TWI727089B - 晶圓的加工方法及研磨裝置 - Google Patents

晶圓的加工方法及研磨裝置 Download PDF

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Publication number
TWI727089B
TWI727089B TW106130122A TW106130122A TWI727089B TW I727089 B TWI727089 B TW I727089B TW 106130122 A TW106130122 A TW 106130122A TW 106130122 A TW106130122 A TW 106130122A TW I727089 B TWI727089 B TW I727089B
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TW
Taiwan
Prior art keywords
wafer
polishing
liquid
polishing pad
layer
Prior art date
Application number
TW106130122A
Other languages
English (en)
Chinese (zh)
Other versions
TW201814784A (zh
Inventor
宮城有佑
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201814784A publication Critical patent/TW201814784A/zh
Application granted granted Critical
Publication of TWI727089B publication Critical patent/TWI727089B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02016—Backside treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
TW106130122A 2016-10-03 2017-09-04 晶圓的加工方法及研磨裝置 TWI727089B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-195906 2016-10-03
JP2016195906A JP6827289B2 (ja) 2016-10-03 2016-10-03 ウエーハの加工方法及び研磨装置

Publications (2)

Publication Number Publication Date
TW201814784A TW201814784A (zh) 2018-04-16
TWI727089B true TWI727089B (zh) 2021-05-11

Family

ID=61803184

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106130122A TWI727089B (zh) 2016-10-03 2017-09-04 晶圓的加工方法及研磨裝置

Country Status (4)

Country Link
JP (1) JP6827289B2 (ko)
KR (1) KR102320761B1 (ko)
CN (1) CN107891358B (ko)
TW (1) TWI727089B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110576386B (zh) * 2018-06-26 2021-10-12 蓝思精密(东莞)有限公司 指纹环的加工方法
WO2020054504A1 (ja) * 2018-09-13 2020-03-19 東京エレクトロン株式会社 処理システム及び処理方法
EP3900876A1 (de) * 2020-04-23 2021-10-27 Siltronic AG Verfahren zum schleifen einer halbleiterscheibe

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344878A (ja) * 2005-06-10 2006-12-21 Disco Abrasive Syst Ltd 加工装置および加工方法
JP2013247132A (ja) * 2012-05-23 2013-12-09 Disco Abrasive Syst Ltd 板状物の加工方法
JP2015046550A (ja) * 2013-08-29 2015-03-12 株式会社ディスコ 研磨パッドおよびウエーハの加工方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997392A (en) * 1997-07-22 1999-12-07 International Business Machines Corporation Slurry injection technique for chemical-mechanical polishing
JPH1190816A (ja) * 1997-09-22 1999-04-06 Toshiba Corp 研磨装置及び研磨方法
US6346032B1 (en) * 1999-09-30 2002-02-12 Vlsi Technology, Inc. Fluid dispensing fixed abrasive polishing pad
JP2002141313A (ja) * 2000-08-22 2002-05-17 Nikon Corp Ｃｍｐ装置及び半導体デバイスの製造方法
KR100681683B1 (ko) * 2001-03-16 2007-02-09 동부일렉트로닉스 주식회사 가공물의 표면 연마장치
JP2002273651A (ja) * 2001-03-19 2002-09-25 Fujitsu Ltd 研磨方法及び研磨装置
JP2004253775A (ja) * 2003-01-31 2004-09-09 Nec Electronics Corp 化学機械的研磨方法
CN102001035A (zh) * 2009-08-28 2011-04-06 中芯国际集成电路制造(上海)有限公司 化学机械抛光系统
CN102528653B (zh) * 2010-12-30 2014-11-05 中芯国际集成电路制造(上海)有限公司 固定式颗粒研磨装置及其研磨方法
JP2015202545A (ja) * 2014-04-16 2015-11-16 株式会社ディスコ 研削装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344878A (ja) * 2005-06-10 2006-12-21 Disco Abrasive Syst Ltd 加工装置および加工方法
JP2013247132A (ja) * 2012-05-23 2013-12-09 Disco Abrasive Syst Ltd 板状物の加工方法
JP2015046550A (ja) * 2013-08-29 2015-03-12 株式会社ディスコ 研磨パッドおよびウエーハの加工方法

Also Published As

Publication number Publication date
KR102320761B1 (ko) 2021-11-01
TW201814784A (zh) 2018-04-16
JP6827289B2 (ja) 2021-02-10
CN107891358A (zh) 2018-04-10
JP2018060872A (ja) 2018-04-12
KR20180037113A (ko) 2018-04-11
CN107891358B (zh) 2021-06-18

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