TWI717531B - 半導體導帶排列裝置及半導體導帶排列方法 - Google Patents

半導體導帶排列裝置及半導體導帶排列方法 Download PDF

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Publication number
TWI717531B
TWI717531B TW106121644A TW106121644A TWI717531B TW I717531 B TWI717531 B TW I717531B TW 106121644 A TW106121644 A TW 106121644A TW 106121644 A TW106121644 A TW 106121644A TW I717531 B TWI717531 B TW I717531B
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TW
Taiwan
Prior art keywords
arrangement
conduction band
semiconductor conduction
semiconductor
axis
Prior art date
Application number
TW106121644A
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English (en)
Chinese (zh)
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TW201812968A (zh
Inventor
林栽瑛
奉舜基
Original Assignee
南韓商韓美半導體有限公司
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Priority to KR10-2016-0083279 priority Critical
Priority to ??10-2016-0083279 priority
Priority to KR1020160083279A priority patent/KR101831256B1/ko
Application filed by 南韓商韓美半導體有限公司 filed Critical 南韓商韓美半導體有限公司
Publication of TW201812968A publication Critical patent/TW201812968A/zh
Application granted granted Critical
Publication of TWI717531B publication Critical patent/TWI717531B/zh

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    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
TW106121644A 2016-07-01 2017-06-28 半導體導帶排列裝置及半導體導帶排列方法 TWI717531B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR10-2016-0083279 2016-07-01
??10-2016-0083279 2016-07-01
KR1020160083279A KR101831256B1 (ko) 2016-07-01 2016-07-01 반도체 스트립 정렬장치 및 반도체 스트립 정렬방법

Publications (2)

Publication Number Publication Date
TW201812968A TW201812968A (zh) 2018-04-01
TWI717531B true TWI717531B (zh) 2021-02-01

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TW106121644A TWI717531B (zh) 2016-07-01 2017-06-28 半導體導帶排列裝置及半導體導帶排列方法

Country Status (3)

Country Link
KR (1) KR101831256B1 (ko)
CN (1) CN107564833B (ko)
TW (1) TWI717531B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200072245A (ko) 2018-12-12 2020-06-22 세메스 주식회사 반도체 스트립 정렬 방법 및 반도체 스트립 절단 방법
KR20220010964A (ko) 2020-07-20 2022-01-27 세메스 주식회사 반도체 스트립 정렬 방법 및 반도체 스트립 절단 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120026745A (ko) * 2010-09-10 2012-03-20 한미반도체 주식회사 반도체 패키지 싱귤레이션 장치
TW201448008A (zh) * 2013-04-22 2014-12-16 Hanmi Semiconductor Co Ltd 半導體條帶鋸切設備

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005332982A (ja) * 2004-05-20 2005-12-02 Renesas Technology Corp 半導体装置の製造方法
CN101667630A (zh) * 2008-09-04 2010-03-10 株式会社日立高新技术 有机el设备制造装置和其制造方法以及成膜装置和成膜方法
KR101275134B1 (ko) * 2012-04-27 2013-06-17 한미반도체 주식회사 반도체 자재 검사장치 및 반도체 자재 검사방법
KR101446170B1 (ko) 2013-05-08 2014-10-01 한미반도체 주식회사 반도체 패키지 정렬장치, 반도체 패키지 절단 정렬장치, 및 반도체 패키지 절단 정렬방법
JP6218526B2 (ja) * 2013-09-20 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
JP2015119085A (ja) * 2013-12-19 2015-06-25 株式会社ディスコ デバイスウェーハの加工方法
KR101627336B1 (ko) 2015-04-01 2016-06-08 한미반도체 주식회사 반도체 패키지 정렬장치 및 반도체 패키지 정렬방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120026745A (ko) * 2010-09-10 2012-03-20 한미반도체 주식회사 반도체 패키지 싱귤레이션 장치
TW201448008A (zh) * 2013-04-22 2014-12-16 Hanmi Semiconductor Co Ltd 半導體條帶鋸切設備

Also Published As

Publication number Publication date
CN107564833B (zh) 2022-01-14
KR101831256B1 (ko) 2018-02-22
KR20180003766A (ko) 2018-01-10
TW201812968A (zh) 2018-04-01
CN107564833A (zh) 2018-01-09

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