TWI551812B - Lamp module - Google Patents

Description

Lighting module 【0001】

This case relates to a lamp module, especially a lamp module that can save cost and reduce power loss.

【0002】

In recent years, with the maturity of related technologies such as light-emitting diodes (LEDs), the luminous efficiency and service life of light-emitting diodes have been significantly improved. Therefore, more and more lamps are illuminated. The polar body replaces the traditional illuminating light source to achieve energy saving effect.

[0003]

A conventional LED lamp includes a circuit board, a driving circuit board, and a conductive pin, and the LED is disposed on the circuit board. In some designs, the circuit board and the driving circuit board are connected by a plurality of wires, and the driving circuit board and the circuit board are also connected through a plurality of wires. Thereby, when the current supplied by the power source is received by the conductive pin, it is transmitted to the driving circuit board via the wire, and is rectified and transformed by the driving circuit on the driving circuit board. The current is then transmitted to the board via the wires to provide the power required to illuminate the LEDs.

[0004]

However, the use of wires to connect the conductive pins to the driving circuit board, and the use of the wires to connect the circuit board and the driving circuit board are all required to be completed by manual soldering, and therefore, the production cost must be increased. In addition, due to the large number of wires and solder joints, many energy losses are also caused. In other designs, conventional LED luminaires utilize a number of connectors to connect the board, the driver board, and the conductive pins. However, the cost of the connector is high, and if the connector is connected to the circuit board, the driving circuit board, and the conductive pin, the production cost is too high.

[0005]

In view of this, how to develop a luminaire module to solve the lack of conventional technology is an urgent problem to be solved by the related art.

[0006]

The purpose of the present invention is to provide a lamp module, wherein the conductive sheets disposed on the surface of the first circuit board are directly in contact with the conductive sheets disposed on the surface of the second circuit board by forming the two circuit boards in a manner perpendicular to each other. The electrical connection does not need to be connected through the connector or the wire welding to solve the problems of excessive cost and high energy loss.

【0007】

Another object of the present invention is to provide a lamp module, wherein the conductive sheets disposed on the surface of the first circuit board are directly in contact with the conductive sheets disposed on the surface of the second circuit board by fixing the two circuit boards perpendicularly to each other. And the electrical connection is formed to save production costs and avoid excessive energy loss.

[0008]

According to the concept of the present invention, a wider implementation aspect of the present invention provides a lamp module, including a first circuit board, a plurality of light emitting diodes, a plurality of first conductive sheets, a second circuit board, and a plurality of second conductive materials. The chip and two conductive pins. The first circuit board includes a first surface, and the plurality of first traces are formed on the first surface, wherein the first circuit board has a first end portion, a second end portion, and a light emitting portion, and the light emitting portion is located at the first end portion Between the second ends. The plurality of light emitting diodes are disposed on the light emitting portion of the first circuit board and located on the first surface, and are connected through the first trace of the first circuit board. A plurality of first conductive sheets are disposed on the first end of the first circuit board and connected to the plurality of light emitting diodes. The second circuit board is disposed at the first end of the first circuit board, and the second circuit board includes a setting surface and a circuit surface, and the plurality of second traces are formed on the circuit surface, wherein the setting surface is parallel to the circuit surface. The plurality of second conductive sheets are disposed on the second circuit board, and each of the first conductive sheets is respectively in contact with the corresponding second conductive sheet, so that the first conductive sheet and the second conductive sheet are electrically connected. The two conductive pins are disposed on the second circuit board and protrude perpendicularly from the setting surface, and each of the conductive pins is electrically connected to the corresponding second conductive sheet.

[0020]

1: Lighting module
11: The first circuit board
111: first end
112: Light department
113: second end
12: Light-emitting diode
12a: The first group of light-emitting diodes
12b: The second group of light-emitting diodes
13, 13a, 13b, 13c, 13d: first conductive sheet
14, 24: second circuit board
15, 15a, 15b, 15c, 15d: second conductive sheet
16: conductive pin
A1: Setting the surface
A2: circuit surface
A3: Fitting surface
S1: first surface
S2: second surface
t: first trace

【0009】

Figure 1 is a schematic view of a lamp module of the preferred embodiment of the present invention.

Figure 2 is a schematic exploded view of the luminaire module shown in Figure 1.

Figure 3 is a schematic view of a lamp module of another preferred embodiment of the present invention.

Figure 4 is a schematic exploded view of the luminaire module shown in Figure 3.

[0010]

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and is not intended to limit the scope of the invention.

[0011]

Please refer to FIG. 1 and FIG. 3 together with FIG. 2 and FIG. 4 . FIG. 1 is a schematic view of a lamp module according to a preferred embodiment of the present invention; FIG. 2 is a lamp module shown in FIG. 1 . 3 is a schematic view of a lamp module of another preferred embodiment of the present invention; and FIG. 4 is a schematic exploded view of the lamp module shown in FIG. As shown in FIG. 1 , FIG. 2 , FIG. 3 and FIG. 4 , the lamp module 1 includes a first circuit board 11 , a plurality of LEDs 12 , a plurality of first conductive sheets 13 , and a second circuit board 14 . a plurality of second conductive sheets 15 and two conductive pins 16. The first circuit board 11 can be a printed circuit board (PCB) and includes a first surface S1, and the plurality of first traces t form a first surface S1 of the first circuit board 11 for conducting current. The first circuit board 11 has a first end portion 111, a light emitting portion 112, and a second end portion 113. The light emitting portion 112 is respectively connected to the first end portion 111 and the second end portion 113, that is, the light emitting portion 112 is located at the first end portion. 111 is between the second end 113 and the second end 113. The plurality of LEDs 12 are disposed on the first portion of the first circuit board 11 and the plurality of LEDs 12 are located on the first surface S1 of the first circuit board 11. In practical applications, the plurality of LEDs 12 are divided into a plurality of groups, and the LEDs 12 of each group can be connected in series through the first trace t of the first circuit board 11, respectively. A plurality of first conductive sheets 13 are disposed on the first end portion 111 of the first circuit board 11 and are connected to the plurality of light emitting diodes 12.

[0012]

Referring to FIGS. 1 and 3 together with FIGS. 2 and 4, the second circuit board 14 is disposed on the first end portion 111 of the first circuit board 11, and may be provided, for example, by a fixing member or an adhesive. Or a casing (none of which is shown) to vertically fix the second circuit board 14 to the first circuit board 11, and to form the first circuit board 11 and the second circuit board 14 into an L-shape. The second circuit board 14 includes a set surface A1 and a circuit surface A2, and a plurality of second traces (not shown) are formed on the circuit surface A2 of the second circuit board 14, wherein the set surface A1 is parallel to the circuit surface A2. The plurality of second conductive sheets 15 are disposed on the second circuit board 14, and each of the first conductive sheets 13 is respectively in contact with the corresponding second conductive sheet 15 in a one-to-one correspondence manner, so that the first conductive sheets 13 and The second conductive sheet 15 forms an electrical connection. The two conductive pins 16 are disposed on the second circuit board 14 and protrude perpendicularly from the mounting surface A1 of the second circuit board 14, and each of the conductive pins is electrically connected to the corresponding second conductive sheet. Thereby, the two conductive pins 16, the second trace of the second circuit board 14, the plurality of second conductive sheets 15, the plurality of first conductive sheets 13, the first trace t of the first circuit board 11, and the plurality The light-emitting diodes 12 form a complete loop for inputting power provided by an external power source (not shown) to the plurality of light-emitting diodes 12 through the two conductive pins 16 to drive the light-emitting diodes 12 to emit light.

[0013]

Referring to FIG. 1 and FIG. 2 again, in the embodiment, the first conductive sheet 13 is located on the first surface S1 of the first circuit board 11, and the first conductive sheet 13 is made of a material having good conductivity. For example, a copper sheet, and preferably the first conductive sheet 13 is integrally formed with the first circuit board 11. In addition, the second circuit board 14 includes a bonding surface A3, the second conductive sheet 15 is disposed on the bonding surface A3 of the second circuit board 14, and the bonding surface A3 of the second circuit board 14 is perpendicular to the circuit surface A2, so that The two circuit boards 14 are assembled to the first surface S1 of the first circuit board 11 through the bonding surface A3. In other words, the bonding surface A3 of the second circuit board 14 is attached to the first surface S1 of the first circuit board 11, so that the first conductive sheet 13 located on the first surface S1 of the first circuit board 11 directly and in the second circuit The second conductive sheets 15 of the bonding surface A3 of the board 14 are in contact with each other to form an electrical connection, and constitute a connection manner in which the second circuit board 14 is vertically fixed to the first circuit board 11. In this embodiment, the second conductive sheet 15 is disposed on the bonding surface A3 of the second circuit board 14 by electroplating, that is, the second trace of the circuit surface A2 of the second circuit board 14 is plated to the second circuit. The surface 14 of the board 14 is bonded to the surface A3. Therefore, the second circuit board 14 can be directly electrically connected to the first circuit board 11 in a vertically disposed manner, thereby reducing the production cost and improving the conductive efficiency.

[0014]

Referring to FIG. 3 and FIG. 4 again, in the embodiment, the first circuit board 11 further includes a second surface S2, the second surface S2 is perpendicular to the first surface S1, and the first conductive sheet 13 is located at the first circuit. The second surface S2 of the plate 11. In addition, the second conductive sheet 15 is disposed on the circuit surface A2 such that the second circuit board 14 is coupled to the second surface S2 of the first circuit board 11 through the circuit surface A2. In other words, the second surface S2 of the first circuit board 11 is attached to the circuit surface A2 of the second circuit board 14, so that the first conductive sheet 13 located on the second surface S2 of the first circuit board 11 is directly located on the second circuit board. The second conductive sheets 15 of the circuit surface A2 of 14 are in contact with each other to form an electrical connection, and constitute a connection manner in which the first circuit board 11 is vertically fixed to the second circuit board 14. In this embodiment, the preferred embodiment is that the first conductive sheet 13 is plated on the second surface of the first circuit board 11, and the second conductive sheet 15 is integrally formed with the second circuit board 14, that is, the first circuit board 11 is The first trace t of the surface S1 is plated to extend to the second surface S2 of the first circuit board 11. Therefore, the first circuit board 11 can be electrically connected directly to the second circuit board 14 in a vertically disposed manner to save the wire. Or the production cost of the connector, and the advantage of improving the transmission efficiency of electricity.

[0015]

In some embodiments, the two conductive pins 16 conform to the specifications and shapes of the specific fluorescent lamp holder, and are made of a highly conductive material, and then the two conductive pins 16 are formed by injection molding, welding or stamping. It is fixed on the second circuit board 14. However, the conductive pin 16 may also be in a shape conforming to other existing lamp socket specifications, so that the power obtained by different lamp socket specifications is input into the lamp module 1.

[0016]

In some embodiments, the first circuit board 11 and the second circuit board 14 are single-sided circuit boards, and have traces only on the first surface S1 and the circuit surface A2, but not limited thereto, the first circuit board 11 The second circuit board 14 can also be a double panel or a multi-layer board. In some embodiments, the second circuit board 14 includes a driving circuit (not shown) for converting the power provided by the external power source into the power required to drive the light emitting diode 12 to emit light, as a plurality of The driving circuit board of the LED 12 is not limited thereto. In other embodiments, the driving circuit can be independently provided, that is, the second circuit board 14 is not provided with any driving circuit.

[0017]

Referring to FIG. 1 and FIG. 2 again, for example, the plurality of light emitting diodes 12 are divided into a first group of light emitting diodes 12a and a second group of light emitting diodes 12b. The first group of light-emitting diodes 12a are connected in series to each other and arranged in two columns, and the second group of light-emitting diodes 12b are also connected in series to each other and arranged in two columns, and the columns of the light-emitting diodes 12 are arranged at a certain interval from each other. In addition, the upstream of the first group of light-emitting diodes 12a is connected to the corresponding first conductive sheet 13a through the traces, and the downstream of the first group of light-emitting diodes 12a passes through the traces and the corresponding first conductive sheets 13b. Similarly, the upstream of the second group of LEDs 12b is connected to the corresponding first conductive sheet 13c through the trace of the first circuit board 11, and the downstream of the second group of LEDs 12b is passed through the trace. It is connected to the corresponding first conductive sheet 13d. When the bonding surface A2 of the second circuit board 14 is attached to the first surface S1 of the first circuit board 11, the first conductive sheet 13a is in contact with the second conductive sheet 15a of the second circuit board 14, and so on. The first conductive sheets 13b, 13c, and 13d are respectively in contact with the second conductive sheets 15b, 15c, and 15d to transmit the power provided by the socket (not shown) to the second conductive sheet via the two conductive pins 16. 15. The second conductive sheet 15 is directly transferred to the first conductive sheet 13. Then, power is transmitted to the plurality of light emitting diodes 12 through the first conductive sheet 13 to drive the light emitting diodes 12 to emit light.

[0018]

In summary, the illuminating module of the present invention is connected in a direct contact manner with the conductive sheet formed on the surface of the first circuit board and the conductive sheet formed on the surface of the second circuit board, thereby saving production cost and avoiding excessive Energy loss.

[0019]

This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.

1: Lighting module
11: The first circuit board
111: first end
112: Light department
113: second end
12: Light-emitting diode
12a: The first group of light-emitting diodes
12b: The second group of light-emitting diodes
13, 13a, 13b, 13c, 13d: first conductive sheet
14: second circuit board
16: conductive pin
A1: Setting the surface
A2: circuit surface
S1: first surface
t: first trace

Claims (10)

[Item 1] A lamp module comprising:
a first circuit board includes a first surface, and a plurality of first traces are formed on the first surface, wherein the first circuit board has a first end portion, a second end portion, and a light emitting portion, and The light emitting portion is located between the first end portion and the second end portion;
a plurality of light emitting diodes disposed on the first light emitting portion of the first circuit board and located on the first surface and connected to the first trace of the first circuit board;
a plurality of first conductive sheets disposed on the first end of the first circuit board and connected to the plurality of light emitting diodes;
a second circuit board disposed at the first end of the first circuit board, wherein the second circuit board includes a setting surface and a circuit surface, and a plurality of second traces are formed on the circuit surface, wherein the setting The surface is parallel to the surface of the circuit;
a plurality of second conductive sheets are disposed on the second circuit board, and each of the first conductive sheets is respectively in contact with the corresponding second conductive sheet, so that the first conductive sheet and the second conductive sheet form electrical properties And the two conductive pins are disposed on the second circuit board and protrude perpendicularly to the setting surface, and each of the conductive pins is electrically connected to the corresponding second conductive sheet. [Item 2] The luminaire module of claim 1, wherein the plurality of first conductive sheets are located on the first surface of the first circuit board. [Item 3] The luminaire module of claim 2, wherein the second circuit board further comprises a bonding surface, the second conductive sheet is disposed on the bonding surface, and the bonding surface is perpendicular to the circuit surface. The second circuit board is coupled to the first surface of the first circuit board through the bonding surface. [Item 4] The luminaire module of claim 3, wherein the first conductive sheet is integrally formed with the first circuit board, and the second conductive sheet is plated on the bonding surface of the second circuit board. [Item 5] The luminaire module of claim 1, wherein the first circuit board further comprises a second surface, the second surface is perpendicular to the first surface, and the first conductive sheet is located on the first circuit board The second surface. [Item 6] The luminaire module of claim 5, wherein the second conductive sheet is disposed on the surface of the circuit, and the second circuit board is coupled to the second surface of the first circuit board through the surface of the circuit . [Item 7] The luminaire module of claim 6, wherein the first conductive sheet is plated on the second surface of the first circuit board, and the second conductive sheet is integrally formed with the second circuit board. [Item 8] The luminaire module of claim 1, wherein the second circuit board further comprises a driving circuit for driving the plurality of illuminating diodes. [Item 9] The luminaire module of claim 1, wherein the two guiding legs are fixed to the second circuit board by injection molding, welding or stamping. [Item 10] The luminaire module of claim 1, wherein the two conductive pins conform to a specification and shape of a fluorescent lamp holder.