TWI658920B - An additive manufacturing method of fabricating an object on a build stage and a metallic base material having a specific surface chemistry for use in additive manufacturing method - Google Patents
An additive manufacturing method of fabricating an object on a build stage and a metallic base material having a specific surface chemistry for use in additive manufacturing method Download PDFInfo
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- TWI658920B TWI658920B TW105143028A TW105143028A TWI658920B TW I658920 B TWI658920 B TW I658920B TW 105143028 A TW105143028 A TW 105143028A TW 105143028 A TW105143028 A TW 105143028A TW I658920 B TWI658920 B TW I658920B
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- additive manufacturing
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- WKFBZNUBXWCCHG-UHFFFAOYSA-N phosphorus trifluoride Chemical compound FP(F)F WKFBZNUBXWCCHG-UHFFFAOYSA-N 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- SPVXKVOXSXTJOY-UHFFFAOYSA-N selane Chemical compound [SeH2] SPVXKVOXSXTJOY-UHFFFAOYSA-N 0.000 description 1
- 229910000058 selane Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- ZGNPLWZYVAFUNZ-UHFFFAOYSA-N tert-butylphosphane Chemical compound CC(C)(C)P ZGNPLWZYVAFUNZ-UHFFFAOYSA-N 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical class [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 238000006276 transfer reaction Methods 0.000 description 1
- 150000003623 transition metal compounds Chemical class 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- WXRGABKACDFXMG-UHFFFAOYSA-N trimethylborane Chemical compound CB(C)C WXRGABKACDFXMG-UHFFFAOYSA-N 0.000 description 1
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 1
- NXHILIPIEUBEPD-UHFFFAOYSA-H tungsten hexafluoride Chemical compound F[W](F)(F)(F)(F)F NXHILIPIEUBEPD-UHFFFAOYSA-H 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K10/00—Welding or cutting by means of a plasma
- B23K10/02—Plasma welding
- B23K10/027—Welding for purposes other than joining, e.g. build-up welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0046—Welding
- B23K15/0086—Welding welding for purposes other than joining, e.g. built-up welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0046—Welding
- B23K15/0093—Welding characterised by the properties of the materials to be welded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/10—Non-vacuum electron beam-welding or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/126—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of gases chemically reacting with the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
- B23K26/342—Build-up welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/32—Process control of the atmosphere, e.g. composition or pressure in a building chamber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/34—Process control of powder characteristics, e.g. density, oxidation or flowability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/70—Recycling
- B22F10/73—Recycling of powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/10—Auxiliary heating means
- B22F12/13—Auxiliary heating means to preheat the material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/10—Auxiliary heating means
- B22F12/17—Auxiliary heating means to heat the build chamber or platform
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/307—Handling of material to be used in additive manufacturing
- B29C64/314—Preparation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
本發明係關於適用於執行加法製造程序之方法與裝置及其所產生之產品,並且特別地,關於使用一能量束以選擇性地熔融一基材以產生一物件之加法製造程序。更特別地,本發明係關於使用反應性流體之方法與系統,以在加法製造程序之前、期間及/或之後而主動操作基材之表面化學性。 The present invention relates to a method and apparatus suitable for performing an additive manufacturing process and products produced therefrom, and in particular, to an additive manufacturing process using an energy beam to selectively fuse a substrate to produce an object. More specifically, the present invention relates to methods and systems for using reactive fluids to actively manipulate the surface chemistry of a substrate before, during, and / or after an additive manufacturing process.
Description
本發明係主張於2015年12月28日申請之美國臨時申請案No.62/271,901之優先權。 This application claims priority from US Provisional Application No. 62 / 271,901, filed on December 28, 2015.
本發明係關於可執行加法製造(additive manufacturing,AM)程序之方法與裝置及其所產生的產品,並且特別關於使用一能量束以選擇性地熔化一材料以產生一物件之加法製造程序。更特別地,本發明係關於方法與系統,其係使用反應性流體以在該加法製造程序之前及/或期間而主動操作一材料之表面。 The present invention relates to a method and apparatus capable of performing additive manufacturing (AM) procedures and products produced by the same, and more particularly to an additive manufacturing procedure using an energy beam to selectively melt a material to produce an object. More particularly, the invention relates to methods and systems that use a reactive fluid to actively manipulate the surface of a material before and / or during the additive manufacturing process.
加法製造程序(或稱積層製造),亦稱為三維列印,係為一種已被建立但仍在成熟中的技術。在其廣泛定義中,加法製造程序關涉一三維物件的製造,其係經由連續層材料之沉積以作成一淨形(net shape)或近淨形(near net shape,NNS)。加法製造涵蓋已知多種名稱之多種製造及原型技術,包含自由成形製造(freeform fabrication)、3D列印、快速原型/模具(rapid prototyping/tooling)等等。加法製造技術係可從多樣化材料製造複雜構件。 Additive manufacturing process (also known as multilayer manufacturing), also known as 3D printing, is a technology that has been established but is still mature. In its broad definition, the additive manufacturing process relates to the manufacture of a three-dimensional object, which is deposited into a net shape or near net shape (NNS) through the deposition of continuous layers of material. Additive manufacturing covers a variety of manufacturing and prototyping technologies known by many names, including freeform fabrication, 3D printing, rapid prototyping / tooling, and more. Additive manufacturing technology can manufacture complex components from a variety of materials.
當大量的加法製造程序在現在是可用的情況下,一種特別的加法製造程序係使用一能量束(例如一電子束或電磁輻射例如一雷射束),以燒結或熔化一材料(例如一粉末、柱體、線或流體,以創造一固體三維 物件,其中粉末材料之粒子係連結一起。最常被使用在粉末材料之方法係為電子束熔化(electron-beam melting,EBM)、選擇性雷射熔化(selective laser melting,SLM)或直接金屬雷射燒結(direct metal laser sintering,DMLS)、選擇性雷射燒結(selective laser sintering,SLS)、熔融沉積成型(fused deposition modeling,FDM)、熔絲製造(fused filament fabrication,FFF)、或粉末層噴頭3D列印(powder bed and inkjet head 3D printing,3DP),這些粉末層程序於此係統稱為雷射粉末沉積或雷射加法製造(laser additive manufacturing(LAM))。選擇性雷射燒結係為一顯著的加法製造程序並可藉由使用一雷射束來燒結或熔化一細小粉末而達到功能原型及模具的快速製造。更精確的說,燒結需要在低於粉末材料之熔點之一溫度熔融(附聚(agglomerating))粉末之粒子,但熔化需要完全熔化粉末之粒子以形成一固體同質塊(solid homogeneous mass)。關於雷射燒結或雷射熔化之具體程序係包含熱轉移至一粉末材料以及之後的燒結或熔化該粉末材料。雖然雷射燒結及熔化程序可被應用於廣泛的粉末材料,但尚未完整了解生產程序之科學與技術方面,例如燒結或熔化速率以及處理參數在層製造過程期間對微結構進展的影響。此製造方法係伴隨多種熱、質量及動量轉移的模式以及發生在粉末表面上且使處理更複雜的化學反應。 While a large number of additive manufacturing processes are now available, a special additive manufacturing process uses an energy beam (such as an electron beam or electromagnetic radiation such as a laser beam) to sinter or melt a material (such as a powder , Cylinder, line, or fluid to create a solid three-dimensional Objects in which particles of powder material are linked together. The most commonly used methods for powder materials are electron-beam melting (EBM), selective laser melting (SLM) or direct metal laser sintering (DMLS), Selective laser sintering (SLS), fused deposition modeling (FDM), fused filament fabrication (FFF), or powder bed and inkjet head 3D printing 3DP), these powder layer procedures are referred to in this system as laser powder deposition or laser additive manufacturing (LAM). Selective laser sintering is a significant additive manufacturing process and enables rapid manufacturing of functional prototypes and molds by using a laser beam to sinter or melt a fine powder. More precisely, sintering requires melting (agglomerating) particles of the powder at a temperature below the melting point of the powder material, but melting requires completely melting the particles of the powder to form a solid homogeneous mass. The specific procedure for laser sintering or laser melting involves thermal transfer to a powder material and subsequent sintering or melting of the powder material. Although laser sintering and melting procedures can be applied to a wide range of powder materials, the scientific and technical aspects of production processes, such as the effects of sintering or melting rates and processing parameters on the progress of microstructures during the layer manufacturing process, have not been fully understood. This manufacturing method is accompanied by multiple modes of heat, mass, and momentum transfer, and chemical reactions that occur on the surface of the powder and complicate the process.
雖然多種雷射加法製造形式為製造及修復複雜物件帶來高潛力,但它們受限於存在於粉末材料使用的某些缺點。其中一缺點係關於粉末材料表面與空氣中的元素如氧氣及氮氣之間的反應性。當粉末材料包含反應性金屬如鐵、鋁及鈦時,該些金屬粒子的表面會與氣體反應而於最後產品中形成微結構缺點(例如空隙、雜質或內含物)。這樣的缺點會導致災難性的失敗。該等雜質包含金屬氧化物以及金屬氮化物,並且這些缺點,無論是雜質、空隙或內含物,其比例會隨著粉末材料之表面面積增加而增加。 Although multiple laser additive manufacturing forms have high potential for manufacturing and repairing complex objects, they are limited by certain disadvantages that exist in the use of powder materials. One of the disadvantages is related to the reactivity of the surface of the powder material with elements in the air such as oxygen and nitrogen. When the powder material contains reactive metals such as iron, aluminum, and titanium, the surfaces of these metal particles can react with the gas to form microstructural defects (such as voids, impurities, or inclusions) in the final product. Such shortcomings can lead to catastrophic failure. These impurities include metal oxides and metal nitrides, and these disadvantages, whether they are impurities, voids or inclusions, their proportions will increase as the surface area of the powder material increases.
在過去,粉末材料已經被形成於低含氧環境以減少不必要的化學反應;然而,在惰性氣體環境中之低含氧粉末材料之操作,從粉末生產到在加法製造程序中實際的使用,係使粉末生產、粉末尺寸的分類、傳送及安全性需求的成本增加,這是由於低含氧金屬粉末的高爆炸特性使 然。不幸地,氧化物或其他雜質在未被如此處理之粉末材料表面上的存在妨礙了用於製造金屬產品之粉末的附著,藉此使製成產品的機械特性下降。在程序中溫度梯度所導致之具有較多/較大細孔與無序的粒排列之粒結構(grain structure)亦造成製成產品中的殘餘應力。 In the past, powder materials have been formed in low-oxygen environments to reduce unnecessary chemical reactions; however, the operation of low-oxygen powder materials in inert gas environments, from powder production to actual use in additive manufacturing processes, This increases the cost of powder production, powder size classification, delivery, and safety requirements. This is due to the high explosive properties of low oxygen metal powders. Of course. Unfortunately, the presence of oxides or other impurities on the surface of the powder material that is not so treated prevents the adhesion of the powder used to make the metal product, thereby reducing the mechanical properties of the finished product. The grain structure with more / larger pores and disordered grain arrangement caused by temperature gradient in the procedure also causes residual stress in the finished product.
粉末材料亦容易吸收濕氣,濕氣係在金屬粉末的例子中導致金屬氧化物的形成,亦容易導致不需要的多孔性在藉由雷射粉末沉積而形成之金屬物件中。對高強度的鋼而言,濕氣亦為氫的來源,其係形成在粉末表面及製成產品中而導致後來的裂縫或氫脆化(hydrogen embrittlement)。 Powder materials also easily absorb moisture, which in the case of metal powders leads to the formation of metal oxides, and also easily causes unwanted porosity in metal objects formed by laser powder deposition. For high-strength steel, moisture is also a source of hydrogen, which is formed on the surface of the powder and in the finished product, causing subsequent cracks or hydrogen embrittlement.
為進一步緩和空氣與濕氣在粉末材料上之有害的影響,由雷射粉末沉積所產生之熔化池係常藉由應用一鈍氣如氬氣與氦氣而被防護。然而,這樣的防護不能移除已存在的氧化物,其係容易在製造、儲存與操作的期間形成於材料粉末的外面。結果,這些被氧化物包覆之金屬填充料必需常在熔化程序期間進行還原以避免多孔性與其他在生成金屬沉積中的缺點。後沉積處理例如熱等靜壓(hot isostatic pressing,HIP)亦常被使用來萎陷細孔(空隙)、內含物與裂縫,以改善雷射沉積金屬之性質。為避免濕氣吸收,亦常將金屬粉末填充料儲存在預先加熱之料斗。這樣的保護及後處理方法對於包含高度反應性金屬(例如超合金)之金屬粉末以及具有高表面面積之細小粉末是相當重要的。 To further mitigate the harmful effects of air and moisture on powder materials, the melting pools created by laser powder deposition are often shielded by the use of a passivating gas such as argon and helium. However, such protection cannot remove existing oxides, which are easily formed outside the material powder during manufacturing, storage, and handling. As a result, these oxide-clad metal fillers must often be reduced during the melting process to avoid porosity and other disadvantages in forming metal deposits. Post-deposition processes such as hot isostatic pressing (HIP) are also often used to collapse pores (voids), inclusions and cracks to improve the properties of laser deposited metals. To avoid moisture absorption, metal powder fillers are often stored in pre-heated hoppers. Such protection and post-treatment methods are important for metal powders containing highly reactive metals (such as superalloys) and fine powders with high surface areas.
另一方面,減輕空氣之有害影響之其他技術係藉由使用一助熔劑與粉末材料而嘗試防護由雷射粉末沉積所產生之熔化池以去除雜質。請參照美國專利申請案US 2013/0136868。助熔劑避免製成產品與空氣中的氣體反應,例如是屏蔽氣體或上面討論過的氣體混合物;然而,助熔劑係為一固體材料且有時會被加入至製成的材料中。 On the other hand, other techniques to mitigate the harmful effects of air have attempted to protect the melting pool generated by the deposition of laser powder to remove impurities by using a flux and powder materials. Please refer to US patent application US 2013/0136868. Fluxes avoid the reaction of the finished product with the gas in the air, such as shielding gases or the gas mixtures discussed above; however, the flux is a solid material and is sometimes added to the manufactured material.
預先處理使用於一些加法製造程序中之原生粉末材料是常常必需的。預先處理可包含塗佈、除氣以及加熱粉末。除氣可用來去除粉末粒子之水汽。當曝露在環境中時,粉末表面可在製造過程中非常快速的被氧化。水汽可被吸收於氣化物內,其係可產生空隙於藉由加法製造程序所形成之材料中。去除所製造材料之水分之方法可造成氫氣的形成,其會使最終材料更脆。前面去除粉末之水汽的方法係包含多種除氣方法。舉例 來說,中國專利CN105593185A係描述藉由使用氫大氣而產生低含氧金屬鈦粉末之一種方法及氫脆化。然而,避免與氧進行反應係導致安全運送/操作的複雜性,這是因為低含氧金屬粉末係具高爆炸性。 Pre-treatment of virgin powder materials used in some additive manufacturing processes is often necessary. Pre-treatment may include coating, degassing, and heating the powder. Degassing can be used to remove moisture from powder particles. When exposed to the environment, the powder surface can be oxidized very quickly during the manufacturing process. Water vapor can be absorbed in the gaseous material, which can create voids in the material formed by the additive manufacturing process. The method of removing moisture from the manufactured material can cause the formation of hydrogen, which makes the final material more brittle. The previous methods for removing water vapor from the powder include a variety of degassing methods. For example In other words, Chinese patent CN105593185A describes a method for generating titanium oxide powder with low oxygen content by using hydrogen atmosphere and hydrogen embrittlement. However, avoiding the reaction system with oxygen leads to the complexity of safe transportation / operation because the low-oxygen metal powder system is highly explosive.
此外,習知方法係在利用金屬氧化物糊料進行製造之後,在足以進行還原反應之高溫下使用氫氣以還原大量金屬氧化物,請參照美國專利申請案US 2013/0136868,其亦被找到不足之處,即由於氣體難以侵入及擴散,在製成產品內還原氧化物是困難的。氣體之高溫熱處理係可造成不需要之粉末的燒結。 In addition, the conventional method uses hydrogen oxide to reduce a large amount of metal oxides at a high temperature sufficient to perform a reduction reaction after manufacturing using metal oxide pastes. Please refer to US patent application US 2013/0136868, which has also been found to be insufficient. Where the gas is difficult to invade and diffuse, it is difficult to reduce the oxide in the finished product. High temperature heat treatment of gases can cause sintering of unwanted powders.
有鑒於上述,可以了解到關於雷射加法製造之一些問題、缺點或不利條件,並且需要改良的方法與設備來生產近淨形物件以終結誤差、及/或具有高品質表面加工、及/或可減少或消除在一完成品中之裂縫、內含物與在沉積層之間的細孔。據此,一種雷射加法製造之系統是需要的,其係可在加法製造程序之前及/或期間藉由引入至少一反應性流體或流體混合物而達到一材料之表面之主動操作,反應性流體或流體混合物係與基材之表面反應,例如但不限於一粉末、電漿、柱體、線或流體,其係被沉積以致被沉積之基材之不同部分可被作成具有不同基材性質。藉由控制/改良/調整基材之表面,製成物件之機械及/或化學性質可藉由基材之表面性質之操作而被強化。 In view of the above, it can be understood that there are some problems, disadvantages or disadvantages of laser additive manufacturing, and improved methods and equipment are needed to produce near-net-shape objects to end errors, and / or have high-quality surface processing, and / or Reduces or eliminates cracks, inclusions, and fine pores between deposited layers in a finished product. Accordingly, a laser additive manufacturing system is needed, which is an active operation that can reach the surface of a material by introducing at least one reactive fluid or fluid mixture before and / or during the additive manufacturing process. Or the fluid mixture reacts with the surface of the substrate, such as, but not limited to, a powder, plasma, cylinder, wire, or fluid, which is deposited such that different portions of the deposited substrate can be made to have different substrate properties. By controlling / improving / adjusting the surface of the substrate, the mechanical and / or chemical properties of the manufactured object can be enhanced by manipulation of the surface properties of the substrate.
本發明係提供一種方法及裝置,其係合適用於加法製造技術,其中一反應性流體係接觸一基材,例如但不限於一粉末、電漿、柱體、線或流體,其中該反應性流體係在施加一能量束之前、期間或之後來調整基材之表面以達到所需的化學性質,該能量束係用來選擇性地燒結(熔融(fuse))或熔化(melt)該基材以產生一3D物件。其中基材包括可藉由反應性流體而被調整至所需化學性之表面之反應性基材,以及具有不與反應性流體反應之表面之不反應性基材,且不反應性基材係選自由固體與流體組成之群組。 The invention provides a method and a device, which are suitable for use in additive manufacturing technology, in which a reactive flow system contacts a substrate, such as, but not limited to, a powder, plasma, cylinder, wire, or fluid, where the reactive The flow system adjusts the surface of the substrate to achieve the desired chemical properties before, during, or after the application of an energy beam, which is used to selectively sinter (fuse) or melt the substrate To create a 3D object. The substrate includes a reactive substrate that can be adjusted to a desired chemical surface by a reactive fluid, and a non-reactive substrate having a surface that does not react with the reactive fluid. From the group consisting of solids and fluids.
依據本發明之一第一方面,基材之表面的化學組成係在加法 製造程序之前、期間及/或之後,藉由引入可與基材之表面進行化學反應之至少一反應性流體或流體混合物而被控制/被改良/被調整。可將包含有氣體混合物的流體取代純淨化氣體(例如氦、氬或氮氣)或在純淨化氣體之外使用於腔室本身內,以及金屬粉末傳送線上、金屬粉末傳送容器內、或使用過之金屬粉末接收器內,而氣體混合物含氫、一氧化碳或其他可化學還原表面氧化物及/或清潔或去除在如固體粉末之材料表面上的雜質之氣體成分。 According to a first aspect of the present invention, the chemical composition of the surface of the substrate is added. Before, during, and / or after the manufacturing process, it is controlled / improved / adjusted by introducing at least one reactive fluid or fluid mixture that can chemically react with the surface of the substrate. A fluid containing a gas mixture can be used instead of a purified gas (such as helium, argon, or nitrogen) or in the chamber itself outside the purified gas, as well as on a metal powder transfer line, in a metal powder transfer container, or used Metal powder receiver, and the gas mixture contains hydrogen, carbon monoxide or other chemically reducing surface oxides and / or gas components that clean or remove impurities on the surface of materials such as solid powders.
本發明係包含藉由一氣體或多氣體所進行之材料的處理,氣體包含氣體混合物,可用以將例如為使用過的金屬粉末回收再利用,使得粉末成本下降。同時,具有較高熱傳導性之該等氣體(例如氦)可被使用作為一淨化氣體或一平衡氣體,其係有效減少溫度梯度所導致之殘餘應力。 The present invention includes the treatment of materials by a gas or multiple gases, and the gas contains a gas mixture, which can be used to recycle, for example, used metal powder, so that the cost of the powder is reduced. At the same time, these gases (such as helium) with higher thermal conductivity can be used as a purge gas or an equilibrium gas, which effectively reduce the residual stress caused by temperature gradients.
本發明可更使用包含氣體混合物之氣體以去除在基材或製成產品中的氫及/或有意地氧化基材之表面。如前所述的,在基材表面上及在製成產品內的氫已知會造成氫脆化。依據本發明,包含具有CO、CO2及/或碳氟化合物之氣體混合物之氣體係被使用來去除氫以增強製成產品之機械強度。 The present invention may further use a gas containing a gas mixture to remove hydrogen from the substrate or manufactured product and / or intentionally oxidize the surface of the substrate. As mentioned earlier, hydrogen on the surface of the substrate and in the finished product is known to cause hydrogen embrittlement. According to the present invention, a gas system comprising a gas mixture with CO, CO 2 and / or fluorocarbons is used to remove hydrogen to enhance the mechanical strength of the finished product.
本發明更考慮包含氣體混合物之氣體之使用以形成氮化物、碳化物、硼化物、磷化物、矽化物或其他化學層於基材之表面上,例如但不限於金屬粉末,以增強製成產品之耐磨損性或耐腐蝕性。 The invention further considers the use of a gas containing a gas mixture to form nitrides, carbides, borides, phosphides, silicides or other chemical layers on the surface of the substrate, such as, but not limited to, metal powders to enhance the finished product Resistance to abrasion or corrosion.
這些氣體之任何組合可被使用以同時形成二元、三元或更高階化合物,例如氮化物與硼化物。 Any combination of these gases can be used to form binary, ternary or higher order compounds simultaneously, such as nitrides and borides.
本發明係更考慮到包含其混合物之氣體/流體可被使用以在加法製造之前、期間及/或之後來改變基材之合金組成。包含揮發有機金屬成分之氣體/流體可被使用藉由化學氣相沉積、原子層沉積或其他程序而將金屬引入或沉積於粉末的表面上,就如其被使用在3D列印程序中。 The present invention further contemplates that the gas / fluid containing its mixture can be used to change the alloy composition of the substrate before, during, and / or after additive manufacturing. Gases / fluids containing volatile organometallic components can be used to introduce or deposit metals onto the surface of the powder by chemical vapor deposition, atomic layer deposition, or other procedures, just as they are used in 3D printing procedures.
本發明更考慮到包含其混合物之反應性流體的使用係理想地合適於與獨立雷射切割程序一併使用或是與雷射切割程序結合加法製造程序一併使用。在此例子中,本發明係考慮到一製成物件可經由一雷射之使用而進一步被塑形,該雷射係藉由熔化、燃燒或汽化基材而進行切割。 在該切割之後及/或期間,該製成物件之表面可被曝露於反應性流體及/或其混合物,使得製成物件之整個表面具有同樣所需的化學性。 The present invention further contemplates that the use of a reactive fluid containing a mixture thereof is ideally suitable for use with an independent laser cutting process or in combination with a laser cutting process and an additive manufacturing process. In this example, the present invention contemplates that a manufactured object can be further shaped by the use of a laser, which is cut by melting, burning, or vaporizing a substrate. After and / or during the cutting, the surface of the finished article may be exposed to a reactive fluid and / or mixture thereof such that the entire surface of the finished article has the same required chemistry.
本發明之一技術功效係為改善機械性質之能力,例如由雷射加法製造所製成的金屬產品具有更高的耐磨損性、更高的耐腐蝕性、更高的機械強度以及較低的殘餘應力。在不希望受限於任何特定的理論之下,相信製成產品之機械及/或化學性質係依賴化學組成與製成產品之基質及表面的粒結構以及使用於程序中的基材。氧化物或其他雜質在基材表面的存在妨礙了用於製造產品之基材的附著,其係降低製成產品之機械性質。在程序中溫度梯度所導致之具有較多/較大細孔與不規則粒排列之粒結構亦造成在製成產品中的殘餘應力。 One of the technical effects of the present invention is the ability to improve mechanical properties. For example, metal products made by laser addition have higher wear resistance, higher corrosion resistance, higher mechanical strength, and lower Residual stress. Without wishing to be bound by any particular theory, it is believed that the mechanical and / or chemical properties of the finished product depend on the chemical composition and the granular structure of the matrix and surface of the manufactured product and the substrate used in the process. The presence of oxides or other impurities on the surface of the substrate prevents the adhesion of the substrate used to make the product, which reduces the mechanical properties of the finished product. The granular structure with more / larger pores and irregular grains caused by temperature gradient in the procedure also causes residual stress in the finished product.
其他的實施例與特徵係呈現於以下說明,並且對於本領域具有通常知識者而言,在研究本說明書後可某種程度上了解這些實施例及技術特徵,或者可藉由揭露實施例之實施而被學習到。所揭露實施例之特徵與有利條件可藉由描述於說明書中之工具、組合與方法而被理解與達到。 Other embodiments and features are presented in the following description, and for those with ordinary knowledge in the art, after studying this specification, they can understand these embodiments and technical features to some extent, or they can be implemented by disclosing the embodiments And learned. The features and advantages of the disclosed embodiments can be understood and achieved through the tools, combinations, and methods described in the specification.
10、210、310‧‧‧加法製造裝置 10, 210, 310‧‧‧ Additive manufacturing device
30、230、330‧‧‧資料檔 30, 230, 330‧‧‧ data files
40、240、340‧‧‧控制器 40, 240, 340‧‧‧ Controller
42、44‧‧‧控制訊號 42, 44‧‧‧ control signal
50、250、350‧‧‧能量產生系統 50, 250, 350‧‧‧‧ energy generation systems
60、60’、60”、260、260’、260”‧‧‧反應性流體 60, 60 ’, 60”, 260, 260 ’, 260” ‧‧‧ reactive fluid
70、270‧‧‧基材 70, 270‧‧‧ substrate
80、280、380‧‧‧惰性氣體 80, 280, 380‧‧‧ inert gas
90、290、390‧‧‧物件 90, 290, 390‧‧‧ objects
100、200、300‧‧‧建立腔室 100, 200, 300‧‧‧ Establish chambers
272‧‧‧供應線 272‧‧‧Supply Line
370、370’、370”‧‧‧反應性流體/基材 370, 370 ’, 370” ‧‧‧ reactive fluid / substrate
本發明之特徵及優勢可藉由參照本說明書的其餘部分與圖式而得到進一步的理解。 The features and advantages of the present invention can be further understood by referring to the rest of the description and the drawings.
圖1係為涵蓋本發明一方面之一加法製造裝置的示意圖,其中反應性流體與基材係在建立腔室內相互接觸。 FIG. 1 is a schematic diagram of an additive manufacturing apparatus covering one aspect of the present invention, in which a reactive fluid and a substrate are in contact with each other in a building chamber.
圖2係為涵蓋本發明一方面之一加法製造裝置的示意圖,其中反應性流體與基材係在進入建立腔室之前相互接觸。 FIG. 2 is a schematic diagram of an additive manufacturing apparatus covering one aspect of the present invention, wherein the reactive fluid and the substrate are in contact with each other before entering the establishment chamber.
圖3係為涵蓋本發明一方面之一加法製造裝置的示意圖,其中反應性流體與基材儲存在相同容器內且在進入建立腔室之前相互接觸。 FIG. 3 is a schematic diagram of an additive manufacturing apparatus covering one aspect of the present invention, in which a reactive fluid and a substrate are stored in the same container and are in contact with each other before entering the establishment chamber.
在示意圖中,相似的構件及/或特徵可具有相同標號。此外,具相同樣式之多種構件可藉由一底線或一第二標號來區別。假如僅有第一標號呈現於說明書中,其說明對於具有相同第一標號之相似元件是有效的,而與第二標號無關。 In the drawings, similar components and / or features may have the same reference numerals. In addition, multiple components with the same pattern can be distinguished by a bottom line or a second label. If only the first reference number is present in the description, the description is valid for similar elements having the same first reference number, regardless of the second reference number.
以下將參照相關圖式,說明依本發明較佳實施例之一種反應性流體於加法製造中的使用及其製成之產品,其中相同的元件將以相同的參照符號加以說明。 In the following, the use of a reactive fluid according to a preferred embodiment of the present invention in the additive manufacturing and the products made by it will be described with reference to related drawings. The same elements will be described with the same reference symbols.
下面定義係適用於本發明。 The following definitions apply to the invention.
加法製造程序(AM processes)(或稱積層製造)在以下的使用係關於產生一有用、三維物件並包含依序形成該物件之形狀且一次一層之步驟之任何程序。加法製造程序係包含電子束熔化(electron-beam melting,EBM)、選擇性雷射熔化(selective laser melting,SLM)或直接金屬雷射燒結(direct metal laser sintering,DMLS)、直接金屬雷射熔化(direct metal laser melting,DMLM)、選擇性雷射燒結(selective laser sintering,SLS)、熔融沉積成型(fused deposition modeling,FDM)、熔絲製造(fused filament fabrication,FFF)、粉末層噴頭3D列印(powder bed and inkjet head 3D printing,3DP)、雷射淨形製造、直接金屬雷射燒結(DMLS)、電漿移轉式電弧(plasma transferred arc)、自由成形製造(freeform fabrication)等等。一特定型式之加法製造程序係使用一能量束(例如一電子束或電磁輻射例如一雷射束),以燒結或熔化一粉末材料。加法製造程序常使用相對貴的材料,例如但不限於粉末、金屬粉末材料、柱體、流體或線作為一原生材料(raw material)。 The use of additive manufacturing processes (AM processes) in the following is about any process that produces a useful, three-dimensional object and includes steps that sequentially form the shape of the object and one layer at a time. The additive manufacturing process includes electron-beam melting (EBM), selective laser melting (SLM) or direct metal laser sintering (DMLS), and direct metal laser melting (DMLS). direct metal laser melting (DMLM), selective laser sintering (SLS), fused deposition modeling (FDM), fused filament fabrication (FFF), powder layer nozzle 3D printing ( powder bed and inkjet head 3D printing (3DP), laser net shape manufacturing, direct metal laser sintering (DMLS), plasma transferred arc, freeform fabrication, etc. A specific type of additive manufacturing process uses an energy beam (such as an electron beam or electromagnetic radiation such as a laser beam) to sinter or melt a powder material. Additive manufacturing processes often use relatively expensive materials such as, but not limited to, powders, metal powder materials, cylinders, fluids, or wires as a raw material.
為清楚說明,下面敘述雖然係針對金屬粉末但是考慮到任何材料的使用,例如但不限於粉末、柱體、流體或線,因此不應被視為一限制條件。本發明係關於加法製造程序,其為製造物件(物、構件、零件、產品等等)的一種快速方法,其中多重薄單元層係依序形成以生產該物件。更特別地,一金屬粉末之多層係被鋪設且被一能量束(例如雷射束)照射,使得在各層裡之金屬粉末之粒子係依序被燒結(熔熔fused)或熔化(melted)以固化該層或基板。依本發明之一方面,與金屬粉末或多種粉末之表面進行反應之至少一反應性流體或流體混合物係在加法製造程序之前、期間及/或之後被帶入接觸該金屬粉末,以主動操作該粉末材料之表面化學性, 如此粉末材料之表面之化學組成係在加法製造程序之前、期間及/或之後被控制/被改良/被調整。在不使用或在使用純淨化氣體(例如氦、氬或氮)的情況下,包含內含氫、一氧化碳或其他可化學還原表面氧化物及/或清潔或去除固態粉末表面上的雜質之氣體成分之氣體混合物係被使用於建立腔室本身,以及在金屬粉末傳送線上、金屬粉末傳送容器中或使用過金屬粉末接收器中。 For the sake of clarity, the following description is for metal powders, but considers the use of any material, such as but not limited to powders, cylinders, fluids or wires, and should not be considered as a limitation. The present invention relates to an additive manufacturing process, which is a fast method for manufacturing an object (object, component, part, product, etc.), in which multiple thin unit layers are sequentially formed to produce the object. More specifically, multiple layers of a metal powder are laid and irradiated with an energy beam (such as a laser beam), so that the particles of the metal powder in each layer are sequentially sintered (fused) or melted to This layer or substrate is cured. According to one aspect of the present invention, at least one reactive fluid or fluid mixture that reacts with the surface of the metal powder or powders is brought into contact with the metal powder before, during and / or after the additive manufacturing process to actively operate the metal powder. Surface chemistry of powder materials, The chemical composition of the surface of such a powder material is controlled / improved / adjusted before, during, and / or after the additive manufacturing process. Gas components that contain hydrogen, carbon monoxide, or other chemically-reducible surface oxides and / or clean or remove impurities on the surface of solid powders without or with a purified gas (such as helium, argon, or nitrogen) The gas mixture is used to build the chamber itself, and on a metal powder transfer line, in a metal powder transfer container, or in a used metal powder receiver.
本發明係包含一基材之整體調整(bulk modification),例如一極薄膜/層(例如小於1μm),藉由將它曝露於反應性流體並使用能量輔助(例如半導體製程中之熱擴散)而調整整體的性質是可行的。 The present invention includes a bulk modification of a substrate, such as a polar film / layer (for example, less than 1 μm), by exposing it to a reactive fluid and using energy assistance (such as thermal diffusion in a semiconductor process). It is possible to adjust the nature of the whole.
本發明係包含藉由一氣體或包含氣體混合物之多氣體所進行之一基材之處理,並可用於將使用過的金屬粉末回收再利用,其係導致粉末的成本下降。同時,具有較高熱傳導性之該等氣體(例如氦)可被使用作為一淨化氣體或一平衡氣體,其係有效減少溫度梯度所導致之殘餘應力。 The present invention includes the treatment of a substrate by a gas or multiple gases including a gas mixture, and can be used to recycle and reuse the used metal powder, which results in a reduction in the cost of the powder. At the same time, these gases (such as helium) with higher thermal conductivity can be used as a purge gas or an equilibrium gas, which effectively reduce the residual stress caused by temperature gradients.
本發明可更使用包含氣體混合物之氣體以去除在粉末中或製成產品中的氫及/或有意地氧化粉末之表面。如前所述的,在基材表面上及在製成產品內的氫已知會造成氫脆化。依據本發明,包含具有CO、CO2及/或碳氟化合物之氣體混合物之氣體係被使用來去除氫以增強製成產品之機械強度。除了這些氣體之外,亦可使用氧氣、臭氧及/或過氧化氫不僅可用來去除氫,也可用在形成金屬氧化物材料。 The present invention may further use a gas containing a gas mixture to remove hydrogen from the powder or make a product and / or intentionally oxidize the surface of the powder. As mentioned earlier, hydrogen on the surface of the substrate and in the finished product is known to cause hydrogen embrittlement. According to the present invention, a gas system comprising a gas mixture with CO, CO 2 and / or fluorocarbons is used to remove hydrogen to enhance the mechanical strength of the finished product. In addition to these gases, oxygen, ozone and / or hydrogen peroxide can also be used not only to remove hydrogen, but also to form metal oxide materials.
本發明更考慮包含氣體混合物之氣體之使用以形成氮化物、碳化物、硼化物、磷化物、矽化物或其他化學層於基材之表面上,以增強製成產品之耐磨損性或耐腐蝕性。這些氣體之任何組合可被使用以同時形成二元、三元或更高階化合物,例如氮化物與硼化物。本發明係更考慮到包含其混合物之氣體/流體可被使用以在加法製造之前及/或期間來改變粉末材料之合金組成。包含揮發有機金屬成分之氣體/流體可被使用藉由化學氣相沉積、原子層沉積或其他程序而將金屬引入或沉積於粉末的表面上,就如其被使用在3D列印程序中。 The invention further considers the use of a gas containing a gas mixture to form nitrides, carbides, borides, phosphides, silicides, or other chemical layers on the surface of the substrate to enhance the wear resistance or resistance of the finished product. Corrosive. Any combination of these gases can be used to form binary, ternary or higher order compounds simultaneously, such as nitrides and borides. The invention further contemplates that the gas / fluid containing its mixture can be used to change the alloy composition of the powder material before and / or during additive manufacturing. Gases / fluids containing volatile organometallic components can be used to introduce or deposit metals onto the surface of the powder by chemical vapor deposition, atomic layer deposition, or other procedures, just as they are used in 3D printing procedures.
雷射燒結/熔化技術之詳細描述可參照美國4,863,538號、 5,017,753號、5,076,869號及4,944,817號專利。對此種製程而言,一雷射束被使用來選擇性熔融一粉末材料藉由掃描在一床上之材料的剖面。這些剖面係基於所要之物件之一三維描述而被掃描。該描述可從多種來源取得,例如一電腦輔助設計(computer aided design)檔案、掃描資料、或一些其他來源。 For a detailed description of laser sintering / melting technology, please refer to US No. 4,863,538, Patents 5,017,753, 5,076,869 and 4,944,817. For this process, a laser beam is used to selectively fuse a powder material by scanning the cross-section of the material on a bed. These sections are scanned based on a three-dimensional description of one of the desired objects. The description can be obtained from a variety of sources, such as a computer aided design file, scanned data, or some other source.
在一實施例中,加法製程裝置包含一建立腔室,物品在其中被製造,包含一可移動建立平台位於該建立腔室內且物品係於可移動建立平台上進行製造,包含一基材/流體傳送系統以及一能量傳送系統。基材/流體傳送系統係傳送經化學調整之一基材到該建立平台。在一選擇性的實施例中,一加熱系統可用以藉由一被加熱氣體加熱該基材與該平台。藉由符合該物件之形狀,基材只需要給該可移動平台之一些部分,該程序係在其上被執行。 In one embodiment, the additive process device includes a build chamber in which the article is manufactured, including a movable build platform located in the build chamber and the article is manufactured on the moveable build platform, including a substrate / fluid. A transmission system and an energy transmission system. The substrate / fluid transfer system transfers one of the chemically adjusted substrates to the build platform. In an alternative embodiment, a heating system may be used to heat the substrate and the platform with a heated gas. By conforming to the shape of the object, the substrate only needs to be given to some parts of the movable platform on which the procedure is performed.
依據本發明一些方面,基材可為一金屬材料,其例如但不限於包含鋁及其合金、鐵及其合金、鈦及其合金、鎳及其合金、不鏽鋼、鈷鉻合金、鉭與鈮。反應性流體係基於要被使用之特定金屬材料與所需表面化學性而選擇。反應性流體例如但不限於包含高擴散氣體及/或氣體混合物例如還原、氧化試劑、反應性氣體或反應性流體。在不使用或在使用純淨化氣體(例如氦、氬或氮)的情況下,包含內含氫、一氧化碳或其他化學還原表面氧化物及/或清潔或去除基材表面上的雜質之氣體成分之氣體混合物之流體係被使用於建立腔室本身,以及在基材傳送線上、基材容器中或使用過基材接收器中。 According to some aspects of the present invention, the substrate may be a metal material, such as, but not limited to, aluminum and its alloys, iron and its alloys, titanium and its alloys, nickel and its alloys, stainless steel, cobalt chromium alloys, tantalum and niobium. The reactive flow system is selected based on the particular metallic material to be used and the desired surface chemistry. Reactive fluids include, but are not limited to, highly diffusive gases and / or gas mixtures such as reducing, oxidizing reagents, reactive gases, or reactive fluids. Gas components that contain hydrogen, carbon monoxide, or other chemically reduced surface oxides and / or clean or remove impurities on the surface of the substrate without or with a purified gas (such as helium, argon, or nitrogen) The gas mixture flow system is used to build the chamber itself, as well as on a substrate transfer line, in a substrate container, or in a used substrate receiver.
生產一三維結構之方法可包含沉積第一層之至少一種前述基材於該平台藉此形成一基板。沉積基板之至少另一層,然後重覆執行各連續層之雷射掃描步驟藉此形成一較厚基板直到得到所需之一物件。就製造一三維結構而言,該基材可藉由在成層程序期間改變反應性氣體而被主動調整。該物品係以層層的方式形成直到完成。在本發明中,一實施例所使用之基材之粒子形狀並無特定限制。對粉末而言,平均粒尺寸在一實施例中係約10-100μm。金屬粉末或金屬產品之性質係在生產製程期間藉由在加法製造程序期間之時空(腔室/線/容器,連續/循環/多步驟)控制 的化學反應而被改善。 The method for producing a three-dimensional structure may include depositing a first layer of at least one of the aforementioned substrates on the platform to form a substrate. At least another layer of the substrate is deposited, and then laser scanning steps of successive layers are repeatedly performed to form a thicker substrate until a desired object is obtained. For manufacturing a three-dimensional structure, the substrate can be actively adjusted by changing the reactive gas during the layering process. The item is formed in layers until completion. In the present invention, the particle shape of the substrate used in one embodiment is not particularly limited. For powders, the average particle size is about 10-100 μm in one example. The properties of the metal powder or metal product are controlled during the manufacturing process by space-time (chamber / line / container, continuous / cycle / multi-step) during the additive manufacturing process The chemical reaction was improved.
在一些實施例中,除了高維準確性以及良好的微結構特性之外,本發明亦提供一較高純度給金屬產品,該金屬產品具有基板之相、結晶結構以及冶金結構之一改良,例如沒有微結構缺點,如空隙、雜質、內含物以及特別的微裂縫與多孔性,而且是在沒有使用金屬沖壓的情況下,即使是該產品可能由一純金屬及/或一合金粉末材料所製成,其被視為可耐燒結。此外,本發明係為提供一方法論給在一製成產品中之磁性質與殘餘應力之調整。 In some embodiments, in addition to high dimensional accuracy and good microstructure characteristics, the present invention also provides a higher purity to the metal product, which has one of the substrate phase, crystal structure and metallurgical structure improvements, such as No microstructural disadvantages such as voids, impurities, inclusions, and special micro-cracks and porosity, and without the use of metal stamping, even if the product may be made of a pure metal and / or an alloy powder material Made, it is considered resistant to sintering. In addition, the present invention is to provide a methodology for adjusting the magnetic properties and residual stresses in a finished product.
依據本發明之加法製造程序可在一惰性氣體環境下被實現,其中基材在進入建立腔室之前係已被儲存於反應性流體或與反應性流體反應。在這樣的例子中,惰性氣體環境係包含選自由氦、氬、氫、氧、氮、空氣、氮氧化物、氨、二氧化碳與其組合所組成之群組之一氣體。在一實施例中,惰性氣體環境係包含選自由氮(N2)、氬(Ar)、氦(He)及其混合物所組成之群組之一氣體。在一實施例中,惰性氣體環境係實質為一氬氣氣體環境。另一者,依本發明之加法製造程序係在所需反應性流體之一氣體環境之下被實現,其中基材在進入該建立腔室之前係已被儲存於反應性流體或與反應性流體進行反應。 The additive manufacturing process according to the present invention can be implemented in an inert gas environment, wherein the substrate has been stored in or reacted with a reactive fluid before entering the establishment chamber. In such an example, the inert gas environment includes a gas selected from the group consisting of helium, argon, hydrogen, oxygen, nitrogen, air, nitrogen oxides, ammonia, carbon dioxide, and combinations thereof. In one embodiment, the inert gas environment includes a gas selected from the group consisting of nitrogen (N 2 ), argon (Ar), helium (He), and mixtures thereof. In one embodiment, the inert gas environment is substantially an argon gas environment. On the other hand, the additive manufacturing process according to the present invention is implemented under a gaseous environment of one of the required reactive fluids, wherein the substrate has been stored in or with the reactive fluid before entering the establishment chamber. Perform the reaction.
請參照圖1所示,一加法製造裝置10之一示意圖係依據本發明之一實施例。如圖1所示,加法製造裝置10係包含一建立腔室100,其具有一可移動建立平台(未顯示),一物件90係在其上被製造。加法製造裝置10更包含一能量產生系統50與一控制器40。在實施例中,當一反應性流體60或多個反應性流體60’、60”被引入加法製造裝置10之建立腔室100內時,其係接觸基材70,以藉由使用由產生系統50所產生之能量而創造一物件90。當基材70接觸反應性流體60時,基材之表面係依需求被調整而成為被調整基材75(未顯示)。基材70表面之該調整可為一化物調整、一塗佈及/或反應性流體60之吸附作用之結果。如果需要的話,加法製造裝置係可引入一惰性氣體80。物件90可有多種形式。控制器40係傳送控制訊號42至產生系統50並傳送控制訊號44至建立腔室100以控制被調整基材75之加熱以及在一些實施例中之熔化以形成物件90。這些控制訊 號42、44可藉由使用設計資料30而產生。 Please refer to FIG. 1, a schematic diagram of an additive manufacturing apparatus 10 is according to an embodiment of the present invention. As shown in FIG. 1, the additive manufacturing apparatus 10 includes a building chamber 100 having a movable building platform (not shown) on which an object 90 is manufactured. The additive manufacturing apparatus 10 further includes an energy generation system 50 and a controller 40. In an embodiment, when a reactive fluid 60 or a plurality of reactive fluids 60 ′, 60 ″ is introduced into the establishment chamber 100 of the additive manufacturing apparatus 10, it contacts the substrate 70 to generate a system by using The energy generated by 50 creates an object 90. When the substrate 70 contacts the reactive fluid 60, the surface of the substrate is adjusted as required to become the adjusted substrate 75 (not shown). The adjustment of the surface of the substrate 70 It can be the result of a chemical adjustment, a coating and / or the adsorption of reactive fluid 60. If necessary, the additive manufacturing device can introduce an inert gas 80. The object 90 can take many forms. The controller 40 is a transmission control Signal 42 goes to generation system 50 and sends control signal 44 to build chamber 100 to control the heating of the adjusted substrate 75 and in some embodiments the melting to form object 90. These control signals The numbers 42, 44 can be generated by using the design data 30.
操作者所設定的值可為電腦饋入以設定要接觸基材70之反應性氣體之量及種類,藉此讓操作者能在製造程序期間設計物件90內之各層之化學樣式。依據要被沉積之多層之作法或進程之至少一反應性氣體(60、60’及/或60”)之釋放之不同的樣式與重覆率可因此被定義並改變。 The value set by the operator can be fed into the computer to set the amount and type of reactive gas to be contacted with the substrate 70, thereby allowing the operator to design the chemical pattern of the various layers within the object 90 during the manufacturing process. Different patterns and repeatability of the release of at least one reactive gas (60, 60 'and / or 60 ") depending on the method or process of the multilayer to be deposited may be defined and changed accordingly.
圖1之加法製造裝置10之說明並非用來暗示物理及/或建築的限制給予不同環境可被實施的方法。舉例來說,在其他實施例中,如圖2、3所示,反應性氣體係在不同時間接觸基材。舉例來說,在圖2所示之一實施例中,反應性流體260與基材270係相互接觸於供應線272,藉此提供更多時間給化學反應來發生於基材270之表面上。將基材與反應性氣體260之混合物曝露於一加熱步驟亦是有助益的,因此供應線272可在引入該建立腔室之前耗盡一外面能量來源(未顯示)。再次,如前所述,被調整之基材(未顯示)接著被導入建立腔室200,物件290係在其中被製造。另一實施例如圖3所示,其不僅顯示調整基材表面化學性的益處,也藉由用反應性流體370儲存並傳輸該基材而達到一些基材之增強的安全性、操作性與傳送性。舉例來說,細小粒子或低含氧粉末係具爆炸性,而藉由使其懸浮在反應性流體370中能大幅增加該等材料的操作性與安全性。下面表1係提供反應性流體的多種例子以及加法製造程序中與金屬材料的反應所發生的地方。 The description of the additive manufacturing apparatus 10 of FIG. 1 is not intended to suggest that physical and / or architectural constraints give different environments a method that can be implemented. For example, in other embodiments, as shown in FIGS. 2 and 3, the reactive gas system contacts the substrate at different times. For example, in one embodiment shown in FIG. 2, the reactive fluid 260 and the substrate 270 are in contact with each other on the supply line 272, thereby providing more time for chemical reactions to occur on the surface of the substrate 270. It is also helpful to expose the mixture of substrate and reactive gas 260 to a heating step, so the supply line 272 can deplete an external energy source (not shown) before being introduced into the setup chamber. Again, as previously described, the adjusted substrate (not shown) is then introduced into the creation chamber 200, in which the article 290 is manufactured. Another embodiment is shown in FIG. 3, which not only shows the benefits of adjusting the surface chemistry of the substrate, but also achieves enhanced safety, operability, and delivery of some substrates by storing and transferring the substrate with a reactive fluid 370 Sex. For example, fine particles or low-oxygen powders are explosive, and their handling and safety can be greatly increased by suspending them in the reactive fluid 370. Table 1 below provides various examples of reactive fluids and where reactions with metallic materials occur during the additive manufacturing process.
圖1所示之加法製造裝置10可藉由調整現有的雷射燒結或熔化系統而建立。不同的實施例可藉由使用反應性氣體替換這些系統之惰性氣體而達到。 The additive manufacturing apparatus 10 shown in FIG. 1 can be established by adjusting an existing laser sintering or melting system. Different embodiments can be achieved by replacing the inert gas of these systems with a reactive gas.
使用粉末材料並藉由習知雷射加法製造程序在生產部件的最大困難之一係為粉末材料之表面與空氣及/或氧氣的高反應性,如此會在部件製造期間造成殘餘應力與缺陷。如前所述,藉由使一反應性流體接觸一金屬粉末,相信能夠減少由於雜質、空隙或內含物所引起之殘餘應力的量並因此得到較高純度金屬、部件或產品。此外,加法製造裝置之操作者係可經由反應性流體之使用而調整各層之機械/化學性質,包含製造物件之表面,藉此提供一些額外的幾何自由度與程序穩健性。另外,亦可達到提升材料使用有效性,例如回收、減少浪費、提升安全性、操作性與可氧化粉末之傳送性。 One of the biggest difficulties in producing components using powder materials and the conventional laser additive manufacturing process is the high reactivity of the surface of the powder material with air and / or oxygen, which can cause residual stresses and defects during component manufacturing. As previously mentioned, by contacting a reactive fluid with a metal powder, it is believed that the amount of residual stress due to impurities, voids or inclusions can be reduced and thus a higher purity metal, component or product can be obtained. In addition, the operator of an additive manufacturing device can adjust the mechanical / chemical properties of each layer through the use of a reactive fluid, including the surface of the manufactured object, thereby providing some additional geometrical freedom and program robustness. In addition, it can also improve the effectiveness of material use, such as recycling, reducing waste, improving safety, operability and transportability of oxidizable powder.
有鑒於上述,裝置10係可處理廣泛的材料種類,包含但不限於下面所說明的。 In view of the above, the device 10 can handle a wide variety of materials, including but not limited to those described below.
鋁及其合金:基材70可為純鋁或一鋁合金。基材70亦可為純鋁與至少一鋁合金之粒子之一混合物,或可為多種鋁合金之一混合物。對於一鋁基材70之成份沒有限制,除了其對於粉末材料粒子係包含足夠的金屬形式之鋁以形成本體上鋁之包膜(enveloping film)。 Aluminum and its alloy: The substrate 70 may be pure aluminum or an aluminum alloy. The substrate 70 may also be a mixture of pure aluminum and particles of at least one aluminum alloy, or may be a mixture of multiple aluminum alloys. There is no limitation on the composition of an aluminum substrate 70, except that it contains enough aluminum in metal form for the powder material particles to form an enveloping film of aluminum on the body.
基材70可更為鎳及鎳合金包含鎳基超合金、銅及其合金、 耐火金屬,包含貴金屬與準金屬及/或具有高氧化能力之材料例如銅、鐵、鈦、釕、鎘、鋅、銠、鉀、鈉、鎳、鉍、錫、鋇、鍺、鋰、鍶、鎂、鈹、鉛、鈣、鉬、鎢、鈷、銦、矽、鎵、鐵、鋯、鉻、硼、錳、鋁、鑭、釹、鈮、釩、釔及/或鈧。 The substrate 70 may further include nickel and nickel alloys including nickel-based superalloys, copper and its alloys, Refractory metals, including precious metals and metalloids, and / or materials with high oxidation capabilities such as copper, iron, titanium, ruthenium, cadmium, zinc, rhodium, potassium, sodium, nickel, bismuth, tin, barium, germanium, lithium, strontium, Magnesium, beryllium, lead, calcium, molybdenum, tungsten, cobalt, indium, silicon, gallium, iron, zirconium, chromium, boron, manganese, aluminum, lanthanum, neodymium, niobium, vanadium, yttrium and / or scandium.
基材70可更為一金屬玻璃或非結晶金屬化合物、具有非結晶結構之三元、四元或更高階金屬合金,例如鋁鈦基合金例如Ti-Al-Fe及Ti-Al-N、鋯基合金例如Zr-Cu-Al-Ni、鈀基合金例如Pd-Ni-P、鐵基合金包含鐵、硼、矽、碳、磷、鎳、鈷、鉻、氮、鈦、鋯、釩與鈮之組合。在製造該等金屬玻璃時,硼、磷、矽、碳及/或任何元素可藉由使用反應性流體如乙硼烷、磷化氫與甲烷而被加入至裝置10內。本發明係可被應用以形成非結晶金屬氧化物,例如In-Ga-Zn-O與Zn-Rh-O。氧化物可藉由使用反應性流體如氧氣或過氧化氫而被形成於裝置10內。 The substrate 70 may be a metallic glass or an amorphous metal compound, a ternary, quaternary or higher-order metal alloy having an amorphous structure, such as an aluminum-titanium-based alloy such as Ti-Al-Fe and Ti-Al-N, zirconium Base alloys such as Zr-Cu-Al-Ni, palladium-based alloys such as Pd-Ni-P, iron-based alloys containing iron, boron, silicon, carbon, phosphorus, nickel, cobalt, chromium, nitrogen, titanium, zirconium, vanadium and niobium Of combination. In manufacturing such metallic glasses, boron, phosphorus, silicon, carbon, and / or any element may be added to the device 10 by using a reactive fluid such as diborane, phosphine, and methane. The invention can be applied to form amorphous metal oxides, such as In-Ga-Zn-O and Zn-Rh-O. The oxide may be formed within the device 10 by using a reactive fluid such as oxygen or hydrogen peroxide.
本發明可選擇多種反應性流體,例如:(1)還原劑:氫、一氧化碳、甲酸、氨、聯氨、甲基聯氨、1,2-二甲基肼;(2)碳化劑(carbonizing agent/carbiding agent):飽和碳氫化合物例如甲烷、乙烷、丙烷、丁烷、戊烷、己烷、庚烷以及更高階的碳氫化合物、未飽和的碳氫化合物,例如乙炔、丙烯、丁烯異構體、乙烯;(3)氧化劑:二氧化碳、氧、四氟化碳、三氟甲烷、二氟甲烷、氟甲烷、過氧化氫、臭氧、氧化亞氮、一氧化氮、二氧化氮、三氟化氮、氟;(4)氮化劑:甲胺、二甲胺、三甲胺、氨、聯氨、甲基聯氨、1,2-二甲基肼;(5)硼化劑:乙硼烷、三甲基硼烷、四甲基乙硼烷、三氯硼烷、三氟硼烷;(6)硫化劑:硫化氫、甲硫醇、乙硫醇、丙硫醇、丁硫醇、戊硫醇、二烷基硫化物;(7)磷化劑:磷化氫、叔丁基膦、三乙基膦、三甲基膦、三氯氧化磷、三氟膦、三氯化磷; (8)矽烷化劑:甲矽烷、乙矽烷、更高階矽烷、烷基矽烷、四乙氧基矽烷、氟矽烷、氯矽烷、氨基矽烷;(9)硒化劑:硒化氫、烷基硒化物;(10)電漿及超臨界流體;(11)其他:六氟化鎢、三甲基鋁、四乙基鋁、三甲基鎵、四乙基鎵、四氯化鈦、過渡金屬化合物、鎢化劑;以及(12)其組合 The present invention can select a variety of reactive fluids, for example: (1) reducing agents: hydrogen, carbon monoxide, formic acid, ammonia, hydrazine, methylhydrazine, 1,2-dimethylhydrazine; (2) carbonizing agent / carbiding agent): saturated hydrocarbons such as methane, ethane, propane, butane, pentane, hexane, heptane and higher order hydrocarbons, unsaturated hydrocarbons, such as acetylene, propylene, butene Isomers, ethylene; (3) oxidants: carbon dioxide, oxygen, carbon tetrafluoride, trifluoromethane, difluoromethane, fluoromethane, hydrogen peroxide, ozone, nitrous oxide, nitric oxide, nitrogen dioxide, trioxide Nitrogen fluoride, fluorine; (4) Nitriding agents: methylamine, dimethylamine, trimethylamine, ammonia, hydrazine, methylhydrazine, 1,2-dimethylhydrazine; (5) boronizing agent: ethyl Borane, trimethylborane, tetramethyldiborane, trichloroborane, trifluoroborane; (6) curing agent: hydrogen sulfide, methyl mercaptan, ethyl mercaptan, propyl mercaptan, butane mercaptan , Pentyl mercaptan, dialkyl sulfide; (7) phosphating agent: phosphine, tert-butylphosphine, triethylphosphine, trimethylphosphine, phosphorus oxychloride, trifluorophosphine, phosphorus trichloride ; (8) Silane agents: silane, ethilanes, higher-order silanes, alkylsilanes, tetraethoxysilanes, fluorosilanes, chlorosilanes, aminosilanes; (9) selenizers: hydrogen selenide, alkylselenium Compounds; (10) plasma and supercritical fluids; (11) others: tungsten hexafluoride, trimethylaluminum, tetraethylaluminum, trimethylgallium, tetraethylgallium, titanium tetrachloride, transition metal compounds , Tungsten agent; and (12) combinations thereof
除非有其他定義,這裡所使用之所有技術與科學名詞具有就如本發明所屬技術領域中習知技藝者所熟知的意思。雖然有許多類似或等同於本發明所說明之方法與材料可被使用於本發明之實施,但依據一些實施例之材料與方法係說明於此。雖然本發明係依據一些實施例而被清楚說明,然而習知技術者可執行其內的許多調整與改變。在沒有進一步的闡述之下,相信習知技術者可藉由使用本發明說明而使用本發明至最大程度。 Unless defined otherwise, all technical and scientific terms used herein have the same meanings as those skilled in the art to which this invention belongs. Although many methods and materials similar or equivalent to those described in the present invention can be used in the practice of the present invention, the materials and methods according to some embodiments are described herein. Although the present invention has been described in detail with reference to some embodiments, those skilled in the art can perform many adjustments and changes therein. Without further elaboration, it is believed that those skilled in the art can use the present invention to the maximum extent by using the description of the present invention.
在已揭露一些實施例的情況下,習知技術者將承認多種調整、替代的建構以及等同物可被使用而不偏離本發明實施例之精神。此外,為避免不必要的混淆本發明,許多習知的程序與元件並未說明於此。據此,上述說明應不被視為本發明範疇的限制。 Where some embodiments have been disclosed, those skilled in the art will recognize that many adjustments, alternative constructions, and equivalents may be used without departing from the spirit of the embodiments of the invention. In addition, in order to avoid unnecessarily obscuring the present invention, many conventional procedures and elements are not described here. Accordingly, the above description should not be considered as limiting the scope of the invention.
當提供多個值之範圍時,需理解為該範圍之上限與下限之間之各中間值(除非上下文有清楚其他指示,不然就到下限的單位的十分之一)亦被揭露,除非上下文有清楚其他指示。在任何被提到的值之間之各較小的範圍或在一提及範圍中之中間值及在該提及範圍內之任何其他提及的值或中間值係被涵蓋。這些較小範圍的上限與下限可被獨立地包含或排除於該範圍內,並且各範圍亦被涵蓋在本發明內,其中一個、兩個或零個限值係被包含在較小的範圍內,並受限於該提及範圍內特別被排除的限值。當所提及範圍包含一個或兩個限值時,排除這些被包含的限值之其中一個或兩個之範圍亦被包含在內。 When a range of multiple values is provided, it should be understood as each intermediate value between the upper and lower limits of the range (unless the context clearly indicates otherwise, or one tenth of the unit of the lower limit) is also disclosed, unless the context There are clear other instructions. Each smaller range between any mentioned value or intervening value in a stated range and any other referenced value or intervening value in that stated range are encompassed. The upper and lower limits of these smaller ranges can be independently included or excluded from the range, and each range is also covered by the present invention. One, two or zero limits are included in the smaller range. And subject to limits that are specifically excluded from the mentioned range. Where the stated range includes one or both of the limits, ranges excluding either or both of those included limits are also included.
本發明及申請專利範圍所述,「一」或「該」係包含多個指示對象,除非上下文有清楚的其他指示。因此,舉例來說,「一程序」包含多個這樣的程序,「介電材料」包含一個或多個介電材料以及習知技術者所熟知之其等同物等等。 According to the scope of the present invention and the patent application, "a" or "the" includes a plurality of indicating objects, unless the context clearly indicates otherwise. Thus, for example, "a procedure" includes a plurality of such procedures, and "dielectric material" includes one or more dielectric materials and equivalents thereof known to those skilled in the art.
此外,本發明所使用之「包含」或「包括」係說明被提及特徵、整體、構件或步驟之存在,但並非禁止一個或多個其他特徵、整體、構件、步驟、行動或群組被加入。 In addition, "include" or "including" used in the present invention means the existence of the mentioned feature, whole, component, or step, but does not prohibit one or more other features, whole, component, step, action or group from being Join.
以上所述僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。 The above description is exemplary only, and not restrictive. Any equivalent modification or change made without departing from the spirit and scope of the present invention shall be included in the scope of the attached patent application.
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Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10106880B2 (en) * | 2013-12-31 | 2018-10-23 | The United States Of America, As Represented By The Secretary Of The Navy | Modifying the surface chemistry of a material |
CN107199337B (en) * | 2016-03-16 | 2020-05-01 | 华邦电子股份有限公司 | Method for forming metal wire structure |
BE1025340B1 (en) * | 2017-06-30 | 2019-02-04 | Phoenix Contact Gmbh & Co. Kg | Method for producing a copper-containing component by means of selective laser sintering |
GB201719370D0 (en) * | 2017-11-22 | 2018-01-03 | Johnson Matthey Plc | Component produced by additive manufacturing |
EP3720710A1 (en) * | 2017-12-08 | 2020-10-14 | Oerlikon Am GmbH | Assisted fused deposition modeling |
EP4219131A1 (en) * | 2017-12-26 | 2023-08-02 | Braskem America, Inc. | High performance polyolefin for material extrusion |
EP3681719A4 (en) | 2018-02-09 | 2021-03-10 | Hewlett-Packard Development Company, L.P. | Three-dimensional printing systems |
ES2918999T3 (en) * | 2018-03-27 | 2022-07-21 | Siemens Energy Inc | Fabrication of a sintered wire and on-site feeding to a laser wire welding system |
US11031161B2 (en) | 2018-05-11 | 2021-06-08 | GM Global Technology Operations LLC | Method of manufacturing a bulk nitride, carbide, or boride-containing material |
US11167375B2 (en) | 2018-08-10 | 2021-11-09 | The Research Foundation For The State University Of New York | Additive manufacturing processes and additively manufactured products |
EP3894108A4 (en) * | 2018-12-14 | 2022-08-17 | Seurat Technologies, Inc. | Additive manufacturing system for object creation from powder using a high flux laser for two-dimensional printing |
EP3670030A1 (en) * | 2018-12-19 | 2020-06-24 | Linde GmbH | Method and system for generating a three-dimensional workpiece |
CN111992711B (en) * | 2019-05-10 | 2022-08-16 | 天津大学 | Method for improving tensile property of titanium alloy additive manufacturing by adding Nb powder |
US11724340B2 (en) * | 2019-05-23 | 2023-08-15 | Saudi Arabian Oil Company | Additive manufacturing of MLD-enhanced drilling tools |
EP3834962A1 (en) * | 2019-12-09 | 2021-06-16 | Linde GmbH | Method and system for generating a three-dimensional workpiece |
CN112941491A (en) * | 2019-12-11 | 2021-06-11 | 王玉漫 | Three-dimensional printing method for different Hermitian-grade materials |
CN113463093A (en) * | 2021-07-06 | 2021-10-01 | 广西大学 | Device and process method for synthesizing composite coating in situ by using chemical vapor deposition to assist laser cladding |
WO2023055654A1 (en) * | 2021-09-30 | 2023-04-06 | Entegris, Inc. | Additive manufactured articles having passivated surfaces and related methods |
US20240025108A1 (en) * | 2022-07-20 | 2024-01-25 | Battelle Savannah River Alliance, Llc | In situ chemical modification during additive manufacturing |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5182170A (en) * | 1989-09-05 | 1993-01-26 | Board Of Regents, The University Of Texas System | Method of producing parts by selective beam interaction of powder with gas phase reactant |
US20040182510A1 (en) * | 2003-02-18 | 2004-09-23 | Rolf Pfeifer | Process and device for producing solid bodies by sequential layer buildup |
TWI308600B (en) * | 2004-12-20 | 2009-04-11 | Nanogram Corp | Dense coating formation by reactive deposition |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4863538A (en) | 1986-10-17 | 1989-09-05 | Board Of Regents, The University Of Texas System | Method and apparatus for producing parts by selective sintering |
US4944817A (en) | 1986-10-17 | 1990-07-31 | Board Of Regents, The University Of Texas System | Multiple material systems for selective beam sintering |
US5076869A (en) | 1986-10-17 | 1991-12-31 | Board Of Regents, The University Of Texas System | Multiple material systems for selective beam sintering |
US5017753A (en) | 1986-10-17 | 1991-05-21 | Board Of Regents, The University Of Texas System | Method and apparatus for producing parts by selective sintering |
DE4022960C1 (en) * | 1990-07-19 | 1991-08-01 | Ralph 5600 Wuppertal De Ippendorf | |
WO2007010598A1 (en) * | 2005-07-19 | 2007-01-25 | Homs Engineering Inc. | Process for producing stent and powder sintering apparatus |
US20100310404A1 (en) * | 2007-12-06 | 2010-12-09 | Ulf Ackelid | Apparataus and method for producing a three-dimensional object |
US9283593B2 (en) | 2011-01-13 | 2016-03-15 | Siemens Energy, Inc. | Selective laser melting / sintering using powdered flux |
KR102182567B1 (en) * | 2011-12-28 | 2020-11-24 | 아르켐 에이비 | Method and apparatus for increasing the resolution in additively manufactured three-dimensional articles |
EP2700459B1 (en) * | 2012-08-21 | 2019-10-02 | Ansaldo Energia IP UK Limited | Method for manufacturing a three-dimensional article |
JP6378688B2 (en) * | 2012-11-01 | 2018-08-22 | ゼネラル・エレクトリック・カンパニイ | Additive manufacturing method and apparatus |
US9714318B2 (en) * | 2013-07-26 | 2017-07-25 | Stratasys, Inc. | Polyglycolic acid support material for additive manufacturing systems |
US9327448B2 (en) * | 2013-08-02 | 2016-05-03 | Northwestern University | Methods for fabricating three-dimensional metallic objects via additive manufacturing using metal oxide pastes |
US20150125333A1 (en) * | 2013-11-05 | 2015-05-07 | Gerald J. Bruck | Below surface laser processing of a fluidized bed |
WO2015106113A1 (en) * | 2014-01-09 | 2015-07-16 | United Technologies Corporation | Material and processes for additively manufacturing one or more parts |
US9321677B2 (en) | 2014-01-29 | 2016-04-26 | Corning Incorporated | Bendable glass stack assemblies, articles and methods of making the same |
US20160214176A1 (en) * | 2014-05-12 | 2016-07-28 | Siemens Energy, Inc. | Method of inducing porous structures in laser-deposited coatings |
US10507638B2 (en) * | 2015-03-17 | 2019-12-17 | Elementum 3D, Inc. | Reactive additive manufacturing |
CN104801703B (en) * | 2015-03-26 | 2016-08-24 | 成都新柯力化工科技有限公司 | A kind of flexible metal powder for 3 D-printing and its preparation method and application method |
US10105798B2 (en) * | 2015-11-05 | 2018-10-23 | Honeywell International Inc. | Surface improvement of additively manufactured articles produced with aluminum alloys |
JP6797642B2 (en) * | 2015-12-10 | 2020-12-09 | キヤノン株式会社 | Raw material powder processing method and three-dimensional model manufacturing method |
-
2016
- 2016-12-23 CN CN201680076521.2A patent/CN108602090A/en active Pending
- 2016-12-23 JP JP2018534824A patent/JP6895974B2/en active Active
- 2016-12-23 WO PCT/US2016/068490 patent/WO2017117041A1/en active Application Filing
- 2016-12-23 SG SG11201804950PA patent/SG11201804950PA/en unknown
- 2016-12-23 ES ES16882459T patent/ES2949692T3/en active Active
- 2016-12-23 US US15/389,629 patent/US20170182558A1/en active Pending
- 2016-12-23 EP EP16882459.7A patent/EP3397400B1/en active Active
- 2016-12-23 TW TW105143028A patent/TWI658920B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5182170A (en) * | 1989-09-05 | 1993-01-26 | Board Of Regents, The University Of Texas System | Method of producing parts by selective beam interaction of powder with gas phase reactant |
US20040182510A1 (en) * | 2003-02-18 | 2004-09-23 | Rolf Pfeifer | Process and device for producing solid bodies by sequential layer buildup |
TWI308600B (en) * | 2004-12-20 | 2009-04-11 | Nanogram Corp | Dense coating formation by reactive deposition |
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