TWI522231B - 金屬/高分子複合材料及其製作方法 - Google Patents
金屬/高分子複合材料及其製作方法 Download PDFInfo
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- TWI522231B TWI522231B TW103141581A TW103141581A TWI522231B TW I522231 B TWI522231 B TW I522231B TW 103141581 A TW103141581 A TW 103141581A TW 103141581 A TW103141581 A TW 103141581A TW I522231 B TWI522231 B TW I522231B
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- 239000010936 titanium Substances 0.000 claims description 10
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 229920002530 polyetherether ketone Polymers 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- WAIPAZQMEIHHTJ-UHFFFAOYSA-N [Cr].[Co] Chemical class [Cr].[Co] WAIPAZQMEIHHTJ-UHFFFAOYSA-N 0.000 claims description 5
- 229920000747 poly(lactic acid) Polymers 0.000 claims description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
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- 239000007921 spray Substances 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 238000007733 ion plating Methods 0.000 claims description 4
- 238000005240 physical vapour deposition Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 229920006260 polyaryletherketone Polymers 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229920001652 poly(etherketoneketone) Polymers 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 238000005422 blasting Methods 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 2
- 238000007750 plasma spraying Methods 0.000 claims description 2
- 238000005488 sandblasting Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims 1
- 229920001643 poly(ether ketone) Polymers 0.000 claims 1
- 239000012808 vapor phase Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 49
- 239000002861 polymer material Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 9
- 238000000151 deposition Methods 0.000 description 7
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
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- 229920001778 nylon Polymers 0.000 description 2
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- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
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- 229920005615 natural polymer Polymers 0.000 description 1
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- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- 230000000750 progressive effect Effects 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0254—Physical treatment to alter the texture of the surface, e.g. scratching or polishing
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L27/00—Materials for grafts or prostheses or for coating grafts or prostheses
- A61L27/50—Materials characterised by their function or physical properties, e.g. injectable or lubricating compositions, shape-memory materials, surface modified materials
- A61L27/56—Porous materials, e.g. foams or sponges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/028—Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/1241—Nonplanar uniform thickness or nonlinear uniform diameter [e.g., L-shape]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
- Y10T428/24545—Containing metal or metal compound
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Dermatology (AREA)
- Dispersion Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Transplantation (AREA)
- Epidemiology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Laminated Bodies (AREA)
- Materials For Medical Uses (AREA)
Description
本發明所揭露的實施例大致上是有關於一種複合材料及其製作方法。特別是有關於一種具有金屬/高分子複合材料及其製作方法。
高分子材料,例如聚醚醚酮(Polyether ether ketone,PEEK)、聚甲基丙烯酸甲酯(Polymethyl methacrylate,PMMA)、聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚乳酸(Polylactide,PLA)、聚四氟乙烯(Polytetrafluoroethene,PTFE)..等,具有良好的機械性能和耐化學品、耐磨損、耐水解等性能,目前已廣泛應用於的醫療植入(medical implant)器材、半導體製程、航太工程、精密機械...等領域之中。
然而,由於高分子材料支撐力不足,且具有不耐熱的等缺點。容易在後續加工製程中,因溫度過高而造成材料劣化。尤其在將高分子材料與金屬材料結合,以形成同時具有高分
子材料和金屬材料之優良特性的複合材料時,高溫容易損傷位於二者之間異質接面上的高分子材料,進而導致金屬材料產生剝離脫落的現象,嚴重影響複合料的功能特性與應用範圍。
因此有需要提供一種先進的金屬/高分子複合材料及其製作方法,來解決習知技術所面臨的問題。
本發明一方面是在提供一種金屬/高分子複合材料,包括:一高分子(polymer)基材以及一金屬散熱層。其中,高分子具有粗化表面,且此粗化表面具有等向性表面粗糙度(isotropic surface roughness)。金屬散熱層共形地(conformally)毯覆於粗化表面上。
本發明的另一方面是提供一種金屬/高分子複合材料的製作方法。此方法包括下述步驟:首先,提供一高分子材基材。再對高分子材基材進行表面粗化製程,於高分子材基材上形成粗化表面,並使粗化表面具有等向性表面粗糙度。後續,於粗化表面上形成金屬散熱層,使金屬散熱層共形地毯覆於粗化表面上。
根據上述,本發明的實施例是揭露一種具有異質接面的金屬/高分子複合材料及其製作方法。其係先對高分子基材進行表面粗化處理,使高分子基材具有無方性(non-directional)粗糙度的粗化表面。之後,再於粗化表面上形成金屬散熱層,使其共
形地毯覆於粗化表面上。
由於,金屬散熱層係藉由低溫鍍膜(沉積)技術在高分子基材上形成,並不會對高分子基材產生損害。加上,金屬散熱層係共形的沉積毯覆於具有等向性表面粗糙度的粗化表面上。因此,可以使金屬散熱層與高分子基材在二者的異質接面處緊密地接合。更可防止後續所進行的高溫製程,因熱應力集中與穿透而破壞高分子材料層,導致金屬散熱層剝落脫離的問題產生,顯著改善金屬/高分子複合材料的性能。
綜上所述,使用本發明所提供之金屬/高分子複合材料及其製作方法,不但能解決習知技術單獨採用金屬材料所導致的應力集中及彈性不足,以及單獨使用高分子材料所導致的支撐力不足等問題;同時能克服現行金屬/高分子複合材料使用上的限制與缺陷,達成本案的發明目的。
100‧‧‧複合材料
101‧‧‧高分子基材
101a‧‧‧粗化表面
101b‧‧‧緻密區
102‧‧‧表面粗化製程
105‧‧‧金屬散熱層
103‧‧‧凹陷部
104‧‧‧沉積製程
105a‧‧‧金屬散熱層的第一表面
105b‧‧‧金屬散熱層的第二表面
105c‧‧‧凸出部
200‧‧‧醫療植入器材
201‧‧‧金屬層
202‧‧‧能量束
S1‧‧‧提供高分子基材
S2‧‧‧對高分子基材的表面進行表面粗化製程,使高分子基材的粗化表面具有複數個凹陷部以及等向性表面粗糙度
S3‧‧‧進行沉積製程在高分子基材的粗化表面上形成金屬散熱層,共形地毯覆於粗化表面上
為了對本發明之上述實施例及其他目的、特徵和優點能更明顯易懂,特舉數個較佳實施例,並配合所附圖式,作詳細說明如下:第1圖係根據本發明的一實施例,繪示製作金屬/高分子複合材料的方法流程圖;第1A圖至第1C圖係根據第1圖,繪示金屬/高分子複合材料的製程結構剖面示意圖;以及
第2圖係根據本發明的一實施例所繪示之應用金屬/高分子複合材料所製作之醫療植入器材的結構剖面圖。
本說明書所揭露的實施例是有關於一種金屬/高分子複合材料及其製作方法與應用,可解決習知技術因熱應力集中與穿透而破壞高分子材料層所產生之金屬材料剝離脫落的問題。為讓本發明之上述目的、特徵和優點能更明顯易懂,特舉一種形成具有異質接面之金屬/高分複合材料的製作方法,以及應用此金屬/高分子複合材料所製作的醫療用複合材料作為較佳實施例,並配合所附圖式詳細描述如下。
但必須注意的是,這些特定的實施案例與方法,並非用以限定本發明。本發明仍可採用其他特徵、元件、方法及參數來加以實施。較佳實施例的提出,僅係用以例示本發明的技術特徵,並非用以限定本發明的申請專利範圍。該技術領域中具有通常知識者,將可根據以下說明書的描述,在不脫離本發明的精神範圍內,作均等的修飾與變化。在不同實施例與圖式之中,相同的元件,將以相同的元件符號加以表示。
第1圖係根據本發明的一實施例,繪示製作金屬/高分子複合材料100的方法流程圖。第1A圖至第1C圖係根據第1圖繪示金屬/高分子複合材料100的製程結構剖面示意圖。製作金屬/高分子複合材料100的方法係由步驟S1開始。首先,提供
一高分子基材101(如第1A圖所繪示)。構成高分子材基材101的材料可以包括,以塑化高分子聚合物,例如塑料、矽膠、合成橡膠、合成纖維、合成塗料或黏著劑等為基底的合成高分子化合物,也可以包括纖維素、澱粉、蛋白質橡膠等天然高分子化合物。
例如,在本發明的一些實施例中,高分子材料層101可包含由熱塑性塑膠,例如聚乙烯(Polyethylene,PE)、聚丙烯(Polypropylene,PP)、聚苯乙烯(Poly Styrene,PS)、聚甲基丙烯酸甲酯、聚氯乙烯(poly vinyl chloride,PVC)、尼龍(Nylon)、聚碳酸酯(Polycarbonates,PC)、聚氨酯(Polyurethane,PU)、聚四氟乙烯(Poly tetrafluoroethene,PTFE)、聚對苯二甲酸乙二酯,或熱固性塑膠,例如環氧樹脂(epoxy)、酚醛塑料(phenolic plastics)、聚醯亞胺(Polyimide,PI)、三聚氰氨甲醛樹脂(melamine-formaldehyde resin),藉由射出、拉擠成型、膜壓、熱壓或吹塑、模造、纏繞成型、預浸材疊層、轉印、發泡、鑄造、積層製造等加工方法形成的高分子聚合物層。
而在本實施例之中,高分子材料層101是由包含聚醚醚酮(Polyether ether ketone,PEEK)、碳強化聚醚醚酮(carbon reinforced PEEK)、聚醚酮酮(Polyetherketoneketone,PEKK)、聚芳基醚酮(Polyaryletherketone,PAEK)的高分子聚合物所構成。其中,高分子基材101具有近似於人體骨材的性質。例如,高分子材料層101較佳具有實質介於2Gpa至22Gpa的彈性模數。
但值得注意的是,本發明所採用的高分子基材101
並不以此為限。任何適於用醫療植入器材、半導體製程、航太工程、精密機械..等領域的高分子材料,皆未脫離本發明的精神範圍。例如,在其他實施例中,可以依照金屬/高分子複合材料100所適用的組織特性,採用不同的高分子材料來形成高分子基材101。
請參照步驟S2,對高分子基材101進行一表面粗化製程102,使高分子基材101的表面101a具有複數個凹陷部103(如第1B圖所繪示)。例如,在本發明的一些實施例中,表面粗化製程102可藉由例如CNC加工、雷射表面處理、電漿表面處理、蝕刻或上述之各種組合,來移除一部分高分子材料層101,藉以形成複數個由表面101a延伸進入高分子材料層101的開口或溝渠(未繪示)。並且使這些開口或溝渠具有實質介於1μm至4000μm之間的深寬比。
但在本發明的另一些實施例中,表面粗化製程102也可以是一種噴砂處理。其係採用實質介於1Kg/mm2至5Kg/mm2的風壓,帶動例如氧化鋁(Al2O3)、二氧化矽(SiO2)...等無化學活性的微粒子或其組合(未繪示),對高分子基材101的表面101a進行物理衝擊,藉以在高分子基材101的表面101a上形成尺度可控且較為均一的凹陷部103。其中,每一個凹陷部103的深寬比較佳係介於1μm至4000μm之間。又由於,高分子基材101受到無化學活性的微粒子的衝擊,因此噴砂處理後通常會在高分子基材101的表面101a下方形成一層質地較緊實的緻密區101b。
另外,由於這些凹陷部103的產生,會使高分子基材101的表面101a具有等向性或非等向性(anisotropic)的表面粗糙度。例如,在本發明的一些實施例之中,這些凹陷部103可以藉由規則的排列方式,在高分子基材101的粗化表面101a組成一個陣列式立體圖案。由於,這些凹陷部103是有方向性且有規則地排列在陣列式立體圖案中。因此,只有沿著特定方向才能測得實質相同的剪力強度(shear strength);故而,可以使高分子基材101的粗化表面101a具有非等向性的表面粗糙度。
而在本發明的另一些實施例之中,這些凹陷部103可以藉由不規則的排列方式,在高分子基材101的粗化表面101a上組成一個不規則的立體圖案。由於,這些凹陷部103係沒方向性且不規則地散佈。因此,在高分子基材101之粗化表面101a上不同方向所測得的剪力強度皆會實質相同;故而可使高分子基材101具有等向性(無方向性)粗糙度。在本實施例之中,高分子基材101的粗化表面101a係具有等向性粗糙度的粗化表面。其平均表面粗糙度(Average surface roughness,Ra)實質介於1μm至5μm之間。
接著請參照步驟S3,藉由沉積製程104在粗化表面101a上形成一金屬散熱層105,共形地毯覆於粗化表面101a上,並填充凹陷部103,完成金屬/高分子複合材料100的製備。其中,金屬散熱層105具有第一表面105a以及相對第一表面105a的第二表面105b。第一表面105a與高分子基材101的粗化表面101a
接觸,並且延伸進入高分子基材101的凹陷部103中,藉以分別在凹陷部103中形成複數個凸出部105c(如第1C圖所繪示)。由於,金屬散熱層105係共形地毯覆蓋於高分子材料層101的粗化表面101a上,因此每一個凸出部105c也具有實質介於1μm至4000μm之間的深寬比。
值得注意的是,凸出部105c的形狀係配合凹陷部103的形狀與排列方式,係按照高分子材料層101的粗化表面101a上之微結構的安排,呈現規則或不規則的排列。每一個凸出部105c也可以依照相對應之凹陷部103的開口形狀,而呈現,例如島狀結構、齒狀結構、倒鉤結構、鳩型槽結構、柱狀結構或上述之形狀的任意組合。
沉積製程104可以包括(但不以此為限)物理氣相沉積(Physical vapor deposition,PVD)、化學氣相沉積(Chemical Vapor Deposition,CVD)、電弧離子鍍膜(Arc ion plating,AIP)、濺鍍(sputtering deposition)、電弧熔射(Arc Spraying)、火焰熔射(flame spray)、電鍍(electroplate)、粉體電漿熔射(powder plasma spray)、無電電鍍、粉體雷射沉積、澆鑄、膠體溶液固化或上述方法之組合。
所形成的金屬散熱層105可以是一種單層或多層結構。例如,在本發明的一些實施例之中,金屬散熱層105包括至少一層金屬鍍膜。構成此金屬鍍膜的材質,包括鈦(Ti)、鋁(Al)、釩(V)、鈦合金(Ti-6Al-4V)、鈷鉻合金(Co-Cr)、不鏽鋼(SUS 316L)、
金(Au)或上述之任意組合。金屬散熱層105的厚度實質介於30μm至500μm之間。在本發明的一些實施例之中,金屬散熱層105的厚度,由高分子材料層101的粗化表面101a起算,較佳係大於150μm。
在本發明的一些實施例中,金屬散熱層105的形成,是採用高功率離子鍍膜製程(例如電弧離子鍍膜製程),搭配粉體造粒合成技術,以例如鈦、鋁、釩、鈦合金、鈷鉻合金、不鏽鋼、金等,金屬粉末作為原料,進行低溫(例如實質為於150℃)的大氣電漿熔射(Air.Plasma Spray,APS),藉以在高分子材料層101的粗化表面101a形成至少一層鈦金屬塗層(coating)。
在本發明的一些實施例之中,沉積製程104所使用之金屬粉末的D50粒度(granularity)分布範圍,實質介於5μm至70μm之間。金屬粉末的形狀可以呈規則或不規則的線狀、片狀或其他立體結構;亦或呈規則或不規則分布的多面體或球形顆粒。在本實施例中,較佳是以純度大於99%,D50粒度分布範圍實質小於30μm(例如為26μm)的鈦-鋁-釩合金圓球細粒粉末;在氬氣流量實質介於20 l/min至100 l/min之間、氫氣流量實質介於1 l/min之間20 l/min及粉末載氣流量實質介於1 l/min至5 l/min之間的條件下進行粉體電漿熔射製程。藉由漸進式的鍍膜方式,在高分子材料層101的粗化表面101a形成多層厚度實質大於1μm的鈦金屬薄膜,以構成金屬散熱層105。
由於,鈦金屬原子的粒子較小,因此在進行熔融以
形成高動能(>20eV)及高游離化(>90%)之粒子時,所需的熱量較少,可降低鍍膜時高分子基材101之粗化表面101a的表面溫度。在沉積製程104期間,將高分子基材101之粗化表面101a的面溫度控制在實質小於120℃的範圍內,並減少熔融粉體撞擊高分子基材101時對高分子基材101之粗化表面101a的破壞,同時提升金屬散熱層105和高分子基材101之間的接合力。
再者,由於金屬散熱層105具有熱擴散緩衝效果,可防止後續製程在高分子基材101之粗化表面101a產生熱能累積。當金屬散熱層105的厚度達到一定程度時,例如大於150μm,可將高分子基材101之粗化表面101a的表面溫度降至其熔點以下,防止後續製程的熱應力集中穿透,而損毀高分子基材101。
另外,鈦金屬薄膜會共形地填充於高分子基材101的凹陷部103中,形成尺度可控且均一的凸出部105c,可平均分散透過金屬散熱層105施加於高分子基材101的機械應力,防止金屬散熱層105與高分子基材101因外力而產生剝離的現象。
以應用於醫療植入器材的金屬/高分子複合材料100為例。請參照第2圖,第2圖係根據本發明的一實施例所繪示之應用金屬/高分子複合材料100所製作之醫療植入器材200的結構剖面圖。其中,醫療植入器材200係以金屬/高分子複合材料100為基底,後續再藉由熔融沉積(Fused Deposition Modeling)製程,導引一能量束202(例如雷射、電子束、電弧、電漿、電磁傳導等能量源)對金屬粉體(例如鈦、金、銀、鐵或上述任意組合的合金
材料)進行燒結(例如,選擇性雷射燒結(Selective Laser Sintering,SLS)或直接金屬雷射燒結(Direct Metal Laser Sintering,DMSL))固化成型、熔融(例如,選擇性雷射熔融(Selective Laser Melting,SLM)或電子束熔融(Electron Beam Melting,EBM)固化成型或上述之組合,於金屬散熱層105的第二表面105b上形成厚度實質介於10μm至5000μm的多孔性的金屬層或多孔隙陣列金屬結構201,而不損壞高分子材料層101之粗化表面101a。
而由於金屬層106具有較佳的生物相容性(biocompatibility),可誘導組織細胞貼附生長於多孔隙陣列金屬結構上,因此可使金屬結構201與植入的組織融合而不會產生脫落的問題。而金屬/高分子複合材料100中的高分子基材101則因具有近似於人體骨組織的彈性模數,可避免單獨使用金屬材料所衍生應力遮蔽效應的問題。
根據上述,本發明的實施例是揭露一種具有異質接面的金屬/高分子複合材料及其製作方法。其係先對高分子基材進行表面粗化處理,使高分子基材具有無方性(non-directional)粗糙度的粗化表面。之後,再於粗化表面上形成金屬散熱層,使其共形地毯覆於粗化表面上。
由於,金屬散熱層係藉由低溫鍍膜(沉積)技術在高分子基材上形成,並不會對高分子基材產生損害。加上,金屬散熱層係共形的沉積毯覆於具有等向性表面粗糙度的粗化表面上。因此,可以使金屬散熱層與高分子基材在二者的異質接面處
緊密地接合。更可防止後續所進行的高溫製程,因熱應力集中與穿透而破壞高分子材料層,導致金屬散熱層剝落脫離的問題產生,顯著改善金屬/高分子複合材料的性能。
綜上所述,使用本發明所提供之金屬/高分子複合材料及其製作方法,不但能解決習知技術單獨採用金屬材料所導致的應力集中及彈性不足,以及單獨使用高分子材料所導致的支撐力不足等問題;同時能克服現行金屬/高分子複合材料使用上的限制與缺陷,達成本案的發明目的。
雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。
101‧‧‧高分子基材
101a‧‧‧粗化表面
101b‧‧‧緻密區
103‧‧‧凹陷部
104‧‧‧沉積製程
105‧‧‧金屬散熱層
105a‧‧‧金屬散熱層的第一表面
105b‧‧‧金屬散熱層的第二表面
Claims (15)
- 一種金屬/高分子複合材料,包括:一高分子(polymer)基材,實質上由至少一高分子聚合物所構成,且具有一粗化表面;其中該粗化表面具有一等向性表面粗糙度(isotropic surface roughness),其中該等向性表面粗糙度,係實質介於1μm至5μm的一平均表面粗糙度(Average surface roughness,Ra);以及一金屬散熱層,共形地(conformally)毯覆於該粗化表面上。
- 如申請專利範圍第1項所述之金屬/高分子複合材料,其中該高分子基材具有一緻密區,藉由該粗化表面暴露於外。
- 如申請專利範圍第1項所述之金屬/高分子複合材料,其中該粗化表面具有複數個凹陷部(recess),且每一該些凹陷部具有實質介於1μm至4000μm之間的一深寬比(aspect ratio)。
- 如申請專利範圍第1項所述之金屬/高分子複合材料,其中該金屬散熱層包括:鈦(Ti)、鋁(Al)、釩(V)、鈦合金(Ti-6Al-4V)、鈷鉻合金(Co-Cr)、不鏽鋼(SUS 316L)、金(Au)或上述之任意組合。
- 如申請專利範圍第1項所述之金屬/高分子複合材料,其中該金屬散熱層具有實質介於30μm至500μm的一厚度。
- 如申請專利範圍第1項所述之金屬/高分子複合材料,其中該高分子基材包括:聚醚醚酮(Polyetheretherketone,PEEK)、碳強化聚醚醚酮(carbon reinforced PEEK)、聚醚酮酮(Polyetherketoneketo,PEKK)、聚芳基醚酮(Polyaryletherketone,PAEK)、聚甲基丙烯酸甲酯(Polymethyl methacrylate,PMMA)、聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚乳酸(Polylactide,PLA)、聚四氟乙烯(Polytetrafluoroethene,PTFE)、聚乙烯(Polyethylene,PE)或上述之任意組合。
- 一種金屬/高分子複合材料的製作方法,包括下述步驟:提供一高分子基材;進行一表面粗化製程,於該高分子基材上形成一粗化表面,並使該粗化表面具有一等向性表面粗糙度;以及於該粗化表面上形成一金屬散熱層,使該金屬散熱層共形地毯覆於該粗化表面上。
- 如申請專利範圍第7項所述之金屬/高分子複合材料的製作方法,其中該表面粗化製程,使該高分子基材的一表面具有複數個凹陷部,且每一該些凹陷部具有實質介於1μm至4000μm之間的一深寬比。
- 如申請專利範圍第7項所述之金屬/高分子複合材料的製作方法,其中該表面粗化製程包括一噴砂處理,藉以在該高分子基材的該粗化表面下方形成一緻密區。
- 如申請專利範圍第9項所述之金屬/高分子複合材料的製作方法,其中該噴砂處理包括採用氧化鋁(Al2O3)粒子、二氧化矽(SiO2)粒子或二者之組合,對該高分子基材的該粗化表面進行衝擊。
- 如申請專利範圍第7項所述之金屬/高分子複合材料的製作方法,其中形成該金屬散熱層的步驟包括,進行一沉積製程於該粗化表面上形成一金屬鍍膜層。
- 如申請專利範圍第11項所述之金屬/高分子複合材料的製作方法,其中形成該沉積製程包括一電弧熔射(Arc Spraying)製程、一電弧離子鍍膜(Arc ion plating,AIP)製程、一濺鍍(sputtering deposition)製程、一粉體電漿熔射(powder plasma spray)製程、一火焰熔射(flame spray)製程、一物理氣相沉積(Physical vapor deposition,PVD)製程、一化學氣相沉積(Chemical Vapor Deposition,CVD)製程或上述之任意組合。
- 如申請專利範圍第11項所述之金屬/高分子複合材料的 製作方法,其中形成該沉積製程包括採用一金屬粉體進行一粉體電漿熔射製程,其中該金屬粉體具有實質介於5μm至70μm之間的一粒度(granularity)範圍。
- 如申請專利範圍第13項所述之金屬/高分子複合材料的製作方法,其中該金屬粉體包括鈦-鋁-釩金屬粉末。
- 如申請專利範圍第11項所述之金屬/高分子複合材料的製作方法,其中在該沉積製程中該粗化表面具有實質低於120℃的一表面溫度。
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