TWI699676B - Display device manufacture method and display device - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000011159 matrix material Substances 0.000 claims abstract description 31
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- 239000006059 cover glass Substances 0.000 description 2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
Description
本發明涉及顯示技術領域,尤其涉及一種顯示裝置之製造方法及顯示裝置。 The present invention relates to the field of display technology, in particular to a manufacturing method of a display device and a display device.
本部分旨在為請求項陳述之本發明之具體實施例提供背景或上下文。此處之描述不因為包括在本部分中就承認是習知技術。 This section is intended to provide background or context for the specific embodiments of the invention stated in the claims. The description here is not recognized as a conventional technology just because it is included in this section.
觸控面板根據被貼合物之物理特性,貼合製程可分為「軟對軟」(Soft-to-Soft,STS)、「軟對硬(Soft-to-Hard,STH)」和「硬對硬」(Hard-to-Hard,HTH)三種不同之貼合製程。其中,「軟對軟」用於兩張軟質材料,如光學膠(Optical Clear Adhhesive,OCA)與氧化銦錫薄膜(ITO Film)之對貼;軟與硬質材料間,如觸控感應模組與蓋板(Cover glass)之貼合稱作「軟對硬」;另外,「硬對硬」之貼合則為蓋板(Cover glass)與液晶顯示模組(LCM)之貼合。 According to the physical characteristics of the touch panel, the bonding process can be divided into "Soft-to-Soft" (STS), "Soft-to-Hard (STH)" and "Hard". "Hard-to-Hard" (HTH) three different bonding processes. Among them, "soft to soft" is used for two soft materials, such as Optical Clear Adhhesive (OCA) and indium tin oxide film (ITO Film); between soft and hard materials, such as touch sensor module and The bonding of the cover glass is called "soft to hard"; in addition, the bonding of the "hard to hard" is the bonding of the cover glass and the liquid crystal display module (LCM).
而在貼合製程中,觸控感應模組正對蓋板之表面設置有若干對位標記,根據對位標記將觸控感應模組與蓋板貼合,以達到貼合對位精度;在觸控感應模組背離蓋板之一側貼合液晶顯示模組時,由於無法觀測到對位標記,一般需要藉由測量液晶顯示模組與蓋板之間之偏移量,再測量蓋板與觸控感應模組之間之偏移量,根據兩次測量結果計算得到液晶顯示模組與觸控感應模組之間之偏移量,計算之過程中引入兩次測量誤差,導致計算得到之偏移量誤差較大。 In the lamination process, the touch sensor module is provided with a number of alignment marks on the surface of the cover plate, and the touch sensor module is attached to the cover plate according to the alignment marks to achieve the lamination and alignment accuracy; When the touch sensor module is attached to the LCD module on the side away from the cover, since the alignment mark cannot be observed, it is generally necessary to measure the offset between the LCD module and the cover, and then measure the cover The offset between the LCD module and the touch sensor module is calculated based on the two measurement results. Two measurement errors are introduced during the calculation process, resulting in the calculation The offset error is relatively large.
另,由於金屬網格狀之觸控電極層之網格重複性高,金屬網線寬度較小,導致感光耦合元件(CCD)無法明確對位。 In addition, due to the high mesh repeatability of the metal mesh-like touch electrode layer and the small width of the metal mesh lines, the photosensitive coupling element (CCD) cannot be clearly aligned.
故,有需要研發一種顯示裝置之製造方法及顯示裝置,以簡化用於觸控感應模組與顯示模組之間貼合偏移量之測量過程,並提高計算精度,並有效解決習知技術所存在之缺失。 Therefore, there is a need to develop a manufacturing method of a display device and a display device to simplify the measurement process of the bonding offset between the touch sensor module and the display module, improve the calculation accuracy, and effectively solve the conventional technology The lack of existence.
本發明一方面提供一種顯示裝置之製造方法,所述顯示裝置包括用於顯示圖像畫面之顯示面,所述顯示裝置定義有用於顯示圖像畫面之顯示區和不用於顯示圖像畫面之非顯示區,所述顯示裝置之製造方法包括以下步驟:提供蓋板與顯示模組,所述蓋板之一側表面在所述非顯示區設置有不透光之油墨層,所述顯示模組設置有不用於出射光線之黑矩陣,所述黑矩陣具有位於所述顯示區之部分;在所述油墨層形成第一通孔;在所述第一通孔中填充用於透射紅外線之紅外線透射層;製作觸控模組之金屬網格狀之觸控電極層,在對應第一通孔位置之觸控電極層上製作第一對位標記;將所述蓋板、所述觸控模組與所述顯示模組進行貼合,所述觸控模組貼合於所述蓋板與所述顯示模組之間;向所述第一通孔中照射紅外線,紅外線經過所述蓋板與所述紅外線透射層之透射、所述第一對位標記與所述觸控電極層之反射後從所述第一通孔出射;根據所述第一通孔中出射之紅外線形成第一圖像,所述第一圖像中包括對應所述第一對位標記之第一圖案;記錄所述第一圖案之第一位置數據;點亮所述顯示模組,採集所述顯示裝置之顯示面之第二圖像,所述第二圖像中包括對應所述黑矩陣區域之第二圖案;記錄所述第二圖案之第二位置數據;根據所述第一位置數據及所述第二位置數據計算所述第一圖案與所述第二圖案之間之第一距離,以及所述觸控模組與所述顯示模組之間之貼合偏移量。 One aspect of the present invention provides a method for manufacturing a display device, the display device includes a display surface for displaying image frames, and the display device is defined with a display area for displaying image frames and a non-display area not used for displaying image frames. In the display area, the manufacturing method of the display device includes the following steps: providing a cover plate and a display module, one side surface of the cover plate is provided with an opaque ink layer in the non-display area, the display module A black matrix that is not used for emitting light is provided, the black matrix has a part located in the display area; a first through hole is formed in the ink layer; and the first through hole is filled with infrared light for transmitting infrared rays Layer; make the touch electrode layer of the metal mesh of the touch module, make the first alignment mark on the touch electrode layer corresponding to the position of the first through hole; put the cover plate and the touch module Is attached to the display module, the touch module is attached between the cover plate and the display module; infrared rays are irradiated into the first through hole, and the infrared rays pass through the cover plate and The transmission of the infrared transmission layer, the reflection of the first alignment mark and the touch electrode layer are emitted from the first through hole; a first image is formed according to the infrared rays emitted from the first through hole , The first image includes a first pattern corresponding to the first alignment mark; records the first position data of the first pattern; lights the display module, and collects the display surface of the display device The second image, the second image includes a second pattern corresponding to the black matrix area; the second position data of the second pattern is recorded; according to the first position data and the second position The data calculates the first distance between the first pattern and the second pattern, and the bonding offset between the touch module and the display module.
本發明另一方面提供一種顯示裝置,定義有用於顯示圖像畫面之顯示區和不用於顯示圖像畫面之非顯示區,所述顯示裝置包括依次層疊設置之:蓋板,在其一表面對應所述非顯示區形成有不透光之油墨層,所述油墨層上設置有第一通孔,所述第一通孔內填充有用於透射紅外線之紅外線透射層;觸控模組,包括用於感測觸控操作之金屬網格狀之觸控電極層,所述觸控電極層之朝向所述油墨層之一側對應所述第一通孔設置有第一對位標記; 顯示模組,朝向所述蓋板之一側設置有不用於出射光線之黑矩陣,所述黑矩陣具有位於所述顯示區之部分。 Another aspect of the present invention provides a display device, which is defined with a display area for displaying image frames and a non-display area not used for displaying image frames. The display device includes a cover plate which is stacked in sequence and corresponds to one surface The non-display area is formed with an opaque ink layer, the ink layer is provided with a first through hole, and the first through hole is filled with an infrared transmission layer for transmitting infrared rays; the touch control module includes A touch electrode layer in the shape of a metal mesh for sensing touch operations, a side of the touch electrode layer facing the ink layer is provided with a first alignment mark corresponding to the first through hole; The display module is provided with a black matrix not used for emitting light toward one side of the cover plate, and the black matrix has a part located in the display area.
上述顯示裝置之製造方法與顯示裝置藉由採集之第一圖像及第二圖像獲得所述第一對位標記及所述黑矩陣之位置信息,從而計算得到所述觸控模組與所述顯示模組之間之相對位置關係,進一步獲得觸控模組與顯示模組之貼合偏移量,檢測與計算方法簡單,精度高。 The manufacturing method of the display device and the display device obtain the position information of the first alignment mark and the black matrix by collecting the first image and the second image, thereby calculating the touch module and the The relative positional relationship between the display modules is described to further obtain the fitting offset between the touch module and the display module. The detection and calculation methods are simple and the accuracy is high.
S1-S11:步驟 S1-S11: steps
10、20、30:顯示裝置 10, 20, 30: display device
101:顯示區 101: display area
102:非顯示區 102: Non-display area
110、310:蓋板 110, 310: cover
112:油墨層 112: Ink layer
113、213、313:第一通孔 113, 213, 313: first through hole
213a:通孔 213a: Through hole
215:第二通孔 215: second through hole
114:紅外線透射層 114: infrared transmission layer
120:光學膠 120: Optical glue
130、330:觸控模組 130, 330: touch module
131:觸控電極層 131: Touch electrode layer
132、232、332:第一對位標記 132, 232, 332: first alignment mark
232a:對位標記 232a: registration mark
236、336:第二對位標記 236, 336: second alignment mark
135:部件 135: Parts
150:顯示模組 150: display module
152:黑矩陣 152: black matrix
152a:第一矩陣 152a: the first matrix
152b:第二矩陣 152b: second matrix
p:區域 p: area
q:貼合區域 q: Fitting area
圖1為本發明提供之顯示裝置之製造方法流程圖。 FIG. 1 is a flowchart of a manufacturing method of a display device provided by the present invention.
圖2為本發明一實施例提供之顯示裝置之正視圖。 FIG. 2 is a front view of a display device provided by an embodiment of the invention.
圖3為圖2所示之顯示裝置之沿III-III線之剖視結構示意圖。 3 is a schematic cross-sectional view of the display device shown in FIG. 2 along the line III-III.
圖4為圖2所示之顯示裝置中區域p之放大圖。 FIG. 4 is an enlarged view of region p in the display device shown in FIG. 2. FIG.
圖5為圖4所示之區域p之沿V-V線剖視結構示意圖。 Fig. 5 is a schematic cross-sectional view of the region p shown in Fig. 4 along the line V-V.
圖6為在一種實施例中區域p之放大圖。 Figure 6 is an enlarged view of region p in one embodiment.
圖7為圖6所示之區域p之沿VII-VII線之剖視結構示意圖。 FIG. 7 is a schematic cross-sectional view of the region p shown in FIG. 6 along the line VII-VII.
圖8為本發明另一實施例中提供之顯示裝置之正視圖。 FIG. 8 is a front view of a display device provided in another embodiment of the invention.
圖9為一種實施例中顯示裝置之正視圖。 Fig. 9 is a front view of a display device in an embodiment.
圖10為本發明另一實施例提供之觸控模組之正視圖。 FIG. 10 is a front view of a touch module provided by another embodiment of the invention.
圖11為由圖10中之觸控模組組裝得到之顯示裝置之正視圖。 FIG. 11 is a front view of the display device assembled from the touch module in FIG. 10.
為了能夠更清楚地理解本發明之前述目之、特徵和優點,下面結合附圖和具體實施例對本發明進行詳細描述。需要說明之是,在不衝突之情況下,本申請之實施例及實施例中之特徵可以相互組合。 In order to be able to understand the foregoing objectives, features and advantages of the present invention more clearly, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments of the application and the features in the embodiments can be combined with each other if there is no conflict.
在下面之描述中闡述了很多具體細節以便於充分理解本發明,所描述之實施例僅是本發明一部分實施例,而不是全部之實施例。基於本發明中之實施例,本領域普通技術人員在沒有做出創造性勞動前提下所獲得之所有其他實施例,均屬本發明保護之範圍。 In the following description, many specific details are explained in order to fully understand the present invention. The described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
除非另有定義,本文所使用之所有之技術和科學術語與屬本發明之技術領域之技術人員通常理解之含義相同。本文中在本發明之說明書中所使用之術語只是為了描述具體之實施例之目之,不是旨在於限制本發明。 Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.
本發明提供一種顯示裝置之製造方法與顯示裝置,藉由一次測量即可得到顯示裝置中之顯示模組與觸控模組之間之貼合偏移量,操作簡單,並且降避免了由於多次測量引入之複數測量誤差,有利於提高測量精度。 The present invention provides a method for manufacturing a display device and a display device. The adhesion offset between the display module and the touch module in the display device can be obtained by one measurement, the operation is simple, and the amount of The complex measurement error introduced by the second measurement helps to improve the measurement accuracy.
實施例一 Example one
請參閱圖1,為本發明提供之顯示裝置之製造方法流程圖,顯示裝置之製造方法包括:S1:提供蓋板與顯示模組,蓋板在非顯示區設置有不透光之油墨層,顯示模組設置有不用於出射光線之黑矩陣,黑矩陣具有位於顯示區之部分;S2:在油墨層形成第一通孔;S3:在第一通孔中填充用於透射紅外線之紅外線透射層;S4:製作觸控模組之金屬網格狀之觸控電極層,在對應第一通孔位置之觸控電極層上製作第一對位標記;S5:將蓋板、觸控模組與顯示模組進行貼合,觸控模組位於蓋板與顯示模組之間;S6:向第一通孔中照射紅外線,紅外線經過蓋板與紅外線透射層之透射、第一對位標記與觸控電極層之反射後從第一通孔出射;S7:根據第一通孔中出射之紅外線形成第一圖像,第一圖像中包括對應第一對位標記之第一圖案;S8:記錄第一圖案之第一位置數據;S9:點亮顯示模組,採集顯示裝置之顯示面之第二圖像,第二圖像中包括對應黑矩陣區域之第二圖案;S10:記錄第二圖案之第二位置數據;S11:根據第一位置數據及第二位置數據計算第一圖案與第二圖案之間之第一距離,以及觸控模組與顯示模組之間之貼合偏移量。 Please refer to FIG. 1, which is a flow chart of the manufacturing method of the display device provided by the present invention. The manufacturing method of the display device includes: S1: providing a cover plate and a display module, the cover plate is provided with an opaque ink layer in the non-display area, The display module is provided with a black matrix that is not used for emitting light, and the black matrix has a part located in the display area; S2: forming a first through hole in the ink layer; S3: filling the first through hole with an infrared transmitting layer for transmitting infrared rays ; S4: Make the metal mesh-shaped touch electrode layer of the touch module, make the first alignment mark on the touch electrode layer corresponding to the position of the first through hole; S5: Connect the cover plate, the touch module and The display module is attached, and the touch module is located between the cover plate and the display module; S6: irradiate infrared rays into the first through hole, the infrared rays pass through the cover plate and the infrared transmission layer, the first alignment mark and touch The reflection of the control electrode layer is emitted from the first through hole; S7: a first image is formed according to the infrared rays emitted from the first through hole, and the first image includes the first pattern corresponding to the first alignment mark; S8: recording The first position data of the first pattern; S9: light the display module, and collect a second image of the display surface of the display device, the second image includes the second pattern corresponding to the black matrix area; S10: record the second pattern The second position data; S11: Calculate the first distance between the first pattern and the second pattern according to the first position data and the second position data, and the bonding offset between the touch module and the display module .
請結合圖1參閱圖2-圖5,圖2為本發明一實施例提供之顯示裝置10之正視圖,圖3為圖2所示之顯示裝置10之沿III-III線之剖視結構示意圖,
圖4為圖2所示之顯示裝置10中區域p之放大圖,圖5為圖4所示之區域p之沿V-V線剖視結構示意圖。
Please refer to FIGS. 2 to 5 in conjunction with FIG. 1. FIG. 2 is a front view of a
如圖2-圖3所示,顯示裝置10包括顯示區101與非顯示區102,其中顯示區101用於顯示圖像畫面;非顯示圖102不用於顯示圖像畫面,並對應設置不透光之油墨以遮光。本發明中之顯示區101是指顯示裝置10中複數層結構中用於顯示圖像畫面之立體空間,非顯示區102是指顯示裝置10中複數層結構中不用於顯示圖像畫面之立體空間。組裝後之顯示裝置10包括依次層疊設置之蓋板110、觸控模組130及顯示模組150。
As shown in Figures 2 to 3, the
步驟S1中,提供蓋板110、觸控模組130與顯示模組150。提供之蓋板110為玻璃蓋板,在一種實施例中,蓋板可以是紅外線透過率相對較高之普通玻璃蓋板或石英玻璃蓋板。蓋板110包括位於顯示區101及非顯示區102之部分。蓋板110位於非顯示區102之一側表面設置有不透光之油墨層112,油墨層112可以使用黑色油墨、白色油墨或其他顏色之油墨,使得蓋板110在非顯示區102呈現相應之顏色。
In step S1, the
提供之觸控模組130包括金屬網格狀之觸控電極層131,在一種實施例中,觸控電極層131呈片狀,在一種實施例中,觸控電極層131呈條狀,多條觸控電極層131按照預設規律排布。
The provided
提供之顯示模組150可以為液晶顯示模組,其包括用於出射光線之區域及不用於出射光線之黑矩陣152(BM),黑矩陣152設置於顯示模組150之四周邊緣區域並圍成「口」字形,黑矩陣152具有位於顯示區101之部分,即在顯示模組150發光時,從顯示區101中能夠看到至少部分不發光之黑矩陣152。黑矩陣152可以為黑色光阻,比如黑色樹脂。
The provided
步驟S2中,結合圖3參閱圖4-圖5,在油墨層112中形成第一通孔113,即在蓋板110表面上第一通孔113之位置不設置油墨,使得光線能夠穿過蓋板110及第一通孔113。第一通孔113位於區域p中,第一通孔113優選為紅外(infra-red,IR)孔,顯示裝置10對應IR孔設置有紅外感測器件以感測用戶與IR孔之間之間距。第一通孔113可以呈圓形、方形、矩形或其他形狀。
In step S2, referring to FIGS. 4 to 5 in conjunction with FIG. 3, a first through
步驟S3在第一通孔113中填充紅外線透射層114,在本實施例中,油墨層112背離蓋板110之一側亦形成有紅外線透射層114,可以理解之是,油墨層112背離蓋板110一側形成之紅外線透射層114不是必須之。紅外線透射層
114中設置有用於透射紅外線並截留其他波段光線的油墨,優選設置IR(infra-red)油墨,在一實施例中,IR油墨之可以見光(550nm)透過率<5%,非可見光(850nm)透過率>80%,即IR油墨對可見光之屏蔽作用較強,入射可見光基本不能透過,IR油墨對紅外線之遮蔽作用較弱,可以透過入射之大部分紅外線。
In step S3, the
步驟S4中,第一對位標記132可以選用金屬材料製成,在形成觸控電極層131後,在觸控電極層131之一側形成第一對位標記132。在一種優選之實施例中,第一對位標記132與金屬網格狀之觸控電極層131材質相同金屬材料製成,比如銅、銀或其他金屬,從而可以在加工觸控電極層131之過程中形成第一對位標記132。
In step S4, the
本實施例中,第一對位標記132呈環形,第一對位標記132還可以呈圓形、方形、矩形條狀、L形、十字形或其他易於在觸控電極層上易於辨認之形狀。
In this embodiment, the
請參閱圖6-7,圖6為在一種實施例中區域p之放大圖,圖7為圖6所示之區域p之沿VII-VII線之剖視結構示意圖。本實施例與前述實施例不同之是,觸控模組130在呈環形之第一對位標記132內部設置有部件135,部件135還延伸至光學膠120中並至少部分容置於光學膠120中。在一種實施例中,部件135還可以設置於觸控模組130上對應第一通孔113之其他位置。部件135可以為光感器件或者是其他器件。
Please refer to FIGS. 6-7. FIG. 6 is an enlarged view of region p in an embodiment, and FIG. 7 is a schematic cross-sectional structure diagram of region p shown in FIG. 6 along line VII-VII. The difference between this embodiment and the previous embodiments is that the
如圖3-5所示,步驟S5中將蓋板110上附著有紅外線透射層114一側之表面利用光學膠(OCA)120貼合觸控模組130形成第一對位標記132一側之表面。使得紅外線依次穿過蓋板110、紅外線透射層114及光學膠120照射至第一對位標記132及第一對位標記132周圍之觸控電極層131。將觸控模組130背離第一對位標記132一側之表面與顯示模組150之出光面進行貼合,在一種實施例中,觸控模組130與顯示模組150藉由光學膠貼合。
As shown in FIGS. 3-5, in step S5, the surface of the
步驟S5之後即可對觸控模組130與顯示模組150之貼合偏移量進行測量,已進行FW補償。
After step S5, the bonding offset between the
步驟S6中,向第一通孔113中照射紅外線,由於蓋板110、紅外線透射層114、光學膠120對紅外線之屏蔽作用較小,提供之紅外線大部分能夠照射至第一對位標記132及第一對位標記周圍之觸控電極層131。用於提供紅外
線之裝置可以是CCD(感光耦合組件)測試儀,CCD測試儀用於發出檢測光線並利用採集到之光線形成圖像,並在得到之圖像中進行測距及相應計算。
In step S6, infrared rays are irradiated into the first through
步驟S7中,利用CCD測試儀採集觸控電極層131與第一對位標記132反射之紅外線並形成第一圖像,第一圖像中包括對應第一對位標記132之第一圖案,第一圖案與第一對位標記132之形狀相對應,在包括觸控電極層131之第一圖像中易於辨認。
In step S7, a CCD tester is used to collect the infrared rays reflected by the
步驟S8:記錄第一圖案之第一位置數據。第一位置數據可以是第一圖案中一個定位點在第一圖像中之坐標,定位點可以是第一圖案之幾何中心、邊緣上之一個定位點或是其他位置選定之定位點。 Step S8: Record the first position data of the first pattern. The first position data may be the coordinates of a positioning point in the first pattern in the first image, and the positioning point may be a geometric center of the first pattern, a positioning point on an edge, or positioning points selected by other positions.
步驟S9中點亮顯示模組150,在一種優選之實施例中,顯示模組150顯示亮場圖像,使得在顯示區101中能夠明顯觀察到黑矩陣152,從而降低在第二圖像中檢測第二圖案之難度。
In step S9, the
步驟S10記錄第二圖案之第二位置數據,第二圖案對應顯示區101中黑矩陣152之形狀,如圖2所示,第二圖案呈「口」字形,黑矩陣152包括兩個第一矩陣152a與兩個第二矩陣152b,兩個第一矩陣152a相互平行,兩個第二矩陣152b相互平行,第一矩陣152a與第二矩陣152b垂直連接。第一矩陣152a中包括第一標記線,第二矩陣152b中包括第二標記線,第一標記線與第二標記線不平行。第二位置數據包括第一標記線在第二圖像中之坐標值,及/或第二標記線在第二圖像中之坐標值。
Step S10: Record the second position data of the second pattern. The second pattern corresponds to the shape of the
步驟S11:根據第一位置數據及第二位置數據計算第一圖案與第二圖案之間之第一距離,判斷第一距離是否落入預設範圍內,並根據第一距離得到觸控模組130與顯示模組150之間之貼合偏移量,在一種實施例中,第一距離與理論距離之差值即為貼合觸控模組130與顯示模組150之間之貼合偏移量,其中,理論距離為貼合之前確認之第一對位標記132與第二位置數據對應位置之間之距離。
Step S11: Calculate the first distance between the first pattern and the second pattern according to the first position data and the second position data, determine whether the first distance falls within a preset range, and obtain the touch module according to the first distance The bonding offset between the
第一距離包括第一子距離與第二子距離,其中,第一子距離為第一圖案與第一標記線之間之距離,第二子距離為第一圖案與第二標記線之間之距離,根據第一子距離及第二子距離,能夠在準確定位第一對位標記132相對於顯示模組150之位置,並計算得到觸控模組130與顯示模組150之間之貼合偏
移量,有利於提高第一對位標記132定位精准度,從而提高計算觸控模組130與顯示模組150貼合偏移量計算之精准度。
The first distance includes a first sub-distance and a second sub-distance, wherein the first sub-distance is the distance between the first pattern and the first marking line, and the second sub-distance is the distance between the first pattern and the second marking line The distance, according to the first sub-distance and the second sub-distance, can accurately locate the position of the
在一種實施例中,步驟S11之後還可以利用其他結構件遮蔽第一通孔113,使得顯示裝置10更加美觀。
In an embodiment, after step S11, other structural members may be used to shield the first through
實施例二 Example two
請參閱圖8,為本發明另一實施例中提供之顯示裝置20之正視圖。顯示裝置20與顯示裝置10相比,主要區別在於,油墨層設置有第一通孔213與第二通孔215,第一通孔213與第二通孔215內部設置有紅外線透射層,觸控電極層之朝向油墨層之一側設置有第一對位標記232與第二對位標記236,其中,第一對位標記232對應第一通孔213設置,第二對位標記236對應第二通孔215設置。應用於第一對位比標記之各種方案同樣適用於第二對位標記236。可以根據步驟S1-S4製作第一通孔213與第一對位標記232,並採用第一通孔213與第一對位標記232之製作方法製作第二通孔215與第二對位標記236。
Please refer to FIG. 8, which is a front view of a
具體地,步驟S5之前,還包括:在油墨層形成第二通孔215;在第二通孔215中填充用於透射紅外線之紅外線透射層;相應地,在本實施例中,步驟S4還包括:在對應第二通孔215之觸控電極層上製作第二對位標記236。第二對位標記236用於在觸控模組上提供另一參考點以確定觸控模組相對於顯示模組之位置,藉由第一對位標記232、第二對位標記236、第一標記線及第二標記線可以唯一確定觸控模組相對於顯示模組之位置。
Specifically, before step S5, it further includes: forming a second through
步驟S5之後,還包括:向第二對位標記236照射紅外線,具體地,紅外線藉由蓋板、紅外線透射層照射至第二對位標記236及其周圍之觸控電極層,經過第二對位標記236及周圍觸控電極層之反射後從第二通孔215出射;根據第二通孔215出射之紅外線形成第三圖像,第三圖像中包括對應第二對位標記236之第三圖案,第三圖案與第二對位標記236之形狀對應;記錄第三圖案之第三位置數據;
步驟S11還包括:根據第三位置數據及第二位置數據計算第三圖案與第二圖案之間之第三距離,根據第一距離與第三距離,計算觸控模組與顯示模組之間之貼合偏移量。
After step S5, it further includes: irradiating infrared rays to the
請參閱圖9,為一種實施例中顯示裝置20之正視圖。顯示裝置20中設置有多於兩個通孔213a及多於兩個對位標記232a,適用於第一通孔213之複數具體方案均適用於通孔213a,適用於第一對位標記232之複數具體方案均適用於對位標記232a,通孔213a與對位標記232a一一對應。可以理解之是,還可以設置其他數量之通孔213a與對位標記232a。
Please refer to FIG. 9, which is a front view of the
實施例三 Example three
請參閱圖10-11,圖10為本發明另一實施例提供之觸控模組330之正視圖,圖11為由圖10中之觸控模組330組裝得到之顯示裝置30之正視圖。觸控模組330與觸控模組130之主要區別在於,觸控模組330包括用於貼合蓋板310之貼合區域q,第二對位標記336設置於貼合區域q之外。
Please refer to FIGS. 10-11. FIG. 10 is a front view of a
具體地,如圖10所示,觸控模組330設置有第一對位標記332與第二對位標記336,其中第一對位標記332位於非顯示區中,第二對位標記336位於貼合區域q之外。如圖11所示,第一對位標記332與油墨層中之第一通孔313相配合,貼合後第二對位標記336未被蓋板310覆蓋,可以採用切削工具將第二對位標記336裁切掉。在本顯示裝置30之油墨層只設置一個第一通孔313,適用於習知之顯示設備僅具有一個IR孔之情況,具有廣泛之應用前景。
Specifically, as shown in FIG. 10, the
在一種實施例中,在步驟S5之前包括:在觸控模組330表面劃分出用於貼合蓋板之貼合區域,在貼合區域之外形成第二對位標記336;在步驟S11,之後包括:將第二對位標記336裁切掉。具體地,可以利用刀片沿蓋板310之邊緣裁切觸控模組330;或者將顯示裝置30之蓋板朝下至於治具上,治具上或油墨層設置有標記點,利用激光進行裁切。
In one embodiment, before step S5, it includes: dividing a bonding area on the surface of the
在另一種裁切觸控模組330之實施例中,在步驟S5之前包括:在觸控模組330表面劃分出用於貼合蓋板310之貼合區域q;在貼合區域q之外形成第二對位標記336;沿貼合區域q邊緣利用切削工具製作裁切線,比如利用刀模或激光;
在步驟S5中,將蓋板310貼合於貼合區域q中;在步驟S11之後,沿裁切線撕除位於貼合區域q之外之第二對位標記336。
In another embodiment of cutting the
本發明實施例中,藉由採集之圖像獲得第一對位標記及黑矩陣之位置信息,從而計算得到觸控模組與顯示模組之間之相對位置關係,進一步獲得觸控模組與顯示模組之貼合偏移量,檢測方法簡單精度高。 In the embodiment of the present invention, the position information of the first alignment mark and the black matrix is obtained from the collected image, thereby calculating the relative position relationship between the touch module and the display module, and further obtaining the touch module and The fitting offset of the display module is simple and accurate.
需要說明之是,在本發明之精神或基本特徵之範圍內,適用於各個實施例中之各具體方案亦可以相互適用,為節省篇幅及避免重複起見,在此就不再贅述。 It should be noted that, within the scope of the spirit or basic features of the present invention, the specific solutions applicable to the various embodiments can also be mutually applicable. In order to save space and avoid repetition, the details are not repeated here.
對於本領域技術人員而言,顯然本發明不限於前述示範性實施例之細節,而且在不背離本發明之精神或基本特徵之情況下,能夠以其他之具體形式實現本發明。因此,無論從哪一點來看,均應將實施例看作是示範性之,而且是非限制性之,本發明之範圍由所附發明申請專利範圍而不是前述說明限定,因此旨在將落在發明申請專利範圍之等同要件之含義和範圍內之所有變化涵括在本發明內。不應將發明申請專利範圍中之任何附圖標記視為限制所涉及之發明申請專利範圍。此外,顯然「包括」一詞不排除其他單元或步驟,單數不排除複數。裝置請求項中陳述之複數裝置亦可以由同一個裝置或系統藉由軟件或者硬件來實現。第一,第二等詞語用來表示名稱,而並不表示任何特定之順序。 For those skilled in the art, it is obvious that the present invention is not limited to the details of the foregoing exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the scope of the appended invention patent application rather than the foregoing description, so it is intended to fall within The meaning of equivalent elements and all changes within the scope of the patent application for invention are included in the present invention. Any reference signs in the scope of the invention application should not be regarded as limiting the scope of the invention application. In addition, it is obvious that the word "include" does not exclude other units or steps, and the singular does not exclude the plural. The plural devices stated in the device request item can also be implemented by the same device or system by software or hardware. The first, second and other words are used to indicate names, but do not indicate any specific order.
最後應說明之是,以上實施例僅用以說明本發明之技術方案而非限制,儘管參照較佳實施例對本發明進行了詳細說明,本領域之普通技術人員應當理解,可以對本發明之技術方案進行修改或等同替換,而不脫離本發明技術方案之精神和範圍。 Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be Modifications or equivalent replacements are made without departing from the spirit and scope of the technical solutions of the present invention.
S1-S11:步驟 S1-S11: steps
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CN111552401B (en) * | 2020-04-22 | 2022-05-10 | 业成科技(成都)有限公司 | Touch control display device |
CN112885241B (en) * | 2021-02-07 | 2022-12-02 | 业成科技(成都)有限公司 | Frame and manufacturing method thereof, display module and measuring method thereof and electronic equipment |
CN113362703B (en) * | 2021-07-05 | 2022-10-18 | 业成科技(成都)有限公司 | Display device and terminal equipment |
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CN109375805A (en) | 2019-02-22 |
CN109375805B (en) | 2022-04-15 |
TW202016710A (en) | 2020-05-01 |
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