TWI644190B - Processing system and process methods - Google Patents

Processing system and process methods

Info

Publication number
TWI644190B
TWI644190B TW106121826A TW106121826A TWI644190B TW I644190 B TWI644190 B TW I644190B TW 106121826 A TW106121826 A TW 106121826A TW 106121826 A TW106121826 A TW 106121826A TW I644190 B TWI644190 B TW I644190B
Authority
TW
Taiwan
Prior art keywords
processing system
process methods
methods
process
processing
Prior art date
Application number
TW106121826A
Other languages
Chinese (zh)
Other versions
TW201905611A (en
Inventor
周友華
莊國勝
Original Assignee
台灣積體電路製造股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 台灣積體電路製造股份有限公司 filed Critical 台灣積體電路製造股份有限公司
Priority to TW106121826A priority Critical patent/TWI644190B/en
Application granted granted Critical
Publication of TWI644190B publication Critical patent/TWI644190B/en
Publication of TW201905611A publication Critical patent/TW201905611A/en

Links

TW106121826A 2017-06-29 2017-06-29 Processing system and process methods TWI644190B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW106121826A TWI644190B (en) 2017-06-29 2017-06-29 Processing system and process methods

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW106121826A TWI644190B (en) 2017-06-29 2017-06-29 Processing system and process methods

Publications (2)

Publication Number Publication Date
TWI644190B true TWI644190B (en) 2018-12-11
TW201905611A TW201905611A (en) 2019-02-01

Family

ID=65431683

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106121826A TWI644190B (en) 2017-06-29 2017-06-29 Processing system and process methods

Country Status (1)

Country Link
TW (1) TWI644190B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200405184A (en) * 2002-06-07 2004-04-01 Praesagus Inc Characterization and reduction of variation for integrated circuits
TW200530875A (en) * 2004-03-04 2005-09-16 Taiwan Semiconductor Mfg Method for physical parameter extraction for transistor model
TW201028808A (en) * 2008-09-19 2010-08-01 Applied Materials Inc Self-diagnostic semiconductor equipment
TW201044629A (en) * 2009-05-19 2010-12-16 Applied Materials Inc Method and apparatus for solar cell production line control and process analysis
TW201225197A (en) * 2010-06-14 2012-06-16 Kla Tencor Corp Advanced process control optimization
TW201245918A (en) * 2011-03-28 2012-11-16 Tokyo Electron Ltd Adaptive recipe selector
TW201619690A (en) * 2014-08-05 2016-06-01 Aselta Nanographics Method for determining the parameters of an IC manufacturing process model
TW201628112A (en) * 2015-01-28 2016-08-01 Dmo Systems Ltd Methodology of incorporating wafer physical measurement with digital simulation for improving semiconductor device fabrication

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200405184A (en) * 2002-06-07 2004-04-01 Praesagus Inc Characterization and reduction of variation for integrated circuits
TW200530875A (en) * 2004-03-04 2005-09-16 Taiwan Semiconductor Mfg Method for physical parameter extraction for transistor model
TW201028808A (en) * 2008-09-19 2010-08-01 Applied Materials Inc Self-diagnostic semiconductor equipment
TW201044629A (en) * 2009-05-19 2010-12-16 Applied Materials Inc Method and apparatus for solar cell production line control and process analysis
TW201225197A (en) * 2010-06-14 2012-06-16 Kla Tencor Corp Advanced process control optimization
TW201245918A (en) * 2011-03-28 2012-11-16 Tokyo Electron Ltd Adaptive recipe selector
TW201619690A (en) * 2014-08-05 2016-06-01 Aselta Nanographics Method for determining the parameters of an IC manufacturing process model
TW201628112A (en) * 2015-01-28 2016-08-01 Dmo Systems Ltd Methodology of incorporating wafer physical measurement with digital simulation for improving semiconductor device fabrication

Also Published As

Publication number Publication date
TW201905611A (en) 2019-02-01

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