TWI606543B - Transportation system and method for transporting processing member - Google Patents

Description

Transport system and method of transporting processing components

The present disclosure relates to a transport system and a method of transporting a processing component using the transport system, and more particularly to a transport system for transporting a processing component for manufacturing a semiconductor device and a method of transporting the processing component.

Semiconductor devices are used in a variety of electronic applications, such as personal computers, mobile phones, digital cameras, and other electronic devices. The semiconductor device is generally fabricated by sequentially depositing an insulating or dielectric layer material, a conductive layer material, and a semiconductor layer material on a semiconductor substrate, and then patterning the various material layers formed using a lithography process to form circuit components and parts. Above the semiconductor substrate. Technological advances in the materials and design of integrated circuits have led to the development of integrated circuits for many generations. Each generation has smaller and more complex circuits than the previous generation. However, these developments have increased the complexity of processing and manufacturing integrated circuits. In order for these developments to be realized, similar developments in the manufacture and production of integrated circuits are also necessary.

In the fabrication of semiconductor devices, a variety of processing elements are used sequentially to fabricate integrated circuits over the semiconductor wafer. For example, in the developing step, masks having different patterns are used to develop the semiconductor wafer. In order to use the reticle in accordance with the process sequence, the plurality of reticles are transmitted through a plurality of The device is shipped. Since the existing methods and equipment still cannot efficiently transport the reticle, a new reticle transport system is still needed to process the semiconductor wafer with higher efficiency.

In view of the above, it is an object of the present disclosure to provide a transport system that can be used to transport a reticle or other processing components used in the fabrication of semiconductor devices to accomplish a higher number of semiconductor fabrication steps.

According to an embodiment of the present disclosure, the transport system includes an acoustic wave emitting device configured to generate sound waves, and a carrying device configured to carry the processing component, wherein the processing component is disposed on the carrier device and the When the carrying device is disposed relative to the acoustic wave transmitting device, the acoustic wave generated by the processing component by the acoustic wave transmitting device moves relative to the carrying device.

In the above embodiment, the acoustic wave transmitting device is spaced apart from the carrying device by a distance L which is approximately equal to nλ/2, wherein λ is the wavelength of the acoustic wave generated by the acoustic wave emitting device, and n is a natural number greater than or equal to 1. .

In the above embodiment, the transport system further includes a gripping head disposed along an axis relative to the acoustic wave emitting device and configured to grip the processing element.

In the above embodiment, the acoustic wave emitting device comprises: a base; a movable member disposed along the axis opposite to the base and facing the reflecting unit; a plurality of cylinders connecting the base and the movable member; and a transducing member And connecting one of the cylinders, the movable member vibrates relative to the base when the transducer is actuated.

In the above embodiment, the chucking head functions as an acoustic wave reflecting element that reflects sound waves generated from the acoustic wave transmitting device. At this time, the acoustic wave emitting device is separated from the chuck by a height difference H which satisfies the equation H = (2m + 1) λ / 4. Alternatively, the transport system further includes a transducer coupled to the clamping head and configured to generate an acoustic wave, the clamping head simultaneously generating an acoustic wave with the acoustic wave emitting device. At this time, the acoustic wave emitting device is separated from the clamping head by a height difference H which satisfies the equation H=mλ/2.

Another object of the present disclosure is to provide a method of transporting a processing component, the method comprising: placing the processing component on a carrier device; moving the carrier device onto an acoustic wave emitting device; and generating the acoustic wave emitting device An acoustic wave having an energy change causes the processing element located above the carrier to move relative to the carrier by the acoustic wave generated by the acoustic emission device; and removing the processing component from the carrier.

In the above embodiment, when the carrying device moves onto the acoustic wave transmitting device, the acoustic wave transmitting device is spaced apart from the carrying device by a distance L, which is approximately equal to nλ/2, wherein λ is the acoustic wave transmitting device The wavelength of the generated sound wave, n is a natural number greater than or equal to 1.

In the above embodiment, when the carrier device is moved over the acoustic wave emitting device, the carrier device is located between the acoustic wave transmitting device and a clamping head for removing the processing component from the carrier device.

In the above embodiment, the method of changing the energy of the acoustic wave generated by the acoustic wave transmitting device includes changing the frequency of the acoustic wave and changing the wavelength of the acoustic wave.

In the above embodiment, the chucking head serves as an acoustic wave reflecting element, and the wavelength of the acoustic wave generated by the acoustic wave transmitting device satisfies the formula H = (2m + 1) λ / 4. H is the height difference between the acoustic wave emitting device and the chucking head, λ is the wavelength of the sound wave generated by the sound wave emitting device, and m is a natural number greater than or equal to zero. Alternatively, the method further includes generating another sound by using a transducer coupled to the clamping head The wave, the chucking head and the acoustic wave emitting device simultaneously generate sound waves, wherein the wavelength of the sound wave generated by the sound wave emitting device satisfies the following formula H=mλ/2. H is the height difference between the acoustic wave emitting device and the clamping head, λ is the wavelength of the acoustic wave generated by the acoustic wave emitting device, and m is a natural number greater than or equal to 1.

1, 1a, 1b‧‧‧ delivery system

10‧‧‧Processing component loading

11‧‧‧ bracket

20‧‧‧Transfer device

21‧‧‧Control unit

23‧‧‧ Robotic arm

3, 3'‧‧‧Processing components

301‧‧‧ Ontology

303‧‧‧ Film adhesive

30, 30a, 30b‧‧‧ exchange devices

31‧‧‧ Pedestal

32‧‧‧ Lifting unit

33‧‧‧ Lifting unit

34, 34a‧‧‧ clamping head

35, 35a‧‧‧ clamping head

40‧‧‧ Carrying device

41‧‧‧Terminal body

43‧‧‧ openings

45‧‧‧Sucker device

451‧‧ ‧ suction hole

47‧‧‧film

49‧‧‧vacuum source

5‧‧‧Substrate

50‧‧‧Processing device

51‧‧‧Light source

53‧‧‧ lens components

55‧‧‧Substrate holder

60‧‧‧Sonic launcher

61‧‧‧Transducer

62b‧‧‧Base

63‧‧‧Oscillator

64b‧‧‧ movable parts

66b‧‧‧Cylinder

68b‧‧‧Cylinder

69b‧‧‧Transducer

70‧‧‧Control device

80‧‧‧ method

81-84‧‧‧Operation

S1, S2, S3, S5‧‧‧ standing waves

S4‧‧‧ shock wave

L‧‧‧ spacing

H‧‧‧ height difference

Z‧‧‧ axis

The full disclosure is based on the following detailed description and in conjunction with the drawings. It should be noted that the illustrations are not necessarily drawn to scale in accordance with the general operation of the industry. In fact, it is possible to arbitrarily enlarge or reduce the size of the component for a clear explanation.

Figure 1 shows a schematic diagram of a transport system of some embodiments of the present disclosure.

Figure 2 is a schematic illustration of some of the components of the transport system of some embodiments of the present disclosure.

Figure 3 shows a top view of a carrier device of some embodiments of the present disclosure.

Fig. 4 is a cross-sectional view taken along line B-B' of Fig. 3.

Figure 5 is a flow chart showing a method of transporting a processing component in accordance with some embodiments of the present disclosure.

Figure 6 is a schematic illustration of the steps of a method of transporting a component in accordance with some embodiments of the present disclosure.

Figure 7 is a schematic illustration of the steps of a method of transporting a component in accordance with some embodiments of the present disclosure.

Figure 8 is a schematic illustration of the steps of a method of transporting a component in accordance with some embodiments of the present disclosure.

Figure 9 is a schematic illustration of the steps of a method of transporting a component in accordance with some embodiments of the present disclosure.

Figure 10 is a schematic illustration of some of the components of the transport system of some embodiments of the present disclosure, wherein a standing wave S2 is generated between the acoustic wave emitting device and the processing element.

Figure 11 is a view showing a part of the components of the transport system of some embodiments of the present disclosure, wherein a standing wave S3 is generated between the acoustic wave transmitting device and the chucking head.

Figure 12 is a view showing a part of the components of the transport system of some embodiments of the present disclosure, wherein a standing wave S5 is generated between the acoustic wave transmitting device and the chucking head.

In the following, a number of specific preferred embodiments will be described in detail with reference to the accompanying drawings, which illustrate several embodiments. However, the present disclosure can be implemented in many different forms, and is not limited to the embodiments described below, and the embodiments provided herein may be made to provide a more thorough and complete disclosure of the scope of the disclosure. By.

Moreover, for convenience of description, spatially relative terms such as "under", "below", "lower", "above", "upper", etc. may be used herein. To describe the relationship of one element or component to another (or other) element or component as illustrated. Spatially relative terms are intended to encompass different orientations of the device in use or operation. The device may be otherwise oriented (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may be interpreted accordingly. It should be understood that additional operations may be provided before, during, and after the method, and that some of the described operations may be substituted or eliminated for other embodiments of the method.

It is to be understood that the elements specifically described or illustrated may be in various forms well known to those skilled in the art. In addition, when a component is "on" another component, it may mean "directly" on other components, or between Other components.

In addition, relative terms such as "lower" or "bottom" and "higher" or "top" may be used in the embodiments to describe the relative relationship of one element to another. It will be understood that if the illustrated device is flipped upside down, the component described on the "lower" side will be the component on the "higher" side.

Here, the terms "about" and "about" are usually expressed within 20% of a given value or range, preferably within 10%, and more preferably within 5%. The quantity given here is an approximate quantity, meaning that the meaning of "about" or "about" may be implied without specific explanation.

Figure 1 shows a schematic view of a transport system 1 of some embodiments of the present disclosure. According to some embodiments of the present disclosure, the transport system 1 includes a processing component loading port 10, a transport device 20, an exchange device 30, a carrier device 40, a processing device 50, an acoustic wave transmitting device 60, and a The control device 70 of each of the above devices is controlled. The number of components of the transport system 1 can be increased or decreased, and is not limited to this embodiment.

In some embodiments, the processing element loading port 10 is configured to perform processing element 3 from a carriage 11 into the transport system 1 or to remove the processing element 3 from the transport system 1 to the cradle 11. In some embodiments, the processing element loading port 10 can hold two brackets 11. One of the two carriages 11 is used to load the processing element 3 to be transported to the transport system 1, the other of which is used to load the processing element 3 removed from the transport system 1.

The conveyor 20 is configured to convey the machining element 3 back and forth between the machining element carrier 10 and the switching device 30. In some embodiments, the transport device The setting 20 is disposed between the processing component carrying inlet 10 and the switching device 30. The transport device 20 can include a control unit 21 and a robot arm 23. The robot arm 23 is controlled by a signal from the control unit 21. The robot arm 23 can be a six-axis robot arm and is configured to grip the machining element 3.

The exchange device 30 is configured to grip the machining element 3 before and after the machining element 3 is placed on the carrier device 40. In some embodiments, as shown in FIG. 2, the exchange device 30 includes a base 31, two lifting units 32, 33, and two clamping heads 34, 35. The two lifting units 32 and 33 are each coupled to the bottom surface of the base 31. The two clamping heads 34, 35 are respectively coupled to the ends of the two lifting units 32, 33. The base 31 is rotatable about a rotation axis A, and the two lifting units 32, 33 are independently movable in the vertical direction with respect to the base 31. The two clamping heads 34, 35 are configured to grip the processing element 3 in a suitable manner. For example, the two clamping heads 34, 35 are respectively connected to a vacuum source, and the processing element 3 is fixed to the bottom surface by the suction force generated by the vacuum.

In some embodiments, the surfaces of the two clamping heads 34, 35 for joining the processing elements 3 are made of a metal material having a characteristic of highly reflected sound waves. In some embodiments, the surfaces of the two clamping heads 34, 35 have a recess to facilitate reflection of sound waves.

Figure 3 shows a top view of the carrier device 40 in some embodiments of the present disclosure, and Figure 4 shows a cross-sectional view taken along line B-B' of Figure 3; The carrier device 40 is configured to carry the processing element 3 and move the machining element 3 between a loading and unloading position (Fig. 6) and a machining position (Fig. 7). In some embodiments, as shown in FIG. 3, the carrier device 40 includes a stage body 41 and two chucking devices 45. An opening 43 is formed through the center of the stage body 41, wherein the size of the opening 43 can be The size of the processing element 3 is adjusted. Two suction cup devices 45 are respectively disposed on opposite sides of the opening 43. As shown in FIG. 4, each of the chucking devices 45 includes a plurality of suction holes 451 formed therein, and the suction holes 451 are coupled to a vacuum source 49. In addition, a film 47 is attached to one end of the suction hole 451.

Referring to Fig. 1, the processing apparatus 50 is configured to process a substrate 5 by the processing element 3. In some embodiments, the processing component 3 is a photomask and the substrate 5 is a semiconductor wafer. The processing device 50 is an exposure device for exposing the substrate 5 during the development process. In some embodiments, the exposure device 50 includes a light source 51, a lens assembly 53, and a substrate holder 55 for holding the semiconductor wafer 5.

The semiconductor wafer 5 can include a variety of device components. Embodiments of device elements formed in semiconductor wafer 5 include transistors (eg, gold oxide half field effect transistors (MOSFET), complementary metal oxide half field effect transistors (CMOS), bipolar junction transistors (BJT), High voltage transistors, high frequency transistors, P-channels and/or N-channel field effect transistors, etc.), diodes and/or other applicable components. A variety of procedures are performed to form the device components, such as deposition, etching, implantation, photolithography, tempering, and/or other suitable procedures. In some embodiments, a shallow trench isolation (STI) layer, an interlayer dielectric (ILD), or an interlayer dielectric layer overlies the device elements of the semiconductor wafer 5.

As shown in FIG. 2, the photomask 3 may include a body 301 and a thin film 303. The body 31 can be made of a suitable transparent material, such as glass, quartz or CF2, over which a pattern of opaque material such as chrome is formed. If the reticle is a phase-shifting layer, a phase transfer layer is provided beneath the chrome layer. In some embodiments, the phase transfer layer can comprise any composition selected from transition metal elements, lanthanides, and any combination thereof. Examples include Mo, Zr, Ta, Cr, and Hf. In one example, the metal-containing layer is composed of one of the following materials, MoSi, MoSiON or Cr. A thin film 303 is assembled on the body 301 to protect a pattern formed on the body 301. The thin film 303 can be formed to a thickness ranging from about 2 μm to about 5 μm thick and having a high transmittance for light.

Continuing with reference to Figure 2, the acoustic wave generating device 60 is configured to generate an acoustic wave. In some embodiments, the acoustic wave generating device 60 is disposed along an axis Z with respect to one of the two clamping heads 34, 35, and includes a transducer 61 and an oscillator 63 coupled to the transducer 61. The transducer 61 is electrically coupled to the control device 70 and converted to a magnetic force having a different intensity according to an electronic signal from the control device 70. The oscillator 63 is vibrated by the above-described magnetic force to generate an acoustic wave. In some embodiments, the acoustic wave generated by acoustic wave generating device 60 is an ultrasonic wave having a frequency between about 10 kHz (kilohertz) and about 100 kHz.

The control device 70 is configured to control the operation of a plurality of devices of the transport system 1. In some embodiments, control device 70 is a computer device that is coupled to the remaining devices of transport system 1 in a wired or wireless manner. For example, the control device 70 is electrically coupled to the switching device 30, the carrier device 40, and the acoustic wave generating device 60. The control device 70 controls the movement of the switching device 30 and the carrier device 40, and controls the operation of the acoustic wave generating device 60, including the wavelength or frequency of the acoustic wave generated by the acoustic wave generating device 60. In some embodiments, the control switching device 30 or the sound wave generating device 60 is provided with a detector to detect the position of the carrier device 40 and send it back to the control device 70.

FIG. 5 is a flow chart showing a method 80 of transporting a reticle in accordance with some embodiments of the present disclosure. For purposes of illustration, the flowchart will be described in conjunction with the schematics shown in Figures 6-9. Can be replaced or eliminated for different embodiments Some of the operations described. Additional components can be added to the transport system 1. Some of the components described may be replaced or eliminated for different embodiments.

The method 80 begins at operation 81 where the processing element 3 is placed over the carrier device 40 using the switching device 30. In some embodiments, to transport the processing element 3 held by the clamping head 35 into the processing apparatus 50 for processing, the carrier 40 is first moved to the position shown in FIG. In this position, the carrier 40 is located between the clamping head 35 and the acoustic wave emitting device 60. The clamping head 35, the carrier device 40 and the acoustic wave emitting device 60 are sequentially arranged along the axis Z. In the remaining embodiments not shown, when the processing element 3 is loaded, the carrier 40 is located below the clamping head 35 and is not disposed between the clamping head 35 and the acoustic wave emitting device 60.

Next, the lifting unit 33 is lowered to place the processing element 3 held by the chucking head 35 on the carrier device 40. At this time, the thin film 303 of the processing element 3 is located in the opening 43, and the opposite sides of the body 301 of the processing element 3 are fixed by the chuck device 45. The opposite sides of the body 301 of the processing element 3 directly contact the film 47 and are vacuum-adsorbed by the suction holes 451 to be fixed on the carrier 40. Next, as shown in Fig. 7, the chucking head 35 releases the processing member 3, and the lifting unit 33 raises the chucking head 35.

In the embodiment in which the processing device 50 processes the substrate 5 using the processing element 3, the carrier device 40 then moves the processing element 3 into the processing device 50, and the processing element 3 is placed over the processed substrate 5 for subsequent processing. This disclosure is not limited to this. In the remaining embodiments, the processing element 3 on the carrier 40 is not used to machine the substrate 5, and the processing element 3 is only transmitted through the carrier 40 to another device. Alternatively, the processing element 3 is only disposed on the carrying device 40, the position of the carrying device 40 is fixed, and the loading device 40 does not move the processing element. Item 3.

The method 80 continues to operation 82 where the carrier device 40 is moved over the acoustic wave transmitting device 60 such that the acoustic wave transmitting device 60 emits one side of the acoustic wave facing the front side of the processing element 3. In some embodiments, when operation 82 is in progress, carrier 40 is moved to the same position as operation 81. That is, the carrier device 40 is located between the chucking head 35 and the acoustic wave emitting device 60. Further, the chucking head 35, the carrier device 40, and the acoustic wave emitting device 60 are sequentially arranged along the axis Z. However, the disclosure is not limited to this. In the remaining unillustrated embodiment, when operation 82 is in progress, carrier 40 is positioned above acoustic emission device 60 and is not disposed between clamping head 35 and acoustic emission device 60.

In some embodiments, when the carrier device 40 is placed above the acoustic wave emitting device 60, the acoustic wave transmitting device 60 is spaced apart from the plane P of the processing device 40 by the processing element 3 by a distance L, and the spacing L is approximately equal to nλ/2, where λ is The wavelength of the sound wave generated by the acoustic wave emitting device, n is a natural number greater than or equal to 1. The processing element 3 is located at a position substantially at the peak or trough of the acoustic wave generated by the acoustic wave emitting device. In the embodiment in which the pitch L between the acoustic wave transmitting device 60 and the plane P described above is fixed, the above equation can be satisfied by adjusting the wavelength of the acoustic wave generated by the acoustic wave transmitting device.

The method 80 continues to operation 83. In operation 83, the acoustic wave having the energy change is generated by the acoustic wave emitting device 60, causing the processing element 3 to move relative to the carrier 40 by the acoustic wave. In some embodiments, the wavelength λ of the acoustic wave generated by the acoustic wave emitting device 60 satisfies the formula H=(2m+1)λ/4, where H is the height difference H between the acoustic wave emitting device 60 and the clamping head 35, m Is a natural number greater than or equal to 0. In some embodiments, m is a natural number greater than or equal to one. In some embodiments, m is A natural number greater than n. In some embodiments, the method of varying the height difference includes moving the position of the holding head 35 relative to the acoustic wave emitting device 60. In some embodiments, the method of changing the energy of the acoustic wave generated by the acoustic wave transmitting device includes changing the frequency of the acoustic wave, changing the wavelength of the acoustic wave, and the like.

In some embodiments, as shown in FIG. 8, the sound waves generated by the acoustic wave emitting device 60 are reflected on the bottom surface of the chucking head 35, and a standing wave S1 is generated in the sound wave transmitting device 60 and the chucking head 35. between. Thus, the processing element 3 and the carrier device 40 located between the acoustic wave emitting device 60 and the chucking head 35 advance by the "acoustic levitation" technique toward the node of the standing wave under the force of the sound wave.

In some embodiments, since the weight of the carrier device 40 is much larger than the weight of the processing member 3, the force of the acoustic wave can cause the processing member 3 to move but the carrier device 40 cannot be moved. Then, the processing element 3 is subjected to the relative movement of the acoustic wave having the energy change relative to the carrier 40, and the adsorption force between the processing element 3 and the film 47 (Fig. 4) of the carrier device 40 is destroyed, and the processing element 3 and the film are processed. The contact force of 47 is further reduced or even disappeared.

The method 80 continues to operation 84. In operation 84, the processing element 3 is removed from the carrier device 40. In some embodiments, the processing element 3 is removed from the carrier 40 by the clamping head 35. Among them, the lifting unit 33 lowers the clamping head 35 so that the clamping head 35 grips the processing element 3. Next, as shown in Fig. 9, the lifting unit 33 is raised to remove the processing element 3 from the carrier unit 40. It is to be noted that since the suction force between the processing element 3 and the film 47 (Fig. 4) of the carrier device 40 has been previously broken, the pulling force provided by the lifting unit 33 to remove the processing member 3 from the carrier device 40 can be reduced. , thereby preventing the film 47 from being subjected to the removal of the processing element 3 To destruction.

In some embodiments, the processing element 3' held by the clamping head 34 is used after the processing element 3. Thus, the chucking heads 34, 35 are displaced by the rotation of the base 31 about the axis of rotation A such that the processing element 3' is positioned above the carrier unit 40. Next, the above-described operations 81-83 are repeated to move the processing element 3'. At the same time, the machining element 3 that has been used is removed from the clamping head 34. If there are subsequent processing elements to be used, they are held by the clamping head 34.

Referring to Fig. 10, in some embodiments, the surface of the processing element 3 is for reflecting the sound waves generated by the acoustic wave transmitting device 60, and a standing wave S2 is formed between the acoustic wave transmitting device 60 and the processing element 3. At this time, the sound wave emitting device 60 and the plane P of the carrier device 40 contacting the processing element 3 are separated by a distance L, and the pitch L is equal to nλ/2, where λ is the wavelength of the sound wave generated by the sound wave emitting device, and n is greater than or equal to 1 Natural number. In this embodiment, n is preferably equal to 1, or less than or equal to 4.

Figure 11 shows a schematic view of some of the components of the transport system 1a of some embodiments of the present disclosure. The same or similar elements as those in FIG. 2 in the embodiment shown in FIG. 11 will be given the same reference numerals, and their features will not be described in detail to simplify the description. The difference between the electric transport system 1 and the transport system 1a includes that the exchange device 30 is replaced by the exchange device 30a.

The exchange device 30a is configured to grip the machining element 3 before and after the machining element 3 is placed on the carrier device 40. In some embodiments, as shown in Fig. 11, the switching device 30 includes a base 31, two lifting units 32, 33, two clamping heads 34a, 35a, and two transducers 36a, 37a. The two lifting units 32 and 33 are each coupled to the bottom surface of the base 31. The two clamping heads 34a, 35a are respectively coupled to the ends of the two lifting units 32, 33. The base 31 is rotatable about a rotation axis A, and two lifting The units 32, 33 are independently movable in the vertical direction relative to the base 31. The two clamping heads 34a, 35a are arranged to grip the processing element 3 in a suitable manner. For example, the two clamping heads 34a, 35a are respectively coupled to a vacuum source, and the processing element 3 is fixed to the bottom surface by the suction generated by the vacuum.

The two transducers 36a and 37a are connected to the holding heads 34a and 35a, respectively, and are electrically connected to the control device 70. The two transducers 36a, 37a are converted into magnetic forces of different intensities based on the electronic signals from the control device 70. The chucking heads 34a, 35a are vibrated by the above-described magnetic force to generate sound waves. In some embodiments, the acoustic waves generated by the transducers 36a, 37a are ultrasonic waves having a frequency between about 10 kHz (kilohertz) and about 100 kHz.

In some embodiments, as shown in FIG. 11, the acoustic wave generated by the acoustic wave emitting device 60 interferes with the acoustic wave generated by the chucking head 35a, and a standing wave S3 is generated from the acoustic wave at the acoustic wave transmitting device 60 and the clamping head. Between 35a. Thus, the processing element 3 and the carrier device 40 located between the acoustic wave emitting device 60 and the chucking head 35a are advanced by the "acoustic levitation" technique to the node of the standing wave by the force of the sound wave.

In some embodiments, the method of transporting the processing element 3 with the exchange device 30a is similar to the method 80 of FIG. However, at the time of operation 83, the wavelengths λ of the acoustic waves generated by the acoustic wave transmitting device 60 and the chucking head 35a each satisfy the formula H = mλ/2, where H is the height difference between the acoustic wave transmitting device 60 and the chucking head 35a. H, m is a natural number greater than or equal to 1. In some embodiments, m is a natural number greater than n. In some embodiments, the method of varying the height difference includes moving the position of the holding head 35a relative to the acoustic wave emitting device 60. In some embodiments, the acoustic wave emitted by the acoustic wave emitting device 60 satisfies the equation ua=Asin(kx-wt), and The acoustic wave emitted by the holding head 35a satisfies the equation ub=Asin(kx-wt), where ua+ub=2Acos(wt)sin(kx), and k=2π/λ.

Figure 12 is a schematic illustration of some of the components of the transport system 1b of some embodiments of the present disclosure. Elements that are the same as or similar to those in FIG. 2 in the embodiment shown in FIG. 12 will be given the same reference numerals, and their features will not be described in detail to simplify the description. The difference between the electric transport system 1 and the transport system 1b includes that the acoustic wave transmitting device 60 is replaced by the acoustic wave transmitting device 60b.

The acoustic wave emitting device 60b includes a base 62b, a movable member 66b, two cylinders 64b, 68b, and a transducer 69b. The movable member is disposed along the axis Z with respect to the base 62b. The pillars 64b and 68b are respectively disposed on opposite sides of the base 62b, and each connects the base 62b and the movable member 66b. The transducer 69b connects one of the two cylinders 64b, 68b and is electrically connected to the control device 70. The transducer 69b can include a piezoelectric material.

When the transducer 69b is actuated, the movable member 66b vibrates against the base 62b to generate the shock wave S4. At the same time, the air medium around the movable member 66b is shaken by the shock wave S4 and reflected on the bottom surface of the chucking head 35, and the plurality of standing waves S5 are generated between the sound wave transmitting device 60b and the chucking head 35. Then, the processing element 3 and the carrier device 40 located between the acoustic wave emitting device 60b and the chucking head 35 advance by the "acoustic levitation" technique toward the node of the standing wave S5 by the force of the sound wave.

In some embodiments, the method of transporting the processing element 3 with the exchange device 30b is similar to the method 80 of FIG. However, at the time of operation 83, the wavelength λ of the acoustic wave generated by the acoustic wave transmitting device 60b satisfies the formula H = (2m + 1) λ / 4, where H is the height difference H between the acoustic wave transmitting device 60b and the chucking head 35. , m is greater than A natural number equal to zero. In some embodiments, m is a natural number greater than or equal to one. In some embodiments, m is a natural number greater than n. In some embodiments, the method of varying the height difference includes moving the position of the holding head 35 relative to the acoustic wave emitting device 60b.

In an embodiment of the plurality of transport systems disclosed herein, the adsorptive force between the processing element and the carrier device is disrupted by sonic suspension techniques prior to separation of the processing element from the carrier. Since the external force for removing the processing element can be reduced as a result, in the prior art, when the processing element is separated from the carrier device, the film on the carrier device in contact with the processing element is destroyed and can be further avoided. In addition, as the proper rate of the transportation system increases, the output processed by the transportation system can be further increased. Moreover, as the service life of the transport system is extended, the cost of processing using the machined components is also reduced.

The embodiments and their advantages are described in detail above, and it is understood that various changes, substitutions and modifications may be made in the present disclosure without departing from the spirit and scope of the disclosure. Further, the scope of the present application is not intended to be limited to the specific embodiments of the process, the machine, the manufacture, the material composition, the tool, the method and the steps described in the specification. It will be readily apparent to those skilled in the art from this disclosure that, in accordance with the present disclosure, substantially the same functions or implementations as those of the corresponding embodiments described herein may be utilized. The resulting process, machine, manufacturing, material composition, tool, method or procedure. Therefore, the scope of the appended claims is intended to cover such processes, machines, manufacture, compositions of matter, tools, methods or steps. In addition, each patent application scope constitutes a separate embodiment, and combinations of different application patent scopes and embodiments are disclosed herein. Within the scope.

3, 3'‧‧‧Processing components

30‧‧‧Exchange device

31‧‧‧ Pedestal

32‧‧‧ Lifting unit

33‧‧‧ Lifting unit

34‧‧‧Clamping head

35‧‧‧Clamping head

40‧‧‧ Carrying device

41‧‧‧Terminal body

60‧‧‧Sonic launcher

61‧‧‧Transducer

63‧‧‧Oscillator

70‧‧‧Control device

S1‧‧‧ Standing wave

L‧‧‧ spacing

H‧‧‧ height difference

Z‧‧‧ axis

Claims (10)

A transport system adapted to transport a processing component, comprising: an acoustic wave emitting device configured to generate acoustic waves; and a carrier configured to carry the processing component, wherein the processing component is disposed on the carrier device and When the carrying device is disposed relative to the acoustic wave transmitting device, the sound wave generated by the processing component by the acoustic wave transmitting device moves relative to the carrying device. The transport system of claim 1, wherein the acoustic wave transmitting device is spaced apart from the carrying device by a distance L, which is approximately equal to nλ/2, wherein λ is the wavelength of the acoustic wave generated by the acoustic wave transmitting device, n is a natural number greater than or equal to 1. The transport system of claim 1, further comprising a clamping head disposed along an axis relative to the acoustic wave emitting device and configured to clamp the processing component; wherein the acoustic wave emitting device is spaced apart from the clamping head a height difference H which satisfies the following equation: H = (2m + 1) λ / 4 where λ is the wavelength of the acoustic wave generated by the acoustic wave emitting device, and m is a natural number greater than or equal to 0, thereby setting the The processing element on the carrier moves relative to the carrier by a standing wave generated between the acoustic wave transmitting device and the clamping head. The transport system of claim 1, further comprising: a clamping head disposed along an axis relative to the acoustic wave emitting device and configured to clamp the processing component; a transducer coupled to the clamping head and configured to generate an acoustic wave; wherein the acoustic wave emitting device is separated from the clamping head by a height difference H, the height difference H satisfying the following equation: H=mλ/2, where λ is The wavelength of the acoustic wave generated by the acoustic wave transmitting device, m is a natural number greater than or equal to 1, whereby the processing element on the carrying device is disposed by the standing wave generated between the acoustic wave transmitting device and the clamping head The carrying device moves. The transport system of claim 1, wherein the acoustic wave emitting device comprises: a base; a movable member disposed along the axis relative to the base; a plurality of cylinders connecting the base and the movable member; and a The transducer is coupled to one of the cylinders, and when the transducer is actuated, the movable member vibrates relative to the base. A method of transporting a processing component, comprising: placing the processing component on a carrier device; moving the carrier device onto an acoustic wave emitting device; and generating an acoustic wave having an energy change by the acoustic wave emitting device to cause the carrier device to be located The processing element above is moved by the acoustic wave generated by the acoustic wave emitting device relative to the carrier; and the processing component is removed from the carrier. The method of claim 6, wherein the acoustic wave transmitting device and the carrying device are when the carrying device moves over the acoustic wave transmitting device Separated by a spacing L, the spacing L is approximately equal to nλ/2, where λ is the wavelength of the acoustic wave generated by the acoustic wave emitting device, and n is a natural number greater than or equal to 1. The method of claim 6, wherein when the carrier device is moved over the acoustic wave emitting device, the carrier device is located at the acoustic wave emitting device and a clip for removing the processing component from the carrier device Between the heads; wherein the method further comprises generating another sound wave by using a transducer coupled to the chucking head, wherein the wavelength of the sound wave generated by the sound wave emitting device satisfies the following formula: H=mλ/2, wherein H The height difference between the acoustic wave transmitting device and the clamping head, λ is the wavelength of the acoustic wave generated by the acoustic wave emitting device, and m is a natural number greater than or equal to 1. The method of claim 6, wherein when the carrier device is moved over the acoustic wave emitting device, the carrier device is located at the acoustic wave emitting device and a clip for removing the processing component from the carrier device Between the heads; wherein the wavelength of the sound wave generated by the acoustic wave transmitting device satisfies the following formula: H = (2m + 1) λ / 4 where H is the height difference between the acoustic wave emitting device and the clamping head, λ The wavelength of the sound wave generated by the acoustic wave emitting device, m is a natural number greater than or equal to zero. The method of claim 6, wherein the method of changing the energy of the sound wave generated by the sound wave transmitting device comprises changing the frequency of the sound wave and changing Varying the wavelength of the sound wave.