TWI470296B - Wafer level lens and manufacturing method of the same - Google Patents

Wafer level lens and manufacturing method of the same Download PDF

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Publication number
TWI470296B
TWI470296B TW101118709A TW101118709A TWI470296B TW I470296 B TWI470296 B TW I470296B TW 101118709 A TW101118709 A TW 101118709A TW 101118709 A TW101118709 A TW 101118709A TW I470296 B TWI470296 B TW I470296B
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TW
Taiwan
Prior art keywords
metal casing
lens
wafer level
level lens
fixing plastic
Prior art date
Application number
TW101118709A
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Chinese (zh)
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TW201348785A (en
Inventor
Yindong Lu
Hanyi Kuo
Zhehao Wu
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Himax Tech Ltd
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Publication date
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Priority to TW101118709A priority Critical patent/TWI470296B/en
Publication of TW201348785A publication Critical patent/TW201348785A/en
Application granted granted Critical
Publication of TWI470296B publication Critical patent/TWI470296B/en

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Description

Wafer level lens and manufacturing method thereof

The present disclosure relates to a lens and a manufacturing technique thereof, and more particularly to a wafer level lens and a method of fabricating the same.

In recent years, with the continuous advancement of digital image module technology, human beings have different perceptions of the definition and application of images. In the revolutionary trend of this wave of images, the most eye-catching is the popularization of image sensing modules, which can be equipped with corresponding image sensing modules for different uses and types of products, such as mobile phones and notes. An electronic device such as a computer that has a limited size can be equipped with a compact and low-cost image sensing module. With the trend of miniaturization and low cost of mobile phone camera modules, the emergence of wafer level camera technology has attracted much attention.

The wafer-level packaging technology has dramatically changed the production mode of traditional image sensors, and the advantages are numerous. The reason is that wafer-level packaging technology was originally designed to build stereoscopic circuits on electronic components to achieve volume and weight miniaturization in order to produce higher proportions of components on wafers of the same area. When such a concept is applied to the production of image sensors, it is expected to be able to convert image sensor production into an electronic component industry, thereby standardizing and mass production. Another advantage of using wafer level fabrication techniques is the low cost of production. If the size of the optical component can be reduced, the number of components per wafer can be increased, and the manufacturing cost per micro-optical component can be reduced, and the size of the sensor or DSP can be reduced, and the optical component can be small. At the time of the conversion, the unit wafer production cost can be greatly reduced.

However, wafer-level cameras are becoming smaller and smaller, and the technology for packaging and protection against electromagnetic waves is also challenging. How to design a stable connection strength and prevent electromagnetic interference to increase its stability and make the quality of wafer-level cameras more reliable will be an urgent problem to be solved in the industry.

Accordingly, one aspect of the present disclosure is to provide a wafer level lens manufacturing method comprising the following steps. Forming a metal casing, the metal casing comprises an open end and a closed end, and the accommodating space is included between the open end and the closed end; the metal casing is placed in the mold; and the plastic material is filled to form a direct contact with the metal casing in the accommodating space The lens is fixed to the plastic part, and the lens fixing plastic part has a lens receiving chamber penetrating; the mold is removed; and the lens group and the image sensor are placed in the lens receiving chamber, wherein the image sensor corresponds to the open end of the metal case The lens group corresponds to a hole in the closed end of the metal casing.

According to an embodiment of the present disclosure, a wafer level lens manufacturing method further includes electrically connecting an image sensor and a circuit board by a solder ball soldering process.

In accordance with another embodiment of the present disclosure, the breach is formed simultaneously with the formation of the metal casing.

According to still another embodiment of the present disclosure, the hole is formed after forming the lens fixing plastic part.

According to still another embodiment of the present disclosure, a wafer level lens manufacturing method further includes forming a sidewall opening in a metal shell to fill a sidewall of the plastic material, and further engaging the lens fixing plastic component with the sidewall opening and the metal casing. .

According to one embodiment of the present disclosure, wafer level lens manufacturing The method further comprises forming a rib structure on the metal casing, so that the lens fixing plastic component is engaged with the metal casing corresponding to the convex rib structure.

According to still another embodiment of the present disclosure, the wafer level lens manufacturing method further comprises forming a concave rib structure on the metal casing, so that the lens fixing plastic component is engaged with the metal casing corresponding to the concave rib structure.

According to an embodiment of the present disclosure, a wafer level lens manufacturing method further includes forming a spring claw hook structure on a metal casing, so that the lens fixing plastic member is engaged with the metal shell according to the elastic claw hook structure.

In accordance with another embodiment of the present disclosure, the material of the metal outer casing comprises iron, stainless steel, copper, aluminum, aluminum-magnesium alloy, nickel alloy, or a combination thereof.

Another aspect of the present disclosure is to provide a wafer level lens comprising: a metal housing, a lens mount molding, a lens assembly, and an image sensor. The metal casing includes an open end and a closed end, and the accommodating space is included between the open end and the closed end. The lens fixing plastic part is formed of a plastic material in a metal casing and is in direct contact with the metal casing, wherein the lens fixing plastic piece has a lens receiving chamber penetrating therethrough. The lens set corresponds to a perforation in the closed end of the metal casing. The image sensor receives the lens set and corresponds to the open end of the metal casing.

According to an embodiment of the present disclosure, the image sensor and the circuit board are electrically connected by a solder ball soldering process.

According to another embodiment of the present disclosure, the metal casing further includes a sidewall opening, and the lens fixing plastic member is engaged with the metal casing corresponding to the sidewall opening.

According to still another embodiment of the present disclosure, the metal casing further comprises a rib structure, so that the lens fixing plastic component is engaged with the metal casing corresponding to the rib structure.

According to still another embodiment of the present disclosure, the metal casing further comprises The concave rib structure allows the lens fixing plastic part to engage with the metal outer casing corresponding to the concave rib structure.

According to another aspect of the present disclosure, the metal casing further includes a spring claw hook structure, so that the lens fixing plastic member is engaged with the metal shell according to the elastic claw hook structure.

In accordance with an embodiment of the present disclosure, the material of the metal outer casing comprises iron, stainless steel, copper, aluminum, aluminum-magnesium alloy, nickel alloy, or a combination thereof.

Yet another aspect of the present disclosure is to provide a wafer level lens comprising: a metal housing, a lens mount molding, a lens assembly, and an image sensor. The metal casing comprises an open end and a closed end, and the open end and the closed end comprise an accommodating space, wherein the side wall of the metal casing comprises at least one geometric feature. The lens fixing plastic part is formed of a plastic material in a metal casing and is in direct contact with the metal casing, wherein the lens fixing plastic part has a lens receiving chamber penetrating through, and the lens fixing plastic part is a comprehensive covering or partially contacting the metal casing, the metal The outer shell increases the bonding strength with the plastic material by at least one geometric feature. The lens set corresponds to a perforation in the closed end of the metal casing. The image sensor receives the lens set and corresponds to the open end of the metal casing.

According to an embodiment of the present disclosure, the image sensor and the circuit board are electrically connected by a solder ball soldering process.

According to another embodiment of the present disclosure, the metal casing further includes a sidewall opening, and the lens fixing plastic member is engaged with the metal casing corresponding to the sidewall opening.

According to still another embodiment of the present disclosure, the metal casing further comprises a rib structure, so that the lens fixing plastic component is engaged with the metal casing corresponding to the rib structure.

According to still another embodiment of the present disclosure, the metal casing further comprises The concave rib structure allows the lens fixing plastic part to engage with the metal outer casing corresponding to the concave rib structure.

According to another aspect of the present disclosure, the metal casing further includes a spring claw hook structure, so that the lens fixing plastic member is engaged with the metal shell according to the elastic claw hook structure.

In accordance with an embodiment of the present disclosure, the material of the metal outer casing comprises iron, stainless steel, copper, aluminum, aluminum-magnesium alloy, nickel alloy, or a combination thereof.

The advantage of the application of the present disclosure is that the simultaneous connection of the metal casing and the lens fixing plastic part can strengthen the connection strength between the two and provide a mechanism for preventing electromagnetic wave interference, and the above object can be easily achieved.

Please refer to Figure 1. 1 is a side cross-sectional view of a wafer level lens 1 in accordance with an embodiment of the present disclosure. The wafer level lens 1 includes a metal casing 100, a lens fixing plastic member 102, a lens group 104, and an image sensor 106.

The metal casing 100 includes an open end 101 and a closed end 103, an open end 101 and a closed end 103. The lens fixing plastic member 102 is formed of a plastic material in the metal casing 100 and is in direct contact with the metal casing 100. It should be noted that the term "direct contact" means that the metal casing 100 and the lens fixing plastic member 102 do not need to be glued and fixed, but are directly tightly fixed to increase the connection stability between the two. In various embodiments, the lens mount plastic component 102 can be a full or partially contact metal housing 100. The lens set 104 corresponds to a perforation 105 in the closed end 103 of the metal outer casing 100. The image sensor 106 receives the lens set 104 and corresponds to the opening of the metal casing 100 End 101.

Please refer to Fig. 2 and Fig. 3A to Fig. 3D at the same time. FIG. 2 is a flow chart of a wafer level lens manufacturing method 200 according to an embodiment of the disclosure. The wafer level lens manufacturing method is used to fabricate the wafer level lens 1 as shown in FIG. 3A to 3D are schematic views showing steps of a wafer level lens manufacturing method 200 in an embodiment of the disclosure.

The wafer level lens manufacturing method 200 includes the following steps (it should be understood that the steps mentioned in the embodiment can be adjusted according to actual needs, except for the order in which the order is specifically stated, or even simultaneously or partially Simultaneous execution).

In step 201, a metal casing 100 is formed, wherein the metal casing 100, as shown in FIG. 3A, includes the open end 101 and the closed end 103 described above. The accommodating space 300 is included between the open end 101 and the closed end 103. In the present embodiment, the holes 105 in the closed end 103 are formed simultaneously with the process of forming the metal casing 100. In one embodiment, the material of the metal casing 100 comprises iron. In other embodiments, it may be made of other metal materials or alloyed with iron and other metals such as nickel.

Next, in step 202, as shown in FIG. 3B, the metal casing 100 is placed in the molds 302 and 304, and the plastic material is filled in the step 203 to form a metal with the accommodating space 300 shown in FIG. 3A. The housing 100 directly contacts the housing 100 to secure the plastic member 102.

At step 204, molds 302 and 304 are removed. As shown in FIG. 3C, the lens fixing plastic member 102 forms a through lens receiving chamber 306 due to the shapes of the molds 302 and 304. Therefore, the lens fixing plastic member 102 can be directly connected to the metal casing 100 without requiring additional fixing.

In step 205, as shown in FIG. 3D, the lens group 104 and the image sensor 106 are placed in the lens housing chamber 306. The image sensor 106 corresponds to the open end 101 of the metal casing 100, and the lens group 104 corresponds to the hole 105 on the closed end 103 of the metal casing 100. In an embodiment, the optical axis of the lens set 104 and the image sensor 106 can achieve the best shooting effect by adjusting the relative position with the broken hole 105.

In an embodiment, the image sensor 106 can be electrically connected to a circuit board 108 by a soldering process of the solder ball 110 as shown in FIG. 1 to electrically connect with other circuits. The image is further processed.

Therefore, the wafer level lens 1 of the present disclosure can be formed by inserting the metal shell 100 and the plastic material into the mold at the same time to form the lens fixing plastic part 102, and can strengthen the direct contact without separately fixing the glue. The strength of the connection between the tightly-bonded metal casing 100 and the lens-fixing plastic member 102, even if subjected to lateral stress, the solder ball 110 is not easily affected and falls off. Still further, the metal casing 100 can provide a mechanism to prevent electromagnetic wave interference. Therefore, the wafer level lens 1 of the present disclosure can greatly improve the stability and make the quality of the wafer level lens 1 more reliable than the conventional technology.

It should be noted that in the above embodiment, the broken hole 105 on the closed end 103 may also be formed after the metal casing 100 is placed in the mold and poured into the plastic material to form the lens fixing plastic member 102.

Please refer to Figure 4. 4 is a side cross-sectional view of a wafer level lens 1 in another embodiment of the present disclosure. The wafer level lens 1 shown in FIG. 4 is similar to the first picture. However, in this embodiment, the wafer level lens 1 is The metal casing 100 further includes a sidewall opening 40.

The sidewall opening 40 is formed simultaneously with the process of forming the metal casing 100. When the metal casing 100 is placed in the mold and filled with the plastic material, the plastic material is further filled into the side wall opening 40 in addition to the accommodating space 300 shown in FIG. 3A. Therefore, after the plastic material is cooled to form the lens fixing plastic member 102, the corresponding sidewall opening 40 and the metal casing 100 can be engaged to achieve a better connection effect.

Please refer to Figure 5. FIG. 5 is a side cross-sectional view of the wafer level lens 1 in still another embodiment of the disclosure. The wafer level lens 1 shown in Fig. 5 is similar to the first picture. However, the metal casing 100 of the wafer level lens 1 can be further formed with geometric features to enhance the bonding strength with the lens fixing plastic member 102 formed of a plastic material. In the present embodiment, the metal casing 100 of the wafer level lens 1 includes a rib structure 50.

The rib structure 50 is formed simultaneously with the process of forming the metal casing 100. When the metal casing 100 is placed in the mold and filled with the plastic material, the plastic material will be filled in the corresponding rib structure 50 in the accommodating space 300. Therefore, after the plastic material is cooled to form the lens fixing plastic member 102, the corresponding rib structure 50 can be engaged with the metal casing 100 to achieve a better connection effect.

Please refer to Figure 6. Figure 6 is a side cross-sectional view of the wafer level lens 1 in still another embodiment of the disclosure. The wafer level lens 1 shown in Fig. 6 is similar to the first picture. However, the metal casing 100 of the wafer level lens 1 can be further formed with geometric features to enhance the bonding strength with the lens fixing plastic member 102 formed of a plastic material. In the present embodiment, the metal casing 100 of the wafer level lens 1 includes a concave rib structure 60.

The concave rib structure 60 is formed simultaneously with the process of forming the metal casing 100 to make. When the metal casing 100 is placed in the mold and filled with a thermoplastic material, the thermoplastic material will be shaped in the corresponding recessed rib structure 60 in the accommodating space 300. Therefore, after the thermoplastic material is cooled to form the lens fixing plastic member 102, the corresponding concave rib structure 60 can be engaged with the metal casing 100 to achieve a better connection effect.

Please refer to Figure 7. Figure 7 is a side cross-sectional view of the wafer level lens 1 in an embodiment of the present disclosure. The wafer level lens 1 shown in Fig. 7 is similar to the first picture. However, the metal casing 100 of the wafer level lens 1 can be further formed with geometric features to enhance the bonding strength with the lens fixing plastic member 102 formed of a plastic material. In the present embodiment, the metal casing 100 of the wafer level lens 1 includes a spring claw hook structure 70.

The shrapnel hook structure 70 is formed simultaneously with the process of forming the metal outer casing 100. When the metal casing 100 is placed in the mold and filled with the plastic material, the plastic material will be formed in the accommodating space 300 corresponding to the elastic claw hook structure 70. Therefore, after the plastic material is cooled to form the lens fixing plastic member 102, the elastic claw hook structure 70 can be engaged with the metal casing 100 to achieve a better connection effect.

Therefore, the wafer level lens 1 of the present disclosure can further achieve a more stable connection effect by the sidewall opening 40, the rib structure 50, the concave rib structure 60 or the elastic claw hook structure 70. In other embodiments, the sidewall opening 40, the rib structure 50, the concave rib structure 60, and the elastic claw hook structure 70 may simultaneously form two or more of them to provide a better connection mechanism.

The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection of the disclosure is defined by the scope of the patent application attached. quasi.

1‧‧‧ Wafer-level lens

100‧‧‧Metal casing

101‧‧‧Open end

102‧‧‧Lens fixed plastic parts

103‧‧‧closed end

104‧‧‧ lens group

105‧‧‧ hole

106‧‧‧Image Sensor

108‧‧‧Circuit board

110‧‧‧ solder balls

200‧‧‧ Wafer-level lens manufacturing method

201-205‧‧‧Steps

300‧‧‧ accommodating space

302, 304‧‧‧ mould

306‧‧‧Lens accommodating chamber

40‧‧‧ sidewall opening

50‧‧‧ rib structure

60‧‧‧ concave rib structure

70‧‧‧Scratch claw hook structure

The above and other objects, features, advantages and embodiments of the present disclosure will become more apparent and understood. The description of the drawings is as follows: FIG. 1 is a side of a wafer level lens according to an embodiment of the disclosure. FIG. 2 is a flow chart of a wafer level lens manufacturing method according to an embodiment of the disclosure; FIG. 3A to FIG. 3D are steps of a wafer level lens manufacturing method according to an embodiment of the disclosure. 4 is a side cross-sectional view of a wafer level lens in another embodiment of the present disclosure. FIG. 5 is a side cross-sectional view of a wafer level lens according to still another embodiment of the disclosure; FIG. In a further embodiment of the present disclosure, a side cross-sectional view of a wafer level lens; and a seventh side view of the wafer level lens in an embodiment of the present disclosure.

200‧‧‧ Wafer-level lens manufacturing method

201-205‧‧‧Steps

Claims (23)

  1. A method of manufacturing a wafer level lens, comprising: forming a metal casing, the metal casing comprising an open end and a closed end, wherein the open end and the closed end comprise an accommodating space; Inserting into a mold; filling a plastic material to form a lens fixing plastic member in direct contact with the metal casing in the accommodating space, and the lens fixing plastic member has a lens accommodating chamber penetrating through the lens; a mold; and a lens group and an image sensor disposed in the lens receiving chamber, wherein the image sensor corresponds to the open end of the metal casing, the lens group corresponding to the closed end of the metal casing One of the holes.
  2. The wafer level lens manufacturing method of claim 1, further comprising electrically connecting the image sensor to a circuit board by a solder ball soldering process.
  3. The wafer level lens manufacturing method of claim 1, wherein the hole is formed simultaneously when the metal casing is formed.
  4. The wafer level lens manufacturing method of claim 1, wherein the hole is formed after forming the lens fixing plastic part.
  5. The wafer level lens manufacturing method as claimed in claim 1 further includes Forming a sidewall opening in the metal casing to fill a sidewall of the thermoplastic material, further allowing the lens fixing plastic member to engage with the metal casing corresponding to the sidewall opening.
  6. The wafer-level lens manufacturing method of claim 1, further comprising forming a rib structure on the metal casing, so that the lens fixing plastic component corresponds to the rib structure and the metal casing.
  7. The wafer-level lens manufacturing method of claim 1, further comprising forming a concave rib structure on the metal casing, so that the lens fixing plastic component corresponds to the concave rib structure and the metal casing.
  8. The wafer level lens manufacturing method of claim 1, further comprising forming a spring claw hook structure on the metal casing, so that the lens fixing plastic component corresponds to the elastic claw hook structure and the metal casing.
  9. The wafer level lens manufacturing method of claim 1, wherein the material of the metal casing comprises iron, stainless steel, copper, aluminum, aluminum-magnesium alloy, nickel alloy or a combination thereof.
  10. A wafer-level lens comprising: a metal casing comprising an open end and a closed end, the open end and the closed end including an accommodating space; and a lens fixing plastic part formed of a plastic material in the metal casing And in direct contact with the metal casing, wherein the lens fixing plastic member has a lens receiving chamber penetrating through; a lens group corresponding to one of the closed ends of the metal casing; and an image sensor Receiving the lens set and corresponding to the open end of the metal casing.
  11. The wafer level lens of claim 10, wherein the image sensor is electrically connected to a circuit board by a solder ball soldering process.
  12. The wafer level lens of claim 10, wherein the metal casing further comprises a side wall opening, and the lens fixing plastic member is engaged with the metal casing corresponding to the side wall opening.
  13. The wafer level lens of claim 10, wherein the metal casing further comprises a rib structure, such that the lens fixing plastic member corresponds to the rib structure and the metal casing.
  14. The wafer level lens of claim 10, wherein the metal casing further comprises a concave rib structure, such that the lens fixing plastic member corresponds to the concave rib structure and the metal casing.
  15. The wafer-level lens of claim 10, wherein the metal casing further comprises a resilient claw hook structure, so that the lens fixing plastic component corresponds to the elastic lens The claw hook structure is engaged with the metal casing.
  16. The wafer level lens of claim 10, wherein the material of the metal casing comprises iron, stainless steel, copper, aluminum, aluminum magnesium alloy, nickel alloy, or a combination thereof.
  17. A wafer-level lens comprising: a metal casing comprising an open end and a closed end, the open end and the closed end comprising an accommodating space, wherein one side wall of the metal casing comprises at least one geometric feature; a fixed plastic part formed of a plastic material in the metal casing and in direct contact with the metal casing, wherein the lens fixing plastic piece has a lens receiving chamber penetrating through the lens, and the lens fixing plastic part is a comprehensive covering or part a portion of the metal casing that is bonded to the plastic material by the at least one geometric feature; a lens group corresponding to one of the closed ends of the metal casing; and an image sensor Receiving the lens set and corresponding to the open end of the metal casing.
  18. The wafer level lens of claim 17, wherein the image sensor is electrically connected to a circuit board by a solder ball soldering process.
  19. The wafer level lens of claim 17, wherein the metal casing further comprises a side wall opening, and the lens fixing plastic member is engaged with the metal casing corresponding to the side wall opening.
  20. The wafer level lens of claim 17, wherein the metal casing further comprises a rib structure, such that the lens fixing plastic member corresponds to the rib structure and the metal casing.
  21. The wafer level lens of claim 17, wherein the metal casing further comprises a concave rib structure, such that the lens fixing plastic member corresponds to the concave rib structure and the metal casing.
  22. The wafer-level lens of claim 17, wherein the metal casing further comprises a resilient claw hook structure, such that the lens fixing plastic member corresponds to the elastic claw hook structure and the metal casing.
  23. The wafer level lens of claim 17, wherein the material of the metal casing comprises iron, stainless steel, copper, aluminum, aluminum-magnesium alloy, nickel alloy, or a combination thereof.
TW101118709A 2012-05-25 2012-05-25 Wafer level lens and manufacturing method of the same TWI470296B (en)

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Application Number Priority Date Filing Date Title
TW101118709A TWI470296B (en) 2012-05-25 2012-05-25 Wafer level lens and manufacturing method of the same

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Application Number Priority Date Filing Date Title
TW101118709A TWI470296B (en) 2012-05-25 2012-05-25 Wafer level lens and manufacturing method of the same

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TWI470296B true TWI470296B (en) 2015-01-21

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200703636A (en) * 2005-07-06 2007-01-16 Asia Optical Co Inc Micro lens and its manufacturing method
US20100053318A1 (en) * 2008-08-28 2010-03-04 Hironori Sasaki Camera module and method of producing the same
TW201122702A (en) * 2009-12-28 2011-07-01 Wisepal Technologies Inc Optical zoom system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200703636A (en) * 2005-07-06 2007-01-16 Asia Optical Co Inc Micro lens and its manufacturing method
US20100053318A1 (en) * 2008-08-28 2010-03-04 Hironori Sasaki Camera module and method of producing the same
TW201122702A (en) * 2009-12-28 2011-07-01 Wisepal Technologies Inc Optical zoom system

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