TWI563062B - - Google Patents

Info

Publication number
TWI563062B
TWI563062B TW103114792A TW103114792A TWI563062B TW I563062 B TWI563062 B TW I563062B TW 103114792 A TW103114792 A TW 103114792A TW 103114792 A TW103114792 A TW 103114792A TW I563062 B TWI563062 B TW I563062B
Authority
TW
Taiwan
Application number
TW103114792A
Other versions
TW201518469A (zh
Inventor
Toshio Mizowaki
Yoshinori Takagi
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of TW201518469A publication Critical patent/TW201518469A/zh
Application granted granted Critical
Publication of TWI563062B publication Critical patent/TWI563062B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/103—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
TW103114792A 2013-08-06 2014-04-24 導電性接著劑、接合體以及接頭 TW201518469A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013162932 2013-08-06

Publications (2)

Publication Number Publication Date
TW201518469A TW201518469A (zh) 2015-05-16
TWI563062B true TWI563062B (zh) 2016-12-21

Family

ID=52461015

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103114793A TWI565785B (zh) 2013-08-06 2014-04-24 Conductive adhesives and welded joints
TW103114792A TW201518469A (zh) 2013-08-06 2014-04-24 導電性接著劑、接合體以及接頭

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW103114793A TWI565785B (zh) 2013-08-06 2014-04-24 Conductive adhesives and welded joints

Country Status (7)

Country Link
US (2) US10650939B2 (zh)
EP (2) EP3031571A4 (zh)
JP (2) JP5920536B2 (zh)
KR (2) KR102095083B1 (zh)
CN (2) CN105452414B (zh)
TW (2) TWI565785B (zh)
WO (2) WO2015019666A1 (zh)

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* Cited by examiner, † Cited by third party
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CN105452414B (zh) * 2013-08-06 2017-05-17 千住金属工业株式会社 导电性粘接剂、接合体和接头
JP6428716B2 (ja) * 2016-07-12 2018-11-28 千住金属工業株式会社 導電性接着剤、接合体および継手
CN106181148B (zh) * 2016-08-17 2017-12-19 浙江特富锅炉有限公司 一种耐腐蚀的锅炉尾部烟气管道合金的焊接工艺
US11101052B2 (en) 2016-10-06 2021-08-24 Sekisui Chemical Co., Ltd. Conductive material, connection structure and method for producing connection structure
JP6956365B2 (ja) * 2017-02-10 2021-11-02 パナソニックＩｐマネジメント株式会社 はんだペーストとそれにより得られる実装構造体
CN106883805A (zh) * 2017-04-14 2017-06-23 中国科学院深圳先进技术研究院 一种导热导电胶及其制备方法和用途
WO2018216739A1 (ja) * 2017-05-25 2018-11-29 横浜ゴム株式会社 導電性組成物
CN107745202B (zh) * 2017-06-23 2020-07-03 深圳市福英达工业技术有限公司 锡基膏状钎焊焊料及其制备方法
JP6584543B2 (ja) * 2018-01-23 2019-10-02 田中貴金属工業株式会社 導電性接着剤組成物
KR102306104B1 (ko) * 2020-07-03 2021-09-29 대성금속 주식회사 고투명 에폭시 솔더 페이스트 및 이를 포함하는 전자 장치
JP2022172874A (ja) * 2021-05-07 2022-11-17 サカタインクス株式会社 導電性樹脂組成物
WO2023074680A1 (ja) * 2021-10-26 2023-05-04 サカタインクス株式会社 導電性樹脂組成物

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US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
CN101809107A (zh) * 2007-10-03 2010-08-18 日立化成工业株式会社 粘接剂组合物、使用其的搭载有电子部件的基板和半导体装置

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US6059894A (en) * 1998-04-08 2000-05-09 Hewlett-Packard Company High temperature flip chip joining flux that obviates the cleaning process
US6054761A (en) * 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
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Publication number Priority date Publication date Assignee Title
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
CN101809107A (zh) * 2007-10-03 2010-08-18 日立化成工业株式会社 粘接剂组合物、使用其的搭载有电子部件的基板和半导体装置

Also Published As

Publication number Publication date
US20160194525A1 (en) 2016-07-07
US10650939B2 (en) 2020-05-12
JP5935947B2 (ja) 2016-06-15
CN105473276B (zh) 2018-04-17
TW201518469A (zh) 2015-05-16
WO2015019667A1 (ja) 2015-02-12
KR102006057B1 (ko) 2019-07-31
TWI565785B (zh) 2017-01-11
TW201518470A (zh) 2015-05-16
EP3031571A4 (en) 2017-05-17
KR20160040268A (ko) 2016-04-12
CN105473276A (zh) 2016-04-06
US20160194526A1 (en) 2016-07-07
EP3031876A4 (en) 2017-05-31
KR20160040269A (ko) 2016-04-12
CN105452414B (zh) 2017-05-17
EP3031876B1 (en) 2019-07-31
WO2015019666A1 (ja) 2015-02-12
EP3031571A1 (en) 2016-06-15
EP3031876A1 (en) 2016-06-15
KR102095083B1 (ko) 2020-03-30
JPWO2015019667A1 (ja) 2017-03-02
CN105452414A (zh) 2016-03-30
JP5920536B2 (ja) 2016-05-18
JPWO2015019666A1 (ja) 2017-03-02

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