TWI650830B - 脆性材料基板的搬送方法及搬送裝置 - Google Patents

脆性材料基板的搬送方法及搬送裝置 Download PDF

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Publication number
TWI650830B
TWI650830B TW104103594A TW104103594A TWI650830B TW I650830 B TWI650830 B TW I650830B TW 104103594 A TW104103594 A TW 104103594A TW 104103594 A TW104103594 A TW 104103594A TW I650830 B TWI650830 B TW I650830B
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TW
Taiwan
Prior art keywords
substrate
head
brittle
plate
conveying
Prior art date
Application number
TW104103594A
Other languages
English (en)
Chinese (zh)
Other versions
TW201541549A (zh
Inventor
太田欣也
時本育往
黑田直洋
礒島聰
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2014-092494 priority Critical
Priority to JP2014092494A priority patent/JP6331656B2/ja
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201541549A publication Critical patent/TW201541549A/zh
Application granted granted Critical
Publication of TWI650830B publication Critical patent/TWI650830B/zh

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733Overhead conveying
TW104103594A 2014-04-28 2015-02-03 脆性材料基板的搬送方法及搬送裝置 TWI650830B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014-092494 2014-04-28
JP2014092494A JP6331656B2 (ja) 2014-04-28 2014-04-28 脆性材料基板の搬送方法及び搬送装置

Publications (2)

Publication Number Publication Date
TW201541549A TW201541549A (zh) 2015-11-01
TWI650830B true TWI650830B (zh) 2019-02-11

Family

ID=54442835

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104103594A TWI650830B (zh) 2014-04-28 2015-02-03 脆性材料基板的搬送方法及搬送裝置

Country Status (4)

Country Link
JP (1) JP6331656B2 (ja)
KR (1) KR20150124379A (ja)
CN (1) CN105035761B (ja)
TW (1) TWI650830B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6282176B2 (ja) * 2014-05-29 2018-02-21 三星ダイヤモンド工業株式会社 脆性材料基板の端材分離装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005225603A (ja) * 2004-02-12 2005-08-25 Toyota Industries Corp パネル搬送装置
JP2007256017A (ja) * 2006-03-22 2007-10-04 Mega Trade:Kk 外観検査装置
JP2008251653A (ja) * 2007-03-29 2008-10-16 Sharp Corp 低負荷搬送装置
JP2011181936A (ja) * 2011-03-28 2011-09-15 Renesas Electronics Corp 半導体装置の製造方法
TW201331009A (zh) * 2012-01-16 2013-08-01 Mitsuboshi Diamond Ind Co Ltd 脆性材料基板之裂斷方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4646467B2 (ja) * 2001-09-04 2011-03-09 旭化成せんい株式会社 紡績糸
JP3779237B2 (ja) * 2002-07-04 2006-05-24 住友電気工業株式会社 基板切断方法及び基板切断装置
JP4139368B2 (ja) * 2004-09-15 2008-08-27 京元電子股▲ふん▼有限公司 電子装置試験用ピックアップ装置
CN2839170Y (zh) * 2005-09-30 2006-11-22 富士迈半导体精密工业(上海)有限公司 基板载具
JP2010118424A (ja) * 2008-11-12 2010-05-27 Disco Abrasive Syst Ltd 薄板状ワークの搬送装置
CN201540830U (zh) * 2009-10-30 2010-08-04 天津三星电机有限公司 贴片电容基板切断设备中用于基板投入的装置
JP2011114070A (ja) * 2009-11-25 2011-06-09 Disco Abrasive Syst Ltd 加工装置
JP2013078810A (ja) * 2011-10-03 2013-05-02 Smc Corp 真空吸着装置
CN102381554B (zh) * 2011-11-01 2013-03-13 武汉人天包装技术有限公司 一种取盘机
CN202414765U (zh) * 2011-12-31 2012-09-05 无锡市奥曼特科技有限公司 一种板式pecvd设备自动上下料系统的硅片搬运机构
CN203143683U (zh) * 2013-03-13 2013-08-21 龙口市埃迪克自动化设备有限公司 小型定向多点位搬送机械装置
JP5744109B2 (ja) * 2013-06-05 2015-07-01 三星ダイヤモンド工業株式会社 脆性基板搬送ユニット

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005225603A (ja) * 2004-02-12 2005-08-25 Toyota Industries Corp パネル搬送装置
JP2007256017A (ja) * 2006-03-22 2007-10-04 Mega Trade:Kk 外観検査装置
JP2008251653A (ja) * 2007-03-29 2008-10-16 Sharp Corp 低負荷搬送装置
JP2011181936A (ja) * 2011-03-28 2011-09-15 Renesas Electronics Corp 半導体装置の製造方法
TW201331009A (zh) * 2012-01-16 2013-08-01 Mitsuboshi Diamond Ind Co Ltd 脆性材料基板之裂斷方法

Also Published As

Publication number Publication date
TW201541549A (zh) 2015-11-01
JP2015208938A (ja) 2015-11-24
CN105035761B (zh) 2019-01-04
JP6331656B2 (ja) 2018-05-30
CN105035761A (zh) 2015-11-11
KR20150124379A (ko) 2015-11-05

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