TWI551812B - Lamp module - Google Patents

Lamp module Download PDF

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Publication number
TWI551812B
TWI551812B TW103138967A TW103138967A TWI551812B TW I551812 B TWI551812 B TW I551812B TW 103138967 A TW103138967 A TW 103138967A TW 103138967 A TW103138967 A TW 103138967A TW I551812 B TWI551812 B TW I551812B
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TW
Taiwan
Prior art keywords
circuit board
conductive
circuit
conductive sheet
disposed
Prior art date
Application number
TW103138967A
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Chinese (zh)
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TW201617556A (en
Inventor
張景清
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張景清
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Application filed by 張景清 filed Critical 張景清
Priority to TW103138967A priority Critical patent/TWI551812B/en
Publication of TW201617556A publication Critical patent/TW201617556A/en
Application granted granted Critical
Publication of TWI551812B publication Critical patent/TWI551812B/en

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Description

燈具模組Lighting module 【0001】【0001】

本案係關於一種燈具模組,尤指一種可節省成本並降低功率損耗的燈具模組。This case relates to a lamp module, especially a lamp module that can save cost and reduce power loss.

【0002】【0002】

近年來,隨著發光二極體(light-emitting diode, LED)等相關技術的成熟,發光二極體的發光效率以及使用壽命均獲得顯著的提升,因此,越來越多的燈具以發光二極體取代傳統的發光光源,以達到節能的效果。In recent years, with the maturity of related technologies such as light-emitting diodes (LEDs), the luminous efficiency and service life of light-emitting diodes have been significantly improved. Therefore, more and more lamps are illuminated. The polar body replaces the traditional illuminating light source to achieve energy saving effect.

【0003】[0003]

習用的發光二極體燈具包括電路板、驅動電路板以及導電接腳等元件,發光二極體設置於電路板上。於部分設計中,電路板與驅動電路板之間係透過數條導線相連接,驅動電路板與電路板之間亦透過數條導線相連接。藉此,當電源提供的電流由導電接腳接收後,經由導線傳輸至驅動電路板,並藉由驅動電路板上的驅動電路進行整流以及變壓。接著,再經由導線將電流傳輸至電路板,以提供發光二極體發光所需的電力。A conventional LED lamp includes a circuit board, a driving circuit board, and a conductive pin, and the LED is disposed on the circuit board. In some designs, the circuit board and the driving circuit board are connected by a plurality of wires, and the driving circuit board and the circuit board are also connected through a plurality of wires. Thereby, when the current supplied by the power source is received by the conductive pin, it is transmitted to the driving circuit board via the wire, and is rectified and transformed by the driving circuit on the driving circuit board. The current is then transmitted to the board via the wires to provide the power required to illuminate the LEDs.

【0004】[0004]

然而,利用導線連接導電接腳與驅動電路板,以及利用導線連接電路板與驅動電路板,皆需要透過人工銲接的方式完成,因此,生產成本必須提高。此外,由於導線以及銲接點的數量眾多,亦造成許多的能量損耗。於其他設計中,習用的發光二極體燈具係利用數個連接器以將電路板、驅動電路板以及導電接腳連接起來。然而,連接器的造價較高,若透過連接器連接電路板、驅動電路板以及導電接腳會造成生產成本過高的問題。However, the use of wires to connect the conductive pins to the driving circuit board, and the use of the wires to connect the circuit board and the driving circuit board are all required to be completed by manual soldering, and therefore, the production cost must be increased. In addition, due to the large number of wires and solder joints, many energy losses are also caused. In other designs, conventional LED luminaires utilize a number of connectors to connect the board, the driver board, and the conductive pins. However, the cost of the connector is high, and if the connector is connected to the circuit board, the driving circuit board, and the conductive pin, the production cost is too high.

【0005】[0005]

有鑑於此,如何發展一種燈具模組,以解決習用技術之缺失,實為相關技術領域者目前迫切需要解決之問題。In view of this, how to develop a luminaire module to solve the lack of conventional technology is an urgent problem to be solved by the related art.

【0006】[0006]

本案之目的在於提供一種燈具模組,藉由將兩個電路板相互垂直的固定方式,使設置於第一電路板表面之導電片直接與設置於第二電路板表面之導電片相接觸並形成電性連接,不需要再透過連接器或導線電銲的方式進行連接,以解決成本過高及能量損耗較多等問題。The purpose of the present invention is to provide a lamp module, wherein the conductive sheets disposed on the surface of the first circuit board are directly in contact with the conductive sheets disposed on the surface of the second circuit board by forming the two circuit boards in a manner perpendicular to each other. The electrical connection does not need to be connected through the connector or the wire welding to solve the problems of excessive cost and high energy loss.

【0007】【0007】

本案之另一目的在於提供一種燈具模組,藉由將兩個電路板相互垂直的固定方式,使設置於第一電路板表面之導電片直接與設置於第二電路板表面之導電片相接觸並形成電性連接,以節省生產成本,並可避免過多的能量損耗。Another object of the present invention is to provide a lamp module, wherein the conductive sheets disposed on the surface of the first circuit board are directly in contact with the conductive sheets disposed on the surface of the second circuit board by fixing the two circuit boards perpendicularly to each other. And the electrical connection is formed to save production costs and avoid excessive energy loss.

【0008】[0008]

根據本案之構想,本案之一較廣實施態樣為提供一種燈具模組,包括第一電路板、複數個發光二極體、複數個第一導電片、第二電路板、複數個第二導電片以及二個導電接腳。第一電路板包括第一表面,且複數個第一跡線形成於第一表面,其中第一電路板具有第一端部、第二端部及發光部,且發光部位於第一端部與第二端部之間。複數個發光二極體設置於第一電路板之發光部且位於第一表面,並透過第一電路板之第一跡線相連接。複數個第一導電片設置於第一電路板之第一端部,並與複數個發光二極體相連接。第二電路板設置於第一電路板之第一端部,且第二電路板包括設置表面及電路表面,複數個第二跡線形成於電路表面,其中設置表面平行於電路表面。複數個第二導電片設置於第二電路板,且每一個第一導電片分別與對應之第二導電片相接觸,俾使第一導電片與第二導電片形成電性連接。二個導電接腳設置於第二電路板,並垂直突出於設置表面,且每一導電接腳分別與對應之第二導電片形成電性連接。According to the concept of the present invention, a wider implementation aspect of the present invention provides a lamp module, including a first circuit board, a plurality of light emitting diodes, a plurality of first conductive sheets, a second circuit board, and a plurality of second conductive materials. The chip and two conductive pins. The first circuit board includes a first surface, and the plurality of first traces are formed on the first surface, wherein the first circuit board has a first end portion, a second end portion, and a light emitting portion, and the light emitting portion is located at the first end portion Between the second ends. The plurality of light emitting diodes are disposed on the light emitting portion of the first circuit board and located on the first surface, and are connected through the first trace of the first circuit board. A plurality of first conductive sheets are disposed on the first end of the first circuit board and connected to the plurality of light emitting diodes. The second circuit board is disposed at the first end of the first circuit board, and the second circuit board includes a setting surface and a circuit surface, and the plurality of second traces are formed on the circuit surface, wherein the setting surface is parallel to the circuit surface. The plurality of second conductive sheets are disposed on the second circuit board, and each of the first conductive sheets is respectively in contact with the corresponding second conductive sheet, so that the first conductive sheet and the second conductive sheet are electrically connected. The two conductive pins are disposed on the second circuit board and protrude perpendicularly from the setting surface, and each of the conductive pins is electrically connected to the corresponding second conductive sheet.

【0020】[0020]

1:燈具模組
11:第一電路板
111:第一端部
112:發光部
113:第二端部
12:發光二極體
12a:第一組發光二極體
12b:第二組發光二極體
13、13a、13b、13c、13d:第一導電片
14、24:第二電路板
15、15a、15b、15c、15d:第二導電片
16:導電接腳
A1:設置表面
A2:電路表面
A3:貼合表面
S1:第一表面
S2:第二表面
t:第一跡線
1: Lighting module
11: The first circuit board
111: first end
112: Light department
113: second end
12: Light-emitting diode
12a: The first group of light-emitting diodes
12b: The second group of light-emitting diodes
13, 13a, 13b, 13c, 13d: first conductive sheet
14, 24: second circuit board
15, 15a, 15b, 15c, 15d: second conductive sheet
16: conductive pin
A1: Setting the surface
A2: circuit surface
A3: Fitting surface
S1: first surface
S2: second surface
t: first trace

【0009】【0009】

第1圖係為本案較佳實施例之燈具模組之示意圖。Figure 1 is a schematic view of a lamp module of the preferred embodiment of the present invention.

第2圖係為第1圖所示之燈具模組之分解結構示意圖。Figure 2 is a schematic exploded view of the luminaire module shown in Figure 1.

第3圖係為本案另一較佳實施例之燈具模組之示意圖。Figure 3 is a schematic view of a lamp module of another preferred embodiment of the present invention.

第4圖係為第3圖所示之燈具模組之分解結構示意圖。Figure 4 is a schematic exploded view of the luminaire module shown in Figure 3.

【0010】[0010]

體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖式在本質上係當作說明之用,而非架構於限制本案。Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and is not intended to limit the scope of the invention.

【0011】[0011]

請參閱第1圖及第3圖並配合第2圖及第4圖,第1圖係為本案較佳實施例之燈具模組之示意圖;第2圖係為第1圖所示之燈具模組之分解結構示意圖;第3圖係為本案另一較佳實施例之燈具模組之示意圖;第4圖係為第3圖所示之燈具模組之分解結構示意圖。如第1圖第2圖、第3圖及第4圖所示,燈具模組1包括第一電路板11、複數個發光二極體12、複數個第一導電片13、第二電路板14、複數個第二導電片15以及二個導電接腳16。第一電路板11可為印刷電路板(printed circuit board, PCB),並包括第一表面S1,且複數個第一跡線t形成第一電路板11之第一表面S1,以供電流導通。第一電路板11具有第一端部111、發光部112以及第二端部113,發光部112分別與第一端部111及第二端部113相連接,即發光部112位於第一端部111與第二端部113之間。複數個發光二極體12設置於第一電路板11之發光部112,且複數個發光二極體12位於第一電路板11之第一表面S1,然並不以此為限,亦可依照實際應用將複數個發光二極體12分成數個組別,且各組別之發光二極體12可分別透過第一電路板11之第一跡線t進行串聯連接。複數個第一導電片13設置於第一電路板11之第一端部111,並與複數個發光二極體12相連接。Please refer to FIG. 1 and FIG. 3 together with FIG. 2 and FIG. 4 . FIG. 1 is a schematic view of a lamp module according to a preferred embodiment of the present invention; FIG. 2 is a lamp module shown in FIG. 1 . 3 is a schematic view of a lamp module of another preferred embodiment of the present invention; and FIG. 4 is a schematic exploded view of the lamp module shown in FIG. As shown in FIG. 1 , FIG. 2 , FIG. 3 and FIG. 4 , the lamp module 1 includes a first circuit board 11 , a plurality of LEDs 12 , a plurality of first conductive sheets 13 , and a second circuit board 14 . a plurality of second conductive sheets 15 and two conductive pins 16. The first circuit board 11 can be a printed circuit board (PCB) and includes a first surface S1, and the plurality of first traces t form a first surface S1 of the first circuit board 11 for conducting current. The first circuit board 11 has a first end portion 111, a light emitting portion 112, and a second end portion 113. The light emitting portion 112 is respectively connected to the first end portion 111 and the second end portion 113, that is, the light emitting portion 112 is located at the first end portion. 111 is between the second end 113 and the second end 113. The plurality of LEDs 12 are disposed on the first portion of the first circuit board 11 and the plurality of LEDs 12 are located on the first surface S1 of the first circuit board 11. In practical applications, the plurality of LEDs 12 are divided into a plurality of groups, and the LEDs 12 of each group can be connected in series through the first trace t of the first circuit board 11, respectively. A plurality of first conductive sheets 13 are disposed on the first end portion 111 of the first circuit board 11 and are connected to the plurality of light emitting diodes 12.

【0012】[0012]

請再參閱第1圖及第3圖並配合第2圖及第4圖,第二電路板14設置於第一電路板11之第一端部111,並可藉由例如:固定元件、黏著劑或殼體(皆未圖示),以將第二電路板14垂直固定於第一電路板11上,使第一電路板11與第二電路板14組接成為L型。第二電路板14包括設置表面A1與電路表面A2,複數個第二跡線(未圖示)形成於第二電路板14之電路表面A2,其中設置表面A1平行於電路表面A2。複數個第二導電片15設置於第二電路板14,且每一個第一導電片13係以一對一的對應方式分別與對應之第二導電片15相接觸,使第一導電片13與第二導電片15形成電性連接。二個導電接腳16設置於第二電路板14,並垂直突出於第二電路板14之設置表面A1,且每一導電接腳分別與對應之第二導電片形成電性連接。藉此,二個導電接腳16、第二電路板14之第二跡線、複數個第二導電片15、複數個第一導電片13、第一電路板11之第一跡線t以及複數個發光二極體12形成完整迴路,以透過二個導電接腳16將外部電源(未圖示)所提供的電力輸入至複數個發光二極體12,以驅動發光二極體12進行發光。Referring to FIGS. 1 and 3 together with FIGS. 2 and 4, the second circuit board 14 is disposed on the first end portion 111 of the first circuit board 11, and may be provided, for example, by a fixing member or an adhesive. Or a casing (none of which is shown) to vertically fix the second circuit board 14 to the first circuit board 11, and to form the first circuit board 11 and the second circuit board 14 into an L-shape. The second circuit board 14 includes a set surface A1 and a circuit surface A2, and a plurality of second traces (not shown) are formed on the circuit surface A2 of the second circuit board 14, wherein the set surface A1 is parallel to the circuit surface A2. The plurality of second conductive sheets 15 are disposed on the second circuit board 14, and each of the first conductive sheets 13 is respectively in contact with the corresponding second conductive sheet 15 in a one-to-one correspondence manner, so that the first conductive sheets 13 and The second conductive sheet 15 forms an electrical connection. The two conductive pins 16 are disposed on the second circuit board 14 and protrude perpendicularly from the mounting surface A1 of the second circuit board 14, and each of the conductive pins is electrically connected to the corresponding second conductive sheet. Thereby, the two conductive pins 16, the second trace of the second circuit board 14, the plurality of second conductive sheets 15, the plurality of first conductive sheets 13, the first trace t of the first circuit board 11, and the plurality The light-emitting diodes 12 form a complete loop for inputting power provided by an external power source (not shown) to the plurality of light-emitting diodes 12 through the two conductive pins 16 to drive the light-emitting diodes 12 to emit light.

【0013】[0013]

請再參閱第1圖及第2圖,於本實施例中,第一導電片13位於第一電路板11之第一表面S1,且第一導電片13係由導電性佳的材質所構成,例如:銅片,且較佳為第一導電片13與第一電路板11一體成形。此外,第二電路板14包括貼合表面A3,第二導電片15設置於第二電路板14之貼合表面A3,且第二電路板14之貼合表面A3垂直於電路表面A2,使第二電路板14透過貼合表面A3與第一電路板11之第一表面S1相組接。換言之,第二電路板14之貼合表面A3貼附於第一電路板11之第一表面S1,使位於第一電路板11之第一表面S1之第一導電片13直接與位於第二電路板14之貼合表面A3之第二導電片15相接觸,以形成電性連接,構成第二電路板14垂直固定於第一電路板11之連接方式。於本實施例中,第二導電片15係透過電鍍的方式設置於第二電路板14之貼合表面A3,即將第二電路板14之電路表面A2之第二跡線電鍍延伸至第二電路板14之貼合表面A3,因此,第二電路板14可以垂直設置的方式直接與第一電路板11形成電性連接,達到減少生產成本,提高導電效率等優點。Referring to FIG. 1 and FIG. 2 again, in the embodiment, the first conductive sheet 13 is located on the first surface S1 of the first circuit board 11, and the first conductive sheet 13 is made of a material having good conductivity. For example, a copper sheet, and preferably the first conductive sheet 13 is integrally formed with the first circuit board 11. In addition, the second circuit board 14 includes a bonding surface A3, the second conductive sheet 15 is disposed on the bonding surface A3 of the second circuit board 14, and the bonding surface A3 of the second circuit board 14 is perpendicular to the circuit surface A2, so that The two circuit boards 14 are assembled to the first surface S1 of the first circuit board 11 through the bonding surface A3. In other words, the bonding surface A3 of the second circuit board 14 is attached to the first surface S1 of the first circuit board 11, so that the first conductive sheet 13 located on the first surface S1 of the first circuit board 11 directly and in the second circuit The second conductive sheets 15 of the bonding surface A3 of the board 14 are in contact with each other to form an electrical connection, and constitute a connection manner in which the second circuit board 14 is vertically fixed to the first circuit board 11. In this embodiment, the second conductive sheet 15 is disposed on the bonding surface A3 of the second circuit board 14 by electroplating, that is, the second trace of the circuit surface A2 of the second circuit board 14 is plated to the second circuit. The surface 14 of the board 14 is bonded to the surface A3. Therefore, the second circuit board 14 can be directly electrically connected to the first circuit board 11 in a vertically disposed manner, thereby reducing the production cost and improving the conductive efficiency.

【0014】[0014]

請再參閱第3圖及第4圖,於本實施例中,第一電路板11更包括第二表面S2,第二表面S2垂直於第一表面S1,且第一導電片13位於第一電路板11之第二表面S2。此外,第二導電片15設置於電路表面A2,使第二電路板14透過電路表面A2與第一電路板11之第二表面S2相組接。換言之,第一電路板11之第二表面S2貼附於第二電路板14之電路表面A2,使位於第一電路板11之第二表面S2之第一導電片13直接與位於第二電路板14之電路表面A2之第二導電片15相接觸,以形成電性連接,構成,構成第一電路板11垂直固定於第二電路板14之連接方式。於本實施例中,較佳之實施方式為第一導電片13電鍍於第一電路板11之第二表面,第二導電片15與第二電路板14一體成形,即將第一電路板11之第一表面S1之第一跡線t電鍍延伸至第一電路板11之第二表面S2,因此,第一電路板11可以垂直設置的方式直接與第二電路板14形成電性連接,達到節省導線或連接器之生產成本,並提高電的傳輸效率的優點。Referring to FIG. 3 and FIG. 4 again, in the embodiment, the first circuit board 11 further includes a second surface S2, the second surface S2 is perpendicular to the first surface S1, and the first conductive sheet 13 is located at the first circuit. The second surface S2 of the plate 11. In addition, the second conductive sheet 15 is disposed on the circuit surface A2 such that the second circuit board 14 is coupled to the second surface S2 of the first circuit board 11 through the circuit surface A2. In other words, the second surface S2 of the first circuit board 11 is attached to the circuit surface A2 of the second circuit board 14, so that the first conductive sheet 13 located on the second surface S2 of the first circuit board 11 is directly located on the second circuit board. The second conductive sheets 15 of the circuit surface A2 of 14 are in contact with each other to form an electrical connection, and constitute a connection manner in which the first circuit board 11 is vertically fixed to the second circuit board 14. In this embodiment, the preferred embodiment is that the first conductive sheet 13 is plated on the second surface of the first circuit board 11, and the second conductive sheet 15 is integrally formed with the second circuit board 14, that is, the first circuit board 11 is The first trace t of the surface S1 is plated to extend to the second surface S2 of the first circuit board 11. Therefore, the first circuit board 11 can be electrically connected directly to the second circuit board 14 in a vertically disposed manner to save the wire. Or the production cost of the connector, and the advantage of improving the transmission efficiency of electricity.

【0015】[0015]

於一些實施例中,二個導電接腳16符合特定日光燈燈座的規格與形狀,並由導電性佳的材料所構成,再利用射出成形、銲接或是沖壓的方式將二個導電接腳16固定於第二電路板14上,然不以此為限,導電接腳16亦可為符合其他現有燈座規格的形狀,以將不同燈座規格取得的電力輸入燈具模組1。In some embodiments, the two conductive pins 16 conform to the specifications and shapes of the specific fluorescent lamp holder, and are made of a highly conductive material, and then the two conductive pins 16 are formed by injection molding, welding or stamping. It is fixed on the second circuit board 14. However, the conductive pin 16 may also be in a shape conforming to other existing lamp socket specifications, so that the power obtained by different lamp socket specifications is input into the lamp module 1.

【0016】[0016]

於一些實施例中,第一電路板11與第二電路板14係為單面電路板,僅在第一表面S1與電路表面A2具有跡線,但不以此為限,第一電路板11與第二電路板14亦可為雙面板或多層板。於一些實施例中,第二電路板14包括驅動電路(未圖示),以藉由該驅動電路將外部電源所提供之電力轉換為驅動發光二極體12發光所需之電力,作為複數個發光二極體12的驅動電路板,然不以此為限。於另一些實施例中,驅動電路可以獨立設置,即第二電路板14並未設置任何驅動電路,。In some embodiments, the first circuit board 11 and the second circuit board 14 are single-sided circuit boards, and have traces only on the first surface S1 and the circuit surface A2, but not limited thereto, the first circuit board 11 The second circuit board 14 can also be a double panel or a multi-layer board. In some embodiments, the second circuit board 14 includes a driving circuit (not shown) for converting the power provided by the external power source into the power required to drive the light emitting diode 12 to emit light, as a plurality of The driving circuit board of the LED 12 is not limited thereto. In other embodiments, the driving circuit can be independently provided, that is, the second circuit board 14 is not provided with any driving circuit.

【0017】[0017]

請再參閱第1圖及第2圖,舉例而言,複數個發光二極體12分成第一組發光二極體12a以及第二組發光二極體12b。第一組發光二極體12a互相串聯並且排成為兩列,第二組發光二極體12b亦互相串聯並且排成為兩列,各列發光二極體12相互間隔一定間距排列。此外,第一組發光二極體12a的上游處透過跡線與對應的第一導電片13a相連接,第一組發光二極體12a的下游處透過跡線與對應的第一導電片13b相連接;相似地,第二組發光二極體12b的上游處透過第一電路板11之跡線與對應之第一導電片13c相連接,第二組發光二極體12b的下游處透過跡線與對應的第一導電片13d相連接。當第二電路板14之貼合表面A2貼合於第一電路板11之第一表面S1時,第一導電片13a係與第二電路板14之第二導電片15a相接觸,以此類推,第一導電片13b、13c、13d分別與第二導電片15b、15c、15d相接觸,以將燈座(未圖示)所提供之電力經由二個導電接腳16傳輸至第二導電片15,再由第二導電片15直接傳輸至第一導電片13。然後,透過第一導電片13將電力傳輸至複數個發光二極體12,以驅動發光二極體12發光。Referring to FIG. 1 and FIG. 2 again, for example, the plurality of light emitting diodes 12 are divided into a first group of light emitting diodes 12a and a second group of light emitting diodes 12b. The first group of light-emitting diodes 12a are connected in series to each other and arranged in two columns, and the second group of light-emitting diodes 12b are also connected in series to each other and arranged in two columns, and the columns of the light-emitting diodes 12 are arranged at a certain interval from each other. In addition, the upstream of the first group of light-emitting diodes 12a is connected to the corresponding first conductive sheet 13a through the traces, and the downstream of the first group of light-emitting diodes 12a passes through the traces and the corresponding first conductive sheets 13b. Similarly, the upstream of the second group of LEDs 12b is connected to the corresponding first conductive sheet 13c through the trace of the first circuit board 11, and the downstream of the second group of LEDs 12b is passed through the trace. It is connected to the corresponding first conductive sheet 13d. When the bonding surface A2 of the second circuit board 14 is attached to the first surface S1 of the first circuit board 11, the first conductive sheet 13a is in contact with the second conductive sheet 15a of the second circuit board 14, and so on. The first conductive sheets 13b, 13c, and 13d are respectively in contact with the second conductive sheets 15b, 15c, and 15d to transmit the power provided by the socket (not shown) to the second conductive sheet via the two conductive pins 16. 15. The second conductive sheet 15 is directly transferred to the first conductive sheet 13. Then, power is transmitted to the plurality of light emitting diodes 12 through the first conductive sheet 13 to drive the light emitting diodes 12 to emit light.

【0018】[0018]

綜上所述,本案之燈具模組藉由形成於第一電路板表面之導電片與形成於第二電路板表面之導電片以直接接觸的方式連接,以節省生產成本,並可避免過多的能量損耗。In summary, the illuminating module of the present invention is connected in a direct contact manner with the conductive sheet formed on the surface of the first circuit board and the conductive sheet formed on the surface of the second circuit board, thereby saving production cost and avoiding excessive Energy loss.

【0019】[0019]

本案得由熟習此技術之人士任施匠思而為諸般修飾,然皆不脫如附申請專利範圍所欲保護者。This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.

 

1:燈具模組
11:第一電路板
111:第一端部
112:發光部
113:第二端部
12:發光二極體
12a:第一組發光二極體
12b:第二組發光二極體
13、13a、13b、13c、13d:第一導電片
14:第二電路板
16:導電接腳
A1:設置表面
A2:電路表面
S1:第一表面
t:第一跡線
1: Lighting module
11: The first circuit board
111: first end
112: Light department
113: second end
12: Light-emitting diode
12a: The first group of light-emitting diodes
12b: The second group of light-emitting diodes
13, 13a, 13b, 13c, 13d: first conductive sheet
14: second circuit board
16: conductive pin
A1: Setting the surface
A2: circuit surface
S1: first surface
t: first trace

Claims (10)

【第1項】[Item 1] 一種燈具模組,包括:
  一第一電路板,包括一第一表面,且複數個第一跡線形成於該第一表面,其中該第一電路板具有一第一端部、一第二端部及一發光部,且該發光部位於該第一端部與該第二端部之間;
  複數個發光二極體,設置於該第一電路板之該發光部且位於該第一表面,並透過第一電路板之該第一跡線相連接;
  複數個第一導電片,設置於該第一電路板之該第一端部,並與該複數個發光二極體相連接;
  一第二電路板,設置於該第一電路板之該第一端部,且該第二電路板包括一設置表面及一電路表面,複數個第二跡線形成於該電路表面,其中該設置表面平行於該電路表面;
  複數個第二導電片,設置於該第二電路板,且每一該第一導電片係分別與對應之該第二導電片相接觸,俾使第一導電片與第二導電片形成電性連接;以及
  二個導電接腳,設置於該第二電路板,並垂直突出於該設置表面,且每一該導電接腳分別與對應之該第二導電片形成電性連接。
A lamp module comprising:
a first circuit board includes a first surface, and a plurality of first traces are formed on the first surface, wherein the first circuit board has a first end portion, a second end portion, and a light emitting portion, and The light emitting portion is located between the first end portion and the second end portion;
a plurality of light emitting diodes disposed on the first light emitting portion of the first circuit board and located on the first surface and connected to the first trace of the first circuit board;
a plurality of first conductive sheets disposed on the first end of the first circuit board and connected to the plurality of light emitting diodes;
a second circuit board disposed at the first end of the first circuit board, wherein the second circuit board includes a setting surface and a circuit surface, and a plurality of second traces are formed on the circuit surface, wherein the setting The surface is parallel to the surface of the circuit;
a plurality of second conductive sheets are disposed on the second circuit board, and each of the first conductive sheets is respectively in contact with the corresponding second conductive sheet, so that the first conductive sheet and the second conductive sheet form electrical properties And the two conductive pins are disposed on the second circuit board and protrude perpendicularly to the setting surface, and each of the conductive pins is electrically connected to the corresponding second conductive sheet.
【第2項】[Item 2] 如申請專利範圍第1項所述之燈具模組,其中該複數個第一導電片位於該第一電路板之該第一表面。The luminaire module of claim 1, wherein the plurality of first conductive sheets are located on the first surface of the first circuit board. 【第3項】[Item 3] 如申請專利範圍第2項所述之燈具模組,其中該第二電路板更包括一貼合表面,該第二導電片設置於該貼合表面,且該貼合表面垂直於該電路表面,使該第二電路板透過該貼合表面與該第一電路板之該第一表面相組接。The luminaire module of claim 2, wherein the second circuit board further comprises a bonding surface, the second conductive sheet is disposed on the bonding surface, and the bonding surface is perpendicular to the circuit surface. The second circuit board is coupled to the first surface of the first circuit board through the bonding surface. 【第4項】[Item 4] 如申請專利範圍第3項所述之燈具模組,其中該第一導電片係與該第一電路板一體成形,該第二導電片係電鍍於該第二電路板之該貼合表面。The luminaire module of claim 3, wherein the first conductive sheet is integrally formed with the first circuit board, and the second conductive sheet is plated on the bonding surface of the second circuit board. 【第5項】[Item 5] 如申請專利範圍第1項所述之燈具模組,其中該第一電路板更包括一第二表面,該第二表面垂直於該第一表面,且該第一導電片位於該第一電路板之該第二表面。The luminaire module of claim 1, wherein the first circuit board further comprises a second surface, the second surface is perpendicular to the first surface, and the first conductive sheet is located on the first circuit board The second surface. 【第6項】[Item 6] 如申請專利範圍第5項所述之燈具模組,其中該第二導電片設置於該電路表面,使該第二電路板透過該電路表面與該第一電路板之該第二表面相組接。The luminaire module of claim 5, wherein the second conductive sheet is disposed on the surface of the circuit, and the second circuit board is coupled to the second surface of the first circuit board through the surface of the circuit . 【第7項】[Item 7] 如申請專利範圍第6項所述之燈具模組,其中該第一導電片係電鍍於該第一電路板之該第二表面,該第二導電片係與該第二電路板一體成形。The luminaire module of claim 6, wherein the first conductive sheet is plated on the second surface of the first circuit board, and the second conductive sheet is integrally formed with the second circuit board. 【第8項】[Item 8] 如申請專利範圍第1項所述之燈具模組,其中該第二電路板更包括驅動該複數個發光二極體發光之一驅動電路。The luminaire module of claim 1, wherein the second circuit board further comprises a driving circuit for driving the plurality of illuminating diodes. 【第9項】[Item 9] 如申請專利範圍第1項所述之燈具模組,其中該二個導接腳係透過射出成形、銲接或沖壓的方式固定於第二電路板。The luminaire module of claim 1, wherein the two guiding legs are fixed to the second circuit board by injection molding, welding or stamping. 【第10項】[Item 10] 如申請專利範圍第1項所述之燈具模組,其中該二個導電接腳係符合一日光燈燈座的規格與形狀。The luminaire module of claim 1, wherein the two conductive pins conform to a specification and shape of a fluorescent lamp holder.
TW103138967A 2014-11-10 2014-11-10 Lamp module TWI551812B (en)

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TWI551812B true TWI551812B (en) 2016-10-01

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201803176U (en) * 2010-09-07 2011-04-20 浙江华泰电子有限公司 Tower-shaped lamp
EP2330345A2 (en) * 2008-08-26 2011-06-08 Solarkor Company Ltd. Led lighting device
TWM450672U (en) * 2012-03-09 2013-04-11 Easlite Industry Co Ltd Structure for jacklight
CN203378119U (en) * 2013-05-15 2014-01-01 王水妹 Electric lamp and electric lamp circuit module thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2330345A2 (en) * 2008-08-26 2011-06-08 Solarkor Company Ltd. Led lighting device
CN201803176U (en) * 2010-09-07 2011-04-20 浙江华泰电子有限公司 Tower-shaped lamp
TWM450672U (en) * 2012-03-09 2013-04-11 Easlite Industry Co Ltd Structure for jacklight
CN203378119U (en) * 2013-05-15 2014-01-01 王水妹 Electric lamp and electric lamp circuit module thereof

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