TWI491842B - Heat sink - Google Patents

Description

heat sink

The present invention relates to a heat sink, and more particularly to a heat sink for heat dissipation of electronic components.

With the rapid development of the electronics industry, the power of electronic components such as a central processing unit (CPU), a north bridge chip, and a display card used in an electronic device is greatly increased, but these electronic components are relatively operated. The heat generated is greatly increased, often resulting in an increase in the temperature inside the electronic component itself and its configured system. At the same time, with the rapid accumulation of heat, the running performance of electronic components is degraded, and it is easy to cause the system to crash.

To ensure that the electronic components can operate within their normal temperature range, a heat sink is typically placed on the electronic components to dissipate the heat generated by them. A commonly used heat sink is an aluminum extruded heat sink having a plurality of heat sink fins, including a base for contacting the electronic component and a plurality of heat sink fins extending from the base. However, due to the limitation of the processing die in the process, the distance between the plurality of heat sink fins of the finished heat sink is severely limited (the shortest distance reaches 1.5 mm is approaching the limit), resulting in the heat sink on the unit area. The number of heat sink fins cannot be increased, which in turn limits the heat dissipation performance of the heat sink.

Moreover, in the manufacture of the conventional heat sink, due to the limitation of the processing die, in addition to the fact that the distance between the plurality of heat dissipation fins cannot be reduced, the number of the heat dissipation fins can be shortened by increasing the length of the heat dissipation fins. The distance between the fins is likely to cause the fracture of the processing die, and it is difficult to manufacture the dispersion with high density. Heat sink for hot fins.

Thus, as the operating speed of electronic components continues to increase, the amount of heat generated by them continues to increase, and conventional heat sinks having heat sink fins have not been able to meet the demand for use.

In view of the above problems, the present invention provides a heat sink for solving the problem that a heat sink having a heat sink fin is limited by a processing die, and the distance between the heat sink fins cannot be shortened, thereby restricting the number of heat sink fins to be severely restricted. It does not provide a problem with good heat dissipation.

The heat sink of the present invention includes a first body and a second body coupled to the first body. The first body includes a first substrate and a plurality of first heat dissipation fins spaced apart from the first substrate, and each of the first heat dissipation fins includes a plurality of first heat dissipation portions and a first heat conduction portion connected to the first substrate . The second body includes a second substrate and a plurality of second heat dissipation fins spaced apart from the second substrate, and each of the second heat dissipation fins includes a plurality of second heat dissipation portions and a second heat conduction portion connected to the second substrate The second heat conducting portion of the plurality of second heat dissipating fins and the first heat conducting portions of the plurality of first heat dissipating fins are in contact with each other, and the plurality of second heat dissipating portions of the second heat dissipating fins and the respective first heat dissipating portions The plurality of first heat dissipating portions of the fin are separated by a gap.

The effect of the invention is that the arrangement of the heat sink through the plurality of first heat dissipation fins and the plurality of second heat dissipation fins is not easily restricted by the processing mold, and the distance between the plurality of heat dissipation fins can be effectively shortened. The first body and the second body are combined with each other to form a heat sink with high-density heat-dissipating fins, thereby further dissipating heat The heat dissipation performance of the device is greatly improved as the heat dissipation area is increased. At the same time, the first heat conducting portion of the first heat dissipating fin and the second heat conducting portion of the second heat dissipating fin are adhered to each other, thereby increasing the transfer rate of energy between the first body and the second body, thereby improving the heat sink. Heat transfer efficiency.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

Referring to FIG. 1 to FIG. 4 , the heat sink 100 disclosed in the first embodiment of the present invention is an aluminum extruded heat sink, which includes a first body 110 and a second body 120. The first body 110 includes A first substrate 111 and a plurality of first heat dissipation fins 112 are integrally formed, and a plurality of first heat dissipation fins 112 are spaced apart from the first substrate 111, and a plurality of concaves are arranged on the first substrate 111. The slot 113, wherein the first substrate 111 is further formed with a plurality of openings 1111 corresponding to the plurality of grooves 113, respectively. In addition, the first heat dissipation portion 1121 includes a first heat conduction portion 1121 and a plurality of first heat dissipation portions 1122. The first heat conduction portion 1121 is connected to the first substrate 111, and the plurality of first heat dissipation portions 1122 are respectively connected to the first heat conduction portion. The first heat conducting portion 1121 is connected between the first substrate 111 and the plurality of first heat dissipating portions 1122 , wherein the thickness t1 of the first heat conducting portion 1121 is greater than the thickness t2 of the first heat dissipating portion 1122 .

The second body 120 is substantially identical in structure to the first body 110. The second body 120 includes a second substrate 121 and a plurality of second heat dissipation fins 122. The plurality of second heat dissipation fins 122 are spaced apart from each other. On the second substrate 121, a plurality of grooves 123 arranged at intervals are formed on the second substrate 121. Second heat sink fin The second heat conducting portion 1221 is connected to the second substrate 121, and the plurality of second heat radiating portions 1222 are respectively connected to the opposite sides of the second heat conducting portion 1221. The second heat conducting portion 1221 is connected between the second substrate 121 and the plurality of second heat radiating portions 1222. The thickness t3 of the second heat conducting portion 1221 is greater than the thickness t4 of the second heat dissipating portion 1222, and the size and structural shape of the second heat conducting portion 1221 are matched with the size and structural shape of the groove 113 of the first body 110. The second heat conducting portion 1221 and the groove 113 of the first body 110 form an interfitting concave and convex structure, for example, when the groove 113 of the first body 110 has a rectangular groove with a width of between 1.0 and 1.5 mm, The two heat conducting portions 1221 are rectangular inserts having a thickness of between 1.0 and 1.5 mm, or other mutually matching trapezoidal, triangular or square concave and convex structures.

Similarly, the size and structure of the first heat conducting portion 1121 of the first heat dissipating fin 112 are also matched to the size and structural shape of the groove 123 of the second body 120 to form a mutually matching concave and convex structure.

It is to be noted that a positioning portion 1223 is further formed at an end of the second heat-dissipating portion 1221 of the second heat-dissipating fin 122 away from the second substrate 121, and the structural shape of the positioning portion 1223 is matched with the first substrate 111 of the first body 110. The structural form of the opening 1111.

Therefore, when the first body 110 is coupled to the second body 120, the first body 110 is correspondingly engaged with the plurality of grooves 123 of the second body 120 by the plurality of first heat dissipation fins 112, and the second body 120 is The plurality of second heat dissipation fins 122 are correspondingly embedded in the plurality of recesses 113 of the first body 110, so that the first heat dissipation fins 112 and the second heat dissipation fins 122 are staggered on the heat sink 100, and the second heat dissipation is performed. Fin The second heat transfer portion 1221 of the 122 and the first heat transfer portion 1121 of the first heat dissipation fin 112 are in contact with each other. Then, the first heat conduction portion 1121 of the first heat dissipation fin 112 and the second heat dissipation fin 122 are second, as the first substrate 111 of the first body 110 and the second substrate 121 of the second body 120 are close to each other. The heat conducting portions 1221 are pushed and tightly coupled to each other and form a heat conducting block inside the heat sink 100 for conducting heat energy.

In addition, when the first substrate 111 of the first body 110 and the second substrate 121 of the second body 120 are close to each other, the plurality of second heat dissipation fins 122 of the second body 120 are correspondingly engaged with the positioning portion 1223. The inside of the plurality of openings 1111 of the first substrate 111 of the body 110 combines the first body 110 and the second body 120 in a tight fit.

The thickness t1 of the first heat conducting portion 1121 of the first heat dissipating fin 112 is greater than the thickness t2 of the first heat dissipating portion 1122, and the thickness t3 of the second heat conducting portion 1221 of the second heat dissipating fin 122 is greater than the second heat dissipating. The thickness t4 of the portion 1222 is such that after the first heat conducting portion 1121 of the first heat dissipating fin 112 and the second heat conducting portion 1221 of the second heat dissipating fin 122 are attached to each other, the first heat dissipating portion of the first heat dissipating fin 112 A gap d is formed between the 1122 and the second heat dissipation portion 1222 of the second heat dissipation fin 122 to serve as an air flow passage. At the same time, the first heat dissipation fins 112 and the plurality of second heat dissipation fins 122 are arranged in a staggered manner. Therefore, the first heat dissipation portion 1122 and the second heat dissipation fins 122 of the first heat dissipation fins 112 . The second heat dissipation portion 1222 can be arranged on the heat sink 100 in a high density manner, thereby increasing the heat dissipation area of the heat sink 100.

Therefore, in the application, the heat sink 100 disclosed in the first embodiment of the present invention can further protrude the second body 120 from the first body 110 by the processing program. The positioning portion 1223 outside the opening 1111 of the substrate 111 is flattened, so that the heat sink 100 can be selectively attached to the central processing unit (CPU) or the graphic in the electronic device with the first substrate 111 of the first body 110. A heat generating component (not shown) such as a graphic processing unit (GPU) or a second substrate 121 of the second body 120 is directly attached to the heat generating component. For example, when the heat sink 100 is attached to the heat generating component through the second substrate 121 of the second body 120 , the heat sink 100 can pass through the second substrate 121 of the second body 120 and the plurality of first heat sink fins 112 . The heat conducting block formed by the first heat conducting portion 1121 and the second heat conducting portion 1221 of the plurality of second heat radiating fins 122 is bonded to each other to transfer heat energy generated by the heat generating component, so that the heat transfer area of the heat sink 100 is increased to have good heat conduction. ability. At the same time, the heat sink 100 can also increase the heat dissipation area of the first heat dissipation fins 1122 of the first heat dissipation fins 112 and the plurality of heat dissipation portions 1222 of the second heat dissipation fins 122 to increase the heat dissipation area of the contact with the surrounding air. Thermal energy can be transferred to the external environment more quickly, thereby improving heat dissipation efficiency.

It can be understood that, since the first body 110 and the second body 120 of the heat sink 100 of the present invention are mutually interlocked by the manner in which the plurality of first heat dissipation fins 112 and the second heat dissipation fins 122 are alternately arranged, the present invention is The heat sink 100 of the present invention can also increase the thickness t2 of the first heat dissipation portion 1122 of the first heat dissipation fin 112 and the thickness t4 of the second heat dissipation portion 1222 of the second heat dissipation fin 122, or increase the first heat dissipation fin 112. The length of the first heat dissipation portion 1122 and the length of the second heat dissipation portion 1222 of the second heat dissipation fin 122 improve the heat dissipation efficiency. Compared with the conventional aluminum extrusion type heat sink, the problem that the heat dissipation area is insufficient and the elongated heat dissipation fins are easily broken is overcome.

In addition, the heat sink 100 of the present invention can also increase the heat transfer efficiency through the tightness between the first heat conducting portion 1121 of the first heat dissipation fin 112 and the second heat conducting portion 1221 of the second heat dissipation fin 122.

As shown in FIG. 5 and FIG. 6, the second embodiment of the present invention is substantially identical in structure to the first embodiment, and the difference between the two is that the heat sink 100 of the second embodiment further includes at least one fixed. The first heat conducting portion 1121 of the first heat dissipating fin 112 is formed with at least one through hole 1123, and at least one through hole 1224 is formed on the second heat conducting portion 1221 of the second heat dissipating fin 122. The fixing member 130 can be, but is not limited to, a bolt having a stud 131 and a nut 132. The stud 131 has a first end and a second end, and the first end of the stud 131 passes through the first heat dissipating fin The through hole 1123 of the first heat conducting portion 1121 and the through hole 1224 of the second heat conducting portion 1221 of the second heat dissipating fin 122 penetrate the first body 110 and the second body 120, and the second end of the stud 131 abuts against the first body 110 is disposed on the first heat conducting portion 1121 of the outermost first heat radiating fin 112. The nut 132 is locked to the first end of the bolt 131 and abuts against the first heat conducting portion 1121 of the other first heat radiating fin 112 of the outermost side of the first body 110 to make the first body 110 and the second body 120 It is clamped and fixed between the nut 132 and the second end of the stud 131.

Therefore, the heat sink 100 can increase the tightness between the plurality of first heat dissipation fins 112 and the plurality of second heat dissipation fins 122 through the rotation of the nut 132 relative to the studs 131, so that the first heat dissipation fins 112 The first heat conducting portion 1121 is more closely adhered to the second heat conducting portion 1221 of the second heat dissipating fin 122, thereby improving the heat transfer performance of the heat sink 100.

Further, in the second embodiment of the present invention, the plurality of the second body 120 The height of the positioning portion 1223 of the second heat dissipating fins 122 on the second heat conducting portion 1221 may also be set to be equal to or smaller than the thickness of the first substrate 111 of the first body 110, so that the positioning portion 1223 of the plurality of second heat dissipating fins 122 After the plurality of openings 1111 of the first substrate 111 are engaged, the flatness of the surface of the first substrate 111 is maintained, and the heat sink 100 can be directly attached to the heating element of the electronic device by the first substrate 111 of the first body 110. In the above, the processing procedure for subsequently milling the positioning portion 1223 of the second heat dissipation fin 122 can be omitted.

Please refer to FIG. 7 and FIG. 8 , which are respectively exploded and combined schematic views of the heat sink 100 disclosed in the third embodiment of the present invention. The third embodiment disclosed in the present invention is substantially identical in structure to the first embodiment, and the difference between the two is that the opening of the first substrate 111 of the first body 110 is omitted, and the second body 120 is second. The arrangement of the positioning portions is omitted on the heat dissipation fins 122. In addition, the thickness of the first heat conduction portion 1121 of the first heat dissipation fin 112 of the first body 110 is slightly larger than the width of the groove 123 of the second body 120, and the second heat conduction of the second heat dissipation fin 122 of the second body 120 The thickness of the portion 1221 is slightly larger than the width of the groove 113 of the first body 110. Therefore, when the first body 110 and the second body 120 are coupled to each other, the first heat dissipation fin 112 of the first body 110 and the groove 123 of the second body 120 and the second heat dissipation fin 122 of the second body 120 The first body 110 and the second body 120 are transmitted through the first heat conducting portion 1121 and the second heat radiating fin 122 of the first heat dissipating fin 112. The two heat conducting portions 1221 are closely attached to each other and integrated into one body.

It is to be noted that, in order to increase the bonding strength between the first body 110 and the second body 120, the first heat conducting portion 1121 of the first heat dissipation fin 112 may also be transmitted. An interfitting concave-convex structure, such as a mating bump and recess structure, is provided between the second heat-conducting portion 1221 of the second heat-dissipating fin 122.

The heat sink of the present invention is configured to form a heat sink with high-density heat-dissipating fins by disposing a plurality of first heat-dissipating fins of the first body and a plurality of second heat-dissipating fins of the second body. The heat dissipation area of the device is increased as the number of heat dissipation fins increases, thereby improving the heat dissipation performance. At the same time, a large heat transfer area is formed between the first body and the second body by the mutual bonding of the first heat conducting portion of the first heat dissipating fin and the second heat conducting portion of the second heat dissipating fin. The heat conducting block allows the heat sink to quickly transfer heat energy to the first heat dissipating portion and the second heat dissipating portion through the heat conducting block to dissipate heat, thereby further improving the heat dissipating efficiency of the heat sink.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

100‧‧‧heatsink

110‧‧‧First Ontology

111‧‧‧First substrate

1111‧‧‧ openings

112‧‧‧First heat sink fin

1121‧‧‧First heat transfer department

1122‧‧‧First heat sink

1123‧‧‧Perforation

113‧‧‧ Groove

120‧‧‧Second ontology

121‧‧‧second substrate

122‧‧‧Second heat sink fins

1221‧‧‧Second heat conduction department

1222‧‧‧second heat sink

1223‧‧‧ Positioning Department

1224‧‧‧Perforation

123‧‧‧ Groove

130‧‧‧Fixed parts

131‧‧‧ Stud

132‧‧‧ nuts

D‧‧‧ gap

T1‧‧‧The thickness of the first heat conducting part

T2‧‧‧The thickness of the first heat sink

T3‧‧‧ Thickness of the second heat conducting part

T4‧‧‧ Thickness of the second heat sink

Fig. 1 is an exploded perspective view showing a heat sink according to a first embodiment of the present invention.

Fig. 2 is a schematic view showing the combination of the heat sink of the first embodiment of the present invention.

Fig. 3 is an exploded perspective view showing another perspective of the heat sink of the first embodiment of the present invention.

Figure 4 is a side elevational view of the heat sink of the first embodiment of the present invention.

Fig. 5 is an exploded perspective view showing the heat sink of the second embodiment of the present invention.

Fig. 6 is a schematic view showing the combination of the heat sink of the second embodiment of the present invention.

Fig. 7 is an exploded perspective view showing the heat sink of the third embodiment of the present invention.

Figure 8 is a schematic view showing the combination of the heat sink of the third embodiment of the present invention.

100‧‧‧heatsink

110‧‧‧First Ontology

1122‧‧‧First heat sink

120‧‧‧Second ontology

1222‧‧‧second heat sink

1223‧‧‧ Positioning Department

D‧‧‧ gap

Claims (5)

A heat sink includes a first body including a first substrate and a plurality of first heat dissipation fins spaced apart from the first substrate, and each of the first heat dissipation fins includes a plurality of first heat dissipation portions and a first heat conducting portion connected to the first substrate; and a second body coupled to the first body, the second body includes a second substrate and a plurality of second heat sinks spaced apart from the second substrate a plurality of second heat dissipating portions and a second heat conducting portion connected to the second substrate; wherein the first body is coupled to the second body when the first body is coupled to the second body The first heat dissipation fins are correspondingly engaged in the plurality of grooves of the second body, and the second heat dissipation fins of the second body are correspondingly embedded in the plurality of grooves of the first body. The second heat conducting portion of the second heat dissipating fins and the first heat conducting portions of the first heat dissipating fins are bonded to each other, and the second heat dissipating portions of the second heat dissipating fins are respectively The first heat dissipation portions of the first heat dissipation fin are separated by a space . The heat sink of claim 1, wherein the first substrate of the first body has a plurality of openings, and the second heat dissipation fins of the second body respectively have a positioning portion, and the second heat dissipation fins The positioning portion is connected to the second heat conducting portion and correspondingly engaged in the openings of the first substrate. The heat sink of claim 2, wherein the height of the positioning portion of the second heat dissipating fins on the second heat conducting portion is equal to or smaller than the thickness of the first substrate. The heat sink of claim 1, further comprising a fixing member, the fixing member passing through the fixing member The first heat conducting portion of the first heat dissipating fin and the second heat conducting portion of the second heat dissipating fins are opposite to each other, and the opposite ends of the fixing member are clamped to fix the first body and the second body. The heat sink of claim 4, wherein the fixing member comprises a stud and a nut, the nut is locked to one end of the stud, and the first body and the second body are fixed to the snail Between the cap and the other end of the stud.