TWI499362B - - Google Patents
Info
- Publication number
- TWI499362B TWI499362B TW101130753A TW101130753A TWI499362B TW I499362 B TWI499362 B TW I499362B TW 101130753 A TW101130753 A TW 101130753A TW 101130753 A TW101130753 A TW 101130753A TW I499362 B TWI499362 B TW I499362B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101130753A TW201410101A (en) | 2012-08-24 | 2012-08-24 | Flexible manufacturing system of full automatic printing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101130753A TW201410101A (en) | 2012-08-24 | 2012-08-24 | Flexible manufacturing system of full automatic printing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201410101A TW201410101A (en) | 2014-03-01 |
| TWI499362B true TWI499362B (en) | 2015-09-01 |
Family
ID=50820573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101130753A TW201410101A (en) | 2012-08-24 | 2012-08-24 | Flexible manufacturing system of full automatic printing machine |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201410101A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW280082B (en) * | 1992-12-09 | 1996-07-01 | Matsushita Electric Works Ltd | |
| US5796986A (en) * | 1995-05-19 | 1998-08-18 | 3Com Corporation | Method and apparatus for linking computer aided design databases with numerical control machine database |
| US6498055B2 (en) * | 2000-05-17 | 2002-12-24 | Kabushiki Kaisha Toshiba | Semiconductor device, method of manufacturing semiconductor device, resin molding die, and semiconductor manufacturing system |
| US20080006440A1 (en) * | 2006-06-21 | 2008-01-10 | Hans-Georg Huonker | Process for manufacturing an injection molded part with integrated flexible printed circuit board |
| US20090026169A1 (en) * | 2007-07-25 | 2009-01-29 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board manufacturing system and manufacturing method thereof |
-
2012
- 2012-08-24 TW TW101130753A patent/TW201410101A/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW280082B (en) * | 1992-12-09 | 1996-07-01 | Matsushita Electric Works Ltd | |
| US5796986A (en) * | 1995-05-19 | 1998-08-18 | 3Com Corporation | Method and apparatus for linking computer aided design databases with numerical control machine database |
| US6498055B2 (en) * | 2000-05-17 | 2002-12-24 | Kabushiki Kaisha Toshiba | Semiconductor device, method of manufacturing semiconductor device, resin molding die, and semiconductor manufacturing system |
| US20080006440A1 (en) * | 2006-06-21 | 2008-01-10 | Hans-Georg Huonker | Process for manufacturing an injection molded part with integrated flexible printed circuit board |
| US20090026169A1 (en) * | 2007-07-25 | 2009-01-29 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board manufacturing system and manufacturing method thereof |
| US20110138616A1 (en) * | 2007-07-25 | 2011-06-16 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board manufacturing system |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201410101A (en) | 2014-03-01 |