TWI661900B - 磨削裝置及矩形基板之磨削方法 - Google Patents

磨削裝置及矩形基板之磨削方法 Download PDF

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Publication number
TWI661900B
TWI661900B TW104112096A TW104112096A TWI661900B TW I661900 B TWI661900 B TW I661900B TW 104112096 A TW104112096 A TW 104112096A TW 104112096 A TW104112096 A TW 104112096A TW I661900 B TWI661900 B TW I661900B
Authority
TW
Taiwan
Prior art keywords
grinding
rectangular substrate
work clamp
assembly
wheel
Prior art date
Application number
TW104112096A
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English (en)
Chinese (zh)
Other versions
TW201600246A (zh
Inventor
山中聰
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201600246A publication Critical patent/TW201600246A/zh
Application granted granted Critical
Publication of TWI661900B publication Critical patent/TWI661900B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/30—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/07—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table
TW104112096A 2014-05-28 2015-04-15 磨削裝置及矩形基板之磨削方法 TWI661900B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-110055 2014-05-28
JP2014110055A JP6305212B2 (ja) 2014-05-28 2014-05-28 研削装置及び矩形基板の研削方法

Publications (2)

Publication Number Publication Date
TW201600246A TW201600246A (zh) 2016-01-01
TWI661900B true TWI661900B (zh) 2019-06-11

Family

ID=54840839

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104112096A TWI661900B (zh) 2014-05-28 2015-04-15 磨削裝置及矩形基板之磨削方法

Country Status (4)

Country Link
JP (1) JP6305212B2 (ko)
KR (1) KR102185238B1 (ko)
CN (1) CN105312974B (ko)
TW (1) TWI661900B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106392795A (zh) * 2016-05-20 2017-02-15 天能电池(芜湖)有限公司 蓄电池滚刷机
CN107775470A (zh) * 2017-06-19 2018-03-09 义乌市摩亚光电科技有限公司 一种等距矩形钢条的加工打磨装置
CN107225452A (zh) * 2017-07-11 2017-10-03 合肥柴阁信息科技有限公司 一种计算机制造用板材打磨装置
JP7216476B2 (ja) * 2018-01-15 2023-02-01 株式会社ディスコ 板状ワークの研削方法
JP7193969B2 (ja) * 2018-10-03 2022-12-21 株式会社ディスコ 矩形基板の研削方法
CN109623541B (zh) * 2018-10-16 2020-07-17 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） Bga封装器件焊球去除设备及其方法
CN109531317B (zh) * 2019-01-21 2023-09-01 北京惠点信元科技有限公司 机械臂式全自动六面木板砂光机
JP7312077B2 (ja) * 2019-10-02 2023-07-20 株式会社ディスコ 板状ワークの研削方法
CN112548727B (zh) * 2020-12-07 2022-05-17 西安埃森克建筑科技有限公司 一种塑料板材表面的批量处理打磨装置
CN112792637A (zh) * 2021-01-15 2021-05-14 重庆仟知佳科技有限公司 一种建筑材料加工用的抛光机床
CN116652747B (zh) * 2023-08-02 2023-10-10 广州适居家具有限公司 一种家具生产用打磨装置及其操作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200303851A (en) * 2002-01-31 2003-09-16 Shinetsu Chemical Co Large-sized substrate and method of producing the same
JP2003340787A (ja) * 2002-05-21 2003-12-02 Towa Corp 基板の固定装置及び固定方法
TW201309415A (zh) * 2011-08-18 2013-03-01 Chinwin Technology Co Ltd 玻璃基板表面處理方法
TW201405645A (zh) * 2012-07-25 2014-02-01 Disco Corp 封裝基板之加工方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09290357A (ja) * 1996-04-25 1997-11-11 Yotaro Hatamura 板状体の研削方法及びその装置
JP2006303274A (ja) 2005-04-22 2006-11-02 Nikon Corp 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
JP5064102B2 (ja) 2007-04-27 2012-10-31 株式会社ディスコ 基板の研削加工方法および研削加工装置
JP5428171B2 (ja) * 2008-03-12 2014-02-26 東ソー株式会社 研磨方法
JP5005605B2 (ja) 2008-04-08 2012-08-22 株式会社ディスコ パッケージ基板の切削方法
JP2010272639A (ja) * 2009-05-20 2010-12-02 Disco Abrasive Syst Ltd 研削装置
WO2010140595A1 (ja) * 2009-06-04 2010-12-09 旭硝子株式会社 板状体の研磨方法
JP2011192781A (ja) 2010-03-15 2011-09-29 Disco Corp パッケージ基板の加工方法
JP5500248B2 (ja) * 2010-09-24 2014-05-21 パナソニック株式会社 レーザ加工装置
JP6049170B2 (ja) * 2012-08-17 2016-12-21 株式会社ディスコ 研削方法
JP6205182B2 (ja) 2013-06-11 2017-09-27 株式会社ディスコ スピンナーユニット及び研削洗浄方法
CN203650346U (zh) * 2014-01-09 2014-06-18 成都四威高科技产业园有限公司 一种机械加工真空吸盘

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200303851A (en) * 2002-01-31 2003-09-16 Shinetsu Chemical Co Large-sized substrate and method of producing the same
JP2003340787A (ja) * 2002-05-21 2003-12-02 Towa Corp 基板の固定装置及び固定方法
TW201309415A (zh) * 2011-08-18 2013-03-01 Chinwin Technology Co Ltd 玻璃基板表面處理方法
TW201405645A (zh) * 2012-07-25 2014-02-01 Disco Corp 封裝基板之加工方法

Also Published As

Publication number Publication date
KR20150136996A (ko) 2015-12-08
CN105312974B (zh) 2019-05-31
KR102185238B1 (ko) 2020-12-01
TW201600246A (zh) 2016-01-01
JP2015223666A (ja) 2015-12-14
JP6305212B2 (ja) 2018-04-04
CN105312974A (zh) 2016-02-10

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