TWI710449B - Conveying drive mechanism, resin molding device, and manufacturing method of resin molded product - Google Patents
Conveying drive mechanism, resin molding device, and manufacturing method of resin molded product Download PDFInfo
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- TWI710449B TWI710449B TW108123685A TW108123685A TWI710449B TW I710449 B TWI710449 B TW I710449B TW 108123685 A TW108123685 A TW 108123685A TW 108123685 A TW108123685 A TW 108123685A TW I710449 B TWI710449 B TW I710449B
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- transmission drive
- drive shaft
- plunger
- center
- drive mechanism
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- 239000011347 resin Substances 0.000 title claims description 87
- 229920005989 resin Polymers 0.000 title claims description 87
- 238000000465 moulding Methods 0.000 title claims description 71
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 230000005540 biological transmission Effects 0.000 claims abstract description 177
- 230000000052 comparative effect Effects 0.000 description 8
- 230000033001 locomotion Effects 0.000 description 7
- 239000007787 solid Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
- B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/53—Means for plasticising or homogenising the moulding material or forcing it into the mould using injection ram or piston
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
本發明的傳送驅動機構(60)包括傳送驅動軸(63)及傳送驅動軸(63)上的柱塞單元(65)。傳送驅動軸(63)至少包括:第一傳送驅動軸(63a)、第二傳送驅動軸(63b)、及第三傳送驅動軸(63c)。於從柱塞(64)的前端(740)觀看的平面視圖中,第三傳送驅動軸(63c)的中心(631c)位於穿過第一傳送驅動軸(63a)的中心(631a)及第二傳送驅動軸(63b)的中心(631b)的直線(632)上以外的部位。The transmission drive mechanism (60) of the present invention includes a transmission drive shaft (63) and a plunger unit (65) on the transmission drive shaft (63). The transmission drive shaft (63) includes at least: a first transmission drive shaft (63a), a second transmission drive shaft (63b), and a third transmission drive shaft (63c). In a plan view from the front end (740) of the plunger (64), the center (631c) of the third transmission drive shaft (63c) is located at the center (631a) passing through the first transmission drive shaft (63a) and the second Convey the center (631b) of the drive shaft (63b) outside of the straight line (632).
Description
本揭示是有關於一種傳送驅動機構、樹脂成形裝置及樹脂成形品的製造方法。 The present disclosure relates to a transmission driving mechanism, a resin molding device, and a method of manufacturing a resin molded product.
例如,於專利文獻1中,記載有一種於與驅動用缸(cylinder)的桿連接的升降台上包括四根柱塞的傳送成形機。專利文獻1的傳送成形機於進行了上模具與下模具的合模後,將驅動用缸驅動並上推柱塞。藉此,柱塞的活塞部於罐內滑動並擠出熔融樹脂,而將樹脂注入至形成於上模具與下模具之間的模腔內。
For example,
[現有技術文獻] [Prior Art Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本專利特開平8-156012號公報 [Patent Document 1] Japanese Patent Laid-open No. 8-156012
專利文獻1所記載的傳送成形機具有如下構成:相對於呈直線狀排列於升降台上四根柱塞,將兩個驅動用缸呈直線狀配置。因此,於專利文獻1所記載的傳送成形機中,有時無法藉由驅動用缸使升降台穩定地升降。
The conveyor molding machine described in
根據此處所揭示的實施形態,可以提供一種傳送驅動機構,所述傳送驅動機構包括:傳送驅動軸;以及傳送驅動軸上的柱塞單元,傳送驅動軸至少包括:第一傳送驅動軸、第二傳送驅動軸及第三傳送驅動軸,柱塞單元包括多個柱塞及柱塞單元本體,多個柱塞構成於第一方向上延伸的柱塞行,多個柱塞的各前端位於柱塞單元本體的外部,第一傳送驅動軸、第三傳送驅動軸及第二傳送驅動軸按此順序位於第一方向上,於從柱塞的前端觀看的平面視圖中,第三傳送驅動軸的中心位於穿過第一傳送驅動軸的中心及第二傳送驅動軸的中心的直線上以外的部位。 According to the embodiment disclosed here, a transmission drive mechanism can be provided, the transmission drive mechanism includes: a transmission drive shaft; and a plunger unit on the transmission drive shaft, the transmission drive shaft includes at least: a first transmission drive shaft, a second transmission drive shaft The transmission drive shaft and the third transmission drive shaft. The plunger unit includes a plurality of plungers and a plunger unit body. The multiple plungers constitute a plunger row extending in the first direction, and each front end of the multiple plungers is located at the plunger Outside of the unit body, the first transmission drive shaft, the third transmission drive shaft, and the second transmission drive shaft are located in the first direction in this order. In the plan view from the front end of the plunger, the center of the third transmission drive shaft It is located at a location other than a straight line passing through the center of the first transmission drive shaft and the center of the second transmission drive shaft.
根據此處所揭示的實施形態,可以提供一種樹脂成形裝置,所述樹脂成形裝置包括所述傳送驅動機構、成形模及合模機構,成形模構成為能夠藉由傳送驅動機構的柱塞,將樹脂移送至成形模的模腔,合模機構構成為能夠將成形模合模。 According to the embodiment disclosed here, it is possible to provide a resin molding apparatus including the conveying drive mechanism, a molding die, and a mold clamping mechanism. The molding die is configured to be able to transfer the resin by the plunger of the conveying drive mechanism. It is transferred to the cavity of the forming mold, and the mold clamping mechanism is configured to be capable of clamping the forming mold.
根據此處所揭示的實施形態,可以提供一種樹脂成形品的製造方法,是使用所述樹脂成形裝置製造樹脂成形品的方法,所述樹脂成形品的製造方法包括:於成形模設置成形對象物的步驟;將成形模合模的步驟;對成形對象物進行樹脂成形的步驟;以及將成形模開模的步驟。 According to the embodiment disclosed here, it is possible to provide a method of manufacturing a resin molded product, which is a method of manufacturing a resin molded product using the resin molding apparatus, the method of manufacturing a resin molded product includes: setting a molded object in a molding die Step; the step of closing the molding die; the step of resin molding the molded object; and the step of opening the molding die.
根據此處所揭示的實施形態,可以提供一種能夠進行穩定的升降動作的傳送驅動機構、樹脂成形裝置及樹脂成形品的製 造方法。 According to the embodiment disclosed here, it is possible to provide a conveying drive mechanism, a resin molding device, and a resin molded product that can perform stable lifting operations. 造方法。 Fabrication methods.
1:成形對象物 1: molding object
10:第一模 10: The first mold
11:第一凹部(凹部) 11: The first recess (concave)
12:收集部 12: Collection Department
13:第一模板 13: The first template
14:樹脂通路 14: Resin passage
20:第二模 20: second mode
21:第二凹部(凹部) 21: The second recess (concave)
22:罐 22: Can
23:第二模板 23: second template
30:第一模保持器 30: The first mold holder
31:第一板 31: First board
32:第一輔助塊 32: The first auxiliary block
40:第二模保持器 40: second mold holder
41:第二輔助塊 41: second auxiliary block
42:第二板 42: second board
50:第二模保持器安裝塊 50: Second mold holder mounting block
60、60a:傳送驅動機構 60, 60a: Transmission drive mechanism
61:柱塞單元 61: Plunger unit
62:柱塞單元支撐板 62: Plunger unit support plate
63:傳送驅動軸 63: Transmission drive shaft
63a:第一傳送驅動軸 63a: The first transmission drive shaft
63b:第二傳送驅動軸 63b: second transmission drive shaft
63c:第三傳送驅動軸 63c: Third transmission drive shaft
63d:第四傳送驅動軸 63d: Fourth transmission drive shaft
64、64a、64b:柱塞 64, 64a, 64b: plunger
65:柱塞單元本體 65: Plunger unit body
70、70a:樹脂 70, 70a: resin
90:模腔 90: Mould cavity
200:第一台板 200: The first board
300:可動台板 300: movable table
400:第二台板 400: The second board
500:連桿 500: connecting rod
600:合模機構 600: clamping mechanism
631a、631b、631c、631d:中心 631a, 631b, 631c, 631d: center
632、633、741、741a、741b:直線 632, 633, 741, 741a, 741b: straight
641、642、643:柱塞行 641, 642, 643: plunger row
740、740a、740b:前端 740, 740a, 740b: front end
1000:模具機構部 1000: Mould Mechanism Department
2000:進入裝載器 2000: Enter the loader
3000:排出裝載器 3000: discharge loader
A:模塑模組 A: Molded module
B:進入裝載器模組 B: Enter the loader module
C:排出裝載器模組 C: discharge loader module
R1~R5:區域 R1~R5: area
S10、S20、S30、S40:步驟 S10, S20, S30, S40: steps
圖1是樹脂成形品的製造裝置的示意性平面圖。 Fig. 1 is a schematic plan view of a manufacturing apparatus of a resin molded product.
圖2是樹脂成形裝置的示意性立體圖。 Fig. 2 is a schematic perspective view of a resin molding apparatus.
圖3是樹脂成形裝置的示意性部分剖面圖。 Fig. 3 is a schematic partial cross-sectional view of the resin molding apparatus.
圖4是實施形態1的傳送驅動機構的示意性側視圖。 Fig. 4 is a schematic side view of the conveying drive mechanism of the first embodiment.
圖5是實施形態1的傳送驅動機構的示意性平面圖。 Fig. 5 is a schematic plan view of the conveying drive mechanism of the first embodiment.
圖6是樹脂成形品的製造方法的流程圖。 Fig. 6 is a flowchart of a method of manufacturing a resin molded product.
圖7圖解於第一模與第二模之間設置成形對象物的步驟的一例的示意性部分剖面圖。 Fig. 7 is a schematic partial cross-sectional view illustrating an example of a step of placing a molded object between the first mold and the second mold.
圖8是第二模的一例的示意性平面圖。 Fig. 8 is a schematic plan view of an example of a second mold.
圖9是圖解將第一模與第二模合模的步驟的一例的示意性部分剖面圖。 Fig. 9 is a schematic partial cross-sectional view illustrating an example of a step of clamping the first mold and the second mold.
圖10是圖解對成形對象物進行樹脂成形的步驟的一例的示意性部分剖面圖。 Fig. 10 is a schematic partial cross-sectional view illustrating an example of a procedure of resin molding of a molded object.
圖11是圖解藉由柱塞的移動而樹脂向模腔內移送的的示意性放大部分剖面圖。 FIG. 11 is a schematic enlarged partial cross-sectional view illustrating the transfer of the resin into the cavity by the movement of the plunger.
圖12是圖解藉由柱塞的移動而樹脂向模腔內移送的的示意性放大部分剖面圖。 Fig. 12 is a schematic enlarged partial cross-sectional view illustrating the transfer of the resin into the cavity by the movement of the plunger.
圖13是比較例的傳送驅動機構的示意性側視圖。 Fig. 13 is a schematic side view of a conveying drive mechanism of a comparative example.
圖14是圖13所示的比較例的傳送驅動機構的示意性平面圖。 Fig. 14 is a schematic plan view of the conveying drive mechanism of the comparative example shown in Fig. 13.
圖15是第二模的另一例的示意性平面圖。 Fig. 15 is a schematic plan view of another example of the second mold.
圖16是實施形態2的傳送驅動機構的示意性側視圖。 Fig. 16 is a schematic side view of the conveying drive mechanism of the second embodiment.
圖17是實施形態2的傳送驅動機構的示意性平面圖。 Fig. 17 is a schematic plan view of the conveying drive mechanism of the second embodiment.
圖18是實施形態3的傳送驅動機構的示意性平面圖。 Fig. 18 is a schematic plan view of the conveying drive mechanism of the third embodiment.
圖19是實施形態4的傳送驅動機構的示意性平面圖。 Fig. 19 is a schematic plan view of a conveying drive mechanism of the fourth embodiment.
圖20是實施形態5的傳送驅動機構的示意性平面圖。 Fig. 20 is a schematic plan view of the conveying drive mechanism of the fifth embodiment.
以下,對實施形態進行說明。再者,於用於實施形態的說明的圖式中,相同的參照符號表示相同部分或相當部分。 Hereinafter, the embodiment will be described. In addition, in the drawings used for the description of the embodiment, the same reference signs indicate the same parts or corresponding parts.
<實施形態1>
<
圖1表示實施形態1的樹脂成形品的製造裝置的示意性平面圖。如圖1所示,實施形態1的樹脂成形品的製造裝置包括:模塑(moulding)模組A、進入裝載器(inloader)模組B、排出裝載器(outloader)模組C。
FIG. 1 shows a schematic plan view of the manufacturing apparatus of the resin molded article of the first embodiment. As shown in FIG. 1, the manufacturing apparatus of the resin molded product of
模塑模組A例如包括模具機構部1000,該模具機構部1000構成為能夠對搭載於引線框架(lead flame)的半導體晶片等成形對象物進行樹脂成形。進入裝載器模組B包括進入裝載器2000,該進入裝載器2000構成為能夠對模塑模組A供給成形對象物。排出裝載器模組C包括排出裝載器3000,該排出裝載器3000構成為能夠從模塑模組A取出樹脂成形品。進入裝載器2000及排出裝載器3000構成為能夠於圖1的箭頭所示的方向上移動。
The mold module A includes, for example, a
模塑模組A及進入裝載器模組B藉由例如螺栓或銷等連 接機構而相互能夠裝卸地連接。另外,模塑模組A與排出裝載器模組C亦藉由例如螺栓或銷等連接機構而相互能夠裝卸地連接。 Molding module A and entering loader module B are connected by, for example, bolts or pins, etc. The connection mechanism is detachably connected to each other. In addition, the molding module A and the discharge loader module C are also detachably connected to each other by a connecting mechanism such as bolts or pins.
圖1所示的實施形態1的樹脂成形品的製造裝置包括兩個模塑模組A,但模塑模組A的個數能夠根據生產量而進行增減調整。實施形態1的樹脂成形品的製造裝置例如可以包括一個模塑模組A,亦可包括增設為四個的模塑模組A。即,實施形態1的樹脂成形品的製造裝置可以設為能夠增減模塑模組A的個數的構成。
The manufacturing apparatus of the resin molded product of
另外,於圖1所示的實施形態1的樹脂成形品的製造裝置中,模塑模組A、進入裝載器模組B、以及排出裝載器模組C按照圖1所示的順序配置,但是例如,亦可藉由模塑模組A、進入裝載器模組B、以及排出裝載器模組C成為一體的一個母機及僅包括模塑模組A的一個或多個子機而構成樹脂成形品的製造裝置。再者,亦可以將一個模塑模組A理解為實施形態的樹脂成形品的製造裝置。
In addition, in the resin molded product manufacturing apparatus of
圖2表示實施形態1的樹脂成形裝置的示意性立體圖。圖2所示的實施形態1的樹脂成形裝置配置於圖1所示的實施形態1的樹脂成形品的製造裝置的模具機構部1000。
Fig. 2 shows a schematic perspective view of the resin molding apparatus of the first embodiment. The resin molding apparatus of
如圖2所示,實施形態1的樹脂成形裝置包括:第一台板200、第二台板400、可動台板300及連桿500。第二台板400與第一台板200隔開地相對。
As shown in FIG. 2, the resin molding apparatus of
可動台板300位於第一台板200與第二台板400之間,
且構成為能夠沿著連桿500相對於第一台板200於第一台板200與第二台板400之間移動。
The
連桿500是於第一台板200與第二台板400之間延伸的棒狀部件。連桿500的一端固定於第一台板200,連桿500的另一端固定於第二台板400。
The connecting
圖2所示的實施形態1的樹脂成形裝置包括:第一模保持器30,安裝於第一台板200;第二模保持器安裝塊50,安裝於可動台板300;第二模保持器40,安裝於第二模保持器安裝塊50;第二模保持器安裝塊50內的傳送驅動機構60;以及可動台板300與第二台板400之間的合模機構600。此處,第二模保持器40經由第二模保持器安裝塊50安裝於可動台板300。
The resin molding apparatus of
圖3表示實施形態1的樹脂成形裝置的示意性部分剖面圖。如圖3所示,實施形態1的樹脂成形裝置包括:作為成形模的第一模10,保持於第一模保持器30;以及作為成形模的第二模20,保持於第二模保持器40。
Fig. 3 shows a schematic partial cross-sectional view of the resin molding apparatus of the first embodiment. As shown in FIG. 3, the resin molding apparatus of
合模機構600構成為藉由使可動台板300相對於第一台板200移動,對第一模10與第二模20沖壓,能夠將第一模10與第二模20合模。
The
第一模保持器30包括第一板31及第一輔助塊(assist block)32。第一板31構成為能夠安裝於第一台板200,從第一台板200側起依次包括隔熱板及加熱板。第一輔助塊32構成為能夠於第一板31的下方固定第一模10。
The
第二模保持器40包括第二輔助塊41及第二板42。第二板42構成為能夠安裝於第二模保持器安裝塊50,且從第二模保持器安裝塊50側起依次包括隔熱板及加熱板。第二輔助塊41構成為能夠於第二板42上固定第二模20。
The
第一模10包括:第一凹部11、收集(cull)部12、及第一模板13。第一凹部11可包括與成形對象物的樹脂成形後的形狀相對應的形狀。收集部12用作將樹脂移送至成形對象物之前的樹脂的積存部。第一模板13構成為能夠固定於第一模保持器30的第一板31。
The
第二模20包括:第二凹部21、罐(pot)22、及第二模板23。第二凹部21可包括與成形對象物的樹脂成形後的形狀相對應的形狀。罐22用作成形對象物的樹脂成形所使用的樹脂的設置部。第二模板23構成為能夠固定於第二模保持器40的第二板42。
The
圖4表示實施形態1的樹脂成形裝置所使用的傳送驅動機構的一例即實施形態1的傳送驅動機構60的示意性側視圖。如圖4所示,實施形態1的傳送驅動機構60包括:傳送驅動軸63;傳送驅動軸63上的柱塞單元61;及傳送驅動軸63與柱塞單元61之間的柱塞單元支撐板62。
Fig. 4 shows a schematic side view of the conveying
柱塞單元61包括多個柱塞64及柱塞單元本體65。多個柱塞64各個是於Z軸方向上呈直線狀延伸的棒狀部件,且多個柱塞64的各前端740位於柱塞單元本體65的外部,並且多個柱塞64的各前端740的另一端(未圖示)位於柱塞單元本體65的內部。
柱塞單元本體65構成為柱塞64能夠於柱塞單元本體65的內部升降。
The
圖5表示實施形態1的傳送驅動機構60的示意性平面圖。圖5是從柱塞64的前端觀看圖4所示的傳送驅動機構60時的示意性平面視圖。如圖5的平面視圖所示,多個柱塞64構成於作為第一方向的X軸方向上延伸的單行的柱塞行641。如圖5的平面視圖所示,單行的柱塞行641藉由多個柱塞的各前端740位於任意的直線741上而構成。
FIG. 5 shows a schematic plan view of the conveying
如圖5的平面視圖所示,單行的柱塞行641位於柱塞單元本體65的將Y軸方向上的寬度二等分的兩個區域R1與區域R2中的一個區域R1,所述Y軸方向作為第二方向,所述兩個區域R1與區域R2由X軸方向上延伸的中心線C-C所劃分。另外,穿過構成單行的柱塞行641的多個柱塞64的各前端740且於X軸方向上延伸的直線741位於區域R1。
As shown in the plan view of FIG. 5, a single row of
再者,單行的柱塞行641或直線741亦可位於柱塞單元本體65的由中心線C-C所劃分的兩個區域R1與區域R2中的另一個區域R2。再者,單行的柱塞行641或直線741位於區域R1或區域R2中的任一個的構成根據多品種少量生產等各種理由而有要求。
Furthermore, a single row of
如圖5的平面視圖所示,傳送驅動機構60的傳送驅動軸63包括第一傳送驅動軸63a、第二傳送驅動軸63b、及第三傳送驅動軸63c。如圖5的平面視圖所示,第一傳送驅動軸63a、第
三傳送驅動軸63c、及第二傳送驅動軸63b按此順序位於X軸方向上。
As shown in the plan view of FIG. 5, the
如圖5的平面視圖所示,於實施形態1的傳送驅動機構60中,第三傳送驅動軸63c的中心631c位於穿過第一傳送驅動軸63a的中心631a及第二傳送驅動軸63b的中心631b的直線632上以外的部位。
As shown in the plan view of FIG. 5, in the
另外,傳送驅動機構60的傳送驅動軸63不限定於如上所述般具有第一傳送驅動軸63a、第二傳送驅動軸63b及第三傳送驅動軸63c的三個傳送驅動軸的構成,但必須具有三個以上的傳送驅動軸。再者,構成傳送驅動軸63的三個以上的傳送驅動軸構成為保持同步。為了使三個以上的傳送驅動軸以保持同步的方式構成,可以構成為使用例如帶、滑輪(pulley)、鏈條(chain)、鏈輪(sprocket)、或齒輪等動力傳遞部件而與三個以上的傳送驅動軸共通的單一的伺服馬達聯動。
In addition, the
以下,參照圖6~圖12,對使用實施形態1的樹脂成形裝置製造樹脂成形品的方法的一例即實施形態1的樹脂成形品的製造方法進行說明。圖6表示實施形態1的樹脂成形品的製造方法的流程圖。如圖6所示,實施形態1的樹脂成形品的製造方法包括:於第一模10與第二模20之間設置成形對象物的步驟(S10);將第一模10與第二模20合模的步驟(S20);對成形對象物進行樹脂成形的步驟(S30);以及將第一模10與第二模20開模的步驟(S40)。以下,對各步驟進行更詳細的說明。
Hereinafter, referring to FIGS. 6 to 12, an example of a method of manufacturing a resin molded product using the resin molding apparatus of
首先,如圖7的示意性部分剖面圖所示,進行於第一模10與第二模20之間設置成形對象物的步驟(S10)。於圖7所示的例子中,成形對象物1設置於第二模20的凹部21。作為成形對象物1,例如可以使用搭載於引線框架的半導體晶片等。
First, as shown in the schematic partial cross-sectional view of FIG. 7, a step of placing a molded object between the
圖8表示實施形態1中使用的第二模20的一例的示意性平面圖。如圖8所示,第二模20的第二凹部21僅設置於亦為柱塞64移動的通路的罐22的單側。另外,於圖8所示的例子中,第二凹部21的形狀為矩形,罐22的形狀為圓形,但並不限定於該些形狀。
FIG. 8 shows a schematic plan view of an example of the
接下來,如圖9的示意性部分剖面圖所示,進行將第一模10與第二模20合模的步驟(S20)。第一模10與第二模20的合模例如可以藉由合模機構600使可動台板300上升,使第二模20相對於已固定的第一模10移動,對第一模10與第二模20沖壓來進行。再者,第一模10與第二模20的合模亦可藉由使第一模10相對於已固定的第二模20移動來進行,亦可藉由使第一模10及第二模20兩者移動來進行。
Next, as shown in the schematic partial cross-sectional view of Fig. 9, a step of clamping the
接下來,如圖10的示意性部分剖面圖所示,進行對成形對象物1進行樹脂成形的步驟(S30)。成形對象物1的樹脂成形例如可以如以下般進行。首先,圖4及圖5所示的實施形態1的傳送驅動機構60經由柱塞單元支撐板62使柱塞單元61上升。藉此,柱塞64上升,將供給至罐22內的樹脂擠出至罐22的外部。接下來,擠出至罐22外部的樹脂熔融,並積存於收集部12。接下
來,將熔融後的樹脂移送至包含第一模10的凹部11及第二模20的凹部21的模腔90內。其後,藉由樹脂固化來密封成形對象物1等,藉此進行成形對象物1的樹脂成形。
Next, as shown in the schematic partial cross-sectional view of FIG. 10, a step of resin molding of the molded
圖11及圖12表示圖解實施形態1的樹脂成形裝置的藉由柱塞64的移動而樹脂70向模腔90內移送的示意性放大部分剖面圖。如圖11所示,於設置成形對象物1的步驟(S10)後且進行合模的步驟(S20)之前,於罐22內設置固體的樹脂70a,柱塞64位於固體的樹脂70a的下側。
11 and 12 show schematic enlarged partial cross-sectional views illustrating the transfer of the
於其後的對成形對象物1進行樹脂成形的步驟(S30)中,如圖12所示,柱塞64將罐22內的固體的樹脂70a向第一模10的收集部12擠出,藉由第一模10的未圖示的加熱板使固體的樹脂70a熔融,已熔融的樹脂70積存於收集部12的內部。其後,已熔融的樹脂70藉由因柱塞64的移動而產生的壓力,穿過樹脂通路14被移送至模腔90內的成形對象物1上。其後,已熔融的樹脂70固化,成形對象物1的樹脂成形完成。
In the subsequent step (S30) of resin molding of the molded
其後,如圖6的流程圖所示,進行將第一模10與第二模20開模的步驟(S40)。第一模10與第二模20的開模例如可以如以下般進行。首先,實施形態1的傳送驅動機構60經由柱塞單元支撐板62使柱塞單元61下降。接著,藉由合模機構600使可動台板300下降,使第二模20相對於已固定的第一模10移動,解除第一模10與第二模20的沖壓來進行。另外,第一模10與第二模20的開模亦可藉由使第一模10相對於固定的第二模20移動
來進行,亦可藉由使第一模10及第二模20兩者移動來進行。最後,將樹脂成形品從樹脂成形裝置取出至外部。根據以上內容,藉由實施形態1的樹脂成形品的製造方法的樹脂成形品的製造完成。
Thereafter, as shown in the flowchart of FIG. 6, a step of opening the
圖13表示基於先前技術的比較例的傳送驅動機構60a的示意性側視圖。圖14表示比較例的傳送驅動機構60a的示意性平面圖。圖14是從柱塞64的前端觀看圖13所示的比較例的傳送驅動機構60a時的示意性平面視圖。
FIG. 13 shows a schematic side view of a conveying
如圖14的平面視圖所示,比較例的傳送驅動機構60a的特徵在於:不存在第三傳送驅動軸63c,將柱塞單元本體65的Y軸方向上的寬度二等分的中心線C-C、與穿過第一傳送驅動軸63a的中心631a及第二傳送驅動軸63b的中心631b的直線632重合。再者,第一傳送驅動軸63a的中心631a及第二傳送驅動軸63b的中心631b位於X軸方向上的柱塞單元本體65的內側的區域即區域R5。
As shown in the plan view of FIG. 14, the
於實施形態1的樹脂成形裝置中,於使用比較例的傳送驅動機構60a來代替實施形態1的傳送驅動機構60的情況下,於柱塞單元61的升降動作中,柱塞單元61向柱塞行641側傾倒,從而有時無法執行穩定的升降動作。
In the resin molding apparatus of the first embodiment, when the conveying
因此,本發明者進行了銳意研究結果發現:藉由設為如下構成,即,例如如圖5的平面視圖所示,於第一傳送驅動軸63a與第二傳送驅動軸63b之間設置第三傳送驅動軸63c,第三傳送驅
動軸63c的中心631c位於穿過第一傳送驅動軸63a的中心631a及第二傳送驅動軸63b的中心631b的直線632上以外的部位,可以抑制於柱塞61的升降動作中柱塞61向柱塞行641側傾倒而實現柱塞單元61的穩定的升降動作,從而完成實施形態1的傳送驅動機構60。
Therefore, the inventors of the present invention have conducted intensive research and found that by setting it as the following configuration, for example, as shown in the plan view of FIG. 5, a third
另外,為了實現柱塞單元61的更穩定的升降動作,亦可如圖5的平面視圖所示,使第三傳送驅動軸63c的中心631c位於柱塞單元本體65的由中心線C-C所劃分的兩個區域中的單行的柱塞行641所處的區域R1,並且使第一傳送驅動軸63a的中心631a及第二傳送驅動軸63b的中心631b位於柱塞單元本體65的由中心線C-C所劃分的兩個區域中的不存在單行的柱塞行641的區域R2。
In addition, in order to achieve a more stable lifting action of the
但,亦可使第一傳送驅動軸63a的中心631a、第二傳送驅動軸63b的中心631b及第三傳送驅動軸63c的中心631c全部僅位於區域R1或區域R2的任一個區域,而實現柱塞單元61的穩定的升降動作。
However, it is also possible to make the
另外,為了實現柱塞單元61的更穩定的升降動作,亦可如圖5的平面視圖所示,使第一傳送驅動軸63a的中心631a位於X軸方向上的柱塞單元本體65的其中一個外側區域即區域R3。
In addition, in order to achieve a more stable lifting action of the
另外,為了實現柱塞單元61的更穩定的升降動作,亦可如圖5的平面視圖所示,使第二傳送驅動軸63b的中心631b位於X軸方向上的柱塞單元本體65的另一個外側區域即區域R4。
In addition, in order to achieve a more stable lifting action of the
另外,為了實現柱塞單元61的更穩定的升降動作,亦可如圖5的平面視圖所示,使第三傳送驅動軸63c的中心631c位於X軸方向上的柱塞單元本體65的內側區域即區域R5。
In addition, in order to achieve a more stable lifting action of the
再者,於以上所述中,對使用構成為模腔90僅位於柱塞64的單側的成形模的情況進行了說明,但亦可使用構成為模腔90位於柱塞64的兩側的例如圖15的示意性平面圖所示般的成形模。
In addition, in the above, the case of using a forming mold configured so that the
<實施形態2> <Embodiment 2>
圖16表示實施形態2的傳送驅動機構60的示意性側視圖。圖17表示實施形態2的傳送驅動機構60的示意性平面圖。圖17是從柱塞64的前端觀看圖16所示的實施形態2的傳送驅動機構60時的示意性平面視圖。
FIG. 16 shows a schematic side view of the conveying
如圖17的平面視圖所示,實施形態2的傳送驅動機構60的特徵在於包括多行的柱塞行643。多行的柱塞行643藉由單行的柱塞行641及單行的柱塞行642排列於Y軸方向上而構成。單行的柱塞行641包含多個柱塞64a,單行的柱塞行642包含多個柱塞64b。單行的柱塞行641及單行的柱塞行642分別於X軸方向上延伸。
As shown in the plan view of FIG. 17, the conveying
如圖17的平面視圖所示,於實施形態2的傳送驅動機構60中,單行的柱塞行641位於柱塞單元本體65的由中心線C-C所劃分的兩個區域R1與區域R2中的一個區域R1,單行的柱塞行642位於另一個區域R2。另外,穿過構成單行的柱塞行641的多
個柱塞64a的各前端740a且於X軸方向上延伸的直線741a位於區域R1,穿過構成單行的柱塞行642的多個柱塞64b的各前端740b且於X軸方向上延伸的直線741b位於區域R2。
As shown in the plan view of FIG. 17, in the
因此,可認為實施形態2與實施形態1的情況相比,於柱塞單元61的升降動作中柱塞單元61傾倒的情況較少。但是,於實施形態2的傳送驅動機構60中,如圖17的平面視圖所示,第三傳送驅動軸63c的中心631c位於穿過第一傳送驅動軸63a的中心631a及第二傳送驅動軸63b的中心631b的直線632上以外的部位,藉此與圖13及圖14所示的比較例的使用傳送驅動機構60a的情況相比,亦可以實現柱塞單元61的穩定的升降動作。
Therefore, it can be considered that in the second embodiment, compared with the case of the first embodiment, the
再者,於實施形態2的傳送驅動機構60中,如圖17的平面視圖所示,第三傳送驅動軸63c的中心631c位於區域R1,第一傳送驅動軸63a的中心631a及第二傳送驅動軸63b的中心631b位於區域R2。
Furthermore, in the
當然多行的柱塞行643的構成並不限定於圖17的平面視圖所示的構成,多行的柱塞行643例如亦可於Y軸方向上排列三行以上的單行的柱塞行643而構成。另外,實施形態2的多行的柱塞行643及實施形態1的單行的柱塞行641亦可構成為能夠交換。
Of course, the configuration of the multiple rows of
實施形態2的所述以外的說明與實施形態1相同,因此省略所述說明。 The description of the second embodiment other than the above is the same as that of the first embodiment, so the description is omitted.
<實施形態3> <Embodiment 3>
圖18表示實施形態3的傳送驅動機構60的示意性平面圖。圖18表示從柱塞的前端觀看實施形態3的傳送驅動機構60時的示意性平面視圖。再者,於圖18中,為了便於說明,省略了多個柱塞及包含多個柱塞的柱塞行的記載。
FIG. 18 shows a schematic plan view of the conveying
如圖18的平面視圖所示,實施形態3的傳送驅動機構60的特徵在於:第一傳送驅動軸63a的中心631a及第二傳送驅動軸63b的中心631b位於柱塞單元本體65的由中心軸線C-C所劃分的Y軸方向上的兩個區域R1與區域R2中的一個區域R1,第三傳送驅動軸63c的中心631c位於另一個區域R2。
As shown in the plan view of FIG. 18, the
如圖18的平面視圖所示,於實施形態3的傳送驅動機構60中,第三傳送驅動軸63c的中心631c亦位於穿過第一傳送驅動軸63a的中心631a及第二傳送驅動軸63b的中心631b的直線632上以外的部位。因此,於實施形態3的傳送驅動機構60中,亦可以實現柱塞單元61的穩定的升降動作。
As shown in the plan view of FIG. 18, in the
實施形態3的所述以外的說明與實施形態1及實施形態2相同,因此省略所述說明。 The description of the third embodiment other than the above is the same as the first and second embodiments, so the description is omitted.
<實施形態4> <Embodiment 4>
圖19表示實施形態4的傳送驅動機構60的示意性平面圖。圖19是從柱塞的前端觀看實施形態4的傳送驅動機構60時的示意性平面視圖。再者,於圖19中,為了便於說明,亦省略了多個柱塞及包含多個柱塞的柱塞行的記載。
Fig. 19 shows a schematic plan view of the conveying
如圖19的平面視圖所示,實施形態4的傳送驅動機構
60的特徵在於更包括位於第一傳送驅動軸63a與第二傳送驅動軸63b之間的第四傳送驅動軸63d。
As shown in the plan view of FIG. 19, the transmission drive mechanism of the
如圖19的平面視圖所示,於實施形態4的傳送驅動機構60中,第三傳送驅動軸63c的中心631c及第四傳送驅動軸63d的中心631d位於穿過第一傳送驅動軸63a的中心631a及第二傳送驅動軸63b的中心631b的直線632上以外的部位。因此,於實施形態4的傳送驅動機構60中,亦可以實現柱塞單元61的穩定的升降動作。
As shown in the plan view of FIG. 19, in the
另外,為了實現柱塞單元61的更穩定的升降動作,亦可如圖19的平面視圖所示設為如下構成:穿過第一傳送驅動軸63a的中心631a及第二傳送驅動軸63b的中心631b的直線632、與穿過第三傳送驅動軸63c的中心631c及第四傳送驅動軸63d的中心631d的直線633交叉。
In addition, in order to achieve a more stable lifting movement of the
另外,為了實現柱塞單元61的更穩定的升降動作,亦可如圖19的平面視圖所示,第四傳送驅動軸63d的中心631d位於X軸方向上的柱塞單元本體65的內側區域R5。
In addition, in order to achieve a more stable lifting action of the
再者,如圖19的平面視圖所示,於實施形態4的傳送驅動機構60中,第二傳送驅動軸63b的中心631b及第四傳送驅動軸63d的中心631d位於區域R1,第一傳送驅動軸63a的中心631a及第三傳送驅動軸63c的中心631c位於區域R2。
Furthermore, as shown in the plan view of FIG. 19, in the
實施形態4的所述以外的說明與實施形態1~實施形態3相同,因此省略所述說明。
The description of Embodiment 4 other than the above is the same as that of
<實施形態5> <Embodiment 5>
圖20表示實施形態5的傳送驅動機構60的示意性平面圖。圖20是從柱塞的前端觀看實施形態5的傳送驅動機構60時的示意性的平面視圖。再者,於圖20中,為了便於說明,亦省略了多個柱塞及包含多個柱塞的柱塞行的記載。
Fig. 20 shows a schematic plan view of the conveying
如圖20的平面視圖所示,實施形態5的傳送驅動機構60的特徵在於亦包括位於第一傳送驅動軸63a與第二傳送驅動軸63b之間的第四傳送驅動軸63d。
As shown in the plan view of FIG. 20, the conveying
如圖20的平面視圖所示,於實施形態5的傳送驅動機構60中,第三傳送驅動軸63c的中心631c及第四傳送驅動軸63d的中心631d位於穿過第一傳送驅動軸63a的中心631a及第二傳送驅動軸63b的中心631b的直線632上以外的部位。因此,於實施形態4的傳送驅動機構60中,亦可以實現柱塞單元61的穩定的升降動作。
As shown in the plan view of FIG. 20, in the
再者,如圖20的平面視圖所示,於實施形態5的傳送驅動機構60中,第一傳送驅動軸63a的中心631a及第三傳送驅動軸63c的中心631c位於區域R1,第二傳送驅動軸63b的中心631b及第四傳送驅動軸63d的中心631d位於區域R2。
Furthermore, as shown in the plan view of FIG. 20, in the
實施形態5的所述以外的說明與實施形態1~實施形態4相同,因此省略所述說明。 The description of the fifth embodiment other than the above is the same as the first to the fourth embodiment, so the description is omitted.
如上所述對實施形態進行了說明,但亦從最初就預定將所述實施形態的各構成適當組合。 The embodiment has been described as described above, but it is also planned from the beginning to appropriately combine the respective components of the embodiment.
應考慮到此次所揭示的實施形態於所有方面為例示,而並非限制者。本發明的範圍並非由所述說明而是由申請專利範圍表示,意在包含與申請專利範圍均等的含義及範圍內的所有變更。 It should be considered that the embodiment disclosed this time is an illustration in all aspects and is not a limitation. The scope of the present invention is shown not by the above description but by the scope of the patent application, and is intended to include the meaning and all changes within the scope equivalent to the scope of the patent application.
60:傳送驅動機構 60: Transmission drive mechanism
62:柱塞單元支撐板 62: Plunger unit support plate
63a:第一傳送驅動軸 63a: The first transmission drive shaft
63b:第二傳送驅動軸 63b: second transmission drive shaft
63c:第三傳送驅動軸 63c: Third transmission drive shaft
64:柱塞 64: Plunger
65:柱塞單元 65: Plunger unit
631a、631b、631c:中心 631a, 631b, 631c: center
632、741:直線 632, 741: straight line
641:柱塞行 641: Plunger Row
740:前端 740: front end
R1~R5:區域 R1~R5: area
Claims (19)
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