TWI611181B - Sensor array, manufacturing method thereof, and sensing method - Google Patents

Abstract

A sensor array includes a circuit board, a plurality of first sensing units, and at least one second sensing unit. The circuit board has opposing upper and lower surfaces. The first sensing unit is located on an upper surface of the circuit board. The first sensing unit includes a plurality of first electrodes and a plurality of layers of sensing material. The sensing material layers are respectively located on the surface of the first electrode, wherein the sensing material layer is produced by a non-contact printing method. The second sensing unit is located on the upper surface of the circuit board. The second sensing unit includes a second electrode that is separated from the first electrode from each other. The sensing material layers respectively cover the surface of the first electrode, and the second electrode is exposed to the atmospheric environment.

Description

Sensor array, manufacturing method thereof and sensing method

The invention relates to a sensor array, a manufacturing method thereof and a sensing method, in particular to a sensor array prepared by a non-contact printing method, a manufacturing method thereof and a sensing method.

Gas sensors are used in a wide range of applications, from industrial safety maintenance to environmental contamination detection to early diagnosis of gas sensors. However, it is customary to distinguish and detect multiple gases, and it is often necessary to pass gas chromatograph (GC) and mass spectrometry (MS) to achieve gas sensing. However, because the gas chromatograph and the mass spectrometer are expensive, not portable, and require professional operation, the sensing process is quite costly and time consuming.

In addition, since a single sensor does not have gas selectivity. Traditionally, in order to achieve gas selection, a gas separation system, such as a microfluidic channel, needs to be placed at the front end of the sensor to achieve gas type discrimination. However, the size of such a sensor is too large, which is detrimental to the development of miniaturized sensors.

The invention is a sensor array, a manufacturing method thereof and a sensing method, and the object thereof is to provide a sensor array with small volume and facilitating miniaturization development; at the same time, the small-sized sensor array can directly sense a small amount. And a variety of test samples.

The invention provides a sensor array, a manufacturing method thereof and a sensing method, which can integrate a plurality of sensing units to sense characteristics of a small amount and a plurality of objects to be tested, and can be compatible with a conventional semiconductor process.

The present invention provides a sensor array, a method of fabricating the same, and a sensing method that can have more sensing material selectivity and can miniaturize the sensor array to have more use or application space.

The invention provides a sensor array comprising a circuit board, a plurality of first sensing units and at least one second sensing unit. The circuit board has opposing upper and lower surfaces. The first sensing unit is located on an upper surface of the circuit board. The first sensing unit includes a plurality of first electrodes and a plurality of layers of sensing material. The sensing material layers are respectively located on the surface of the first electrode, wherein the sensing material layer is produced by a non-contact printing method. The second sensing unit is located on the upper surface of the circuit board. The second sensing unit includes a second electrode that is separated from the first electrode from each other. The sensing material layers respectively cover the surface of the first electrode, and the second electrode is exposed to the atmospheric environment.

In an embodiment of the invention, the material of the sensing material layer comprises a metal, a metal oxide, a graphene, a graphene oxide, a carbon nanotube, a fullerene, a gold cluster, a polymer, a metal sulfide, Quantum dots, perovskites or combinations thereof.

In an embodiment of the invention, the sensor array further includes a wafer on a lower surface of the circuit board. The wafer is electrically connected to the wiring board by wire bonding or flip-chip bonding.

In an embodiment of the invention, the sensor array further includes a plurality of wafers. The above wafers are stacked on each other to constitute a stacked wafer structure.

In an embodiment of the invention, the first electrode comprises an interdigitated electrode, a stacked electrode or a combination thereof. The first sensing unit is configured to sense gas, light, humidity, or a combination thereof.

In an embodiment of the invention, the second electrode is a serpentine electrode. The second sensing unit is configured to sense the temperature.

In an embodiment of the invention, the second sensing unit does not have a sensing material-free.

In an embodiment of the invention, the upper surface or the lower surface of the circuit board is a surface which is a curved surface, a concave surface, a sloped surface, or a combination thereof.

In an embodiment of the invention, the area of the sensing material layer is between 1 square micrometer and 10 ⁶ square micrometer, and the area of the sensor array is between 1 square micrometer and 10 ⁶ square micrometer. .

The present invention provides a method of fabricating a sensor array, the steps of which are as follows. Provide a circuit board. The circuit board has opposing upper and lower surfaces. A plurality of first electrodes and at least one second electrode are formed on an upper surface of the circuit board, wherein the first electrodes and the second electrodes are separated from each other. A plurality of sensing material layers are respectively formed on the surface of the first electrode by a non-contact printing method without forming a sensing material layer on the surface of the second electrode.

In an embodiment of the invention, the non-contact printing method includes ink jet printing (Ink Jet Printing) or aerosol spray printing (Aerosol Jet Printing).

The present invention provides a sensing method as follows. The mixed gas is sensed by the above-described sensor array. The sensing material layer in the sensor array reacts with a plurality of gases in the mixed gas to generate a plurality of reaction signals. The parameter data is received from the reaction database, and the concentration of the gas is measured based on the parameter data and the reaction signal.

式1， R _w、R _t、R _z為反應訊號， S _wm、S _tm、S _zm、S _we、S _te、S _ze、S _wt、S _tt、S _zt為參數資料， C _m、C _e、C _t為氣體的濃度。 In an embodiment of the invention, the method for measuring the concentration of the gas based on the parameter data and the reaction signal is as follows. Substituting the parameter data and the reaction signal into Equation 1, thereby obtaining the concentration of the gas,

Equation 1, R _w , R _t , R _z are reaction signals, S _wm , S _tm , S _zm , S _we , S _te , S _ze , S _wt , S _tt , S _zt are parameter data, C _m , C _e C _t is the concentration of the gas.

Based on the above, the sensor array with the plurality of first sensing units of the present invention can react with different analytes by different sensing material layers, thereby achieving sensing of a small amount and a plurality of analytes. characteristic. Additionally, the at least one second sensing unit of the present invention does not have any sensing material and, therefore, can be used to sense the temperature in the atmospheric environment. In other words, the present invention can eliminate the error caused by the change of the ambient temperature by temperature compensation, so that the obtained measurement data is more accurate. On the other hand, the present invention can form a plurality of sensing material layers on the back surface of the wiring board by the non-contact printing method, and the invention has more sensing material selectivity than the conventional semiconductor manufacturing process. And the non-contact printing method can also be integrated with the semiconductor process to increase the production speed. On the other hand, the non-contact printing method can produce a sensor array that is small in size and facilitates miniaturization. In addition, the present invention does not require additional gas separation systems to achieve gas selectivity. Compared with the prior art, the present invention can miniaturize the entire sensor array to have more use or application space, thereby achieving the commercialization of the product.

The above described features and advantages of the invention will be apparent from the following description.

The invention will be more fully described with reference to the drawings of the embodiments. However, the invention may be embodied in a variety of different forms and should not be limited to the embodiments described herein. The thickness of layers and regions in the drawings will be exaggerated for clarity. The same or similar reference numbers indicate the same or similar elements, and the following paragraphs will not be repeated.

First, it should be noted that although the sensor arrays 100, 200, 300, and 400 are all described by taking a sensing gas as an example, the present invention is not limited thereto. In other embodiments, the sensor arrays 100, 200, 300, 400 herein can also be used to sense other environmental factors such as light, humidity, or temperature. Or it can simultaneously sense other environmental factors such as gas, light, humidity and temperature.

Referring to FIG. 1 , the sensor array 100 of the first embodiment includes a circuit board 102 , a plurality of first sensing units 103 , and at least one second sensing unit 203 . The circuit board 102 has a wiring layer and a dielectric layer (not shown) stacked on each other. In an embodiment, the circuit board 102 can be, for example, a flexible circuit board, a rigid circuit board, or a hard and soft circuit board. The flexible circuit board may have a soft dielectric layer, and the material thereof includes Polyimide (PI), Polyethylene Terephthalate (PET) or Polythylene Naphthalate (PEN). ) and other materials. The flexible circuit board has flexibility, that is, the surface of the circuit board 102 composed of a flexible circuit board may be non-planar. In addition, the rigid wiring board may have a hard dielectric layer, and the material thereof includes a prepreg.

The first sensing unit 103 is located on the circuit board 102. In an embodiment, the first sensing unit 103 can be, for example, an array array. The first sensing units 103 are separated from each other and are not in contact to sense a plurality of objects to be tested. That is to say, as the number of the first sensing units 103 increases, the number of types of the object to be tested can be sensed. In an embodiment, the number of the first sensing units 103 may be greater than or equal to the type of the object to be tested. In addition, although only the 3×3 array arrangement is illustrated in FIG. 1 (that is, the eight first sensing units 103 plus one second sensing unit 203), the present invention is not limited thereto. In other embodiments, the number of first sensing units 103 can be adjusted as needed.

Specifically, each of the first sensing units 103 includes a first electrode 104 and a sensing material layer 106. The first electrode 104 is located on the circuit board 102. In detail, each of the first electrodes 104 includes two sub-electrodes 105a, 105b. As shown in the enlarged view in the upper right corner of Fig. 1, the sub-electrodes 105a, 105b are all finger-type electrodes which are separated from each other and do not contact each other. However, the present invention does not limit the shape of the sub-electrodes 105a, 105b as long as the sub-electrodes 105a, 105b are separated by a predetermined distance apart from each other and are not in contact with each other. In an alternate embodiment, the first electrode 104 can also be, for example, a stacked electrode. The arrangement of the three-dimensional stacked electrodes can effectively increase the density of the sensing array and reduce the overall component volume. In detail, the stacked electrodes may be formed by vertically stacking a plurality of electrode layers and a plurality of dielectric layers (not shown) on the circuit board 102. That is, at least one dielectric layer is disposed between two adjacent electrode layers to electrically isolate adjacent two electrode layers. In an embodiment, the electrode layer comprises a conductor material. The conductor material can be a doped or undoped polysilicon material, a metal material, or a combination thereof. The material of the above dielectric layer may be tantalum oxide, tantalum nitride or a combination thereof.

In an embodiment, a plurality of sensing material layers 106 are respectively located on the first electrode 104. More specifically, the sensing material layer 106 covers the surfaces of the sub-electrodes 105a, 105b and fills the gap between the sub-electrodes 105a, 105b. Although the sensing material layer 106 illustrated in FIG. 1 does not completely cover all surfaces of the sub-electrodes 105a, 105b (or the first electrode 104), the invention is not limited thereto. In other embodiments, the sensing material layer 106 may also completely cover all surfaces of the sub-electrodes 105a, 105b (or the first electrode 104) including the top and sides. It should be noted that when the object to be tested adsorbs or contacts the surface of the sensing material layer 106, the object to be tested may react with the sensing material layer 106 such that the capacitance of the sensing material layer 106 between the sub-electrodes 105a, 105b The isoelectric value of the value or resistance value changes.

For example, sensor array 100 is a gas sensor array. As shown in FIG. 1, the sensor array 100 includes at least three first sensing units 103a, 103b, 103c. When the analyte is a mixed gas having three gases, the three gases in the mixed gas react with the sensing material layers 106a, 106b, 106c such that the capacitance values or resistances of the sensing material layers 106a, 106b, 106c The value of the isoelectric characteristic changes. Then, the data of the capacitance value or the electrical resistance change of the resistance value can be transmitted to the circuit board 102 through the first electrodes 104a, 104b, 104c under the sensing material layers 106a, 106b, 106c for subsequent data processing. In this way, the sensor array 100 of the present embodiment can simultaneously sense three different gases to achieve gas selectivity without requiring an additional gas separation system. Additionally, when the sensor array 100 is an ultraviolet sensor array, ultraviolet light can be reacted with the sensing material layer 106 to change the resistance value of the sensing material layer 106. Thereby, the sensor array 100 can sense whether the intensity of the ultraviolet light in the environment is excessive, thereby reminding the user to shade or apply the sunscreen.

It should be noted that the method of forming the sensing material layer 106 may be, for example, a non-contact printing method. In an embodiment, the non-contact printing method includes an inkjet printing method or an aerosol spray printing method. An aerosol spray printing method is exemplified by using an aerosol jet deposition head to form an outer sheath flow and an inner gas-filled carrier flow (inner aerosol-laden). Carrier flow) A ring-shaped propagating nozzle. In an annular aerosol spray process, an aerosol stream having a sensing material is concentrated and deposited on a planar or non-planar circuit board 102. Next, a heat treatment or photochemical treatment is performed to form the sensing material layer 106 on the first electrode 104. The above steps may be referred to as Maskless Mesoscale Material Deposition (M3D), that is, it may be deposited without using a mask such that the deposited material layer has a size of 1 micrometer to 10 micrometers. Linewidth between the lines.

In one embodiment, the size of the formed sensing material layer 106 or the area of the sensing material layer 106 overlying the first electrode 104 may be between 1 square micrometer and 10 ⁶ square micrometers, for example, 10 Square micron. In other words, as the size of the sensing material layer 106 is reduced, the size of the sensor array 100 with the sensing material layer 106 can also be reduced to between 1 square micron and 10 ⁶ square micron. Compared to the conventional sensor array (which measures about 10 ⁸ square micrometers), the sensor array 100 of the present invention has a small size, which can be applied to increasingly thin and portable electronic devices. For example, it is a mobile phone, a tablet computer, a music player, the above combination or the like portable electronic device.

In addition, the non-contact printing method of the present embodiment can form a material that is incompatible with the semiconductor process (for example, a nano-cluster, a magnetic material, or a bio-organic material, etc.) on the wiring board 102. Therefore, this embodiment has more sensing material selectivity than conventional semiconductor processes. In particular, most of the sensing materials except the metal and metal oxides cannot be formed on the sensor array in a conventional semiconductor process. Therefore, the non-contact printing method of the embodiment can apply not only a plurality of sensing materials (including sensing materials compatible with a semiconductor process and sensing materials not compatible with a semiconductor process) to the sensor array, but also Can be integrated with semiconductor processes to increase production speed to meet the needs of commercialization of products. In addition, the non-contact printing method of the present embodiment can also form the sensing material layer 106 on a curved surface, a concave surface, a slope surface, a combination thereof or the like, compared to a conventional manufacturing method in which a sensing material can be formed only on a plane. On the surface, this is difficult to achieve by conventional manufacturing methods.

In an embodiment, the material of the sensing material layer 106 includes a metal, a metal oxide, a graphene, a graphene oxide, a carbon nanotube, a fullerene, a gold cluster, a polymer, a metal sulfide, a quantum dot, Perovskite or a combination thereof. The metal can be, for example, nickel, copper or other suitable material. The metal oxide can be, for example, zinc oxide, tin oxide, tungsten oxide, magnesium oxide, titanium oxide, iron oxide, zirconium oxide or other suitable materials. The polymer may, for example, be poly-3,4-ethylenedioxythiophene (PEDOT) or other suitable material.

With continued reference to FIG. 1 , the sensor array 100 of the first embodiment includes a second sensing unit 203 on the circuit board 102 . The second sensing unit 203 includes a second electrode 204. As shown in the enlarged view of the lower right corner of FIG. 1, the second electrode 204 can be, for example, a serpentine electrode. The serpentine electrode means that the electrode is spirally arranged between opposite points to reduce the occupied area and increase the effective surface area. However, the present invention is not limited thereto. In other embodiments, the second electrode 204 may have other shapes.

It is worth noting that when performing the above gas sensing, it is necessary to adjust the data according to the humidity and temperature of the environment. The humidity sensing can be performed by forming a moisture sensing material on one of the first electrodes 104. The temperature sensing is to expose the second electrode 204 to the atmosphere, thereby sensing the temperature in the atmospheric environment. In other words, the second sensing unit 203 does not have any sensing material. Specifically, the second sensing unit 203 is a characteristic that changes the resistance value of the second electrode 204 that is not covered by any sensing material as the ambient temperature changes, thereby sensing the temperature in the atmospheric environment. Compared with the commercially available temperature sensor, the second electrode 204 (or the second sensing unit 203) of the embodiment has higher sensitivity, smaller area, lower manufacturing cost, and can be formed by printing. On a variety of substrates. Therefore, the second electrode 204 (or the second sensing unit 203) of the present embodiment can be widely applied to various electronic components.

Taking the metal oxide sensing material as an example, the water vapor in the environment will adsorb on the surface of the metal oxide sensing material, forming an additional conductive path, causing the resistance to drop and the equivalent capacitance to rise. That is to say, the higher the humidity, the more the resistance decreases; the higher the capacitance rises. When the ambient temperature changes, the temperature rise causes the resistance of the metal oxide sensing material to decrease; conversely, when the temperature drops, the resistance rises. Therefore, temperature and humidity can be considered as the basic electrical level of the sensor array. In other words, the sensor array 100 of the present embodiment can additionally sense the humidity and temperature of the environment, so that the gas sensed data is more accurate.

Please refer to FIG. 2 , which may be, for example, a cross-sectional view taken along line A-A′ of FIG. 1 . The sensor array 200 of the second embodiment includes a circuit board 102 , a plurality of first sensing units 103 , and at least one second sense. Measurement unit 203. The circuit board 102 has opposing upper and lower surfaces 102a, 102b. In an embodiment, the upper surface 102a of the circuit board 102 may be the back side of the circuit board 102; and the lower surface 102b of the circuit board 102 may be the front side of the circuit board 102. The first sensing unit 103 and the second sensing unit 203 are both located on the upper surface 102a of the circuit board 102. The first sensing unit 103 includes a plurality of first electrodes 104 and a plurality of sensing material layers 106. The sensing material layer 106 covers the surface of the first electrode 104 and fills the gap between the first electrodes 104. Although the sensing material layer 106 illustrated in FIG. 2 does not cover the side of the first electrode 104, the invention is not limited thereto. In other embodiments, the sensing material layer 106 may also completely cover the top and sides of the first electrode 104. The second sensing unit 203 includes a second electrode 204. The second sensing unit 203 does not have any sensing material covering the surface of the second electrode 204. The materials of the circuit board 102, the first sensing unit 103, and the second sensing unit 203 of FIG. 2 are similar to those of the circuit board 102, the first sensing unit 103, and the second sensing unit 203 of FIG. As explained in the above paragraphs, it will not be repeated here.

In addition, the sensor array 200 of the second embodiment further includes the wafer 202 on the lower surface 102b of the circuit board 102. In detail, the wafer 202 can be electrically connected to the circuit board 102 by flip chip bonding. The manner of flip-chip bonding means that the wafer 202 is electrically connected to the circuit board 102 by a plurality of bumps 214 located between the circuit board 102 and the wafer 202. In addition, the space between the circuit board 102 and the wafer 202 is filled by an underfill 206 to cover the bumps 214.

In one embodiment, wafer 202 may be other suitable wafers such as a micro control unit (MCU) or a Bluetooth chip. The wafer 202 can receive the data measured or sensed by the first sensing unit 103 and the second sensing unit 203 (ie, the data of the capacitance value or the resistance value of the sensing material layer 106, and the second electrode) 204 changes in the resistance value), and data processing or data transmission. Although only one wafer 202 is illustrated in FIG. 2, the invention is not limited thereto. In other embodiments, the number and type of wafers 202 can be adjusted as desired.

Please refer to FIG. 3, which may be, for example, a schematic cross-sectional view taken along line A-A' of FIG. The sensor array 300 of the third embodiment is similar to the sensor array 200 of the second embodiment. The difference between the two is that the sensor array 300 is electrically connected to the circuit board 102 by wire bonding. The wire bonding method means that the wafer 302 is electrically connected to the circuit board 102 and the wafer 202 by a plurality of wires 308. In addition, the wafer 202 and a portion of the lower surface 102b of the wiring board 102 are covered by an encapsulant 310, and the wires 308 are covered.

Please refer to FIG. 4, which may be, for example, a schematic cross-sectional view taken along line A-A' of FIG. The sensor array 400 of the fourth embodiment is similar to the sensor array 200 of the second embodiment, except that the stacked wafer structure 402 of the sensor array 400 includes wafers 402a, 402b stacked on one another. Wafer 402a is located between circuit board 102 and wafer 402b. The wafer 402a is electrically connected to the wiring board 102 by flip chip bonding. That is, the wafer 402a is electrically connected to the circuit board 102 by the bumps 414. Thereafter, the space between the circuit board 102 and the wafer 402a is filled by the primer 406 to cover the bumps 414. The wafer 402b is electrically connected to the circuit board 102 by wire bonding. That is, the sensor array 400 is electrically connected to the circuit board 102 and the wafer 402b by wires 408. In addition, the wafers 402a, 402b, the primer 406, and a portion of the lower surface 102b of the wiring board 102 are covered by the encapsulant 410, and the wires 408 are covered. Although the stacked wafer structure 402 in FIG. 4 only shows two wafers 402a, 402b, the invention is not limited thereto. In other embodiments, the number and type of wafers can be adjusted as needed.

式1， R _w、R _t、R _z為反應訊號， S _wm、S _tm、S _zm、S _we、S _te、S _ze、S _wt、S _tt、S _zt為參數資料， C _m、C _e、C _t為氣體的濃度。 The invention also provides a sensing method, the steps of which are as follows. The mixed gas is sensed by any one of the sensor arrays 100, 200, 300, 400 (hereinafter simply referred to as the sensor array 100-400). The sensing material layer 106 in the sensor array 100-400 reacts with a plurality of gases in the mixed gas to generate a plurality of reaction signals. The parameter data is received from the reaction database, and the concentration of the gas is measured based on the parameter data and the reaction signal. Specifically, the method of measuring the concentration of the gas based on the parameter data and the reaction signal is as follows. The parameter data and the reaction signal are substituted into Equation 1, thereby obtaining the concentration of the gas.

Equation 1, R _w , R _t , R _z are reaction signals, S _wm , S _tm , S _zm , S _we , S _te , S _ze , S _wt , S _tt , S _zt are parameter data, C _m , C _e C _t is the concentration of the gas.

In addition, the second electrode 204 (or the second sensing unit 203) in the sensor array 100-400 can also sense the temperature in the atmospheric environment, thereby adjusting the reaction signal to make the obtained gas. The concentration is more accurate. That is to say, the sensor array 100-400 of the present embodiment can simultaneously sense the gas and environmental factors including humidity and temperature to eliminate the influence of environmental factors such as humidity and temperature, thereby improving the accuracy of the data.

In an embodiment, the gas comprises a volatile organic or inorganic gas. The volatile organic compounds may be, for example, alkanes, aromatic hydrocarbons, alkenes, halogenated hydrocarbons, esters, aldehydes, ketones or combinations thereof. Further, the above inorganic gas may be, for example, carbon monoxide, carbon dioxide, ammonia, nitrogen monoxide, nitrogen dioxide, hydrogen sulfide, or a combination thereof.

In order to demonstrate the achievability of the present invention, a plurality of examples are listed below to further illustrate the sensor array of the present invention. Although the following experiments are described, the materials used, the amounts and ratios thereof, the processing details, the processing flow, and the like can be appropriately changed without departing from the scope of the invention. Therefore, the invention should not be construed restrictively based on the experiments described below.

Instance 1-3

Taking the sensor array of FIG. 2 as an example, tungsten oxide (ie, Example 1), titanium oxide (ie, Example 2), and zinc oxide (ie, Example 3) were respectively used as a sensing material layer to form three sensing units. . Next, a mixed gas containing methanol m, ethanol e, and toluene t is reacted with the sensing material layers of Examples 1-3, thereby generating gas reaction signals R _w , R _t , R _z , and the results are shown in Figures 5-7. Shown.

Figure 5 is a graph of gas reaction versus gas concentration for Example 1. Figure 6 is a graph showing the relationship between the gas reaction of Example 2 and the gas concentration. Figure 7 is a graph showing the relationship of gas reaction to gas concentration for Example 3.

As shown in Figure 5-7, the gas reaction is linear with the gas concentration between 0 and 6000 ppm. That is, when the sensing material layers of Examples 1-3 react to the mixed gas are R _w , R _t , R _z , and the parameters of the mixed gas (ie, methanol m, ethanol e, and toluene t) are obtained from the reaction database. Information, which can list 3 simultaneous equations. Next, three unknown numbers can be solved from the above three simultaneous equations to obtain the concentrations of methanol m, ethanol e, and toluene t in the mixed gas.

式1， R _w、R _t、R _z為實例1-3的感測材料層對混合氣體的反應訊號， S _wm、S _tm、S _zm、S _we、S _te、S _ze、S _wt、S _tt、S _zt為參數資料， C _m、C _e、C _t分別為甲醇m、乙醇e以及甲苯t的濃度。 In addition, the above three simultaneous equations can be expressed by Equation 1:

Formula 1, R _w , R _t , R _z are the reaction signals of the sensing material layer of Examples 1-3 to the mixed gas, S _wm , S _tm , S _zm , S _we , S _te , S _ze , S _wt , S _Tt and S _zt are parameter data, and C _m , C _e and C _t are the concentrations of methanol m, ethanol e and toluene t, respectively.

In summary, the sensor array with the plurality of first sensing units of the present invention can react with different analytes by different sensing material layers, thereby achieving sensing of a small amount and a plurality of types to be tested. The characteristics of the object. Additionally, the at least one second sensing unit of the present invention may not have any sensing material and, therefore, may be used to sense the temperature in the atmospheric environment. In other words, the present invention can compensate for errors caused by changes in ambient temperature by temperature compensation, so that the measured data obtained is more accurate. On the other hand, the present invention can form a plurality of sensing material layers on the back surface of the wiring board by a non-contact printing method. Compared with the conventional semiconductor process, the present invention has more sensing material selectivity, and the non-contact printing method can also be integrated with the semiconductor process, thereby increasing the production speed. In addition, the present invention does not require additional gas separation systems to achieve gas selectivity. Compared with the prior art, the present invention can miniaturize the entire sensor array to have more use or application space, thereby achieving the commercialization of the product.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100, 200, 300, 400‧‧‧ sensor arrays
102‧‧‧PCB
102a‧‧‧ upper surface
102b‧‧‧ lower surface
103, 103a, 103b, 103c‧‧‧ first sensing unit
104, 104a, 104b, 104c‧‧‧ first electrode
105a, 105b‧‧‧ subelectrode
106, 106a, 106b, 106c‧‧‧ sensing material layer
202, 302, 402a, 402b‧‧‧ wafer
203‧‧‧Second sensing unit
204‧‧‧second electrode
214, 414‧‧ ‧ bumps
206, 406‧‧ ‧ primer
308, 408‧‧‧ wires
310, 410‧‧‧ Sealant
402‧‧‧Stacked wafer structure
M‧‧‧Methanol
E‧‧‧Ethanol
T‧‧‧toluene

1 is a top view of a sensor array in accordance with a first embodiment of the present invention. 2 is a cross-sectional view of a sensor array in accordance with a second embodiment of the present invention. 3 is a cross-sectional view of a sensor array in accordance with a third embodiment of the present invention. 4 is a cross-sectional view of a sensor array in accordance with a fourth embodiment of the present invention. Figure 5 is a graph of gas reaction versus gas concentration for Example 1. Figure 6 is a graph showing the relationship between the gas reaction of Example 2 and the gas concentration. Figure 7 is a graph showing the relationship of gas reaction to gas concentration for Example 3.

100‧‧‧sensor array

102‧‧‧PCB

103, 103a, 103b, 103c‧‧‧ first sensing unit

104, 104a, 104b, 104c‧‧‧ first electrode

105a, 105b‧‧‧ subelectrode

106, 106a, 106b, 106c‧‧‧ sensing material layer

203‧‧‧Second sensing unit

204‧‧‧second electrode

Claims (13)

An array of sensors includes: a circuit board having an upper surface and a lower surface; a plurality of first sensing units located on the upper surface of the circuit board, the first sensing units including: a first electrode; and a plurality of sensing material layers respectively on the surfaces of the first electrodes, wherein the sensing material layers are formed by a non-contact printing method; and at least one second feeling The second sensing unit includes a second electrode separated from the first electrodes, wherein the sensing material layers respectively cover the first electrodes The surface, while the second electrode is exposed to the atmosphere. The sensor array of claim 1, wherein the materials of the sensing material layer comprise a metal, a metal oxide, a graphene, a graphene oxide, a carbon nanotube, a fullerene, a gold cluster , polymers, metal sulfides, quantum dots, perovskites or combinations thereof. The sensor array of claim 1, further comprising a wafer on the lower surface of the circuit board, and the wafer is electrically connected to the circuit board by wire bonding or flip chip bonding. The sensor array of claim 1, further comprising a plurality of wafers on the lower surface of the circuit board, the wafers being stacked on each other to form a stacked wafer structure. The sensor array of claim 1, wherein the first electrodes comprise an interdigitated electrode, a stacked electrode or a combination thereof, and the first sensing unit is configured to sense gas, light, Humidity or a combination thereof. The sensor array of claim 1, wherein the second electrode is a serpentine electrode, and the second sensing unit is configured to sense a temperature. The sensor array of claim 6, wherein the second sensing unit does not have a sensing material. The sensor array of claim 1, wherein the upper surface or the lower surface of the wiring board is a surface of a curved surface, a concave surface, a sloped surface, or a combination thereof. The sensor array of claim 1, wherein the area of the sensing material layer is between 1 square micrometer and 10 ⁶ square micrometers, and the area of the sensor array is 1 square micrometer. Between 10 ⁶ square microns. A method of manufacturing a sensor array, comprising: providing a circuit board having an opposite upper surface and a lower surface; forming a plurality of first electrodes and at least one second electrode on the upper surface of the circuit board The first electrode and the second electrode are separated from each other; and a plurality of sensing material layers are respectively formed on the surfaces of the first electrodes by a non-contact printing method, and not at the second electrode A layer of sensing material is formed on the surface. The method of manufacturing a sensor array according to claim 10, wherein the non-contact printing method comprises an inkjet printing method or an aerosol spray printing method. A sensing method, comprising: sensing a mixed gas by the sensor array according to any one of claims 1 to 9, wherein the sensing in the sensor array The material layer reacts with a plurality of gases in the mixed gas to generate a plurality of reaction signals; and receives a parameter data from a reaction database, and measures the concentration of the gases according to the parameter data and the reaction signals. The sensing method of claim 12, wherein the method for measuring the concentration of the gas according to the parameter data and the reaction signals comprises: substituting the parameter data and the reaction signals into Equation 1, This gives the concentration of these gases, Equation 1, R _w , R _t , R _{z are} the reaction signals, S _wm , S _tm , S _zm , S _we , S _te , S _ze , S _wt , S _tt , S _{zt are} the parameter data, C _m , C _e , C _{t are} the concentrations of these gases.