallel. 如申請專利範圍第2項所述的光學識別模組,該至少一光通孔的延伸方向與該半導體基版之間具有一夾角,且該夾角不等於90度。 For the optical identification module described in item 2 of the scope of patent application, there is an included angle between the extending direction of the at least one light through hole and the semiconductor substrate, and the included angle is not equal to 90 degrees. 如申請專利範圍第1項所述的光學識別模組,其中該些屏蔽層的材質為金屬。 For the optical identification module described in item 1 of the scope of patent application, the material of the shielding layers is metal. 如申請專利範圍第1項所述的光學識別模組,其中該些屏蔽層是藉由該積體電路的一金屬內連線而形成。 In the optical identification module described in the first item of the scope of patent application, the shielding layers are formed by a metal interconnection of the integrated circuit. 如申請專利範圍第1項所述的光學識別模組,還包括:一反射層,設置於該半導體基底的頂面上,該反射層具有至少一針孔,該針孔在該半導體基底上的正投影與該至少一感測區重疊。 As described in the first item of the scope of patent application, the optical identification module further includes: a reflective layer disposed on the top surface of the semiconductor substrate, the reflective layer has at least one pinhole, and the pinhole is formed on the semiconductor substrate. The orthographic projection overlaps the at least one sensing area. 如申請專利範圍第6項所述的光學識別模組,其中該反射層的該針孔與該些屏蔽層中最接近該半導體基底的屏蔽層的該開口於該半導體基底上的正投影彼此重疊。 The optical identification module according to item 6 of the scope of patent application, wherein the pinhole of the reflective layer and the orthographic projection of the opening on the semiconductor substrate of the shielding layer closest to the semiconductor substrate in the shielding layers overlap with each other . 如申請專利範圍第6項所述的光學識別模組,其中該反射層的該針孔的尺寸小於該感測區的尺寸。According to the optical identification module described in item 6 of the scope of patent application, the size of the pinhole of the reflective layer is smaller than the size of the sensing area.
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