TWI509111B - Surface treatment of electrolytic copper foil, laminated board, and printed wiring board, electronic equipment - Google Patents

Surface treatment of electrolytic copper foil, laminated board, and printed wiring board, electronic equipment Download PDF

Info

Publication number
TWI509111B
TWI509111B TW102143163A TW102143163A TWI509111B TW I509111 B TWI509111 B TW I509111B TW 102143163 A TW102143163 A TW 102143163A TW 102143163 A TW102143163 A TW 102143163A TW I509111 B TWI509111 B TW I509111B
Authority
TW
Taiwan
Prior art keywords
copper foil
roughness
treated
electrolytic copper
printed wiring
Prior art date
Application number
TW102143163A
Other languages
English (en)
Chinese (zh)
Other versions
TW201428139A (zh
Inventor
Michiya Kohiki
Kenji Inukai
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201428139A publication Critical patent/TW201428139A/zh
Application granted granted Critical
Publication of TWI509111B publication Critical patent/TWI509111B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW102143163A 2012-11-26 2013-11-26 Surface treatment of electrolytic copper foil, laminated board, and printed wiring board, electronic equipment TWI509111B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012257896 2012-11-26

Publications (2)

Publication Number Publication Date
TW201428139A TW201428139A (zh) 2014-07-16
TWI509111B true TWI509111B (zh) 2015-11-21

Family

ID=50776215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102143163A TWI509111B (zh) 2012-11-26 2013-11-26 Surface treatment of electrolytic copper foil, laminated board, and printed wiring board, electronic equipment

Country Status (7)

Country Link
JP (1) JP5710845B2 (ko)
KR (2) KR20140124402A (ko)
CN (1) CN104812945B (ko)
MY (1) MY176308A (ko)
PH (1) PH12015501174A1 (ko)
TW (1) TWI509111B (ko)
WO (1) WO2014081041A1 (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107614760B (zh) * 2015-07-03 2018-07-13 三井金属矿业株式会社 粗糙化处理铜箔、覆铜层叠板和印刷电路板
CN107923047B (zh) * 2015-07-29 2020-05-01 纳美仕有限公司 粗糙化处理铜箔、覆铜层叠板及印刷电路板
TWI732892B (zh) * 2016-07-26 2021-07-11 日商松下知識產權經營股份有限公司 透視型電極用積層板、透視型電極素材、組件及透視型電極用積層板之製造方法
KR102274906B1 (ko) * 2016-09-12 2021-07-09 후루카와 덴키 고교 가부시키가이샤 구리박 및 이것을 갖는 동장 적층판
KR101734840B1 (ko) * 2016-11-11 2017-05-15 일진머티리얼즈 주식회사 내굴곡성이 우수한 이차전지용 전해동박 및 그의 제조방법
JP7356209B2 (ja) * 2017-03-31 2023-10-04 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7492808B2 (ja) 2017-03-31 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN110546313A (zh) * 2017-04-25 2019-12-06 古河电气工业株式会社 表面处理铜箔
CN111836716B (zh) 2018-03-30 2023-02-24 三井金属矿业株式会社 覆铜层叠板
US11999112B2 (en) * 2018-04-10 2024-06-04 Dic Corporation Composite structure and manufacturing method therefor
WO2019208368A1 (ja) * 2018-04-25 2019-10-31 古河電気工業株式会社 表面処理銅箔、銅張積層板、及びプリント配線板
JP7032239B2 (ja) * 2018-05-28 2022-03-08 古河電気工業株式会社 リードフレーム材およびその製造方法ならびに半導体パッケージ
JP6895936B2 (ja) * 2018-09-28 2021-06-30 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及び回路基板
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
CN113795615B (zh) * 2019-06-07 2024-08-02 古河电气工业株式会社 表面处理铜箔、覆铜层叠板以及印刷电路板
TWM608774U (zh) * 2019-06-19 2021-03-11 金居開發股份有限公司 進階反轉電解銅箔及應用其的銅箔基板
JP7392996B2 (ja) 2019-06-19 2023-12-06 金居開發股▲分▼有限公司 アドバンスド電解銅箔及びそれを適用した銅張積層板
TWI697574B (zh) 2019-11-27 2020-07-01 長春石油化學股份有限公司 電解銅箔、電極及包含其之鋰離子電池
KR20220160580A (ko) * 2020-03-30 2022-12-06 미쓰비시 마테리알 가부시키가이샤 접합체, 및, 절연 회로 기판
JP7053976B1 (ja) * 2020-06-11 2022-04-12 三井金属鉱業株式会社 両面銅張積層板
WO2022153580A1 (ja) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281759A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008285751A (ja) * 2007-04-19 2008-11-27 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板
TW201229322A (en) * 2010-10-06 2012-07-16 Furukawa Electric Co Ltd Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
JP2012169598A (ja) * 2011-01-26 2012-09-06 Sumitomo Bakelite Co Ltd プリント配線板およびプリント配線板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4567360B2 (ja) * 2004-04-02 2010-10-20 三井金属鉱業株式会社 銅箔の製造方法及びその製造方法で得られる銅箔
JP5215631B2 (ja) * 2007-10-24 2013-06-19 三井金属鉱業株式会社 表面処理銅箔
TWI434965B (zh) * 2008-05-28 2014-04-21 Mitsui Mining & Smelting Co A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method
EP2351876A1 (en) * 2008-11-25 2011-08-03 JX Nippon Mining & Metals Corporation Copper foil for printed circuit
JP5282675B2 (ja) * 2009-06-23 2013-09-04 日立電線株式会社 プリント配線板用銅箔およびその製造方法
JP5885054B2 (ja) * 2010-04-06 2016-03-15 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
JP5634103B2 (ja) * 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008285751A (ja) * 2007-04-19 2008-11-27 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板
TW201229322A (en) * 2010-10-06 2012-07-16 Furukawa Electric Co Ltd Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
JP2012169598A (ja) * 2011-01-26 2012-09-06 Sumitomo Bakelite Co Ltd プリント配線板およびプリント配線板の製造方法

Also Published As

Publication number Publication date
KR20170002705A (ko) 2017-01-06
KR20140124402A (ko) 2014-10-24
TW201428139A (zh) 2014-07-16
PH12015501174B1 (en) 2015-08-10
MY176308A (en) 2020-07-28
JPWO2014081041A1 (ja) 2017-01-05
CN104812945A (zh) 2015-07-29
PH12015501174A1 (en) 2015-08-10
JP5710845B2 (ja) 2015-04-30
CN104812945B (zh) 2018-08-28
WO2014081041A1 (ja) 2014-05-30
KR102078897B1 (ko) 2020-02-19

Similar Documents

Publication Publication Date Title
TWI509111B (zh) Surface treatment of electrolytic copper foil, laminated board, and printed wiring board, electronic equipment
JP6193534B2 (ja) 粗化処理銅箔、銅張積層板及びプリント配線板
JP5634103B2 (ja) 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
KR101803165B1 (ko) 캐리어 부착 동박, 프린트 배선판, 구리 피복 적층판, 전자 기기 및 프린트 배선판의 제조 방법
KR20060041689A (ko) 표면처리동박 및 회로기판
WO2007105635A1 (ja) 表面処理電解銅箔及びその製造方法
TW201800242A (zh) 表面處理銅箔及使用其製成的覆銅積層板
CN104271813A (zh) 表面处理铜箔及使用其的积层板、铜箔、印刷配线板、电子机器、以及印刷配线板的制造方法
KR20160034915A (ko) 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 프린트 배선판, 구리 피복 적층판 및 프린트 배선판의 제조 방법
TW202020233A (zh) 表面處理銅箔、附載體銅箔、覆銅層積板及印刷配線板
KR101695236B1 (ko) 동박, 이를 포함하는 전기부품 및 전지
JP2010180454A (ja) 表面処理銅箔およびその製造方法ならびに銅張積層板
JPH09217193A (ja) 非シアン化物真鍮めっき浴混合物、真鍮層を有する金属箔の製造方法、及び非シアン化物真鍮めっき浴の使用方法
CN105264123A (zh) 铜箔、附有载体的铜箔、覆铜积层体、印刷配线板、半导体封装用电路形成基板、半导体封装、电子机器、树脂衬底、电路的形成方法、半加成法、印刷配线板的制造方法
CN113795615B (zh) 表面处理铜箔、覆铜层叠板以及印刷电路板
KR20090084517A (ko) 내열성과 내약품성이 개선된 인쇄회로용 동박 및 그제조방법
JP6353193B2 (ja) キャリア付き銅箔、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、及びプリント配線板の製造方法
JP2020183565A (ja) 電解銅箔、該電解銅箔を用いた表面処理銅箔、並びに該表面処理銅箔を用いた銅張積層板及びプリント配線板
TWI805902B (zh) 表面處理銅箔、覆銅積層板及印刷線路板
JP2014208481A (ja) キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
CN112004964B (zh) 表面处理铜箔、覆铜板以及印刷电路板
JP2014208480A (ja) キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
TWI808700B (zh) 粗化處理銅箔、銅箔積層板及印刷佈線板
WO2022255422A1 (ja) 粗化処理銅箔、銅張積層板及びプリント配線板
JP2014208482A (ja) キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法