TWI561020B - Delta modulated low power ehf communication link - Google Patents

Delta modulated low power ehf communication link

Info

Publication number
TWI561020B
TWI561020B TW101119491A TW101119491A TWI561020B TW I561020 B TWI561020 B TW I561020B TW 101119491 A TW101119491 A TW 101119491A TW 101119491 A TW101119491 A TW 101119491A TW I561020 B TWI561020 B TW I561020B
Authority
TW
Taiwan
Prior art keywords
communication link
low power
ehf communication
delta modulated
modulated low
Prior art date
Application number
TW101119491A
Other languages
English (en)
Other versions
TW201304438A (zh
Inventor
Gary D Mccormack
Ian A Kyles
Original Assignee
Keyssa Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keyssa Inc filed Critical Keyssa Inc
Publication of TW201304438A publication Critical patent/TW201304438A/zh
Application granted granted Critical
Publication of TWI561020B publication Critical patent/TWI561020B/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/38—Synchronous or start-stop systems, e.g. for Baudot code
    • H04L25/40—Transmitting circuits; Receiving circuits
    • H04L25/49—Transmitting circuits; Receiving circuits using code conversion at the transmitter; using predistortion; using insertion of idle bits for obtaining a desired frequency spectrum; using three or more amplitude levels ; Baseband coding techniques specific to data transmission systems
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/38—Synchronous or start-stop systems, e.g. for Baudot code
    • H04L25/40—Transmitting circuits; Receiving circuits
    • H04L25/49—Transmitting circuits; Receiving circuits using code conversion at the transmitter; using predistortion; using insertion of idle bits for obtaining a desired frequency spectrum; using three or more amplitude levels ; Baseband coding techniques specific to data transmission systems
    • H04L25/4902—Pulse width modulation; Pulse position modulation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B14/00—Transmission systems not characterised by the medium used for transmission
    • H04B14/02—Transmission systems not characterised by the medium used for transmission characterised by the use of pulse modulation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L27/00—Modulated-carrier systems
    • H04L27/02—Amplitude-modulated carrier systems, e.g. using on-off keying; Single sideband or vestigial sideband modulation
    • H04L27/04—Modulator circuits; Transmitter circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H01L2924/30111—Impedance matching

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Near-Field Transmission Systems (AREA)
  • Dc Digital Transmission (AREA)
TW101119491A 2011-05-31 2012-05-31 Delta modulated low power ehf communication link TWI561020B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161491811P 2011-05-31 2011-05-31

Publications (2)

Publication Number Publication Date
TW201304438A TW201304438A (zh) 2013-01-16
TWI561020B true TWI561020B (en) 2016-12-01

Family

ID=46246233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101119491A TWI561020B (en) 2011-05-31 2012-05-31 Delta modulated low power ehf communication link

Country Status (6)

Country Link
EP (1) EP2715997B1 (zh)
JP (1) JP5959630B2 (zh)
KR (1) KR20140039009A (zh)
CN (1) CN103828315A (zh)
TW (1) TWI561020B (zh)
WO (1) WO2012166922A1 (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8554136B2 (en) 2008-12-23 2013-10-08 Waveconnex, Inc. Tightly-coupled near-field communication-link connector-replacement chips
KR101615082B1 (ko) 2011-03-24 2016-04-29 키사, 아이엔씨. 전자기 통신의 집적회로
US9614590B2 (en) 2011-05-12 2017-04-04 Keyssa, Inc. Scalable high-bandwidth connectivity
US8714459B2 (en) 2011-05-12 2014-05-06 Waveconnex, Inc. Scalable high-bandwidth connectivity
US8811526B2 (en) 2011-05-31 2014-08-19 Keyssa, Inc. Delta modulated low power EHF communication link
US8897700B2 (en) 2011-06-15 2014-11-25 Keyssa, Inc. Distance measurement using EHF signals
CN106330268B (zh) 2011-09-15 2019-01-22 基萨公司 电介质媒介下的无线通信
TW201325344A (zh) 2011-10-20 2013-06-16 Waveconnex Inc 低輪廓的無線連接器
WO2013059802A1 (en) 2011-10-21 2013-04-25 Waveconnex, Inc. Contactless signal splicing
WO2013090625A1 (en) 2011-12-14 2013-06-20 Waveconnex, Inc. Connectors providing haptic feedback
US9344201B2 (en) 2012-01-30 2016-05-17 Keyssa, Inc. Shielded EHF connector assemblies
US9559790B2 (en) 2012-01-30 2017-01-31 Keyssa, Inc. Link emission control
US9203597B2 (en) 2012-03-02 2015-12-01 Keyssa, Inc. Systems and methods for duplex communication
WO2013134444A1 (en) 2012-03-06 2013-09-12 Waveconnex, Inc. System for constraining an operating parameter of an ehf communication chip
KR101776821B1 (ko) 2012-03-28 2017-09-08 키사, 아이엔씨. 기판 구조들을 이용하는 전자기 신호의 재지향
KR20150003814A (ko) 2012-04-17 2015-01-09 키사, 아이엔씨. 인터칩 통신을 위한 유전체 렌즈 구조들
EP2883271B1 (en) 2012-08-10 2020-07-22 Keyssa, Inc. Dielectric coupling systems for ehf communications
US9374154B2 (en) 2012-09-14 2016-06-21 Keyssa, Inc. Wireless connections with virtual hysteresis
EP2932556B1 (en) 2012-12-17 2017-06-07 Keyssa, Inc. Modular electronics
WO2014145366A2 (en) 2013-03-15 2014-09-18 Keyssa, Inc. Extremely high frequency communication chip
US9426660B2 (en) 2013-03-15 2016-08-23 Keyssa, Inc. EHF secure communication device
US9473207B2 (en) * 2013-03-15 2016-10-18 Keyssa, Inc. Contactless EHF data communication
US10049801B2 (en) 2015-10-16 2018-08-14 Keyssa Licensing, Inc. Communication module alignment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4497068A (en) * 1982-01-25 1985-01-29 Eaton Corporation Encoding system for optic data link
US4694504A (en) * 1985-06-03 1987-09-15 Itt Electro Optical Products, A Division Of Itt Corporation Synchronous, asynchronous, and data rate transparent fiber optic communications link
US20020058484A1 (en) * 2000-10-06 2002-05-16 Bobier Joseph A. Suppressed cycle based carrier modulation using amplitude modulation
US20070273476A1 (en) * 2004-03-26 2007-11-29 Semiconductor Energy Laboratory Co., Ltd. Thin Semiconductor Device And Operation Method Of Thin Semiconductor Device

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US3796831A (en) * 1972-11-13 1974-03-12 Rca Corp Pulse modulation and detection communications system
JPS5272502A (en) * 1975-12-13 1977-06-17 Mitsubishi Electric Corp Code transmitter
US4678937A (en) * 1984-02-03 1987-07-07 Rosemount Engineering Company Limited Electrical isolation circuit
JPH05236031A (ja) * 1991-07-23 1993-09-10 Hitachi Maxell Ltd データ伝送方式
JPH05327788A (ja) * 1992-05-15 1993-12-10 Hitachi Maxell Ltd データ復調回路
US5621913A (en) 1992-05-15 1997-04-15 Micron Technology, Inc. System with chip to chip communication
JPH0983538A (ja) * 1995-09-18 1997-03-28 Fujitsu Ltd 無線通信用のｉｏカード及びｉｏカードによる無線通信方式
CN2237914Y (zh) * 1995-09-20 1996-10-16 汪雪松 无线助听器
CN2313296Y (zh) * 1997-07-25 1999-04-07 电子工业部第五十四研究所 通信信号八重分集接收简易装置
US6741646B1 (en) * 2000-07-25 2004-05-25 Thomson Licensing S.A. Modulation technique for transmitting a high data rate signal, and an auxiliary data signal, through a band limited channel
US8554136B2 (en) 2008-12-23 2013-10-08 Waveconnex, Inc. Tightly-coupled near-field communication-link connector-replacement chips
JP5278210B2 (ja) * 2009-07-13 2013-09-04 ソニー株式会社 無線伝送システム、電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4497068A (en) * 1982-01-25 1985-01-29 Eaton Corporation Encoding system for optic data link
US4694504A (en) * 1985-06-03 1987-09-15 Itt Electro Optical Products, A Division Of Itt Corporation Synchronous, asynchronous, and data rate transparent fiber optic communications link
US20020058484A1 (en) * 2000-10-06 2002-05-16 Bobier Joseph A. Suppressed cycle based carrier modulation using amplitude modulation
US20070273476A1 (en) * 2004-03-26 2007-11-29 Semiconductor Energy Laboratory Co., Ltd. Thin Semiconductor Device And Operation Method Of Thin Semiconductor Device

Also Published As

Publication number Publication date
KR20140039009A (ko) 2014-03-31
WO2012166922A1 (en) 2012-12-06
TW201304438A (zh) 2013-01-16
JP5959630B2 (ja) 2016-08-02
EP2715997A1 (en) 2014-04-09
EP2715997B1 (en) 2019-11-27
CN103828315A (zh) 2014-05-28
JP2014519761A (ja) 2014-08-14

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