TWI693413B - Electronic component testing device and applied test classification equipment - Google Patents

Electronic component testing device and applied test classification equipment Download PDF

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TWI693413B
TWI693413B TW107126187A TW107126187A TWI693413B TW I693413 B TWI693413 B TW I693413B TW 107126187 A TW107126187 A TW 107126187A TW 107126187 A TW107126187 A TW 107126187A TW I693413 B TWI693413 B TW I693413B
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electronic component
testing device
hole
carrier
electronic components
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TW107126187A
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TW202007993A (en
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陳麒宏
陳炅煜
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鴻勁精密股份有限公司
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一種電子元件測試裝置,其測試機構係於架置具之第一通孔上方裝配至少一電性連接測試機之測試器,載送機構係於架置具之下方設有具至少一第一承置部件之轉盤,該轉盤旋轉帶動第一承置部件及其承置之具發光體的電子元件載送至第一通孔下方,電傳機構係於測試機構之第一通孔下方設有帶動電傳器位移之載具,以令電傳器之傳輸件電性接觸電子元件之接點,使電子元件之發光體朝向測試器投射光線,測試器於接收光線後係傳輸一訊號至測試機,以判別電子元件之發光品質,達到自動化測試而提高生產效能之實用效益。 An electronic component testing device, the testing mechanism is equipped with at least one tester electrically connected to the testing machine above the first through hole of the mounting tool, and the carrying mechanism is provided with at least one first bearing under the mounting tool The turntable of the component, the rotation of the turntable drives the first receiving component and the electronic component with the luminous body to be carried under the first through hole, and the teletype mechanism is provided with a drive under the first through hole of the testing mechanism The carrier of the telegraph displacement, so that the transmission part of the telegraph electrically contacts the contact of the electronic component, so that the luminous body of the electronic component projects light toward the tester, and the tester transmits a signal to the tester after receiving the light In order to judge the luminous quality of electronic components, to achieve the practical benefits of automated testing and improve production efficiency.

Description

電子元件測試裝置及其應用之測試分類設備 Electronic component testing device and applied test classification equipment

本發明係提供一種自動化測試具發光體之電子元件,以提高生產效能之電子元件測試裝置。 The invention provides an electronic component testing device for automatically testing electronic components with luminous bodies to improve production efficiency.

在現今,具發光二極體(LED)之電子元件已廣泛應用於不同產品,例如顯示裝置或小尺寸燈具等,該電子元件係於一面嵌固有複數顆LED,另一面則具有接點,由於電子元件必須歷經多道加工製程,例如裁切製程或封裝製程,因此,業者為確保產品品質,於電子元件製作完成後,均會進行測試作業,以測試電子元件之發光均勻度及亮度等,而淘汰出不良品,目前係以人工作業逐一測試電子元件,但由於電子元件數量龐大,人工測試作業不僅耗時費力而無法提升生產效能,更易因人工作業疏失,而造成測試品質參差不齊之缺失。 Nowadays, electronic components with light emitting diodes (LEDs) have been widely used in different products, such as display devices or small-sized lamps, etc. The electronic components are embedded with multiple LEDs on one side and have contacts on the other side. Electronic components must go through multiple processing processes, such as cutting processes or packaging processes. Therefore, in order to ensure product quality, after the completion of the production of electronic components, manufacturers will conduct test operations to test the luminous uniformity and brightness of electronic components. The elimination of defective products is currently testing electronic components one by one manually. However, due to the large number of electronic components, manual testing operations not only take time and effort to improve production efficiency, but also are more likely to be caused by manual operations, resulting in uneven test quality. Missing.

本發明之目的一,係提供一種電子元件測試裝置,其測試機構係於架置具之第一通孔上方裝配至少一電性連接測試機之測試器,載送機構係於架置具之下方設有具至少一第一承置部件之轉盤,該轉盤旋轉帶動第一承置部件及其承置之具發光體的電子元件載送至第一通孔下方,電傳機構係於測試機構之第一通孔下方設有帶動電傳器位移之載具,以令電傳器之傳輸件電性接觸電子元件之接點,使電子元件之發光體朝向測試器投射光線,測試器於接收光線後係傳輸一訊號至測試機,以判別電子元件之發光品質,達到自動化測試而提高生產效能之實用效益。 The first object of the present invention is to provide an electronic component testing device. The testing mechanism is equipped with at least one tester electrically connected to the testing machine above the first through hole of the mounting device. The carrying mechanism is below the mounting device. A turntable with at least one first receiving part is provided, and the turntable rotates and drives the first receiving part and the electronic component with a luminous body to be carried under the first through hole. Below the first through hole, there is a carrier that drives the displacement of the telegraph, so that the transmission part of the telegraph electrically contacts the contact of the electronic component, so that the luminous body of the electronic component projects light toward the tester, and the tester receives light After that, a signal is transmitted to the testing machine to judge the luminous quality of the electronic components, so as to achieve the practical benefits of automated testing and improving production efficiency.

本發明之目的二,係提供一種電子元件測試裝置,更包含檢知機構,該檢知機構係於架置具之第二通孔下方配置具 抽氣部件之貼接座,於載送機構之第一承置部件貼抵於該貼接座時,該貼接座即以抽氣部件吸附第一承置部件上之電子元件,若無法真空吸附,即檢知該電子元件並無平置於第一承置部件,而必須排除異常,使得該檢知機構可檢知電子元件是否平置於載送機構之第一承置部件,以利後續測試作業而確保測試品質,達到提升使用效能之實用效益。 The second object of the present invention is to provide an electronic component testing device, further comprising a detection mechanism, the detection mechanism is disposed under the second through hole of the mounting tool When the first receiving part of the conveying mechanism is pressed against the attaching base, the attaching base of the exhausting part sucks the electronic components on the first receiving part by the exhausting part, if there is no vacuum Adsorption, that is, it is detected that the electronic component is not flat on the first receiving part, and the abnormality must be eliminated, so that the detection mechanism can detect whether the electronic component is flat on the first receiving part of the carrying mechanism, to facilitate Follow-up test operations to ensure test quality and achieve practical benefits to improve the use efficiency.

本發明之目的三,係提供一種應用電子元件測試裝置之測試分類設備,其包含機台、供料裝置、收料裝置、測試裝置、輸送裝置及中央控制裝置,該供料裝置係配置於機台上,並設有至少一容納待測電子元件之供料承置器,該收料裝置係配置於機台上,並設有至少一容納已測電子元件之收料承置器,該測試裝置係配置於機台上,並設有測試機構、載送機構及電傳機構,以執行電子元件測試作業,該輸送裝置係配置於機台上,並設有至少一移料單元,以移載電子元件,該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 The third object of the present invention is to provide a test classification device using an electronic component test device, which includes a machine, a feeding device, a receiving device, a testing device, a conveying device and a central control device. The feeding device is configured on the machine On the table, there is at least one feed holder for accommodating the electronic component to be tested. The receiving device is arranged on the machine table and at least one feed holder for accommodating the tested electronic component is provided. The test The device is arranged on the machine table, and is provided with a test mechanism, a carrying mechanism and a telex mechanism to perform electronic component testing operations. The conveying device is arranged on the machine table and is provided with at least one material moving unit to move With electronic components, the central control device is used to control and integrate the actions of each device to perform automated operations to achieve practical benefits of improving operating efficiency.

〔本發明〕 〔this invention〕

10‧‧‧測試裝置 10‧‧‧Test device

11‧‧‧測試機構 11‧‧‧ Testing organization

111‧‧‧架置具 111‧‧‧Mounting tool

1111‧‧‧第一通孔 1111‧‧‧First through hole

1112‧‧‧第二通孔 1112‧‧‧The second through hole

112‧‧‧測試器 112‧‧‧Tester

12‧‧‧載送機構 12‧‧‧Carrier

121‧‧‧第一馬達 121‧‧‧ First Motor

122‧‧‧轉盤 122‧‧‧Turntable

1221‧‧‧第一承置部件 1221‧‧‧The first bearing component

1222‧‧‧第二承置部件 1222‧‧‧Second bearing component

1223‧‧‧第一穿孔 1223‧‧‧First punch

1224‧‧‧第二穿孔 1224‧‧‧Second Perforation

13‧‧‧電傳機構 13‧‧‧ Telex agency

131‧‧‧載具 131‧‧‧vehicle

132‧‧‧第二馬達 132‧‧‧Second motor

133‧‧‧傳動組 133‧‧‧ transmission group

134‧‧‧電路板 134‧‧‧ circuit board

135‧‧‧電傳座 135‧‧‧Telephone Block

1351‧‧‧探針 1351‧‧‧Probe

1361‧‧‧移動件 1361‧‧‧Mobile

1362‧‧‧固定板 1362‧‧‧Fixed board

1363‧‧‧滑軌組 1363‧‧‧Slide rail set

1364‧‧‧支撐架 1364‧‧‧support frame

1365‧‧‧壓缸 1365‧‧‧Press cylinder

1366‧‧‧第一限位件 1366‧‧‧First limit piece

1367‧‧‧第二限位件 1367‧‧‧Second limit piece

1368‧‧‧槽軌 1368‧‧‧slot rail

1369‧‧‧第三限位件 1369‧‧‧The third limit piece

1370‧‧‧卡掣座 1370‧‧‧Card holder

14‧‧‧檢知機構 14‧‧‧ Inquiry agency

141‧‧‧貼接座 141‧‧‧Patch

142‧‧‧抽氣部件 142‧‧‧Suction parts

143‧‧‧本體 143‧‧‧Body

144‧‧‧承壓件 144‧‧‧Pressure parts

145‧‧‧作動件 145‧‧‧Actuator

21‧‧‧機台 21‧‧‧machine

22‧‧‧測試機 22‧‧‧Test machine

23‧‧‧電子元件 23‧‧‧Electronic components

231‧‧‧發光體 231‧‧‧ luminous body

232‧‧‧接點 232‧‧‧Contact

24‧‧‧移料器 24‧‧‧shifter

25‧‧‧電子元件 25‧‧‧Electronic components

30‧‧‧機台 30‧‧‧machine

40‧‧‧供料裝置 40‧‧‧Feeding device

41‧‧‧供料承置器 41‧‧‧ Feeding holder

50‧‧‧收料裝置 50‧‧‧Receiving device

51‧‧‧收料承置器 51‧‧‧ Receiver

60‧‧‧輸送裝置 60‧‧‧Conveying device

61‧‧‧第一移料單元 61‧‧‧First material moving unit

62‧‧‧入料載台 62‧‧‧Incoming carrier

621‧‧‧入料承置槽 621‧‧‧Incoming receiving trough

63‧‧‧第二移料單元 63‧‧‧Second shifting unit

631‧‧‧第一拾取器 631‧‧‧First Picker

632‧‧‧第二拾取器 632‧‧‧Second Picker

64‧‧‧第一校正器 64‧‧‧ First corrector

65‧‧‧第三移料單元 65‧‧‧The third material transfer unit

651‧‧‧第三拾取器 651‧‧‧ third picker

652‧‧‧第四拾取器 652‧‧‧ Fourth Picker

66‧‧‧第二校正器 66‧‧‧Second corrector

67‧‧‧出料載台 67‧‧‧Discharge carrier

671‧‧‧出料承置槽 671‧‧‧Discharge receiving trough

68‧‧‧第四移料單元 68‧‧‧The fourth material transfer unit

第1圖:本發明電子元件測試裝置之配置圖。 Figure 1: The configuration diagram of the electronic component testing device of the present invention.

第2圖:本發明電子元件測試裝置之局部示意圖(一)。 Figure 2: Partial schematic diagram (1) of the electronic component testing device of the present invention.

第3圖:本發明電子元件測試裝置之局部示意圖(二)。 Figure 3: Partial schematic diagram (2) of the electronic component testing device of the present invention.

第4圖:本發明電子元件測試裝置之局部示意圖(三)。 Figure 4: Partial schematic diagram (3) of the electronic component testing device of the present invention.

第5圖:本發明電子元件測試裝置之使用示意圖(一)。 Fig. 5: Schematic diagram of the electronic device testing device of the present invention (1).

第6圖:本發明電子元件測試裝置之使用示意圖(二)。 Figure 6: A schematic diagram of the use of the electronic component testing device of the present invention (2).

第7圖:本發明電子元件測試裝置之使用示意圖(三)。 Fig. 7: The use schematic diagram (3) of the electronic component testing device of the present invention.

第8圖:本發明電子元件測試裝置之使用示意圖(四)。 Figure 8: The schematic diagram (4) of the electronic device testing device of the present invention.

第9圖:本發明電子元件測試裝置應用於測試分類機之示意圖。 Figure 9: A schematic diagram of the electronic component testing device of the present invention applied to a test sorter.

為使 貴審查委員對本發明作更進一步之瞭解,茲 舉一較佳實施例並配合圖式,詳述如後: In order to make your examination committee have a better understanding of the present invention, we hereby Give a preferred embodiment in conjunction with the drawings, detailed as follows:

請參閱第1至4圖,本發明電子元件測試裝置10包含測試機構11、載送機構12及電傳機構13,更進一步包含檢知機構14,該測試機構11係設有至少一架置具111,該架置具111係開設至少一第一通孔1111,該至少一第一通孔1111的上方裝配至少一測試器112,於本實施例中,該架置具111係裝配於機台21,並設有第一通孔1111及第二通孔1112,於第一通孔1111上裝配一為積分球之測試器112,該測試器112係電性連接一測試機22,由於測試機22非本案之必要技術特徵,故不予贅述;該載送機構12係設有至少一載送驅動源,以及至少一由該載送驅動源驅動旋轉之轉盤,於本實施例中,該載送驅動源係為第一馬達121,該第一馬達121係驅動一轉盤122旋轉作動,該轉盤122係位於測試機構11之架置具111下方,並設有至少一承置電子元件之第一承置部件1221,於本實施例中,該轉盤122係設有第一承置部件1221及第二承置部件1222,該第一承置部件1221之底面係開設有第一穿孔1223,該第二承置部件1222之底面係開設有第二穿孔1224,該轉盤122係旋轉帶動第一承置部件1221及第二承置部件1222依序位移至測試機構11之第一通孔1111及第二通孔1112下方處;該電傳機構13係於該測試機構11之第一通孔1111下方設有至少一載具131,更進一步,該載具131係為固定式或移動式設計,若為固定式載具,則固設於機台21,若為移動式載具,則由電傳驅動源驅動作至少一方向位移,於本實施例中,該載具131係為移動式載具,並由電傳驅動源驅動作第一方向(如Z方向)位移,該電傳驅動源係設有壓缸或線性馬達或包含馬達及傳動組,於本實施例中,該電傳驅動源係設有第二馬達132,並以第二馬達132驅動一為螺桿螺座組之傳動組133,該傳動組133係以螺座帶動載具131作Z方向位移, 另該電傳機構13係於載具131上裝配至少一電傳器,該電傳器係設有至少一電性接觸電子元件之傳輸件而執行預設作業,例如電子元件發光檢測作業,使電子元件之發光體朝向測試器112投射光線,測試器112於接收光線後係傳輸一訊號至測試機22,以判別電子元件之發光品質,或例如對電子元件執行電性測試作業,於本實施例中,該電傳器係於載具131上設有電性連接之電路板134及電傳座135,該電路板134係電性連接測試機22,該電傳座135係設有為探針1351之傳輸件,以電性接觸電子元件之接點,又該電傳機構13係設有至少一換位單元,以控制載具131作水平位移,而進行電傳器之更換維修作業,該換位單元係設有至少一承置電傳驅動源之移動件1361,該移動件1361係採自動化或手動方式作水平位移,不以本發明所揭露之實施態樣為限,於本實施例中,該換位單元係於移動件1361與固定板1362之間設有滑軌組1363,以手動方式使該移動件1361利用滑軌組1363作水平位移,另於固定板1362上設有支撐架1364,該支撐架1364供裝配測試機22,並設置至少一限位該移動件1361向外位移之第一限位器及至少一限位該移動件1361向內位移之第二限位器,於本實施例中,該第一限位器係設有一由壓缸1365驅動作Z方向位移之第一限位件1366,於第一限位件1366作Z方向向下位移時,可擋止移動件1361向外位移,反之,於第一限位件1366作Z方向向上位移時,則可解除擋止而供移動件1361向外位移,該第二限位器可為獨立元件或成型於支撐架1364,於本實施例中,該第二限位器係於支撐架1364之一端設有一為擋板之第二限位件1367,以擋止該移動件1361向內位移,又該換位單元係設有至少一第三限位器,該第三限位器係於移動件1361開設有槽軌1368,以供穿置一第三限位件1369,該第三限位件1369則插置於一卡掣座1370,以輔助擋止移動件1361位移;該 檢知機構14係於轉盤122之第二承置部件1222下方配置至少一具抽氣部件142之貼接座141,以抽吸該第二承置部件1222承置之電子元件,更進一步,該貼接座141係裝配於一浮動器而作浮動位移,於本實施例中,該浮動器係於本體143內設有承壓件144,該承壓件144係為彈簧或膜片或氣囊,於本實施例中,該承壓件144係為彈簧,並彈性頂置一作動件145,該作動件145係承置貼接座141,使貼接座141作Z方向浮動位移。 Please refer to FIGS. 1 to 4, the electronic component testing device 10 of the present invention includes a testing mechanism 11, a carrying mechanism 12 and a telex mechanism 13, and further includes a detection mechanism 14, the testing mechanism 11 is provided with at least one mounting device 111. The mounting device 111 defines at least one first through hole 1111, and at least one tester 112 is mounted above the at least one first through hole 1111. In this embodiment, the mounting device 111 is mounted on a machine 21, and is provided with a first through hole 1111 and a second through hole 1112, a tester 112 as an integrating sphere is assembled on the first through hole 1111, the tester 112 is electrically connected to a test machine 22, because the test machine 22 is not a necessary technical feature of this case, so it will not be described in detail; the carrying mechanism 12 is provided with at least one carrying drive source and at least one turntable driven by the carrying drive source to rotate. In this embodiment, the carrying The driving source is a first motor 121, which drives a turntable 122 to rotate and operate. The turntable 122 is located under the mounting device 111 of the testing mechanism 11 and is provided with at least one first receiving electronic component. The receiving member 1221, in this embodiment, the turntable 122 is provided with a first receiving member 1221 and a second receiving member 1222, a bottom surface of the first receiving member 1221 is provided with a first through hole 1223, the first The bottom surface of the second receiving member 1222 is provided with a second through hole 1224. The turntable 122 rotates to drive the first receiving member 1221 and the second receiving member 1222 to sequentially move to the first through hole 1111 and the second of the testing mechanism 11 Below the through hole 1112; the teletype mechanism 13 is provided with at least one carrier 131 under the first through hole 1111 of the test mechanism 11, and further, the carrier 131 is of a fixed or mobile design, if The fixed carrier is fixed on the machine 21, if it is a mobile carrier, it is driven by a teledrive source for displacement in at least one direction. In this embodiment, the carrier 131 is a mobile carrier, It is driven by a teledrive source for displacement in the first direction (such as the Z direction). The teledrive source is equipped with a pressure cylinder or a linear motor or contains a motor and a transmission group. In this embodiment, the teledrive source is A second motor 132 is provided, and the second motor 132 drives a transmission group 133 which is a screw screw seat group. The transmission group 133 drives the carrier 131 to move in the Z direction by the screw seat. In addition, the telex mechanism 13 is equipped with at least one telex on the carrier 131, and the telex is provided with at least one transmission member that electrically contacts the electronic component to perform a preset operation, such as a light emitting detection operation of the electronic component, so that The luminous body of the electronic component projects light toward the tester 112. After receiving the light, the tester 112 transmits a signal to the testing machine 22 to judge the luminous quality of the electronic component, or, for example, perform an electrical test operation on the electronic component, in this embodiment For example, the telexer is provided with an electrically connected circuit board 134 and a teledock 135 on the carrier 131, the circuit board 134 is electrically connected to the testing machine 22, and the teledock 135 is provided as a probe The transmission part of the pin 1351 electrically contacts the contacts of the electronic components, and the telex mechanism 13 is provided with at least one transposition unit to control the horizontal displacement of the carrier 131 to perform the replacement and maintenance of the telex, The transposition unit is provided with at least one moving part 1361 that supports a telex drive source. The moving part 1361 is horizontally displaced by an automated or manual method, and is not limited to the implementation form disclosed in the present invention. In the example, the transposition unit is provided with a slide rail group 1363 between the moving member 1361 and the fixed plate 1362. The moving member 1361 is manually displaced horizontally by the slide rail group 1363, and is further provided on the fixed plate 1362 The support frame 1364 is provided for assembling the testing machine 22, and is provided with at least a first limiter that limits the outward displacement of the moving member 1361 and at least a second limit position that limits the inward displacement of the movable member 1361 In this embodiment, the first limiter is provided with a first limiter 1366 driven by the pressure cylinder 1365 for displacement in the Z direction. When the first limiter 1366 is displaced downward in the Z direction, The moving member 1361 is prevented from moving outwards. On the contrary, when the first limiting member 1366 is displaced upward in the Z direction, the blocking can be released to allow the moving member 1361 to move outwards. The second stopper can be an independent component or It is formed on the support frame 1364. In this embodiment, the second limiter is provided with a second limiter 1367 as a baffle at one end of the support frame 1364, so as to stop the moving member 1361 from moving inward, and The transposition unit is provided with at least a third limiter, and the third limiter is provided with a groove rail 1368 on the moving part 1361 for passing through a third limiter 1369, the third limiter 1369 is inserted into a detent seat 1370 to assist in stopping the displacement of the moving member 1361; the The detection mechanism 14 is configured with at least one attaching seat 141 with an exhaust member 142 under the second receiving member 1222 of the turntable 122 to suck the electronic components received by the second receiving member 1222. Further, the The attachment base 141 is assembled with a floater for floating displacement. In this embodiment, the floater is provided with a pressure member 144 in the body 143. The pressure member 144 is a spring or a diaphragm or an air bag. In this embodiment, the pressure-bearing member 144 is a spring, and an actuating member 145 is elastically placed on the actuating member 145. The actuating member 145 supports the attachment base 141 so that the attachment base 141 floats in the Z direction.

請參閱第5圖,該載送機構12係以第一馬達121驅動轉盤122旋轉,該轉盤122即帶動第一承置部件1221及第二承置部件1222同步作水平旋轉位移,令第一承置部件1221對位於架置具111之第二通孔1112,以供一移料器24將一待測具發光體231及接點232之電子元件23經第二通孔1112而移入於第一承置部件1221,由於該檢知機構14之貼接座141係微高於第一承置部件1221,當第一承置部件1221旋轉至第二通孔1112之下方時,即會微壓貼接座141作Z方向向下位移,該貼接座141則經由該作動件145而壓縮該承壓件144向下退位,使第一承置部件1221位於架置具111與貼接座141之間,該貼接座141並利用承壓件144之頂推彈力而貼合於第一承置部件1221之底面,使抽氣部件142對位於第一承置部件1221之第一穿孔1223,該檢知機構14即利用抽氣部件142抽吸第一承置部件1221內待測之電子元件23,若真空吸附電子元件23,則檢知電子元件23平置於第一承置部件1221,而可依作動時序載送位移,反之,若無法真空吸附電子元件23,即檢知該電子元件23並無平置於第一承置部件1221,而必須排除異常,以確保測試品質;因此,當貼接座141之抽氣部件142真空抽吸第一承置部件1221內待測之電子元件23後,即確認電子元件23平置於第一承置部件1221,再控制 抽氣部件142釋放電子元件23,進而完成檢知作業。 Please refer to FIG. 5, the carrying mechanism 12 uses a first motor 121 to drive a turntable 122 to rotate, and the turntable 122 drives the first receiving member 1221 and the second receiving member 1222 to perform horizontal rotation displacement simultaneously, so that the first bearing The positioning member 1221 is located at the second through hole 1112 of the mounting fixture 111 for a material shifter 24 to move an electronic component 23 of the illuminant 231 and the contact 232 of the tool to be tested into the first through the second through hole 1112 The receiving part 1221 is slightly higher than the first receiving part 1221 because the attachment seat 141 of the detection mechanism 14 is slightly pressed when the first receiving part 1221 rotates below the second through hole 1112 The receiving base 141 is displaced downward in the Z direction, and the attaching base 141 compresses the pressure receiving member 144 downward through the actuating member 145 so that the first receiving part 1221 is located between the mounting tool 111 and the attaching base 141 At the same time, the affixing base 141 is affixed to the bottom surface of the first receiving part 1221 by the pushing elastic force of the pressure member 144, so that the exhaust part 142 is located at the first through hole 1223 of the first receiving part 1221. The detection mechanism 14 uses the suction member 142 to suck the electronic component 23 to be tested in the first receiving member 1221. If the electronic component 23 is vacuum-absorbed, the detecting electronic component 23 is placed flat on the first receiving member 1221. Displacement can be carried in accordance with the timing of actuation. On the contrary, if the electronic component 23 cannot be vacuum adsorbed, it is detected that the electronic component 23 is not placed flat on the first receiving part 1221, and the abnormality must be eliminated to ensure the test quality; therefore, when After the suction component 142 of the attaching base 141 vacuum suctions the electronic component 23 to be tested in the first receiving component 1221, it is confirmed that the electronic component 23 is placed flat on the first receiving component 1221, and then controlled The exhaust member 142 releases the electronic component 23 to complete the detection operation.

請參閱第6圖,接著該載送機構12係以第一馬達121驅動轉盤122旋轉,轉盤122即帶動具電子元件23之第一承置部件1221及第二承置部件1222作水平旋轉位移,令第一承置部件1221對位於架置具111之第一通孔1111,該電傳機構13係以第二馬達132驅動該傳動組133之螺桿,經傳動組133之螺座帶動載具131及其上之電路板134及電傳座135作Z方向向上位移,令電傳座135之探針1351電性接觸電子元件23之接點232而供電,並頂升電子元件23貼置於架置具111之底面,且使電子元件23之下半部保持位於第一承置部件1221內,進而使電子元件之發光體231經由第一通孔1111而對測試器112之內部投射光線,該測試器112於接收光線後,即傳輸一訊號至測試機,由測試機判別電子元件23之發光品質,然於測試電子元件23時,由於轉盤122之第二承置部件1222係位於架置具111之第二通孔1112處,而可承置下一待測之電子元件25。 Please refer to FIG. 6, and then the carrying mechanism 12 is driven by the first motor 121 to rotate the turntable 122. The turntable 122 drives the first receiving part 1221 and the second receiving part 1222 of the electronic component 23 for horizontal rotation displacement. Make the first receiving part 1221 align with the first through hole 1111 of the mounting device 111, the teletype mechanism 13 drives the screw of the transmission group 133 by the second motor 132, and drives the carrier 131 through the screw seat of the transmission group 133 The circuit board 134 and the teleconductor 135 on it are displaced upward in the Z direction, so that the probe 1351 of the teleconductor 135 electrically contacts the contact 232 of the electronic component 23 to supply power, and the electronic component 23 is lifted and placed on the rack The bottom surface of the fixture 111 is placed, and the lower half of the electronic component 23 is kept in the first receiving part 1221, so that the luminous body 231 of the electronic component projects light into the tester 112 through the first through hole 1111. After receiving light, the tester 112 transmits a signal to the testing machine, and the testing machine judges the luminous quality of the electronic component 23. However, when testing the electronic component 23, since the second receiving part 1222 of the turntable 122 is located on the mounting device The second through hole 1112 of 111 can hold the next electronic component 25 to be tested.

請參閱第7圖,於完成測試作業後,該電傳機構13係以第二馬達132驅動該傳動組133之螺桿,經傳動組133之螺座帶動載具131及其上之電路板134及電傳座135作Z方向向下位移,令電傳座135之探針1351承置電子元件23脫離架置具111,並將電子元件23平置於第一承置部件1221內,再使探針1351脫離電子元件23之接點232。 Please refer to FIG. 7, after completing the test operation, the telex mechanism 13 drives the screw of the transmission group 133 with the second motor 132, and drives the carrier 131 and the circuit board 134 and the carrier 131 on the screw seat of the transmission group 133 The teletype base 135 is displaced downward in the Z direction, so that the probe 1351 of the teletype base 135 receives the electronic component 23 from the mounting fixture 111, and the electronic component 23 is placed flat in the first receiving part 1221, and then the probe The pin 1351 is separated from the contact 232 of the electronic component 23.

請參閱第8圖,該載送機構12係以第一馬達121驅動轉盤122旋轉,轉盤122即帶動具已測電子元件23之第一承置部件1221及具待測電子元件25之第二承置部件1222作水平旋轉位移,令第一承置部件1221對位於架置具111之第二通孔1112,以供一移料器24經第二通孔1112於第一承置部件1221取出已測之電子元件23,然該 架置具111亦可開設第三通孔,並令轉盤122之第一承置部件1221對位於第三通孔,以供移料器24經第三通孔而取出已測電子元件23,而於不同位置執行上料及下料。 Please refer to FIG. 8, the carrying mechanism 12 uses a first motor 121 to drive a turntable 122 to rotate. The turntable 122 drives the first receiving part 1221 with the electronic component 23 under test and the second bearing with the electronic component 25 under test The positioning member 1222 horizontally rotates and displaces, so that the first receiving member 1221 faces the second through hole 1112 of the mounting fixture 111, so that a feeder 24 can be taken out of the first receiving member 1221 through the second through hole 1112. Measured electronic components 23, but the The mounting tool 111 can also open a third through-hole, and the first receiving part 1221 of the turntable 122 is located in the third through-hole, so that the feeder 24 can take out the tested electronic component 23 through the third through-hole, and Perform loading and unloading at different positions.

請參閱第1至4圖及第9圖,係本發明測試裝置10應用於電子元件測試分類機之示意圖,該測試分類機係於機台30上配置有供料裝置40、收料裝置50、測試裝置10、輸送裝置60及中央控制裝置(圖未示出);該供料裝置40係裝配於機台30,並設有至少一為供料盤之供料承置器41,用以容納至少一待測之電子元件;該收料裝置50係裝配於機台30,並設有至少一為收料盤之收料承置器51,用以容納至少一已測之電子元件;該測試裝置10係裝配於機台30,並設有測試機構11、載送機構12及電傳機構13,以執行電子元件測試作業;該輸送裝置60係裝配於機台30上,並設有至少一移載電子元件之移料單元,於本實施例中,該輸送裝置60係設有第一移料單元61,以於供料裝置40之供料承置器41取出待測之電子元件,並移載至至少一入料載台62,該入料載台62係作線性位移或旋轉位移,於本實施例中,該入料載台62係設有複數個承置電子元件之入料承置槽621,並作旋轉位移,以供第一移料單元61移入待測之電子元件,一第二移料單元63係設有第一拾取器631及第二拾取器632,並以第一拾取器631及第二拾取器632作線性位移而於入料載台62、一第一校正器64及測試裝置10間移載待測之電子元件,該第一校正器64係承置電子元件,並校正調整電子元件之擺置角度,以及檢知電子元件是否平置於第一校正器64,該第一拾取器631係將入料載台62之待測電子元件移載至第一校正器64,該第二拾取器632則將第一校正器64之待測電子元件移入測試裝置10,該測試裝置10係對電子元件執行測試作業,於測試完畢後,一第三移料單元65係設有第三拾取器651及第四拾取器652,並以第三拾取器651及第四拾取器652作線性位移 而於測試裝置10、一第二校正器66及一出料載台67間移載已測之電子元件,該第二校正器66係承置電子元件,並校正調整電子元件之擺置角度,以及檢知電子元件是否平置於第二校正器66,該出料載台67係作線性位移或旋轉位移,於本實施例中,該出料載台67係設有複數個承置電子元件之出料承置槽671,並作旋轉位移,該第三拾取器651係將測試裝置10之已測電子元件移載至第二校正器66,該第四拾取器652則將第二校正器66之已測電子元件移載至出料載台67,一第四移料單元68係於出料載台67取出已測之電子元件,並依據測試結果,將已測之電子元件輸送至收料裝置50之收料承置器51處而分類收置;該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 Please refer to FIG. 1 to FIG. 4 and FIG. 9, which is a schematic diagram of the test device 10 of the present invention applied to an electronic component test sorter. The test sorter is equipped with a feeding device 40 and a receiving device 50 on a machine 30. Testing device 10, conveying device 60 and central control device (not shown in the figure); the feeding device 40 is assembled on the machine table 30, and is provided with at least one feeding holder 41 which is a feeding tray for accommodating At least one electronic component to be tested; the receiving device 50 is mounted on the machine 30 and is provided with at least one receiving receptacle 51 as a receiving tray for accommodating at least one tested electronic component; the test The device 10 is assembled on the machine 30, and is provided with a testing mechanism 11, a carrying mechanism 12 and a telex mechanism 13 to perform electronic component testing operations; the conveying device 60 is assembled on the machine 30 and is provided with at least one A material transfer unit that transfers electronic components. In this embodiment, the conveying device 60 is provided with a first material transfer unit 61 to take out the electronic components to be tested from the feed holder 41 of the feed device 40, and It is transferred to at least one feed carrier 62, which is used for linear displacement or rotational displacement. In this embodiment, the feed carrier 62 is provided with a plurality of feed carriers for receiving electronic components The groove 621 is placed and rotated to allow the first material transfer unit 61 to move into the electronic component to be measured. A second material transfer unit 63 is provided with a first picker 631 and a second picker 632, and The picker 631 and the second picker 632 are linearly displaced to transfer the electronic components to be tested between the loading stage 62, a first corrector 64, and the testing device 10, and the first corrector 64 supports the electronic components , And calibrate and adjust the placement angle of the electronic components, and detect whether the electronic components lie flat on the first corrector 64, and the first picker 631 transfers the electronic components to be tested on the loading stage 62 to the first calibration 64, the second picker 632 moves the electronic component to be tested of the first corrector 64 into the test device 10, the test device 10 performs a test operation on the electronic component, after the test is completed, a third material removal unit 65 The third picker 651 and the fourth picker 652 are provided, and the third picker 651 and the fourth picker 652 are used for linear displacement The measured electronic components are transferred between the testing device 10, a second corrector 66, and a discharge stage 67. The second corrector 66 supports the electronic components and corrects and adjusts the placement angle of the electronic components. And detect whether the electronic component is placed flat on the second corrector 66, and the discharge carrier 67 is linearly or rotationally displaced. In this embodiment, the discharge carrier 67 is provided with a plurality of receiving electronic components The discharge receiving groove 671 is rotated and displaced. The third picker 651 transfers the measured electronic components of the testing device 10 to the second corrector 66, and the fourth picker 652 transfers the second corrector The measured electronic components of 66 are transferred to the discharge stage 67. A fourth material removal unit 68 takes out the measured electronic components from the discharge stage 67, and according to the test results, sends the measured electronic components to the receiving station The receiving device 51 of the feeding device 50 is sorted and stored; the central control device is used to control and integrate the actions of each device to perform automated operations, so as to achieve the practical benefits of improving operating efficiency.

10‧‧‧測試裝置 10‧‧‧Test device

11‧‧‧測試機構 11‧‧‧ Testing organization

111‧‧‧架置具 111‧‧‧Mounting tool

112‧‧‧測試器 112‧‧‧Tester

12‧‧‧載送機構 12‧‧‧Carrier

121‧‧‧第一馬達 121‧‧‧ First Motor

122‧‧‧轉盤 122‧‧‧Turntable

13‧‧‧電傳機構 13‧‧‧ Telex agency

131‧‧‧載具 131‧‧‧vehicle

132‧‧‧第二馬達 132‧‧‧Second motor

133‧‧‧傳動組 133‧‧‧ transmission group

134‧‧‧電路板 134‧‧‧ circuit board

135‧‧‧電傳座 135‧‧‧Telephone Block

1361‧‧‧移動件 1361‧‧‧Mobile

1362‧‧‧固定板 1362‧‧‧Fixed board

1363‧‧‧滑軌組 1363‧‧‧Slide rail set

1364‧‧‧支撐架 1364‧‧‧support frame

1365‧‧‧壓缸 1365‧‧‧Press cylinder

1366‧‧‧第一限位件 1366‧‧‧First limit piece

14‧‧‧檢知機構 14‧‧‧ Inquiry agency

141‧‧‧貼接座 141‧‧‧Patch

143‧‧‧本體 143‧‧‧Body

145‧‧‧作動件 145‧‧‧Actuator

21‧‧‧機台 21‧‧‧machine

22‧‧‧測試機 22‧‧‧Test machine

Claims (10)

一種電子元件測試裝置,包含:測試機構:係設有至少一架置具,該架置具開設至少一第一通孔,該至少一第一通孔上方裝配測試器;載送機構:係設有至少一載送驅動源,以及至少一由該載送驅動源驅動旋轉之轉盤,該轉盤係設有至少一承置電子元件且位於該第一通孔下方之第一承置部件;電傳機構:係於該測試機構之第一通孔下方設有至少一載具,該載具係裝配至少一電傳器,該電傳器係設有至少一電性接觸電子元件之傳輸件;檢知機構:係設有至少一具抽氣部件之貼接座,以抽吸承置於該轉盤之電子元件,該轉盤能旋轉帶動該第一承置部件相對該貼接座移動。 An electronic component testing device includes: a testing mechanism: at least one mounting tool is provided, the mounting tool is provided with at least one first through hole, and a tester is assembled above the at least one first through hole; There is at least one carrying drive source, and at least one turntable driven and rotated by the carrying drive source, the turntable is provided with at least one first receiving part that receives electronic components and is located below the first through hole; Mechanism: At least one carrier is provided under the first through hole of the test mechanism, the carrier is equipped with at least one telex, and the telex is provided with at least one transmission element that electrically contacts the electronic component; Knowing mechanism: It is provided with at least one attaching seat with a suction component to suck the electronic components placed on the turntable. The turntable can rotate and drive the first receiving member to move relative to the attaching base. 依申請專利範圍第1項所述之電子元件測試裝置,其中,該測試機構係於該架置具設有該第一通孔及第二通孔,該載送機構之轉盤係設有該第一承置部件及第二承置部件。 The electronic component testing device according to item 1 of the patent application scope, wherein the testing mechanism is provided with the first through hole and the second through hole on the mounting device, and the turntable of the carrying mechanism is provided with the first A bearing component and a second bearing component. 依申請專利範圍第2項所述之電子元件測試裝置,其中,該檢知機構係於該轉盤之第二承置部件下方配置該貼接座。 The electronic component testing device according to item 2 of the patent application scope, wherein the detection mechanism is configured with the attaching base under the second receiving part of the turntable. 依申請專利範圍第3項所述之電子元件測試裝置,其中,該檢知機構之貼接座係裝配於浮動器而作浮動位移。 The electronic component testing device according to item 3 of the patent application scope, wherein the attachment base of the detection mechanism is mounted on the float for floating displacement. 依申請專利範圍第1或3項所述之電子元件測試裝置,其中,該電傳機構之載具係為固定式或移動式。 The electronic component testing device according to item 1 or 3 of the patent application scope, wherein the carrier of the teletype mechanism is fixed or mobile. 依申請專利範圍第5項所述之電子元件測試裝置,其中,該電傳機構係設有電傳驅動源驅動該載具作第一方向位移。 The electronic component testing device according to item 5 of the patent application scope, wherein the teletype mechanism is provided with a teletype drive source to drive the carrier for displacement in the first direction. 依申請專利範圍第6項所述之電子元件測試裝置,其中,該電傳機構係設有至少一換位單元,以承載該載具作水平位移。 The electronic component testing device according to item 6 of the patent application scope, wherein the teletype mechanism is provided with at least one transposition unit to carry the carrier for horizontal displacement. 依申請專利範圍第7項所述之電子元件測試裝置,其中,該 電傳機構之換位單元係設有承置該電傳驅動源之移動件,另於固定板上設有支撐架,該支撐架設置至少一限位該移動件外移之第一限位器,並設有至少一限位該移動件內移之第二限位器。 The electronic component testing device according to item 7 of the patent application scope, wherein The transposition unit of the teletype mechanism is provided with a moving part supporting the teletype drive source, and a supporting frame is provided on the fixing plate, and the supporting frame is provided with at least a first stopper which limits the outward movement of the mobile part At least one second limiter is provided to limit the movement of the moving part. 一種應用電子元件測試裝置之測試分類機,包含:機台;供料裝置:係配置於該機台上,並設有至少一供料承置器,用以容納至少一待測之電子元件;收料裝置:係配置於該機台上,並設有至少一收料承置器,用以容納至少一已測之電子元件;至少一依申請專利範圍第1項所述之電子元件測試裝置:係配置於該機台上,以對電子元件執行測試作業;輸送裝置:係配置於該機台上,並設有至少一移載電子元件之移料單元;中央控制裝置:係用以控制及整合各裝置作動,以執行自動化作業。 A test sorting machine using an electronic component testing device, comprising: a machine; a feeding device: it is arranged on the machine and is provided with at least one feeding holder for accommodating at least one electronic component to be tested; Receiving device: It is arranged on the machine and is equipped with at least one receiving receiver for accommodating at least one tested electronic component; at least one electronic component testing device according to item 1 of the scope of patent application : It is configured on the machine to perform test operations on electronic components; Conveying device: It is arranged on the machine and is equipped with at least one material transfer unit for transferring electronic components; Central control device: It is used to control And integrate actions of various devices to perform automated operations. 依申請專利範圍第9項所述之應用電子元件測試裝置之測試分類機,其中,該輸送裝置係設有一於該供料裝置及至少一入料載台之間移載電子元件的第一移料單元,一第二移料單元係於該入料載台、第一校正器及該測試裝置之間移載電子元件,一第三移料單元係於該測試裝置、第二校正器及至少一出料載台之間移載電子元件,一第四移料單元係於該出料載台及該收料裝置之間移載電子元件。 The test sorting machine using an electronic component testing device as described in item 9 of the patent application scope, wherein the conveying device is provided with a first shifter for transferring electronic components between the feeding device and at least one feed carrier Material unit, a second material transfer unit is used to transfer electronic components between the material input stage, the first calibrator and the test device, and a third material transfer unit is provided between the test device, the second calibrator and at least Electronic components are transferred between a discharge carrier, and a fourth material transfer unit is used to transfer electronic components between the discharge carrier and the receiving device.
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