TWI717819B - Electronic device and fixture assembly thereof - Google Patents

Electronic device and fixture assembly thereof Download PDF

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TWI717819B
TWI717819B TW108131470A TW108131470A TWI717819B TW I717819 B TWI717819 B TW I717819B TW 108131470 A TW108131470 A TW 108131470A TW 108131470 A TW108131470 A TW 108131470A TW I717819 B TWI717819 B TW I717819B
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electronic
assembly
jig
unit
movable
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TW108131470A
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TW202110567A (en
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黃詠証
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宏碁股份有限公司
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Abstract

An electronic device is provided, including two hemispherical housings, a hollow tubular member, and a circuit assembly. The housings are adhered to each other and respectively have a through hole. The tubular member connects to the two housings and forms a passage communicating with the through holes. The circuit assembly is disposed between the housings and surrounds the tubular member.

Description

電子裝置及其治具組件Electronic device and its fixture assembly

本發明是有關於一種可攜式電子裝置,特別是有關於一種球形之電子裝置及其治具組件。The present invention relates to a portable electronic device, in particular to a spherical electronic device and its fixture components.

隨著電子與感測技術的日新月異,各種具有計數功能的電子式佛珠已逐漸出現於市面上。舉例而言,如中華民國第M368059號新型專利所揭露之佛珠結構,其主要係由半球形之上殼、底殼以及設置於其內的電路組件所構成,其中前述半球形之上殼、底殼一般係透過黏合的方式加以組裝。With the rapid development of electronics and sensing technologies, various electronic prayer beads with counting functions have gradually appeared on the market. For example, the bead structure disclosed in the Republic of China Patent No. M368059 is mainly composed of a hemispherical upper shell, a bottom shell, and circuit components arranged therein, wherein the hemispherical upper shell and bottom The shell is generally assembled by bonding.

應了解的是,前述電子式佛珠或其他球形電子產品在進行殼體黏合的過程中,往往會由於加壓力道不平均而導致殼體的連接強度不足;此外,當需要對大量的球形電子產品進行殼體黏合程序時,通常係必須對每個球形產品逐一進行組裝,而無法同時對多個球形產品同步加壓黏合,故難以提升其生產效率。It should be understood that the aforementioned electronic beads or other spherical electronic products often have insufficient connection strength due to uneven pressure channels during the shell bonding process; in addition, when a large number of spherical electronic products need to be connected When performing the shell bonding procedure, it is usually necessary to assemble each spherical product one by one, and it is impossible to simultaneously press and bond multiple spherical products simultaneously, so it is difficult to improve the production efficiency.

有鑑於此,如何能改善傳統球形電子產品的結構設計,並針對前述球形電子產品提供更好且有效率的加壓黏合治具始成為一重要之課題。In view of this, how to improve the structural design of traditional spherical electronic products and provide better and efficient pressure bonding fixtures for the aforementioned spherical electronic products has become an important issue.

有鑑於前述習知問題點,本發明之一實施例提供一種電子裝置,包括兩個半球形殼體、一中空之管體以及一電路組件。前述殼體相互黏合並分別形成有一穿孔,前述管體連接前述殼體並形成有一通道,其中前述通道連接前述穿孔。前述電路組件設置於前述殼體之間並且圍繞前述管體。In view of the aforementioned conventional problems, an embodiment of the present invention provides an electronic device including two hemispherical shells, a hollow tube and a circuit component. The shells are adhered to each other to form a perforation respectively, the pipe body is connected to the shell to form a channel, and the channel is connected to the perforation. The aforementioned circuit assembly is arranged between the aforementioned casings and surrounds the aforementioned pipe body.

於一實施例中,前述管體具有兩個端部,且前述端部分別形成有一斜面,其中前述斜面分別抵接前述穿孔之一內側表面。In one embodiment, the tube body has two ends, and the ends are respectively formed with an inclined surface, wherein the inclined surface respectively abuts an inner surface of the through hole.

於一實施例中,前述管體具有兩個端部,且前述端部具有可撓性材質。In an embodiment, the aforementioned tube has two ends, and the aforementioned ends have a flexible material.

於一實施例中,前述電路組件包括相互電性連接之至少一天線元件、一電路板以及一線圈,前述天線元件設置於前述電路板上,且前述線圈環繞前述管體。In one embodiment, the circuit assembly includes at least one antenna element, a circuit board, and a coil that are electrically connected to each other, the antenna element is disposed on the circuit board, and the coil surrounds the tube body.

本發明一實施例更提供一種治具組件,用以製造複數個前述之電子裝置,其中前述治具組件包括一治具單元,前述治具單元包括複數個可動模組,其中前述可動模組相互連接並形成一長條形之容納空間,用以容納前述電子裝置。An embodiment of the present invention further provides a jig assembly for manufacturing a plurality of the aforementioned electronic devices, wherein the jig assembly includes a jig unit, the jig unit includes a plurality of movable modules, and the movable modules are mutually connected. Connecting and forming a long-shaped accommodating space for accommodating the aforementioned electronic device.

於一實施例中,每一前述可動模組包括一矩形之支撐板以及一柱狀之可動件,其中前述支撐板形成有一導引柱,且前述可動件形成有一長條形之導引孔;特別地是,前述導引柱穿過前述導引孔,用以引導前述可動件相對前述支撐板沿垂直前述支撐板的方向移動。In one embodiment, each of the movable modules includes a rectangular support plate and a columnar movable element, wherein the support plate is formed with a guide column, and the movable element is formed with a long guide hole; In particular, the guide post passes through the guide hole to guide the movable element to move relative to the support plate in a direction perpendicular to the support plate.

於一實施例中,前述治具組件更包括一熱收縮元件,用以包覆前述治具單元以及前述電子裝置,其中當前述熱收縮元件受熱收縮時壓迫前述可動件相對於前述支撐板朝前述治具單元的內側方向移動,以使前述電子裝置中的前述管體以及前述殼體緊密接合。In one embodiment, the jig assembly further includes a heat-shrinkable element for covering the jig unit and the electronic device, wherein when the heat-shrinkable element is heat-shrinked, the movable element is forced toward the supporting plate. The inner side of the jig unit moves so that the tube body and the casing in the electronic device are tightly joined.

於一實施例中,前述治具組件更包括一中空之漏斗狀構件,設置於前述治具單元之一末端,用以導引前述電子裝置進入前述容納空間。In one embodiment, the fixture assembly further includes a hollow funnel-shaped member disposed at one end of the fixture unit for guiding the electronic device into the accommodation space.

於一實施例中,前述支撐板相互連接並組成一多邊形結構。In one embodiment, the aforementioned supporting plates are connected to each other to form a polygonal structure.

於一實施例中,前述治具組件更包括至少一擋止件,設置於前述治具單元之一末端,以防止前述電子裝置自前述容納空間脫落。In one embodiment, the jig assembly further includes at least one stopper, which is disposed at one end of the jig unit to prevent the electronic device from falling off the receiving space.

於一實施例中,前述擋止件具有一圓柱狀結構。In one embodiment, the stopper has a cylindrical structure.

以下說明本發明實施例之電子裝置及其治具組件。然而,可輕易了解本發明實施例提供許多合適的發明概念而可實施於廣泛的各種特定背景。所揭示的特定實施例僅僅用於說明以特定方法使用本發明,並非用以侷限本發明的範圍。The electronic device and its fixture assembly according to the embodiments of the present invention are described below. However, it can be easily understood that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide variety of specific backgrounds. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific way, and are not used to limit the scope of the present invention.

除非另外定義,在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語,例如在通常使用的字典中定義的用語,應被解讀成具有一與相關技術及本揭露的背景或上下文一致的意思,而不應以一理想化或過度正式的方式解讀,除非在此特別定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings commonly understood by the general artisans to whom the disclosure belongs. It is understandable that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant technology and the background or context of this disclosure, and not in an idealized or overly formal way Interpretation, unless specifically defined here.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下各實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,實施方式中所使用的方向用語是用來說明並非用來限制本發明。The foregoing and other technical content, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only directions for referring to the attached drawings. Therefore, the directional terms used in the embodiments are used to illustrate but not to limit the present invention.

首先請一併參閱第1、2、3圖,其中第1圖表示本發明一實施例之電子裝置1的爆炸圖,第2圖表示第1圖所示之電子裝置1於組裝後的剖視圖,其中一線材R係穿過前述電子裝置1,第3圖則表示第1圖所示之殼體10、20以及管體30的爆炸圖。Please refer to Figures 1, 2 and 3 together. Figure 1 shows an exploded view of the electronic device 1 according to an embodiment of the present invention, and Figure 2 shows a cross-sectional view of the electronic device 1 shown in Figure 1 after assembly. One of the wires R passes through the aforementioned electronic device 1, and Figure 3 shows an exploded view of the housing 10, 20 and the tube body 30 shown in Figure 1.

如第1、2、3圖所示,本實施例之電子裝置1例如為一球形之電子式佛珠,其主要包括兩個半球形之殼體10、20、一中空之管體30以及一電路組件U,前述殼體10、20係相互黏合並分別形成有一穿孔11、21,前述管體30則設置於前述殼體10、20之間並形成有一通道31,其中該通道31連接該些穿孔11、21。As shown in Figures 1, 2, and 3, the electronic device 1 of this embodiment is, for example, a spherical electronic bead, which mainly includes two hemispherical shells 10, 20, a hollow tube 30, and a circuit In the assembly U, the housings 10 and 20 are bonded to each other to form a through hole 11 and 21 respectively. The tube body 30 is disposed between the housings 10 and 20 and forms a channel 31, wherein the channel 31 connects the through holes 11, 21.

從第1、2圖中可以看出,電路組件U係設置在兩個殼體10、20之間並且圍繞前述管體30,其主要包含有相互電性連接之至少一天線元件A、一電路板B以及一線圈C,前述天線元件A設置於電路板B上,前述線圈C則環繞前述管體30,藉此可用以發射或接收無線訊號。在本實施例中,前述電路組件U共包含有兩個天線元件A、兩個電路板B以及兩個線圈C,且其係以對稱之方式設置在管體30的周圍,藉此可使球形電子裝置1的重量分布更為平均,且可使空間配置達到最佳化。As can be seen from Figures 1 and 2, the circuit assembly U is arranged between the two housings 10, 20 and surrounds the aforementioned tube 30, and it mainly includes at least one antenna element A and a circuit electrically connected to each other. The board B and a coil C, the antenna element A is arranged on the circuit board B, and the coil C surrounds the tube 30, so that it can be used to transmit or receive wireless signals. In this embodiment, the aforementioned circuit assembly U includes two antenna elements A, two circuit boards B, and two coils C, and they are arranged symmetrically around the tube body 30, thereby making it spherical The weight distribution of the electronic device 1 is more even, and the space configuration can be optimized.

請繼續參閱第2、3圖,前述管體30的兩個端部32係採用可撓性材質(例如橡膠材質),且該些端部32分別形成有斜面,組裝時可使前述兩個端部32之斜面分別抵接於穿孔11、21的內側表面(斜面),藉以使前述通道31連通殼體10、20之穿孔11、21,並使得管體30能緊密地結合於兩個殼體10、20之間以具備防水之功能;舉例而言,前述殼體10、20可透過黏著劑相互接合,且一線材R可穿過前述穿孔11、21以及通道31,藉以將數個電子裝置1串接在一起而成為串珠(String of Beads)。Please continue to refer to Figures 2 and 3, the two ends 32 of the aforementioned tube 30 are made of flexible material (such as rubber), and the ends 32 are respectively formed with inclined surfaces, so that the two ends can be assembled during assembly. The inclined surface of the portion 32 respectively abuts against the inner surface (inclined surface) of the through holes 11, 21, so that the aforementioned passage 31 is connected to the through holes 11, 21 of the housings 10, 20, and the tube body 30 can be tightly combined with the two housings 10 and 20 have a waterproof function; for example, the aforementioned housings 10, 20 can be joined to each other through an adhesive, and a wire R can pass through the aforementioned perforations 11, 21 and the channel 31, thereby connecting several electronic devices 1 are connected together to become String of Beads.

再請一併參閱第4、5、6圖,其中第4圖表示將多個電子裝置1和擋止件80放入一治具單元70內部的示意圖,第5圖表示第4圖中之一可動模組60的爆炸圖,第6圖則表示第5圖中之可動件40與支撐板50結合後的示意圖。Please refer to Figures 4, 5, and 6, where Figure 4 shows a schematic diagram of placing multiple electronic devices 1 and stoppers 80 into a fixture unit 70, and Figure 5 shows one of Figure 4 The exploded view of the movable module 60, and FIG. 6 shows a schematic diagram of the movable element 40 and the supporting plate 50 in FIG. 5 after being combined.

如第4圖所示,為了能夠同時對多個電子裝置1的殼體進行加壓黏合,本實施例係提供一種長條形之治具單元70,其中前述治具單元70包含有複數個相互連接的可動模組60,且前述治具單元70係形成有一長條形的容納空間71,用以容納前述電子裝置1和擋止件80。As shown in Fig. 4, in order to press and bond the housings of multiple electronic devices 1 at the same time, this embodiment provides an elongated fixture unit 70, wherein the aforementioned fixture unit 70 includes a plurality of mutual The movable module 60 is connected, and the jig unit 70 is formed with a long accommodating space 71 for accommodating the electronic device 1 and the stopper 80.

需特別說明的是,在將多個電子裝置1放入治具單元70之前,可先以膠水將每一電子裝置1的殼體10、20稍微黏接固定;接著,在電子裝置1被依序置入長條形的容納空間71後,可將圓柱狀的擋止件80塞進容納空間71內並使其位在治具單元70的末端,以防止前述電子裝置1從前述容納空間71脫落。It should be noted that before putting the multiple electronic devices 1 into the fixture unit 70, the housings 10 and 20 of each electronic device 1 can be slightly glued and fixed with glue; then, the electronic device 1 is After being sequentially placed in the elongated accommodating space 71, the cylindrical stopper 80 can be inserted into the accommodating space 71 and positioned at the end of the jig unit 70 to prevent the electronic device 1 from being removed from the accommodating space 71 Fall off.

如第5、6圖所示,前述每一可動模組60主要包括一柱狀之可動件40以及一矩形的支撐板50,前述可動件40以及支撐板50例如可採用電木材質,其中在可動件40的中央形成有一長條形之導引孔41,在支撐板50的中央則形成有一開孔S以及位於開孔S內之一導引柱51。As shown in Figures 5 and 6, each of the aforementioned movable modules 60 mainly includes a columnar movable element 40 and a rectangular support plate 50. The aforementioned movable element 40 and support plate 50 can be made of bakelite material, for example. A long guide hole 41 is formed in the center of the movable element 40, and an opening S and a guide post 51 located in the opening S are formed in the center of the support plate 50.

應了解的是,前述支撐板50之導引柱51於組裝後係穿過可動件40之導引孔41(如第6圖所示),由於導引孔41的尺寸較導引柱51更大,因此可動件40能相對於導引柱51沿著垂直支撐板50的方向移動。It should be understood that the guide post 51 of the aforementioned support plate 50 passes through the guide hole 41 of the movable member 40 (as shown in Figure 6) after assembly, because the size of the guide hole 41 is larger than that of the guide post 51. Is large, so the movable member 40 can move in a direction perpendicular to the support plate 50 relative to the guide post 51.

在本實施例中,前述治具單元70係由四個可動模組60所構成,藉以使得治具單元70內部的容納空間71大致具有一長方體結構;然而,前述治具單元70亦可由三個、五個或更多的可動模組60所構成,以使前述容納空間71大致具有一中空之多邊形結構,用以容納前述電子裝置1。In this embodiment, the aforementioned jig unit 70 is composed of four movable modules 60, so that the accommodation space 71 inside the jig unit 70 roughly has a rectangular parallelepiped structure; however, the aforementioned jig unit 70 can also be composed of three , Five or more movable modules 60 are formed, so that the accommodation space 71 has a hollow polygonal structure for accommodating the electronic device 1.

接著請參閱第7圖,其中第7圖表示多個球形電子裝置1透過一中空之漏斗狀構件T引導而進入治具單元70內部的示意圖。如第7圖所示,為了能夠順利且容易地引導多個電子裝置1依序進入治具單元70內部的容納空間71,可將一中空之漏斗狀構件T連接到治具單元70之一末端,藉以快速且有效地引導該些電子裝置1進入到治具單元70內部,其中位在治具單元70另一末端之擋止件80可用以防止前述電子裝置1從治具單元70內部掉出。Next, please refer to FIG. 7, where FIG. 7 shows a schematic diagram of a plurality of spherical electronic devices 1 guided through a hollow funnel-shaped member T into the fixture unit 70. As shown in Figure 7, in order to smoothly and easily guide multiple electronic devices 1 into the accommodating space 71 inside the fixture unit 70, a hollow funnel-shaped member T can be connected to one end of the fixture unit 70 In order to quickly and effectively guide the electronic devices 1 into the fixture unit 70, the stopper 80 at the other end of the fixture unit 70 can be used to prevent the aforementioned electronic device 1 from falling out of the fixture unit 70 .

請參閱第8圖,其中第8圖表示將多個電子裝置1和擋止件80放入治具單元70後,以一熱收縮元件90將其包覆的示意圖。如第8圖所示,在將多個電子裝置1以及擋止件80放入治具單元70後,由於擋止件80係位於治具單元70的兩端,藉此能防止電子裝置1從治具單元70內部脫落;接著,可將一熱收縮元件90包覆住前述治具單元70、電子裝置1以及擋止件80,然後對熱收縮元件90加熱並使其收縮。舉例而言,前述熱收縮元件90可採用具有聚烯烴材質之熱縮套管(Heat Shrink Tube)。Please refer to FIG. 8, where FIG. 8 shows a schematic diagram of a plurality of electronic devices 1 and the stopper 80 being put into the fixture unit 70 and then covered by a heat shrinkable element 90. As shown in Figure 8, after the multiple electronic devices 1 and the stopper 80 are placed in the fixture unit 70, the stopper 80 is located at both ends of the fixture unit 70, thereby preventing the electronic device 1 from The jig unit 70 falls off inside; then, a heat-shrinkable element 90 can be wrapped around the jig unit 70, the electronic device 1 and the stopper 80, and then the heat-shrinkable element 90 is heated and shrinks. For example, the aforementioned heat shrinkable element 90 may be a heat shrink tube made of polyolefin material.

如第9圖中的箭頭方向所示,當熱收縮元件90被加熱後會迅速收縮,並從上、下、左、右四個側邊壓迫每一可動模組60中的可動件40,從而使可動件40相對於支撐板50朝治具單元70的內側方向移動;如此一來,圓柱狀的可動件40便能夠均勻地壓迫電子裝置1,並使得每一電子裝置1的管體30以及兩個殼體10、20之間可緊密地被壓合,以確保其具有足夠的連接強度。As shown by the arrow direction in Figure 9, when the heat shrinkable element 90 is heated, it will shrink quickly, and press the movable element 40 in each movable module 60 from the top, bottom, left, and right sides, thereby The movable element 40 is moved relative to the support plate 50 toward the inner side of the jig unit 70; in this way, the cylindrical movable element 40 can evenly press the electronic device 1 and make the tube 30 and the tube body of each electronic device 1 The two shells 10 and 20 can be pressed tightly to ensure that they have sufficient connection strength.

另一方面,當熱收縮元件90被加熱後也會在治具單元70的長軸方向產生收縮力,此時位於治具單元70末端的擋止件80會受到前述收縮力作用(如第9圖中的箭頭方向所示)而朝治具單元70的內側方向壓迫前述電子裝置1。On the other hand, when the heat shrinkable element 90 is heated, it will also generate a shrinking force in the long axis direction of the jig unit 70. At this time, the stopper 80 at the end of the jig unit 70 will be subjected to the aforementioned shrinking force (as in the 9th The direction of the arrow in the figure shows) and the aforementioned electronic device 1 is pressed toward the inner side of the jig unit 70.

如前所述,由於熱收縮元件90被加熱後具有可收縮變形的特性,藉此能迫使可動件40以及擋止件80從各個方向朝治具單元70的內側壓迫電子裝置1,從而使得每一電子裝置1的管體30與殼體10、20之間能夠緊密且均勻地被壓合。應了解的是,本實施例之治具單元70可和前述漏斗狀構件T、擋止件80以及熱收縮元件90共同構成一治具組件,然而前述漏斗狀構件T並非必須,且當電子裝置1的數量夠多時,亦可將熱收縮元件90直接包覆並接觸位在治具單元70末端的電子裝置1而不需要設置擋止件80;或者,也可透過其他加壓工具對治具單元70加壓而不使用熱收縮元件90。As mentioned above, since the heat shrinkable element 90 has the characteristic of being shrinkable and deformable after being heated, the movable element 40 and the stopper 80 can be forced to press the electronic device 1 toward the inside of the jig unit 70 from all directions, so that each The tube body 30 and the housings 10 and 20 of an electronic device 1 can be pressed tightly and uniformly. It should be understood that the fixture unit 70 of this embodiment can form a fixture assembly with the aforementioned funnel-shaped member T, the stopper 80 and the heat-shrinkable element 90. However, the aforementioned funnel-shaped member T is not necessary and is used as an electronic device. When the number of 1 is large enough, the heat-shrinkable element 90 can also be directly covered and contact the electronic device 1 at the end of the fixture unit 70 without the stopper 80; alternatively, other pressing tools can be used to treat The tool unit 70 is pressurized without using the heat shrinkable element 90.

綜上所述,本發明提供一種電子裝置及其治具組件,前述電子裝置具有兩個半球形殼體以及一中空之管體,其中藉由將電路組件設置於前述殼體之間並且圍繞前述管體,可達到空間利用的最佳化;此外,由於本發明能透過長條形的治具單元容納多個電子裝置,因此可同時對多個電子裝置的管體以及殼體進行壓合,從而大幅提升電子裝置之組裝效率。In summary, the present invention provides an electronic device and a fixture assembly thereof. The electronic device has two hemispherical shells and a hollow tube body, wherein the circuit assembly is arranged between the shells and surrounds the The tube body can optimize the use of space; in addition, because the present invention can accommodate multiple electronic devices through the elongated fixture unit, the tube bodies and shells of multiple electronic devices can be pressed together at the same time. Thus, the assembly efficiency of the electronic device is greatly improved.

另一方面,因為本發明之治具單元包含有多個圓柱狀的可動件,因此當熱收縮元件加熱收縮時可從各個不同方向均勻地壓迫電子裝置,以避免因加壓力道不平均而導致殼體的連接強度不足,從而能有效提升電子裝置的組裝品質與良率。On the other hand, because the jig unit of the present invention includes a plurality of cylindrical movable parts, when the heat shrinkable element is heated and contracted, the electronic device can be uniformly pressed from different directions to avoid uneven pressure passages. The connection strength of the housing is insufficient, which can effectively improve the assembly quality and yield of the electronic device.

雖然本發明的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作更動、替代與潤飾。此外,本發明之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟,任何所屬技術領域中具有通常知識者可從本發明揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本發明使用。因此,本發明之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本發明之保護範圍也包括各個申請專利範圍及實施例的組合。Although the embodiments of the present invention and its advantages have been disclosed as above, it should be understood that anyone with ordinary knowledge in the relevant technical field can make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the manufacturing processes, machines, manufacturing, material composition, devices, methods, and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the technical field can disclose the content from the present invention. It is understood that the current or future developed processes, machines, manufacturing, material composition, devices, methods and steps can be used according to the present invention as long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of the present invention includes the above-mentioned manufacturing process, machine, manufacturing, material composition, device, method and step. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present invention also includes each patent application scope and a combination of embodiments.

雖然本發明已以較佳實施例揭露於上,然其並非用以限定本發明,任何熟習此項工藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present invention. Anyone familiar with the technology can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to those defined by the attached patent scope.

1:電子裝置 10:殼體 11:穿孔 20:殼體 21:穿孔 30:管體 31:通道 32:端部 40:可動件 41:導引孔 50:支撐板 51:導引柱 60:可動模組 70:治具單元 71:容納空間 80:擋止件 90:熱收縮元件 A:天線元件 B電路板 C:線圈 R:線材 S:開孔 T:漏斗狀構件 U:電路組件 1: Electronic device 10: Shell 11: Piercing 20: shell 21: Piercing 30: tube body 31: Channel 32: end 40: movable parts 41: guide hole 50: support plate 51: Guiding Post 60: movable module 70: Fixture unit 71: accommodation space 80: stop 90: Heat shrinkable element A: Antenna element B circuit board C: Coil R: Wire S: Open hole T: Funnel-shaped member U: Circuit component

第1圖表示本發明一實施例之電子裝置1的爆炸圖。 第2圖表示第1圖所示之電子裝置1於組裝後的剖視圖,其中一線材R係穿過前述電子裝置1。 第3圖表示第1圖所示之殼體10、20以及管體30的爆炸圖。 第4圖表示將多個電子裝置1和擋止件80放入一治具單元70內部的示意圖。 第5圖表示第4圖中之一可動模組60的爆炸圖。 第6圖表示第5圖中之可動件40與支撐板50結合後的示意圖。 第7圖表示多個球形電子裝置1透過一中空之漏斗狀構件T引導而進入治具單元70內部的示意圖。 第8圖表示將多個電子裝置1和擋止件80放入治具單元70後,以一熱收縮元件90將其包覆的示意圖。 第9圖表示當熱收縮元件90被加熱後迅速收縮之示意圖。 Fig. 1 shows an exploded view of an electronic device 1 according to an embodiment of the invention. FIG. 2 shows a cross-sectional view of the electronic device 1 shown in FIG. 1 after being assembled, in which a wire R passes through the aforementioned electronic device 1. Fig. 3 shows an exploded view of the housing 10, 20 and the pipe body 30 shown in Fig. 1. FIG. 4 shows a schematic diagram of putting a plurality of electronic devices 1 and the stopper 80 into a fixture unit 70. Figure 5 shows an exploded view of one of the movable modules 60 in Figure 4. Fig. 6 shows a schematic diagram of the movable element 40 and the supporting plate 50 in Fig. 5 after being combined. FIG. 7 shows a schematic diagram of a plurality of spherical electronic devices 1 guided through a hollow funnel-shaped member T into the fixture unit 70. FIG. 8 shows a schematic diagram of a plurality of electronic devices 1 and stoppers 80 being put into the fixture unit 70 and then covered with a heat shrinkable element 90. Fig. 9 shows a schematic diagram of the rapid shrinkage of the heat shrinkable element 90 after being heated.

1:電子裝置 1: Electronic device

10:殼體 10: Shell

11:穿孔 11: Piercing

20:殼體 20: shell

21:穿孔 21: Piercing

30:管體 30: tube body

31:通道 31: Channel

A:天線元件 A: Antenna element

B:電路板 B: Circuit board

C:線圈 C: Coil

U:電路組件 U: Circuit component

Claims (6)

一種治具組件,用以製造複數個電子裝置,每個電子裝置包括兩個半球形之殼體、一中空之管體、以及一電路組件,該些殼體相互黏合並分別形成有一穿孔,該管體連接該些殼體並形成有一通道,該通道連接該些穿孔,該電路組件設置於該些殼體之間並且圍繞該管體,其中該治具組件包括一治具單元,該治具單元包括複數個可動模組,該些可動模組相互連接並形成一長條形之容納空間,用以容納該些電子裝置,其中每一該可動模組包括:一矩形之支撐板,形成有一導引柱;以及一柱狀之可動件,形成有一長條形之導引孔,其中該導引柱穿過該導引孔,用以引導該可動件相對該支撐板沿垂直該支撐板的方向移動。 A jig assembly is used to manufacture a plurality of electronic devices. Each electronic device includes two hemispherical shells, a hollow tube body, and a circuit assembly. The shells are bonded to each other and form a through hole respectively. The pipe body is connected to the shells and forms a channel, the channel is connected to the through holes, the circuit assembly is disposed between the shells and surrounds the pipe body, wherein the fixture assembly includes a fixture unit, the fixture The unit includes a plurality of movable modules which are connected to each other and form a long accommodating space for accommodating the electronic devices. Each of the movable modules includes: a rectangular support plate formed with a Guide post; and a column-shaped movable member formed with a long guide hole, wherein the guide post passes through the guide hole to guide the movable member relative to the support plate along the vertical direction of the support plate Move in direction. 如申請專利範圍第1項所述之治具組件,其中該治具組件更包括一熱收縮元件,用以包覆該治具單元以及該些電子裝置,且當該熱收縮元件受熱收縮時壓迫該些可動件相對於該些支撐板朝該治具單元的內側方向移動,以使該些電子裝置中的該些管體以及該些殼體緊密接合。 The jig assembly described in claim 1, wherein the jig assembly further includes a heat-shrinkable element for covering the jig unit and the electronic devices, and the heat-shrinkable element is compressed when the heat shrinks The movable parts move toward the inner side of the fixture unit relative to the supporting plates, so that the tubes and the shells in the electronic devices are tightly joined. 如申請專利範圍第1項所述之治具組件,其中該治具組件更包括一中空之漏斗狀構件,設置於該治具單元之一末端,用以導引該些電子裝置進入該容納空間。 The jig assembly described in item 1 of the scope of patent application, wherein the jig assembly further includes a hollow funnel-shaped member disposed at an end of the jig unit for guiding the electronic devices into the containing space . 如申請專利範圍第1項所述之治具組件,其中該些支撐板相互連接並組成一多邊形結構。 In the jig assembly described in item 1 of the scope of patent application, the supporting plates are connected to each other to form a polygonal structure. 如申請專利範圍第1項所述之治具組件,其中該治具組件更包括至少一擋止件,設置於該治具單元之一末端,以防止該些電子裝置自該容納空間脫落。 According to the jig assembly described in claim 1, wherein the jig assembly further includes at least one stopper disposed at an end of the jig unit to prevent the electronic devices from falling off the receiving space. 如申請專利範圍第5項所述之治具組件,其中該擋止件具有一圓柱狀結構。 According to the fixture assembly described in item 5 of the scope of patent application, the stopper has a cylindrical structure.
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