TWI634148B - Resin composition for electronic device sealing and electronic device - Google Patents

Abstract

The present invention provides an electronic device sealing resin composition capable of sufficiently suppressing the transmission of water vapor, and an electronic device using the resin composition for sealing the electronic device.

The present invention provides a resin composition for sealing an electronic device comprising (A) a polybutadiene polymer having a (meth) acrylonitrile group at the terminal represented by the following chemical formula (1) and (B) a photopolymerization initiator And does not contain a thermoplastic resin having a mass average molecular weight of 50,000 or more. (wherein R ¹ and R ² each represent a hydroxyl group or H ₂ C=C(R ⁷ )-COO-, and R ³ and R ⁴ each independently represent a substituted or unsubstituted divalent organic group having 1 to 16 carbon atoms; R ⁵ , R ⁶ and R ⁷ each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and contain at least one organic group represented by the following chemical formula (2), and each of l and m represents an integer of 0 or 1. , n represents an integer from 15 to 150, x: y = 0 to 100: 100 to 0, except that there is no case where both R ¹ and R ² are hydroxyl groups),

Description

Resin composition for electronic device sealing and electronic device

The present invention relates to a resin composition for sealing used in an electronic device and an electronic device sealed using the resin composition for sealing.

Various package configurations are known for organic electronic devices and their circuits. These structures are generally composed of a substrate and a cover, an active organic component such as a light-emitting diode disposed between the substrate and the cover, a sealing active organic component, and a sealing material bonded to the substrate and the cover. One or both of the substrate and the cover are made of a transparent material, such as transparent glass or plastic, to allow light to pass through. The substrate and the cover may also have flexibility, and any of the glass or plastic may be made of steel. The active organic component is formed on a substrate, and the same state is covered by an inorganic barrier film or a coating film composed of a plurality of barrier films made of a layer of inorganic and organic layers. The coating protects the surface and the periphery of the active organic component. The sealing material is applied or bonded to the active organic component, but is coated or bonded thereto when the coating is present. The sealing material fills the space between the substrate and the cover by coating the active organic component, and the substrate is attached to the cover.

However, active organic parts are prone to low molecular weight, oxygen Or water vapor to deteriorate. For example, an organic electroluminescence device is formed by a cathode, a light-emitting layer, and an anode, and a metal layer having a low work function is used as an anode to ensure effective electron injection and a low operating voltage. Metals with low work functions are chemically reactive with oxygen and water vapor, and such reactions can shorten the life of the device. Further, oxygen and water vapor react with the luminescent organic material to suppress luminescence. In order to prevent the occurrence of such a reaction, a coating film is often provided on the surface of the active organic component as described above. However, it is difficult for the inorganic barrier film to suppress pinholes, and the active organic component cannot completely block oxygen or water vapor from the outside. Therefore, the sealing material surrounding the active organic component is designed to suppress the permeation of oxygen and water vapor from the outside, in particular, water vapor, regardless of the presence or absence of the coating film.

As the sealing material, a curable film-like sealing material can be used (for example, refer to Patent Document 1). In general, a film-like sealing material is provided between two carrier films, and one of the carrier films is removed, and the film-like sealing material exposed by pressurization or heat is applied to the cover or the substrate. Either then. Subsequently, the other support film is removed to bring the lid and the substrate back to each other. The film-like sealing material can be hardened by ultraviolet radiation or heat as needed.

Further, a liquid sealing material can also be used as such a sealing material (for example, refer to Patent Document 2). Generally, after the liquid sealing material is applied to the entire surface of either the lid or the substrate, the lid or the substrate is pressed or heated and pressurized in the same manner as the film-like sealing material, whereby the lid and the lid can be used. The substrates are followed by each other. Liquid sealing materials generally require hardening and hardening by ultraviolet radiation or heat.

The film-like sealing material generally has a higher viscosity than the liquid sealing material at room temperature. When a film-like sealing material is used at room temperature, the wettability to the substrate or the cover is poor, and depending on the case, the sealing material hardly flows and entrains the air. To the seal between the substrate and the substrate. In order to make the sealing material flow and achieve good wetting to minimize the entrained air, it is considered to adhere the film-like sealing material at a high temperature. The heating temperature sometimes exceeds 100 ° C and requires special equipment. Furthermore, the film-like sealing material requires the use, removal, and disposal of the carrier.

The liquid sealing material discloses a sealing material using a compound resin having an epoxy group or an oxetanyl group (for example, refer to Patent Document 2), or a sealing material using an ionic polymerizable cyanoacrylate monomer ( For example, refer to Patent Document 3) and a sealing material using bisphenol epoxy acrylate and epoxy resin (for example, refer to Patent Document 4). However, the suppression effect of such water vapor transmission or the bending resistance after hardening is insufficient. Therefore, as a sealing material having high suppression effect of water vapor transmission and excellent bending resistance after curing, a sealing formed of hydrogenated polybutadiene having a terminal having an ester bond and a (meth) acrylate group is disclosed. (for example, refer to Patent Document 5).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-214366

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2004-231938

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2008-021480

[Patent Document 4] Japanese Laid-Open Patent Publication No. 2006-183002

[Patent Document 5] Japanese Patent No. 4801925

The sealing material described in Patent Document 5 is a polybutadiene, and does not contain an ether or an ester in the main chain. Therefore, the polybutadiene can be crosslinked and hardened by application of ultraviolet radiation or heat. Therefore, the effect of suppressing water vapor transmission is high. Further, since the (meth) acrylate group is introduced at the end, there is a moderate distance between the crosslinking points, and the density of the crosslinking point is not excessively high, so that the bending resistance after curing is excellent. Further, since the group having an ester bond has a (meth) acrylate group, the hydrophobicity is high and the effect of suppressing water vapor transmission is also enhanced. However, the suppression of water vapor transmission for use in active organic parts is insufficient.

Accordingly, an object of the present invention is to provide an electronic device sealing resin composition capable of sufficiently suppressing the transmission of water vapor, and an electronic device using the electronic device sealing resin composition.

In order to solve the above problems, the resin composition for sealing an electronic device of the present invention is characterized by containing (A) a polybutadiene polymer having a (meth)acryl fluorenyl group at the terminal represented by the following chemical formula (1), and (B) The photopolymerization initiator does not contain a resin composition for electronic device sealing of a thermoplastic resin having a mass average molecular weight of 50,000 or more.

(wherein R ¹ and R ² each independently represent a hydroxyl group or H ₂ C=C(R ⁷ )-COO-, and R ³ and R ⁴ each independently represent a substituted or unsubstituted divalent organic group having 1 to 16 carbon atoms; The group, R ⁵ , R ⁶ and R ⁷ each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and contains at least one organic group represented by the following chemical formula (2), and each of l and m independently represents 0 or An integer of 1 , n represents an integer from 15 to 150, and x: y = 0 to 100: 100 to 0, except that R ¹ and R ² are both hydroxyl groups).

The resin composition for sealing an electronic device preferably further contains (C) a reactive diluent, and the mass ratio (A) of the component (A) to the component (C): (C) is 5:95 to 50:50. .

Further, the resin composition for sealing an electronic device preferably further contains (D) a hydrocarbon compound having a number average molecular weight of less than 50,000, and the total of the component (A) and the component (C) and the component (D) The mass ratio [(A)+(C)]:(D) is 20:80~70:30.

Moreover, it is preferable that the resin composition for sealing the electronic device is characterized in that the hydrocarbon compound of the component (D) contains at least (d1) a hydrocarbon-based softener and (d2) a hydrocarbon-based adhesion-imparting agent, and the component (d1) and the above ( D2) The mass ratio of the components (d1): (d2) is 20:80 to 80:20.

Further, the reactive diluent of the component (C) is preferably a difunctional (meth) acrylate monomer.

Moreover, the resin composition for sealing the above electronic device is preferably The hydrocarbon softener of the above component (d1) is polybutene or/and polyisobutylene.

Moreover, it is preferable that the resin composition for sealing an electronic device is a hydrogenated petroleum resin which is a hydrocarbon-based adhesion-imparting agent of the component (d2).

Moreover, it is preferable that the resin composition for sealing an electronic device is hydrogenated by 50% or more of the unsaturated bond of the butadiene skeleton of the polybutadiene polymer.

In order to solve the above problems, the electronic device of the present invention is characterized in that it is sealed by using a sealing material for a resin composition for sealing an electronic device according to any one of the above.

The above electronic device preferably has flexibility.

Further, the electronic device is preferably an organic device having active organic components, and the sealing member is disposed on, above, or around the active organic component.

The organic device is an organic electroluminescence device, and the active organic component may be formed of a cathode, a light-emitting layer, and an anode.

Furthermore, the electronic device may be a touch screen having a substrate made of glass or a polymer and a substantially transparent conductive metal disposed on the substrate, and the sealing material is disposed on the metal. Up, up, or around.

In addition, the electronic device may also be a photovoltaic device having a photovoltaic cell or a photovoltaic cell array, and the sealing material is disposed on, above, or around any of the photovoltaic cells or any of the foregoing photovoltaic cells.

In addition, the above electronic device may be a thin film transistor having a semiconductor layer, wherein the sealing material is disposed on, above, or around the semiconductor layer.

The resin composition for sealing an electronic device of the present invention can sufficiently suppress the permeation of water vapor. Further, since the electronic device of the present invention is sealed by using the resin composition for sealing an electronic device, deterioration due to water vapor transmission can be sufficiently reduced.

1A, 1B, 1C‧‧ ‧ photovoltaic cells

101A, 101B, 101C‧‧‧ Component state photovoltaic cells

102A, 103A, 103B, 102C‧‧‧Next sealing layer

104A, 104B‧‧‧ substrate on the front side

105A, 105B, 105C‧‧‧ substrate on the back side

2A, 2B‧‧‧ film transistor

201, 208‧‧‧ substrate

202, 209‧‧ ‧ gate electrode

203‧‧‧Dielectric material

204‧‧‧ Surface modified film

205‧‧‧Semiconductor layer

206, 213‧‧‧ source electrode

207, 214‧‧‧汲electrode

210‧‧‧gate dielectric

211‧‧‧ Substantial non-fluorinated polymer layer

212‧‧‧Organic semiconductor layer

Figure 1 is a schematic cross-sectional view of a photovoltaic cell exemplified.

2 is a schematic cross-sectional view of a photovoltaic cell exemplified.

3 is a schematic cross-sectional view of a photovoltaic cell exemplified.

Fig. 4 is a schematic cross-sectional view showing a thin film transistor exemplified.

Fig. 5 is a schematic cross-sectional view showing a thin film transistor exemplified.

Hereinafter, embodiments of the present invention will be described in detail. In the present specification, "(meth)acrylic acid" means "acrylic acid" and/or "methacrylic acid".

The resin composition for sealing an electronic device according to the embodiment of the present invention contains (A) a polybutadiene polymer having a (meth)acryl fluorenyl group at the terminal represented by the following chemical formula (1), and (B) photopolymerization initiation. Agent, without quality A thermoplastic resin having a volume average molecular weight of 50,000 or more.

(wherein R ¹ and R ² each independently represent a hydroxyl group or H ₂ C=C(R ⁷ )-COO-, and R ³ and R ⁴ each independently represent a substituted or unsubstituted divalent organic group having 1 to 16 carbon atoms; The group, R ⁵ , R ⁶ and R ⁷ each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and contains at least one organic group represented by the following chemical formula (2), and each of l and m independently represents 0 or An integer of 1 , n represents an integer from 15 to 150, and x: y = 0 to 100: 100 to 0, except that R ¹ and R ² are both hydroxyl groups).

(A) The polybutadiene polymer can be obtained by a urethanization reaction of a polybutadiene polymer having a hydroxyl group introduced into a molecular end with a 2-(meth)acryloxyethyl isocyanate or the like. Alternatively, a polybutadiene polymer having a hydroxyl group introduced at the end of the molecule may be reacted with a diisocyanate such as hexamethylene diisocyanate and then reacted with (meth)acrylic acid.

The polybutadiene polymer preferably has a mass average molecular weight of 500. The above is less than 50,000, more preferably 1,000 or less and less than 10,000, and more preferably 1,000 or more. When the molecular weight is 50,000 or more, the water vapor permeation suppressing effect is high, but the viscosity of the electronic device sealing resin composition is increased, and the coating property is lowered to entrain the air into the electronic device sealing resin composition and the substrate. The situation between the two. When the molecular weight is less than 500, the crosslinking density becomes too high, and the bending resistance of the resin composition for sealing an electronic device after hardening may be insufficient. Further, the mass average molecular weight of the present invention is based on a calibration line calculated by a gel permeation chromatography (GPC) and prepared using a polystyrene standard material.

The fine structure of the polybutadiene resin is expressed by the ratio of the 1,2 structure to the 1,4 structure and the cis-trans structure of the 1,4 structure. 1,2 construction quantities are often referred to as vinyl content. The vinyl content of the polybutadiene can vary from about 5% to about 90%. The ratio of cis to trans configuration can vary from about 1:10 to about 10:1.

The polybutadiene polymer can also be hydrogenated, the cis and trans two, 4, 4 structures become ethylene structures, and the 1, 2 structure becomes 1-butene structure. When hydrogenation is used to reduce double bonds and improve thermal stability, weather resistance, chemical resistance, water vapor barrier properties, etc., as shown in the following chemical formulas (3) to (5), the butadiene skeleton has an unsaturated state. 50% or more of the bond, preferably 80% or more, more preferably 90% or more by hydrogenation. Further, the polybutadiene polymer of the component (A) is a polybutadiene polymer having a (meth)acryl fluorenyl group at the terminal represented by the chemical formulas (3) to (5), and comprises a butadiene skeleton. The concept of hydrogenation of more than 50% of unsaturated bonds.

(In the formulae (3) to (5), R ¹ and R ² each independently represent a hydroxyl group or H ₂ C=C(R ⁷ )-COO-, and R ³ and R ⁴ each independently represent a substituted carbon number of 1 to 16. And an unsubstituted divalent organic group, each of R ⁵ , R ⁶ and R ⁷ independently represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and contains at least one organic group represented by the chemical formula (2), and m each independently represents an integer of 0 or 1, n represents an integer of 15 to 150, and x: y = 0 to 100: 100 to 0, except that R ¹ and R ² are both hydroxyl groups).

On the other hand, in the case of a high-cis polybutadiene having a large number of 1,4 structures, the structure after hydrogenation is close to a crystalline polyethylene structure, and the glass transition temperature also increases as the hydrogenation rate increases. In addition, when there are many structures of 1,2, when there are stereological regularities of syndiotactic or isotactic on the chains of the 1,2 structure, there is a possibility of exhibiting crystallinity, and due to changes in physical properties, There is a case where the coating property is lowered with an increase in viscosity, or the flexibility after hardening is insufficient. Therefore, when the pressure is suppressed, the hydrogenation ratio of less than 90% is preferable, and it is preferably less than 80%. The average number of hydroxyl groups per molecule varies from about 1 to 3, but is preferably from about 1.5 to about 3, more preferably from about 1.5 to about 2.5.

(B) Photopolymerization initiators are, for example, benzophenone-based photopolymerization initiators, acetophenone-based photopolymerization initiators, thioxanthone-based photopolymerization initiators, and benzoin-based light A polymerization initiator or the like.

The benzophenone-based photopolymerization initiator is, for example, KAYACURE-BP100 (benzophenone, manufactured by Nippon Kayaku Co., Ltd.), SANYO OBA (benzimidylbenzoic acid, manufactured by Nippon Paper Co., Ltd.), SANYO OBM (methyl benzoyl benzoate, manufactured by Nippon Paper Industries Co., Ltd.), TRIGANOL 12 (4-phenylbenzophenone, Akzo), KAYACURE-MBP (3,3'-dimethyl-4-methyl) Oxybenzophenone, manufactured by Nippon Kayaku Co., Ltd.), KAYACURE-BMS ([4-(methylphenylthio)phenyl)phenyl ketone, manufactured by Nippon Kayaku Co., Ltd.), ESACURE-TZT (2,4,6-trimethylbenzophenone, Lamberti), IRGACURE 651 (2,2-dimethoxy-1,2-diphenylethane-1-one, manufactured by BASF Corporation )Wait.

The acetophenone-based photopolymerization initiator is exemplified by, for example, DAROCUR 1173 (2-hydroxy-2-methyl-1-phenylpropan-1-one, manufactured by BASF Corporation), DAROCUR 1116 (1-(4-isopropyl) Phenyl)-2-hydroxy-2-methylpropan-1-one, manufactured by BASF Corporation, IRGACURE 184 (1-hydroxycyclohexyl phenyl ketone, manufactured by BASF Corporation), DAROCUR 953 (1-(4-12) Alkylphenyl)-2-hydroxy-2-methylpropan-1-one, manufactured by BASF Corporation, DAROCUR 2959 (4-(2-hydroxyethoxy)-phenyl (2-hydroxy-2-propyl) ) Ketone, manufactured by BASF Corporation, etc.

The thioxanthone-based photopolymerization initiator is exemplified by, for example, NISSOCURE-TX (thioxanthone, manufactured by Nippon Soda Co., Ltd.), NISSOCURE-MTX (2-methylthioxanthone, manufactured by Nippon Soda Co., Ltd.), KAYACURE- RTX (2,4-dimethylthioxanthone, manufactured by Nippon Kayaku Co., Ltd.), KAYACURE-CTX (2,4-dichlorothioxanthone, manufactured by Nippon Kayaku Co., Ltd.), KAYACURE-DETX (2) , 4-diethyl thioxanthone, manufactured by Nippon Kayaku Co., Ltd.), KAYACURE-DITX (2,4-diisopropylthioxanthone, manufactured by Nippon Kayaku Co., Ltd.), and the like.

The benzoin photopolymerization initiator is exemplified by, for example, NISSOCURE-BO (thioxanthone, manufactured by Nippon Soda Co., Ltd.), NISSOCURE-MBO (benzoin methyl ether, manufactured by Nippon Soda Co., Ltd.), and NISSOCURE-EBO. (Benzene ethyl ether, manufactured by Japan Soda Co., Ltd.), IRGACURE 65 (benzyl methyl acetal, manufactured by BASF Corporation) Wait.

Other photopolymerization initiators are exemplified by 1-phenyl-1,2-propanedione-2(o-ethoxycarbonyl)anthracene and the like. The trade name is, for example, QUANTACURE-PDO (manufactured by Ward Blenkinsop Co., Ltd.).

The amount of the photopolymerization initiator is an effective amount, and is typically in the range of 0.01 to 20 parts by mass per 100 parts by mass of the (meth) acrylate. By setting this composition, the polymerization reaction via the active ingredient formation reaction can be appropriately controlled. The selection of the photopolymerization initiator is at least partially dependent on the (meth) acrylate used for the resin composition for sealing, and the desired curing rate, and one or two or more kinds may be used in any ratio.

The resin composition for sealing an electronic device of the present invention does not contain a thermoplastic resin having a mass average molecular weight of 50,000 or more. When a thermoplastic resin having a mass average molecular weight of 50,000 or more is contained, the viscosity is increased and the coatability is lowered.

The resin composition for sealing an electronic device of the present invention preferably contains (C) a reactive diluent. (C) The reactive diluent is such that the viscosity of the resin composition for sealing an electronic device is lowered, and it is easy to apply. Further, since the resin composition for sealing an electronic device can be polymerized when it is cured, the water permeability is low as compared with the simple diluted component, and the sealed electronic component or the active organic component can be prevented from being exposed to moisture or suppressed to a minimum. limit. In addition, when the optimum amount is contained, the water vapor barrier property can be improved. Further, the electronic device can be sealed by hardly increasing the low molecular weight component contained in the electronic device sealing resin composition for polymerization, and corrosion or suppression of metal constituent elements such as electrodes in the device can be prevented to a minimum.

(C) The reactive diluent may be a liquid photopolymerizable starting monovinyl monomer selected from vinyl esters such as vinyl acetate, (meth)acrylic monomers, N-vinyl monomers, and polythiol compounds. Further, the effect of lowering the viscosity is exerted, and the (meth)acrylic monomer is preferred because it is easy to simultaneously control the (A) polybutadiene polymer and the curing system.

The (meth)acrylic monomer is exemplified by, for example, n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, isomyristyl (meth)acrylate, ( Isostearyl methacrylate, n-octadecyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxy (meth) acrylate Propyl ester, 4-hydroxybutyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, morpholine ‧(M) acrylate, 1,4-butanediol ‧ di(meth) acrylate, dicyclopentadiene dimethylol ‧ (meth) acrylate, cyclohexane dimethylol ‧ (meth) acrylate, hexanediol ‧ di(meth) acrylate, decane diol ‧ di (meth) acrylate, phenoxy ethyl acrylate, tricyclodecane dimethanol ‧ two (a Acrylate, trimethylolpropane ‧ tri(meth) acrylate, ginseng (2-hydroxyethyl) isocyanurate ‧ tri (meth) acrylate, (meth) acrylate and polyol Ester and the like. Among these, a (meth) acrylate monomer having a large viscosity reduction effect, a high water vapor barrier property, and a polyfunctional (meth) acrylate monomer is preferable. Further, it is preferably a hexanediol ‧ di(meth) acrylate or a tricyclodecane dimethanol ‧ (b) which has a high effect of improving the water vapor barrier property by being combined with the (A) polybutadiene polymer Methyl) acrylate, 1,4-butanediol ‧ di(meth) acrylate.

The N-vinyl monomer is exemplified by, for example, N,N-dimethylpropenylamine, N-vinylpyrrolidone, N-vinylcaprolactam or the like. The polythiol compound is not particularly limited as long as it has 2 to 6 fluorenyl groups in the molecule, and examples thereof include aliphatic polythiols such as an alkyl dithiol having a carbon number of 2 to 20, and aromatic hydrocarbons such as xylene dithiol. a polythiol; a polythiol formed by substituting a halogen atom of an alcoholic halohydrin adduct; a polythiol formed from a hydrogen sulfide reaction product of a polyepoxy compound; A polythiol formed from a polyhydric alcohol having 2 to 6 hydroxyl groups in the molecule, and an ester compound of thioglycolic acid, β-propionic acid or β-indolyl acid.

The content ratio (A) of the component (A) and the component (C) in the resin composition for sealing electronic devices of the present invention: (C), based on the viewpoint of viscosity and water vapor barrier property, is important in terms of mass ratio 5:95~50:50, preferably 5:95~40:60, more preferably 10:90~30:70, and even better 20:80~30:70. By setting the (A) component and the (C) component to an optimum content ratio, the viscosity can be lowered and the water vapor barrier property can be greatly improved. When the content ratio is not optimal, the viscosity reduction effect is small and the coating conditions may be limited, and the water vapor barrier property may not be effectively exhibited even if the viscosity is lowered.

The resin composition for sealing an electronic device of the present invention preferably contains (D) a hydrocarbon compound having a number average molecular weight of less than 50,000. In the present invention, the hydrocarbon compound of the component (D) exhibits an effect of lowering the water permeability of the resin composition for sealing an electronic device, and suppressing the effect of the sealed electronic component and the active organic component being exposed to moisture.

The hydrocarbon compound may have various number average molecular weights, preferably 300 or more and less than 50,000, more preferably 500 or more and less than 30,000, and more It is preferably 500 or more and 10,000 or less. When the molecular weight is less than 50,000, the viscosity of the resin composition for sealing an electronic device is not greatly increased, and the water vapor barrier property can be improved. If the number average molecular weight is less than 300, since the resin composition for sealing the electronic device directly or through the coating film of the film seals the active organic component, the active organic component to be sealed is formed, in particular, by a metal layer having a low work function. The electrode layer is affected, and the life of the device is shortened. In addition, even if the number average molecular weight is less than 50,000, if the mass average molecular weight is 50,000 or more, the viscosity of the resin composition for electronic device sealing is greatly improved, and the coating property is remarkably impaired.

The total content of the component (A) and the component (C) in the resin composition for sealing electronic devices of the present invention, and the content ratio of the component (D) [(A) + (C)]: (D), based on water vapor barrier The viewpoint of the resistance, the viscosity, and the bending resistance after hardening can be adjusted in a mass ratio of 20:80 to 70:30, [(A)+(C)]: (D) is preferably 30:70 to 50:50. .

The hydrocarbon compound may be a saturated hydrocarbon compound or an unsaturated hydrocarbon compound. Unsaturated bonds such as carbon-carbon double bonds may also be modified by hydrogenation, maleation, epoxidation, amination, or the like. Hydrogenation is preferred because it has improved water vapor barrier properties, transparency, and compatibility with other saturated hydrocarbon compounds. Maleic acidification, epoxidation, and amination are preferred for improving the adhesion between the cap and the substrate and the compatibility with other functional group-containing compounds.

Examples of the hydrocarbon compound which can be used are liquid rubber such as naphthenic oil, paraffin oil, low molecular polyisobutylene resin, polybutene, polyisoprene, low molecular weight polyethylene, low molecular polypropylene, and cyclic olefin polymerization. Material, oil Resin, rosin resin, terpene resin, or derivatives thereof, etc., but are not limited thereto.

When a hydrocarbon compound is used, a combination of a hydrocarbon compound or a plurality of hydrocarbon compounds can be used. However, as a result of a positive review by the present inventors, it has been found that (d1) a hydrocarbon having a plasticizing effect in addition to water vapor barrier properties The softener and the (d2) hydrocarbon-based adhesion-imparting agent having an adhesion improving effect in addition to the water vapor barrier property can obtain water vapor barrier properties at a low viscosity.

The mechanism for obtaining a low viscosity and high water vapor barrier property by using (d1) a hydrocarbon-based softener and (d2) a hydrocarbon-based adhesion-imparting agent is not clear, but it is presumed as follows. That is, since the hydrocarbon compound of the component (D) is a low molecular compound, the viscosity of the electronic device sealing resin composition before curing is not greatly improved. On the other hand, after hardening, it is considered that the hydrocarbon compound of the component (D) enters the inside of the mesh structure formed by the polymerization of the component (A) and the component (B) or the components (A) to (C), thereby filling the gap and increasing the water. Vapor barrier properties. Here, when the (d1) hydrocarbon-based adhesion-imparting agent is not used and the (d2) hydrocarbon-based adhesion-imparting agent is not used, it is not possible to enter the mesh structure by the interstitial gap, or it may be too hard even if it enters. Since a gap is generated, it is considered that the water vapor barrier property cannot be improved. On the other hand, when the (d1) hydrocarbon-based adhesion-imparting agent is not used and the (d1) hydrocarbon-based softener is not used, the water vapor barrier property of the hydrocarbon-based compound itself is insufficient even if the gap between the mesh structures is buried, and it is considered that it is almost impossible. Improve water vapor barrier properties.

(d1) Specific examples of the hydrocarbon-based softener are CALSOL 5120 (a naphthenic oil, manufactured by Calumet Lubricants Co.), KAYDOL (alkane system, white mineral oil, manufactured by Witco Co.), TETRAX (manufactured by Nippon Oil Co.), PARAPOL 1300 (manufactured by ExxonMobil Chemical Co.), and INDOPOL H-300 (manufactured by BPO Amoco Co.) , Glissopal (low-molecule polyisobutylene, manufactured by BASF), Nissan polybutene (polybutene with a molecular structure of long-chain hydrocarbons derived from isobutylene and partially cationically polymerized, JX Nitto Nippon Energy Co., Ltd.), ESSEN polybutene (polybutylene polymerized by cationic polymerization of isobutylene and n-butene, manufactured by Nippon Oil Co., Ltd.), PARLEAM (hydrogenated polybutene, manufactured by Nippon Oil Co., Ltd.), KURAPRENE LIR (Liquid isoprene rubber, manufactured by KURARAY Co., Ltd.), KURAPRENE LBR (liquid butadiene rubber, manufactured by Kuraray Co., Ltd.), but is not limited thereto.

(d2) Examples of the hydrocarbon-based adhesion-imparting agent are CLEARON (hydrogenated terpene-based resin, manufactured by YASUHARA CHEMICAL Co., Ltd.), ESTERGUM, and SUPER ESTER (hydrogenated rosin-based resin or hydrogenated rosin ester-based resin, Arakawa Chemical Industry Co., Ltd. PIN), PINECRYSTAL (Suihua rosin resin or bismuth ester rosin resin, manufactured by Arakawa Chemical Industry Co., Ltd.), ESCOREZ 5300 and 5400 series (pentene, isoprene, piperine produced by thermal decomposition of petroleum brain) (Crine hydrogenated dicyclopentadiene resin, manufactured by ExxonMobil Chemical Co.) and EASTOTAC (C5 hydrogenated dicyclopentadiene) obtained by copolymerization of a piper and a C5 fraction such as 1,3-pentadiene. Resin, manufactured by Eastman Chemical Co., Inc., ESCOREZ 5600 series (partially hydrogenated aromatic modified dicyclopentadiene resin, ExxonMobil Chemical Co.) System), ARCON (C9-based hydrogenated petroleum resin obtained by copolymerization of C9 fractions such as pyrene, vinyl toluene and α- or β-methylstyrene produced by thermal decomposition, manufactured by Arakawa Chemical Industries Co., Ltd. ), I-MARV (copolymerized hydrogenated petroleum resin of C5 fraction and C9 fraction, manufactured by Idemitsu Kosan Co., Ltd.), but is not limited thereto.

Other than the above, the non-hydrogenated alicyclic hydrocarbon resin is exemplified by a C5, C9, C5/C9 hydrocarbon resin, a polyterpene resin, an aromatic modified polyterpene resin, or a rosin derivative. When a non-hydrogenated alicyclic hydrocarbon resin is used, it is typically used in combination with other hydrogenated or partially hydrogenated adhesion-imparting agents. The non-hydrogenated alicyclic hydrocarbon resin may be used in an amount of less than about 30% by mass based on the total weight of the electronic device sealing resin composition.

The hydrocarbon-based adhesion-imparting agent may also contain a hydrogenated petroleum resin, specifically a hydrogenated alicyclic petroleum resin. Specific examples of the hydrogenated alicyclic petroleum resin are ESCOEZ 5300 series (manufactured by ExxonMobil Chemical Co., Ltd.) and I-MARV P series (manufactured by Idemitsu Kosan Co., Ltd.). In order to improve the water vapor barrier property and transparency, the hydrogenated alicyclic petroleum resin may be a hydrogenated dicyclopentadiene resin. The hydrogenated alicyclic petroleum resin which can be used in the resin composition for electronic device sealing has a mass average molecular weight of usually 200 to 5,000, and the hydrogenated alicyclic petroleum resin preferably has a mass average molecular weight of 500 to 3,000. When the mass average molecular weight exceeds 5,000, there is a lack of adhesion, or the suitability for (d1) a hydrocarbon-based softener may be lowered.

The hydrocarbon-based adhesion-imparting agent may have a softening temperature or a softening point (ring-spinning softening temperature) which can be at least partially dependent on the adhesiveness of the electronic device sealing resin composition, the use temperature, and the coating conditions. Global law The softening temperature is generally from about 50 ° C to 200 ° C, preferably from about 80 ° C to 150 ° C. The range of the ring and ball softening temperature of a commercially available general hydrocarbon-based adhesion-imparting agent is as long as it is used in the above range. For example, the ESCOREZ 5380 series ESCOREZ 5380 has a softening point of 86 ° C, ESCOREZ 5300 is 105 ° C, ESCOREZ 5320 is 124 ° C, and ESCOREZ 5340 is 140 ° C, so it can be appropriately selected.

When the (d1) hydrocarbon-based softening agent and the (d2) hydrocarbon-based adhesion-imparting agent are used, polybutene as the (d1) hydrocarbon-based softening agent and hydrogenated dicyclopentane as the (d2) hydrocarbon-based adhesion-imparting agent can be used. A combination of olefinic resins. Further, a combination of polybutene as the (d1) hydrocarbon-based softener and a non-hydrogenated alicyclic hydrocarbon-based resin as the (d2) hydrocarbon-based adhesion-imparting agent may be used, but it is not limited thereto.

In the resin composition for sealing electronic devices of the present invention, the water vapor barrier property and the bending resistance after curing are improved by containing a large amount of the (d1) hydrocarbon-based softener, and a large amount of (d2) hydrocarbon-based adhesive is contained. It is preferred that the water vapor barrier property is greatly increased when the agent is added. (d2) Since the hydrocarbon-based adhesion-imparting agent is almost a hydrophobic compound derived from petroleum, essential oil or turpentine, the water vapor barrier property is high. The content ratio (d1) of (d1) and (d2): (d2) exhibits a multiplication effect when the mass ratio is 20:80 to 80:20.

A filler, a coupling agent, an ultraviolet absorber, an ultraviolet stabilizer, an antioxidant, a stabilizer, or a combination of these may be added to the resin composition for sealing an electronic device. The amount of the additive is typically selected so as not to adversely affect the hardening speed of the (A) polybutadiene-based polymer or to adversely affect the physical properties of the resin composition for sealing the electronic device.

Examples of fillers that can be used include calcium or magnesium carbonates (for example, calcium carbonate, magnesium carbonate, and dolomite), and citrates (for example, kaolin, fired clay, pyrophyllite, bentonite, strontium). Mica, zeolite, talc, attapulgite, and ash, citric acid (eg, diatomaceous earth, and cerium oxide), aluminum hydroxide, pearlite, barium sulfate (eg, sedimentation) Barium sulfate), calcium sulfate (for example, gypsum), calcium sulfite, carbon black, zinc oxide, titanium dioxide, but not limited thereto.

Fillers can also have different particle sizes. For example, when it is desired to provide a resin composition for sealing an electronic device having a high transmittance in a visible light region, the average primary particle diameter of the filler is preferably in the range of 1 to 100 nm, more preferably in the range of 5 to 50 nm. Further, when a filler in a plate form or a squamous form is used in order to improve the permeability of low water molecules, the average particle diameter is preferably in the range of 0.1 to 5 μm, and the resin composition for sealing can be dispersed based on the filler. From a sexual point of view, a hydrophobic filler can be treated with a hydrophobic surface. Hydrophobic Surface Treatment The hydrophilic filler can be obtained by denaturation of any conventional hydrophilic filler by hydrophobic treatment. For example, an alkyl group having a hydrophobic group such as n-octyltrialkoxydecane, an alkyl or alkyl decane binder, a decylating agent such as dimethyldichlorodecane or hexamethyldiazepine, or a hydroxyl group terminal The surface of the hydrophilic filler is treated with a higher alcohol such as polydimethyl methoxy alkane or stearyl alcohol or a higher fatty acid such as stearic acid. Further, the average particle diameter in the present invention is determined by a laser diffraction scattering type particle size distribution measurement method.

As an example of the cerium oxide filler, the product treated with dimethyldichloromethane is exemplified by, for example, AEROSIL-R972, R974 or R9768 (manufactured by Nippon Aerosil Co., Ltd.), and hexamethyldiene. The decazane-treated product is exemplified by, for example, AEROSIL-RX50, NAX50, NX90, RX200, or RX300 (manufactured by Nippon Aerosil Co., Ltd.), and the octyl decane-treated product is exemplified by, for example, AEROSIL-R805 (Nippon). Manufactured by Aerosil Co., Ltd., the product treated with dimethyl oxime oil is exemplified by AEROSIL-RY50, NY50, RY200S, R202, RY200 or RY300 (manufactured by Nippon Aerosil Co., Ltd.). And CAB ASIL TS-720 (manufactured by Cabot Co., Ltd.), but it is not limited to these.

The fillers may be used singly or in combination. When the filler is contained, the amount of the filler to be added is generally 0.01 to 20% by mass based on the total amount of the resin composition for sealing the electronic device.

Further, the addition of a coupling agent which is not used as a particle surface modifier can improve the adhesion of the electronic device sealing composition. These coupling agents typically have a moiety that reacts or interacts with the organic component and a moiety that reacts or interacts with the inorganic component. Useful coupling agents are exemplified by, for example, methacryloxypropylmethyldimethoxydecane (manufactured by Shinestsu Chemical Co., Ltd., KBM502), 3-mercaptopropylmethyldimethoxydecane (Shinestsu Chemical). Co., Ltd., KBM802), and glycidylpropyltrimethoxydecane (manufactured by Shinestsu Chemical Co., Ltd., KBM403).

Examples of the ultraviolet absorber are benzotriazole-based compounds, oxazolic acid amide-based compounds, and benzophenone-based compounds, but are not limited thereto. When the ultraviolet absorber is used, the ultraviolet absorber may be about 0.01 mass based on the total amount of the resin composition for sealing. The amount is used in an amount of % to 3% by mass.

Examples of the antioxidant which can be used are, for example, a hindered phenol compound and a phosphate compound, but are not limited thereto. When an antioxidant is used, the antioxidant can be used in an amount of about 0.01 to 2% by mass based on the total amount of the resin composition for sealing.

Examples of stabilizers that can be used are phenolic stabilizers, hindered amine stabilizers, imidazole stabilizers, dithiocarbamate stabilizers, phosphorus stabilizers, thioester stabilizers, and phenosomes. Thiazide, but is not limited to these. When a stabilizer is used, the stabilizer can be used in an amount of about 0.001 to 3% by mass based on the total amount of the resin composition for sealing.

The resin composition for sealing an electronic device can be prepared by various methods. For example, the resin composition for sealing an electronic device can be prepared by completely mixing the above compounds. Any mixer such as a kneader or a 3-axis roll for mixing the composition may be used. The obtained composition can be used as a resin composition for sealing an electronic device, or can be combined with other components to form a resin composition for sealing an electronic device.

The resin composition for sealing an electronic device of the present invention can be applied to a substrate, a cover, an arbitrary component of an electronic device or the like by a screen printing method or the like to seal the electronic device. The coating of the resin composition for electronic device sealing on the substrate or the like can also be carried out by a conventional method such as die coating, spin coating, blade coating, rolling, or the like. Moreover, it is sealed at room temperature (25 ° C) to 100 ° C, preferably at normal temperature (25 ° C) to 80 ° C, without pressure, or pressed at a pressure of 1.0 MPa or less for 30 seconds to 5 minutes. Hehe. Subsequently, the resin composition for sealing an electronic device of the present invention is ultraviolet ray It is hardened by irradiation, and it seals an electronic device as a sealing material. The thickness of the sealing material can be appropriately designed, and can be, for example, various thicknesses of about 5 to 200 μm, about 10 to 100 μm, or about 25 to 100 μm.

Since the resin composition for sealing an electronic device of the present invention contains only a little water or is completely contained, the adverse effect of the moisture of the resin composition for electronic device sealing on the electronic device is suppressed to a minimum. Further, since the moisture permeability is low, it is possible to prevent the constituent elements of the sealed electrons and the active organic component from being exposed to moisture or to a minimum. Further, the resin composition for sealing an electronic device can be designed to contain only a small amount of an acidic component or be completely contained, so that corrosion or suppression of a metal component such as an electrode in an electronic device can be prevented to a minimum.

Further, the resin composition for sealing an electronic device of the present invention exhibits good adhesion characteristics. Further, since the resin composition for sealing an electronic device has sufficient coatability, the air which is a void is hardly caught in the sealed electronic device or is not caught at all. Further, the resin composition for sealing an electronic device of the present invention can reduce the release of a large amount of gas which is a problem in an adhesive used in an electronic device. Further, the resin composition for sealing an electronic device of the present invention is applied onto a base film, or after the application, the resin composition for sealing is not cured, and ultraviolet rays having a low temperature of less than 1 J/cm ^{2 are} irradiated to form a sheet. By forming an adhesive seal layer, the operability can also be improved. In the present specification, a sheet including a base film and an adhesive sealing layer is referred to as a sheet for adhesive encapsulation. When sealing is performed using the sheet for adhesive sealing, it is bonded by heating at a pressure of 50 to 100 ° C and a pressure of 0.3 to 1.0 MPa for 30 seconds to 5 minutes.

The resin composition for sealing an electronic device of the present invention also has a high transmittance (at least about 80%) in a visible light region (a wavelength region of about 380 nm to about 800 nm) of the electromagnetic spectrum. When the resin composition for sealing an electronic device has such a high transmittance in a visible light region, it can be disposed as a sealing material on the side of the light-emitting or light-receiving surface of the electronic device without being blocked, and sealed.

Further, the resin composition for sealing an electronic device of the present invention can be used in various electronic devices. The electronic device to which the resin composition for electronic device sealing of the present invention is applied can suppress the occurrence of sealing defects in which the substrate is shifted or peeled due to impact or vibration to a minimum. Moreover, as an electronic device which can use the resin composition for electronic device sealing which improves the bending resistance after hardening, the flexible display is mentioned. Other types of electronic devices that can use the resin composition for sealing electronic devices are exemplified by organic light-emitting diodes, photovoltaic cells, thin film transistors, and touch screens.

Next, a case where the above electronic device is an organic electroluminescence device will be described. The organic electroluminescence device is an active organic component light-emitting unit having at least an anode, a light-emitting layer, and a cathode, and the resin composition for sealing an electronic device described in the present specification is applied to the upper surface of the active organic component, and to the periphery thereof. Hardening, thereby forming a sealing material. In addition, the active organic component may be sealed with a sealing material obtained by curing a plurality of resin compositions for sealing electronic devices described in the present specification, and a sealing material formed by using the resin composition for electronic device sealing of the present invention may be used in combination. Sealed with other sealing materials.

Organic electroluminescent devices also have active organic parts The light unit is called a laminate. The laminate may have various configurations, for example, a combination of one light-emitting unit or two or more light-emitting units. Further, as one of the constituent elements of the laminated body, a color filter layer may be included.

The laminate can also be carried on the substrate of the device. The substrate of the device may be rigid, or rigid (not easily bendable), or may be flexible. The hard substrate may contain an inorganic material such as yttria-stabilized zirconia (YSZ), glass, or metal, and may also include a resin material such as polyester, polyimide, or polycarbonate. The flexible substrate may also comprise, for example, a fluoropolymer (for example, trifluoroethylene, polychlorotrifluoroethylene (PCTFE), vinylidene fluoride (VDF), and chlorotrifluoroethylene). CTFE) copolymer, polyimine, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, alicyclic polyolefin, or ethylene-vinyl alcohol copolymer.

The shape, configuration, size, and the like of the device are not limited. The substrate of the device mostly has a plate shape. The device can be transparent, colorless, translucent, or opaque. The substrate may also be coated with a gas barrier layer comprising an inorganic material such as SiO, SiN, DLF (diamond-like film) or DLG (diamond-like glass). The gas barrier layer film may also include a flexible visible light transmissive substrate on which a polymer and an inorganic layer are alternately disposed, and such films are described in U.S. Patent No. 7,018,713 B2 (Padiyath et al.). The gas barrier layer can also be formed by a vacuum vapor deposition method, a physical vapor deposition method, or a plasma CVD (chemical vapor deposition) method.

The anode generally functions to supply a hole to the organic light-emitting layer. Any known anode material can be used for the anode. Work function of anode material Generally, it is 4.0 eV or more, and preferred examples of the anode material are semiconductor metal oxides such as tin oxide, zinc oxide, indium oxide, and indium tin oxide (ITO), metals such as gold, silver, chromium, and nickel, and polyaniline. An organic conductive material such as polythiophene is not limited thereto. The anode typically comprises a film shape formed by, for example, vacuum evaporation, sputtering, ion plating, CVD, or plasma CVD. In either application, the anode can be patterned by etching or the like. The thickness of the anode can vary over a wide range, typically from about 10 nm to 50 μm.

The cathode used with the anode generally functions to inject electrons into the organic light-emitting layer. Any known cathode material can be used for the cathode. The work function of the cathode material is usually 4.5 eV or less, and preferred examples of the cathode material are alkali metals such as Li, Na, K, and Cs, composite materials such as LiF/Al, alkaline earth metals such as Mg and Ca, gold, and silver. , rare earth metals such as indium and antimony, and alloys such as MgAg, but are not limited thereto. The cathode typically comprises a film shape formed by, for example, vacuum evaporation, sputtering, ion plating, CVD or plasma CVD. In either application, the cathode can be patterned by etching or the like. The thickness of the cathode can vary over a wide range, typically from about 10 nm to 50 μm.

The light emitting unit disposed between the anode and the cathode may have various layer configurations. For example, the light emitting unit may be a single layer structure containing only the organic light emitting layer, or may be, for example, an organic light emitting layer/electron transport layer, a hole transport layer/organic light emitting layer, a hole transport layer/organic light emitting layer, and a hole transport layer. Multilayer construction of organic light-emitting layer/electron transport layer organic light-emitting layer/electron transport layer/electron injection layer, or electron injection layer/hole transport layer/organic light-emitting layer/electron transport layer/electron injection layer. The layers of the layers are described below.

The organic light-emitting layer may contain at least one luminescent material, and may optionally contain a hole transporting material, an electron transporting material, or the like. The luminescent material is not particularly limited, and a luminescent material generally used in the manufacture of an organic electroluminescence device can be used. The luminescent material may be exemplified by a metal complex, a low molecular weight fluorescent coloring material, a fluorescent polymer compound, or a phosphorescent material. Preferred examples of the metal complex are ginseng (8-hydroxyquinoline) aluminum complex (Alq3), bis(benzoquinoline) ruthenium complex (BeBq2), bis(8-hydroxyquinoline) zinc. The complex (Znq2) and the phenanthroline ruthenium complex (Eu(TTA)3(phen)) are not limited thereto. Preferred examples of the low molecular weight fluorescent coloring material include perylene, quinacridone, coumarin, and 2-thiophenecarboxylic acid (DCJTB), but are not limited thereto. Preferred examples of the fluorescent polymer compound are poly(p-phenylphenylene) (PPV), 9-chloromethylhydrazine (MEH-PPV), and polyfluorene (PF), but are not limited thereto. . Preferred examples of the phosphorescent material are platinum octaethylporphyrin and a cyclic metal ruthenium compound.

The organic light-emitting layer can be formed by any suitable method from the above-described light-emitting material. For example, the organic light-emitting layer can be formed by a thin film formation method such as vacuum evaporation or physical vapor deposition. The thickness of the organic light-emitting layer is not particularly limited and is generally about 5 nm to 100 nm.

The organic light emitting unit may also include a hole transport layer and/or a hole injection layer formed by the hole transport material. The hole transporting material generally functions to emit holes from the anode, transport holes, and block electrons emitted from the cathode. Preferred examples of the hole transporting material are N,N'-diphenyl-N,N'-di(m-tolyl)benzidine (TPD), N,N,N',N'-肆 (between -toluene 1,3-phenylenediamine (PDA), 1,1-bis[N,N-bis(p-tolyl)amino]phenyl]cyclohexane (TPAC) and 4,4',4 "-[N,N',N"-triphenyl-N,N',N"-tris(m-tolyl)amino]-phenylene (m-MTDATA), but is not limited thereto. The hole transport layer and the hole injection layer can be formed by a film formation method such as vacuum deposition or physical vapor deposition. The thickness of the layers is not particularly limited, and is generally 5 nm to 100 nm.

The organic light emitting unit may include an electron transport layer and/or an electron injection layer formed of an electron transport material. The electron transporting material functions to transport electrons and block holes from the anode. Preferred examples of the electron transporting material are 2-(4-t-butylphenyl)-5-(4-biphenylyl)-1,3,4-oxadiazole (PBD), and 3-(4). -T-butylphenyl)-4-phenyl-5-(4-biphenyl)-1,2,4-triazole (TAZ) AIQ, but is not limited thereto. The electron transport layer and the electron injection layer can be formed by a thin film formation method such as vacuum deposition or physical vapor deposition. The thickness of the layers is not particularly limited and may generally be from 5 nm to 100 nm.

The organic electroluminescence device disclosed in the present specification can seal the laminate by using the sealing material of the resin composition for sealing an electronic device of the present invention. The sealing material can be formed in a state of covering the entire layer of the exposed surface of the laminated body disposed on the substrate.

In the organic electroluminescence device, since the resin composition for sealing an electronic device of the present invention has a subsequent property alone, it is not necessary to provide another adhesive layer for laminating the sealing material. In other words, by omitting the laminating adhesive, the manufacturing process can be simplified and the reliability can be enhanced. Furthermore, unlike the prior art, the resin composition can be covered by the electronic device sealing. The laminated body does not leave a hollow portion between the laminated body and the cover. If there is no hollow portion, moisture permeation can be reduced, whereby deterioration of device characteristics can be prevented and a small and thin device can be obtained. When a hollow portion is desired, a gasket surrounding the adhesive of the device may also be used.

Further, the resin composition for sealing an electronic device of the present invention has transparency in a visible light region (380 nm to 800 nm) of the spectrum. Since the average permeability of the resin composition for sealing an electronic device is 80% or more or 90% or more, the resin composition for sealing an electronic device does not substantially reduce the luminous efficiency of the organic electroluminescence device. This is particularly advantageous for an upper luminescent type organic electroluminescent device.

An undynamic film for protecting the upper portion and the bottom portion of the laminate may also be disposed outside the laminate. The non-dynamic film may be formed of an inorganic material such as SiO, SiN, DLG or DLF, and formed by a film formation method such as vacuum evaporation or sputtering. The thickness of the non-dynamic film is not particularly limited and is generally about 5 nm to 100 nm.

A material capable of absorbing moisture and/or oxygen or a layer formed of the material may be disposed outside the laminate. This layer can be disposed at any position as long as the desired effect is obtained.

In addition to the above-described constituent elements, the organic electroluminescence device may include various conventional constituent elements.

When a full color device is desired, an organic electroluminescent device having a white light emitting portion can be used in combination with a color filter. This combination is not required for the three-color luminescence method. In addition, it can be used in combination with a color conversion method (CCM) or an organic electroluminescence device that corrects color purity of a color filter.

Further, the organic electroluminescence device may have a protective film as the outermost layer. The protective film may be a protective film having a water vapor barrier property or an oxygen barrier property, and the protective film is also referred to as a "gas barrier film" or a "gas barrier layer". The gas barrier layer may be formed of various materials having water vapor barrier properties. Preferred materials are listed as comprising a fluoropolymer (for example, polyethylene naphthalate, polytetrafluoroethylene, polychlorotrifluoroethylene (PCTEF), polyimine, polycarbonate, polyterephthalic acid. The polymer layer of ethylene glycol, alicyclic polyolefin and ethylene-vinyl alcohol copolymer) is not limited thereto. The polymer layer may be used, or the polymer layer may be coated with an inorganic film (for example, yttrium oxide, tantalum nitride, aluminum oxide, DLG or DLF) by a film formation method (for example, sputtering). . Further, the gas barrier layer may have a flexible visible light transmissive substrate in which a polymer layer and an inorganic layer are alternately disposed. The protective film can be used as described in U.S. Patent No. 7,018,713 B2 (Padiyath et al.). The thickness of the gas barrier layer can vary over a wide range and can generally range from about 10 nm to 500 μm.

The organic electroluminescent device disclosed in the present specification can be utilized as an illumination or display means in various fields. Applications include, for example, lighting devices used in place of fluorescent lamps, or display devices such as computer devices, television receivers, DVDs (digital optical disks), audio equipment, measuring machinery, mobile phones, PDAs (Mobile Information Terminals), and panels, or A light source array such as a backlight unit and a printer.

Further, the resin composition for sealing an electronic device of the present invention can also be used for encapsulating a metal and a metal oxide which are disposed on a substrate. Elements. For example, the resin composition for sealing an electronic device can be used for a touch screen in which a substantially transparent conductive metal such as indium tin oxide (ITO) is deposited on a substrate such as glass or a polymer film such as cellulose triacetate. . The resin composition for sealing an electronic device does not contain any acidic element that causes corrosion of the metal and/or the substrate, or even if it is contained in a small amount, corrosion of the metal and/or the substrate can be prevented.

Further, the resin composition for sealing an electronic device of the present invention can also be used as a sealing material disposed on, above, or around a photovoltaic cell. The photovoltaic cells may also be configured as an array (a series of photovoltaic cells connected to each other), and part or all of the plurality of photovoltaic cells constituting the array may be sealed by the resin composition for sealing electronic devices of the present invention.

In general, photovoltaic cells are semiconductor devices that convert light into electricity, sometimes referred to as solar cells. When a photovoltaic cell is exposed to light, a voltage is generated between the positive electrode and the negative electrode, with the result that electrons flow. The magnitude of the voltage is proportional to the intensity of the photovoltaic contacts formed by the light impinging on the surface of the cell. Typically, a solar cell or a solar cell module is electrically connected to a specific device or connected to each other in order to generate a common voltage for storing electricity, thereby forming a solar cell array functioning as a single power generating unit.

The semiconductor materials used in photovoltaic cells include crystalline or polycrystalline hafnium or thin films, such as amorphous, semi-crystalline hafnium, gallium arsenide, copper indium diselenide, organic semiconductors, CIG, and the like. Two types of semiconductor materials using semiconductor materials of thin films and thin films in photovoltaic cells. The semiconductor material of the wafer is a mechanically cut from a single crystalline or polycrystalline ingot, or a thin sheet of semiconductor material fabricated using casting. Thin film semiconductor material A continuous layer of semiconductor material disposed on a substrate or supersubstrate by sputtering or chemical vapor deposition processes.

Photovoltaic cells for wafers and thin films are mostly brittle with a degree that they must have more than one support. The support may be formed of a rigid material such as a glass plate, or may be a preferred material such as a metal film and/or a polyimide or polyethylene terephthalate. Formed from a thin sheet of material. The support can be tied to the uppermost layer or substrate between the photovoltaic cell and the light source, in which case the support passes light from the source. Instead of or in addition to this, the support may also be anchored to the bottom layer behind the photovoltaic cell.

The resin composition for electronic device sealing can be disposed on, above, or around the photovoltaic cell. By using the electronic device sealing resin composition, the photovoltaic cell can be protected from the environment and/or the battery can be attached to the support. The resin composition for sealing an electronic device can also be used as one of several kinds of sealing materials which are formed of the same composition or different compositions. Further, the resin composition for sealing an electronic device can be directly applied to a battery and then cured, or an adhesive layer in which a resin composition for sealing an electronic device is formed into a sheet-like shape can be laminated on a photovoltaic cell, followed by subsequent deposition. The sealing layer is hardened.

Fig. 1 is a view showing a cross-sectional structure of a photovoltaic cell 1A in which a photovoltaic cell 101A in a state in which an element is sealed by an encapsulating layer 102A, 103A is used. Further, on the outer surface of the adhesive sealing layers 102A and 103A, a substrate 104A on the front side and a substrate 105A on the back side are provided.

2 is a view showing a cross-sectional structure of a photovoltaic cell 1B according to a modification, in which a photovoltaic cell 1B in an element state is disposed on a substrate 104B on the front side by a preferred method such as chemical vapor deposition. Then, the adhesive sealing layer 103B including the detachable base film (not shown) is placed on the photovoltaic cell 1B, and the base film is peeled off and the base on the back side is laminated thereon. In the state of the material 105B, the adhesive sealing layer 103B is cured, whereby the photovoltaic cell 101B in the element state is sealed. In the photovoltaic cell 1B, the adhesive sealing layer 103B including the detachable base film may be bonded to the back surface side substrate 105B, and the base film may be peeled off and the surface may be bonded. The adhesive sealing layer 102B is cured on the photovoltaic cell 101B in the element state.

Fig. 3 is a view showing a cross-sectional structure of another exemplary photovoltaic cell 1C, in which a photovoltaic cell 101C in an element state is disposed on a substrate 105C on the back side by a preferred method such as chemical vapor deposition. Next, the photovoltaic cell 101C in the state of the element is sealed using the adhesive sealing layer 102C including the adhesive encapsulating sheet, for example, a removable base film (not shown). The substrate on the front side may be used as needed, or a removable substrate film may be used as the substrate on the front side.

The resin composition for sealing the electronic device may be disposed on, above, or around the semiconductor layer of the thin film transistor. A thin film electro-crystal system is a special type of field effect transistor fabricated by disposing a thin film formed of a semiconductor material, a dielectric layer in contact with a substrate, and a metal. A thin film transistor can be used to drive the light emitting device.

Useful semiconductor materials are listed above for photovoltaic cells And organic semiconductors. The organic semiconductors are exemplified by small molecules such as erythrene, tetracene, pentacene, quinone diimide, tetracyanoquinodimethane, and polythiophene and polyfluorene containing poly(3-hexylthiophene). An aromatic or other conjugated electron system of a polymer such as polydiacetylene, poly(2,5-extended acetylene extended ethylene), or poly(p-phenylene extended ethylene). The vapor deposition of the inorganic material can be carried out using chemical vapor deposition or physical vapor deposition. The evaporation of organic materials can be carried out by vacuum evaporation of small molecules or solution casting of polymers or small molecules.

The thin film transistor generally includes a gate electrode, a gate dielectric on the gate electrode, a source electrode and a drain electrode adjacent to the gate dielectric, and a gate dielectric adjacent to the source and the drain The semiconductor layer adjacent to the electrode (for example, see SMSze, Physics of Semiconductor Devices, 2nd Edition, John Wiley and Sons, page 492, New York (1981)). These constituent elements can be assembled by various configurations.

The thin film transistor is exemplified by a thin film transistor disclosed in, for example, U.S. Patent No. 7,279,777 B2 (Bai et al.). Fig. 4 shows the cross-sectional structure of the thin film transistor 2A. The substrate 201 includes a gate electrode 202 disposed on the substrate 201, a dielectric material 203 disposed on the gate electrode 202, and any surface modification film 204 disposed on the dielectric material 203 and the substrate 201. The semiconductor layer 205 provided on the surface modification film 204, the source electrode 206 and the drain electrode 207 which are in contact with the semiconductor layer 205. At least a part of the semiconductor layer 205 is sealed by the sealing material 208 using the resin composition for electronic device sealing of the present invention.

Another example of a thin film transistor is exemplified by a exemplified thin film transistor disclosed in U.S. Patent No. 7,352,038 B2 (Kelley et al.). Fig. 5 is a sectional view showing the structure of the thin film transistor 2B. The thin film transistor 2B has a gate electrode 210 disposed on the substrate 209, and a gate dielectric 211 is disposed on the gate electrode 210. The substantially non-fluorinated polymer layer 212 is interposed between the gate dielectric 211 and the organic semiconductor layer 213. The source electrode 214 and the drain electrode 215 are provided on the organic semiconductor layer 213. At least a part of the organic semiconductor layer 213 is sealed by using the sealing material 216 of the resin composition for electronic device sealing of the present invention.

The invention is further illustrated by the following examples, but the examples are not intended to limit the invention in any way.

(Examples 1 to 39 and Comparative Examples 1 to 7)

The components (A) and (C), (d1), and (d2) are blended in the ratios (mass parts) shown in Tables 1 to 4. The components (B) are (A) and (C). A total of 3% by mass of the mixture was blended, and toluene was added as a suitable solvent to adjust the solution. The solution was desolvated in a vacuum vessel, and the resin compositions for sealing electronic devices of Examples 1 to 39 and Comparative Examples 1 to 7 were obtained, respectively. The water vapor barrier properties, coatability, and reliability of each composition were evaluated.

(A) polybutadiene polymer

A1: TE-2000 (polybutadiene with acryl-based end, urethane bond, unhydrogenated, Mn2000, manufactured by Japan Soda Co., Ltd.)

A2: TEAI-1000 (polybutylene with acryl-based end, urethane bond, hydrogenated, Mn1000, manufactured by Japan Soda Co., Ltd.)

A3: urethane acrylate obtained by the following synthesis method

A4: SPBDA-S30 (end-introduced acrylic-based polybutadiene, no urethane bond, hydrogenated, Mw3000, Osaka Organic Chemical Industry Co., Ltd.)

A5: GI-3000 (terminal hydroxyl polybutadiene, no urethane bond, hydrogenated, Mn3000, Japan Soda)

(Synthesis method of urethane acrylate A3)

GI-3000 (terminal hydroxyl polybutadiene, urethane-free bond, hydrogenated, Mn3000) manufactured by Japan Soda Co., Ltd. was dissolved in cyclohexane, and 2-propene was slowly added dropwise while stirring at 40 ° C. Methoxyethyl isocyanate (KARENZ (registered trademark) AOI, manufactured by Showa Denko Co., Ltd.) was further stirred for 4 hours, and then crystals were precipitated in isopropyl alcohol to obtain a terminally modified hydrogenated butadiene acrylate.

(S) Styrene Butadiene Acrylate

To a reactor having an internal volume of 7 L of argon replacement, 1.90 kg of dehydrated purified cyclohexane, 22.9% by mass of a hexane solution of 1,3-butadiene, 2 kg, and 20.0% by mass of a styrene cyclohexane solution were added. After 0.374 kg of a hexane solution of 0.53 kg/1.6 mol/L of 2,2-bis(tetrahydrofuranyl)propane, 108.0 ml of a 0.5 mol/L dilithium polymerization initiator was added to start polymerization. The temperature of the mixture was raised to 50 ° C, and polymerization was carried out for 1.5 hours. Then, 108.0 ml of a cyclohexane solution of 1 mol/L of ethylene oxide was added thereto, and the mixture was further stirred for 2 hours, and then 50 ml of isopropyl alcohol was added.

The hexane solution of the obtained copolymer was precipitated in isopropyl alcohol, and sufficiently dried to obtain a styrene butadiene rubber having a hydroxyl group at its molecular end (styrene content: 20% by mass, mass average molecular weight: 18,000, molecular weight distribution: 1.15).

120 g of styrene butadiene rubber having a hydroxyl group at the terminal of the molecule obtained above is dissolved in 1 L of hexane which is sufficiently dehydrated and purified so as to constitute a unit derived from butadiene of nickel relative to the styrene butadiene rubber. A catalyst solution of nickel naphthenate, triethylaluminum, and butadiene [1:3:3 (mole ratio), respectively, previously adjusted in another vessel was fed in a manner of 1,000 mol. Hydrogen was added under pressure to a closed reaction vessel at 2.758 MPa (400 psi), and hydrogenation was carried out at 110 ° C for 4 hours.

Subsequently, the catalyst residue was separated by extraction with 3 mol/m ³ of hydrochloric acid, and the catalyst residue was sedimented and separated by centrifugation. Subsequently, a hydrogenated styrene butadiene rubber having a hydroxyl group at the terminal of the molecule is precipitated in isopropyl alcohol, and then sufficiently dried to obtain a hydrogenated styrene butadiene rubber having a hydroxyl group at the molecular terminal (styrene content 20% by mass, mass average The molecular weight is 16,500, the hydrogenation rate is 98%, and the molecular weight distribution is 1.1).

The hydrogenated styrene butadiene rubber having a hydroxyl group at the terminal of the molecule thus obtained was dissolved in cyclohexane, and 2-propenyloxyethyl isocyanate ("KARENZ (registered trademark) AOI" was slowly added dropwise while stirring at 40 °C. After further stirring for 4 hours, the crystals were precipitated in isopropyl alcohol to obtain a terminally modified hydrogenated styrene butadiene rubber.

(B) Photopolymerization initiator

B1: ESACURE TZT (2,4,6-trimethylbenzophenone, manufactured by Lamberti Co., Ltd.)

B2: ESACURE KIP 100F (poly{2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propan-1-one} and 2-hydroxy-2-methyl-1 -Phenyl-propan-1-one blend, manufactured by Lamberti Co., Ltd.)

B3: Irgacure 184 (1-hydroxycyclohexyl phenyl ketone, manufactured by BASF Corporation)

B4: Antioxidant IRGANOX 1520L (Vobart Chemicals Co., Ltd.)

(C) Reactive diluent

C1:1,6HX-A (1,6-hexanediol diacrylate, manufactured by Kyoeisha Chemical Co., Ltd.)

C2: DCP-A (dimethylol-tricyclodecane diacrylate, manufactured by Kyoeisha Chemical Co., Ltd.)

C3: CD595 (1,10-nonanediol diacrylate, manufactured by Sartomer Co., Ltd.)

C4: Light Ester ID (isodecyl methacrylate, manufactured by Kyoeisha Chemical Co., Ltd.)

(d1) hydrocarbon softener

D1-1: Nissan polybutene 200N (polybutene, Mn2650, manufactured by Nippon Oil Co., Ltd.)

D1-2: Glissopal 1000 (polyisobutylene, Mn1000, manufactured by BASF Corporation)

D1-3: Nissan polybutene 015N (polybutene, Mn580, manufactured by Nippon Oil Co., Ltd.)

D1-4: Oppanol B10N (polyisobutylene, Mw36,000, Mn12,000, manufactured by BASF Corporation)

D1-5: KURAPRENE LIR30 (polyisoprene rubber, Mw29,000, Mn28,000, manufactured by KURARAY Co., Ltd.)

D1-6: Oppanol B15N (polyisobutylene, Mw 75,000, Mn 22,000, manufactured by BASF Corporation)

(d2) Hydrocarbon adhesion promoter

D2-1: ESCOREZ 5320 (C5-based hydrogenated dicyclopentadiene resin, softening point 124 ° C, Mw 640, Mn430, manufactured by ExxonMobil Chemical Co., Ltd.)

D2-2: 1-MARV P100 (C5 dicyclopentadiene/C9 copolymerized hydrogenated petroleum resin, softening point 100 ° C, Mw 660, manufactured by Idemitsu Kosan Co., Ltd.)

D2-3: ESCOREZ 1310 (C5 petroleum resin, softening point 94 ° C, Mw 1600, Mn 1000, manufactured by ExxonMobil Chemical Co., Ltd.)

D2-4: PINECRYSTAL KE311 (hydrogenated rosin ester resin, softening point 95 ° C, Mn 580, manufactured by Arakawa Chemical Industries, Ltd.)

The water vapor barrier properties, coatability, reliability, and bending resistance of each of the compositions of the examples and the comparative examples were evaluated.

(water vapor barrier)

The resin composition for electronic device sealing of Example ‧ Comparative Example was applied to a glass plate by a BAKER type cloth so as to have a thickness of 50 μm. Subsequently, ultraviolet rays having a wavelength of 365 nm of 5 J/cm ^{2 were} irradiated with a high pressure mercury lamp to be hardened to obtain a test sheet. The obtained sheet was placed between the low-humidity chamber and the high-humidity chamber without wrinkles or slack, and a differential pressure gas/vapor permeability measuring device (GTR-10XAWT, manufactured by GTR Tech Co., Ltd.) was used. A gas chromatograph (G2700T, manufactured by YANACO Technology Co., Ltd.) was used to determine the water vapor barrier properties at 40 ° C, 90% RH, 60 ° C, and 90% RH in accordance with JIS K7129C. The water vapor barrier property was evaluated in five stages according to the following evaluation criteria. Further, in the evaluation, the above D means a qualified product, and E means a non-conforming product (the same applies hereinafter).

A is excellent

: 60°C moisture permeability is 100g/m ² days or less and 40°C moisture permeability is 20g/m ² days or less

B is very good

: 60°C moisture permeability is 100g/m ² days or less and 40°C moisture permeability is 50g/m ² days or less

C good

: 60°C moisture permeability is 100g/m ² days or less and 40°C moisture permeability is 100g/m ² days or less

D: Normal

: 60°C moisture permeability is 100g/m ² days or more and 40°C moisture permeability is 100g/m ² days or less

E bad

: 60 ° C and 40 ° C moisture permeability is 100g / m ² days or more

(coating property)

As a condition 1, a coating experiment of a resin composition for sealing was carried out in the following order. According to JIS R 3202, a 1.2 mm-thick floating glass was adjusted to a size of 30 mm × 30 mm, and a bezel was left on the four sides as a bezel, and metal calcium was vapor-deposited to a thickness of 100 nm to prepare a glass substrate. On the other hand, the resin composition for electronic device sealing was applied to another floating glass so as to have a thickness of 50 μm. The test composition of the resin composition for sealing the substrate glass/electronic device/glass was obtained by laminating the coating glass and the glass substrate with the resin composition for sealing the electronic device sealing surface facing down. Next, two sheets of the above-mentioned 1.2 mm thick floating glass and 50 μm thick polyethylene terephthalate film were placed one on top of the test sample to ensure vacuum lamination at 80 ° C and 0.6 without gap. Pressurize under MPa for 5 minutes. The pressurized sample was taken out from the laminator, and irradiated with a high-pressure mercury lamp to irradiate ultraviolet rays having a wavelength of 365 nm of 5 J/cm ^{2 to} be hardened, and visually observed whether or not the bonding was possible, or whether the two sheets of glass could be filled and sealed without voids. A resin composition is used. Condition 2 was carried out under the same conditions as Condition 1 except that the pressurization of the laminator was set to 1 minute. The condition 3 was carried out under the same conditions as the condition 2 except that the temperature was 40 ° C, and the condition 4 was carried out under the same conditions as the condition 3 except that the pressurization of the laminator was 0.1 MPa. The applicability was evaluated in five stages according to the following evaluation criteria.

A is excellent

: Samples with unobserved pores were obtained under all conditions

B is very good

: Samples with no observed pores were obtained under conditions 1, 2 and 3

C good

: Samples with unobserved pores obtained under conditions 1 and 2

D ordinary

: Samples with no observed pores were obtained under Condition 1

E bad

: pores are observed under either conditions or cannot be fitted

(reliability)

A sample in which no pores were observed in the coatability test was treated at 40 ° C and 90% RH for 1000 hours, and then, after cooling to room temperature (25 ° C), the composition of the resin for sealing by the electronic device was measured by the change of the calcium vapor deposition film. The amount of moisture infiltrated by the object. The reliability is evaluated in two stages based on the following evaluation criteria.

A is excellent

: The water immersion amount after 1000 hours is 3mm or less

E bad

: After 1000 hours, the water immersion amount is 3mm or more or pore or peeling is observed.

(bending resistance)

The resin composition for electronic device sealing of Example ‧ Comparative Example was applied onto a PET film having a thickness of 100 μm so as to be 25 μm thick. The resin composition for sealing the coated electronic device is faced downward, and the coated film is bonded to another 100 μm thick PET film without entraining the pores, and then irradiated with a high-pressure mercury lamp at a wavelength of 365 nm at a wavelength of 5 J/cm ² . Hardening was carried out to obtain a test sample of a 100 μm thick PET film/25 μm thick sealing resin composition/100 μm thick PET film. Next, the bending resistance test of the obtained test sample was carried out using a 25 mm diameter mandrel according to JIS K 5600-5-1 1999. The bending resistance was evaluated in three stages according to the following evaluation criteria.

A is excellent

: The sample is bendable, and no peeling from the film, discoloration of the sample, or cracking is observed.

D ordinary

: The sample can be bent, but discoloration such as whitening is observed.

E bad

: The sample cannot be bent, or the sample after the test is observed to be peeled off and cracked.

As shown in Tables 1 to 3, Examples 1 to 39 contain a polybutadiene polymer having a (meth)acryl fluorenyl group at the terminal and having a urethane bond, and a photopolymerization initiator, and The composition of the thermoplastic resin having a mass average molecular weight of 50,000 or more has both water vapor barrier properties and coating properties, and good results are obtained in the evaluation of reliability. In addition, Examples 14 to 17, 19 to 25, 28 to 31, and 33 to 39 contain a reactive dilution in a range of 5:95 to 50:50 by mass ratio of the polybutadiene polymer to the reactive diluent. The agent is improved in coating properties. Further, in Examples 19 to 32 and 34 to 39, the mass ratio of the polybutadiene polymer and the reactive diluent to the hydrocarbon compound having a number average molecular weight of less than 50,000 is in the range of 20:80 to 70:30. contain A hydrocarbon compound having a number average molecular weight of less than 50,000 shows good water vapor barrier properties.

As shown in Table 4, in Comparative Examples 1, 3, and 4, since the polybutadiene polymer had a (meth) acrylonitrile group at the terminal but no urethane bond, the reliability was poor. In Comparative Example 2, since it was a styrene-based polybutadiene polymer, the reliability was poor. In Comparative Examples 5 and 7, since the polybutadiene polymer having a (meth)acryloyl group at the terminal and having a urethane bond was not contained, the reliability was poor. In Comparative Example 6, since the thermoplastic resin having a mass average molecular weight of 50,000 or more was contained, the coating property and the reliability were both inferior.

Claims (12)

A resin composition for sealing an electronic device, comprising: (A) a polybutadiene polymer having a (meth)acryl fluorenyl group at a terminal represented by the following chemical formula (1), and (B) a photopolymerization initiator; (C) a reactive diluent, (D) a hydrocarbon compound having a number average molecular weight of less than 50,000, and the reactive diluent of the component (C) is a difunctional (meth) acrylate monomer, which does not contain (methyl) a dicyclopentenyloxyethyl acrylate, which does not contain a thermoplastic resin having a mass average molecular weight of 50,000 or more, a total mass of the component (A) and the component (C), and a mass ratio of the component (D). (A)+(C)]: (D) is 20:80 to 70:30, and the hydrocarbon compound of the component (D) contains at least (d1) a hydrocarbon-based softener and (d2) a hydrocarbon-based adhesion-imparting agent, and The mass ratio (d1) of the component (d1) to the component (d2) is (d2): 20:80 to 80:20, (wherein R ¹ and R ² each independently represent a hydroxyl group or H ₂ C=C(R ⁷ )-COO-, and R ³ and R ⁴ each independently represent a substituted or unsubstituted divalent organic group having 1 to 16 carbon atoms; The group, R ⁵ , R ⁶ and R ⁷ each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and contains at least one organic group represented by the following chemical formula (2), and each of l and m independently represents 0 or An integer of 1 , n represents an integer from 15 to 150, x: y = 0 to 100: 100 to 0, except that R ¹ and R ² are both hydroxyl groups), The resin composition for sealing an electronic device according to claim 1, wherein the mass ratio (A) of the component (A) to the component (C): (C) is 5:95 to 50:50. The resin composition for sealing an electronic device according to claim 1, wherein the hydrocarbon-based softening agent of the component (d1) is polybutene or/and polyisobutylene. The resin composition for sealing an electronic device according to claim 1, wherein the hydrocarbon-based adhesion-imparting agent of the component (d2) is a hydrogenated petroleum resin. The resin composition for sealing an electronic device according to claim 1, wherein 50% or more of the unsaturated bonds of the butadiene skeleton of the polybutadiene polymer are hydrogenated. An electronic device characterized by being sealed by using a sealing material for a resin composition for sealing an electronic device according to any one of claims 1 to 5. The electronic device of claim 6, which has flexibility. The electronic device of claim 6 or 7, wherein the electronic device is an organic device having an active organic component, and the sealing material is disposed on, above, or around the active organic component. The electronic device of claim 8, wherein the foregoing organic device has In an electroluminescent device, the active organic component is formed of a cathode, a light-emitting layer, and an anode. The electronic device of claim 6 or 7, wherein the electronic device is a touch screen, having a substrate made of glass or polymer, and a substantially transparent conductive metal disposed on the substrate, and the sealing is The material is disposed above, above, or around the aforementioned metal. The electronic device of claim 6 or 7, wherein the electronic device is a photovoltaic device having a photovoltaic cell or a photovoltaic cell array, and the sealing material is disposed on or above any one of the photovoltaic cell or the photovoltaic cell array. , or around. The electronic device of claim 6 or 7, wherein the electronic device is a thin film transistor having a semiconductor layer, and the sealing material is disposed on, above, or around the semiconductor layer.